A depth camera structure

Abstract

The purpose of this utility model is to propose a depth camera structure, including a back shell, a motherboard, a sensor board, a VCