Industrial camera with embedded space microcomputer architecture

Abstract

This application relates to an industrial camera with an embedded spatial microcomputer structure, including: a PC unit and a main housing. The main housing is a hollow structure with a detachable top and an internal mounting bracket. At the bottom edge of the main housing, an annular abutment plate extends in a direction away from the main housing to form a mounting groove with a preset space. The mounting groove is suitable for matching the external circuit board of the industrial camera. The PC unit is embedded inside the main housing and fixed on the mounting bracket. The mounting groove provides a certain degree of protection for the motherboard and achieves a reasonable structural layout and compact connection between the main unit and the camera components.

Description

Technical Field

[0001] This application relates to the field of industrial camera technology, and more particularly to an industrial camera with an embedded spatial microcomputer structure. Background Technology

[0002] In the industrial production sector, industrial cameras, as crucial image acquisition devices, are widely used in quality inspection, visual guidance, and defect identification. With the continuous improvement of industrial automation, higher demands are being placed on the performance, integration, ease of installation, and heat dissipation of industrial cameras. Existing industrial cameras suffer from an overly compact connection between the main unit and camera components, leading to potential damage to the camera's motherboard. Utility Model Content

[0003] To address the problem that traditional industrial cameras, while compact in installation, are prone to motherboard damage, this invention provides a system comprising: a PC unit and a main unit housing;

[0004] The main housing is a hollow structure with a detachable top and an internal mounting bracket. The bottom edge of the main housing has an annular abutment plate extending away from the main housing to form a mounting groove with a preset space. The mounting groove is suitable for matching the circuit board of an external industrial camera.

[0005] The PC unit is embedded inside the host housing and fixed on the mounting bracket.

[0006] In one possible implementation, the sidewall of the main housing has multiple bolt holes along the opening direction.

[0007] In one possible implementation, the host housing includes: a terminal housing and a mounting housing;

[0008] The terminal housing has a square structure, the PC unit is embedded inside the terminal housing, and the bottom of the terminal housing has a flat structure;

[0009] The mounting housing is a cover structure, with its top plane bolted to the bottom of the terminal housing, and the opening of the cover faces away from the terminal housing.

[0010] In one possible implementation, the mounting housing has a preset thickness;

[0011] The outer wall of the mounting housing is provided with heat dissipation grooves.

[0012] One possible implementation also includes a heat dissipation housing;

[0013] The side wall of the terminal housing is provided with a first heat dissipation hole, which is opened along the direction perpendicular to the bottom of the terminal housing and is elongated.

[0014] The heat dissipation housing is a ring structure with multiple through second heat dissipation holes on its side wall. The heat dissipation housing is located inside the terminal housing, separating the PC unit from the top of the terminal housing, and the second heat dissipation holes on the heat dissipation housing correspond to the first heat dissipation holes.

[0015] One possible implementation also includes a cooling fan;

[0016] The cooling fan is located inside the terminal housing, within the annular cooling housing.

[0017] One possible implementation also includes: a display screen;

[0018] The side wall of the main unit housing has a recessed display screen groove;

[0019] The display screen is embedded within the display screen and is communicatively connected to the PC unit.

[0020] In one possible implementation, the sidewall of the host housing is provided with multiple interfaces, which are communicatively connected to the PC unit.

[0021] In one possible implementation, heat dissipation slots are formed in the side wall of the main unit housing.

[0022] In one possible implementation, the host housing is made of metal.

[0023] The industrial camera with an embedded spatial microcomputer structure according to the embodiments of this application has the following advantages: The main board of the camera body is located in a mounting slot, which provides a certain degree of protection for the main board and achieves a reasonable structural layout and compact connection between the host and camera components. Specifically, by recessing a mounting slot at the bottom of the camera housing, the main board of the camera body is embedded in the mounting slot, protecting the circuit board of the camera body. The camera housing does not need a top, saving costs. Furthermore, by separating the main board of the camera body from the PC unit of the host, interference between the circuit board of the camera body and the PC unit of the host is avoided.

[0024] Other features and aspects of this application will become clear from the following detailed description of exemplary embodiments with reference to the accompanying drawings. Attached Figure Description

[0025] The accompanying drawings, which are included in and form part of this specification, illustrate exemplary embodiments, features, and aspects of this application together with the specification and serve to explain the principles of this application.

[0026] Figure 1 A schematic diagram of the main structure of an industrial camera with an embedded space microcomputer structure according to an embodiment of this application is shown.

[0027] Figure 2 This is a fully exploded schematic diagram of an industrial camera with an embedded space microcomputer structure according to an embodiment of this application.

[0028] Figure 3 An exploded view of an industrial camera with an embedded space microcomputer structure according to an embodiment of this application is shown. Detailed Implementation

[0029] Various exemplary embodiments, features, and aspects of this application will now be described in detail with reference to the accompanying drawings. The same reference numerals in the drawings denote elements that have the same or similar functions. Although various aspects of the embodiments are shown in the drawings, they are not necessarily drawn to scale unless specifically indicated otherwise.

[0030] It should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model or simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0031] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0032] The term “exemplary” as used herein means “serving as an example, embodiment, or illustration.” Any embodiment illustrated herein as “exemplary” is not necessarily to be construed as superior to or better than other embodiments.

[0033] Furthermore, to better illustrate this application, numerous specific details are provided in the following detailed embodiments. Those skilled in the art should understand that this application can be implemented without certain specific details. In some instances, methods, means, components, and circuits well-known to those skilled in the art have not been described in detail in order to highlight the main points of this application.

[0034] like Figures 1-3 As shown, the industrial camera with an embedded spatial microcomputer structure according to the present application embodiment includes: a PC unit and a main housing 100. The main housing 100 is a hollow structure with a detachable top and an internal mounting bracket. At the bottom edge of the main housing 100, an annular abutment plate extends in a direction away from the main housing 100 to form a mounting groove 1121 with a preset space. The mounting groove is suitable for matching the circuit board external to the industrial camera. The PC unit is embedded inside the main housing 100 and fixed on the mounting bracket.

[0035] In this specific embodiment, the motherboard of the camera body 210 is located within the mounting groove 1121. The mounting groove 1121 provides a certain degree of protection for the motherboard and simultaneously achieves a reasonable structural layout and compact connection between the host 100 and the camera assembly 220. Specifically, by recessing the mounting groove 1121 at the bottom of the camera housing 200, the motherboard of the camera body 210 is embedded within the mounting groove 1121, protecting the circuit board of the camera body 210. The camera housing 200 of the camera body 210 does not need a top, saving costs. Furthermore, by separating the motherboard of the camera body 210 from the PC unit of the host 100, interference between the circuit board of the camera body 210 and the PC unit of the host 100 is avoided.

[0036] In one specific embodiment, the side wall of the main housing has multiple bolt holes along the opening direction for fixing the camera housing covered by the camera body to make bolt connections.

[0037] In one specific embodiment, the camera housing 200 matches the main housing 110, and the opening edge of the camera housing 200 is bolted to the bottom edge of the main housing 110. The camera housing 200 and the main housing 110 are adapted to each other in shape and size to ensure a tight and stable connection. The bolted connection between the opening edge of the camera housing 200 and the bottom edge of the main housing 110 ensures a stable connection between the main unit 100 and the camera assembly 220, while also facilitating future maintenance and replacement.

[0038] Furthermore, for ease of disassembly, both the camera housing 200 and the main housing 110 are made of metal, and the opening of the main housing 110 is made of magnetic material, so that the camera housing 200 and the main housing 110 can be installed and disassembled by magnetic attraction.

[0039] In one specific embodiment, at the opening of the camera housing 200, an abutment portion 211 extends circumferentially away from the camera housing 200. The abutment portion 211 matches the mounting groove 1121. When the camera housing 200 is connected to the main housing 110, the abutment portion 211 abuts against the inner wall of the mounting groove 1121. The abutment portion 211 is a ring-shaped structure with a square cross-section. Because the abutment portion 211 matches the mounting groove 1121, when the camera housing 200 is connected to the main housing 110, the abutment portion 211 abuts against the inner wall of the mounting groove 1121, increasing the contact area between the camera housing 200 and the main housing 110, further improving the stability of the connection, effectively preventing the camera housing 200 from shaking or shifting on the main housing 110, and enhancing the overall reliability of the industrial camera structure.

[0040] In one specific embodiment, the mounting slot 1121 has a preset space inside, providing sufficient installation space for the motherboard, while also facilitating the layout and organization of the wiring, ensuring the neat and orderly internal structure of the industrial camera, and avoiding problems such as installation difficulties or mutual interference between components due to insufficient space.

[0041] In one specific embodiment, the main unit housing 110 includes a terminal housing 111 and a mounting housing 112. The terminal housing 111 has a square structure, with the PC unit embedded inside. The bottom of the housing is flat, providing a level base for the mounting housing 112. The mounting housing 112 is a cover structure, with its top plane bolted to the bottom of the terminal housing 111. The opening of the cover faces away from the terminal housing 111. This modular design facilitates the processing and assembly of the main unit housing 110. The opening of the cover, facing away from the terminal housing 111, creates a space for the mounting groove 1121, which accommodates components such as the motherboard at the opening of the camera housing 200 of the camera assembly 220. This achieves a rational division of the main unit housing 110 structure and functional integration.

[0042] In one specific embodiment, the mounting housing 112 has a preset thickness, and heat dissipation grooves are formed on the outer wall of the mounting housing 112. The heat dissipation grooves on the outer wall of the mounting housing 112 increase the heat dissipation area of ​​the mounting housing 112, which can effectively accelerate the dissipation of heat generated by components such as the PC unit during operation, reduce the internal temperature, improve the heat dissipation performance of the industrial camera, and extend the service life of the equipment.

[0043] In one specific embodiment, the depth of the mounting slot 1121 is greater than the thickness of the motherboard of the camera body 210, which facilitates the embedding of the motherboard of the camera body 210. In addition, when the camera assembly 220 is installed with the host 100, the heat dissipation effect can be further improved when there is a distance between the motherboard of the camera assembly 220 and the bottom of the host housing 110.

[0044] In one specific embodiment, the camera body 210 is communicatively connected to the PC unit. The image data acquired by the camera body 210 can be transmitted to the PC unit for processing, storage and analysis through the communication connection. The PC unit can also send control commands to the camera body 210 to realize parameter setting and working status control of the camera body 210, thereby enabling the industrial camera to realize intelligent image acquisition and processing functions and meet the diverse needs in industrial automated production.

[0045] In one specific embodiment, the top of the camera housing 200 is attached to the bottom of the main housing 110, so that the main housing 100 and the camera assembly 220 form a compact integral structure after connection, reducing the gap between the two.

[0046] In one specific embodiment, a self-reset button 230 is embedded on the side wall of the camera housing 200. The self-reset button 230 is electrically connected to the camera assembly 220 through a normally closed contact and an energized circuit chip. By touching the self-reset button 230, the industrial camera can be restarted.

[0047] In one specific embodiment, a heat dissipation housing 113 is also included. A first heat dissipation hole is provided on the side wall of the terminal housing 111. The first heat dissipation hole is elongated and runs perpendicular to the bottom of the terminal housing 111. The heat dissipation housing 113 has a ring-shaped structure, and multiple through-holes of a second heat dissipation hole are provided on its side wall. The heat dissipation housing 113 is disposed inside the terminal housing 111, separating the PC unit from the top of the terminal housing 111. The second heat dissipation holes on the heat dissipation housing 113 correspond to the first heat dissipation holes. By making reasonable use of the space inside the terminal housing 111, the PC unit is separated from the top space, forming an independent heat dissipation area. The elongated first heat dissipation hole and the corresponding second heat dissipation holes increase the effective ventilation area of ​​the heat dissipation holes, allowing external air to smoothly enter the housing along a direction perpendicular to the bottom of the terminal housing 111 and exchange heat with the heat dissipation housing 113, thereby improving heat dissipation efficiency.

[0048] In one specific embodiment, a cooling fan 114 is also included, which is disposed inside the terminal housing 111 and located within the annular heat dissipation housing 113. The cooling fan 114 creates an active airflow within the annular heat dissipation housing 113, accelerating the airflow speed within the heat dissipation housing 113.

[0049] In one specific embodiment, the device further includes a display screen. A display screen slot is recessed in the side wall of the main housing 100, and the display screen is embedded within it, communicating with the PC unit. This embedded design makes the structure of the main housing 100 more compact, forming a single unit with the display screen, reducing the use of external connection cables. Simultaneously, the communication connection between the display screen and the PC unit enables real-time display of the device's operating status, data information, etc., providing users with an intuitive interactive interface, facilitating user operation and monitoring of the device, and improving the device's human-computer interaction performance.

[0050] In one specific embodiment, the side wall of the host housing 100 is provided with multiple interfaces, which are communicatively connected to the PC unit. Users can connect various external devices, such as keyboards, mice, printers, and storage devices, through these interfaces to realize data input, output, and sharing, meeting the needs of different users in different application scenarios.

[0051] In one specific embodiment, heat dissipation grooves are provided on the side wall of the main unit housing 100 to further optimize the flow path of external air.

[0052] In one specific embodiment, the main unit housing 100 is made of metal, which can quickly conduct the heat generated by internal heating elements such as the PC unit to the surface of the housing, greatly shortening the heat conduction path in the housing, improving the heat dissipation speed, and enhancing the structural strength and durability of the main unit housing 100.

[0053] The various embodiments of this application have been described above. These descriptions are exemplary and not exhaustive, nor are they limited to the disclosed embodiments. Many modifications and variations will be apparent to those skilled in the art without departing from the scope and spirit of the described embodiments. The terminology used herein is chosen to best explain the principles, practical application, or improvement of the technology in the market, or to enable others skilled in the art to understand the embodiments disclosed herein.

Claims

1. An industrial camera with an embedded space microcomputer structure, characterized by, include: PC unit and main unit casing; The main housing is a hollow structure with a detachable top and an internal mounting bracket. The bottom edge of the main housing has an annular abutment plate extending away from the main housing to form a mounting groove with a preset space. The mounting groove is suitable for matching the circuit board of an external industrial camera. The PC unit is embedded inside the host housing and fixed on the mounting bracket.

2. The industrial camera with embedded space microcomputer architecture of claim 1, wherein, The side wall of the main housing has multiple bolt holes along the opening direction.

3. The industrial camera with embedded space microcomputer architecture of claim 1, wherein, The host housing includes: a terminal housing and a mounting housing; The terminal housing has a square structure, the PC unit is embedded inside the terminal housing, and the bottom of the terminal housing has a flat structure; The mounting housing is a cover structure, with its top plane bolted to the bottom of the terminal housing, and the opening of the cover faces away from the terminal housing.

4. The industrial camera with embedded space microcomputer architecture of claim 3, wherein, The mounting housing has a preset thickness; The outer wall of the mounting housing is provided with heat dissipation grooves.

5. The industrial camera with embedded space microcomputer architecture of claim 3, wherein, It also includes a heat dissipation housing; The side wall of the terminal housing is provided with a first heat dissipation hole, which is opened along the direction perpendicular to the bottom of the terminal housing and is elongated. The heat dissipation housing is a ring structure with multiple through second heat dissipation holes on its side wall. The heat dissipation housing is located inside the terminal housing, separating the PC unit from the top of the terminal housing, and the second heat dissipation holes on the heat dissipation housing correspond to the first heat dissipation holes.

6. The industrial camera with embedded space microcomputer architecture of claim 5, wherein, It also includes cooling fans; The cooling fan is located inside the terminal housing, within the annular cooling housing.

7. The industrial camera with embedded spatial microcomputer architecture of claim 1, wherein, Also includes: Display screen; The side wall of the main unit housing has a recessed display screen groove; The display screen is embedded within the display screen and is communicatively connected to the PC unit.

8. The industrial camera with embedded space microcomputer architecture of claim 1, wherein, The side wall of the main unit housing is provided with multiple interfaces, which are communicatively connected to the PC unit.

9. The industrial camera with embedded space microcomputer architecture of claim 1, wherein, The side wall of the main unit housing has heat dissipation grooves.

10. The industrial camera with embedded spatial microcomputer architecture of claim 1, wherein, The main unit casing is made of metal.

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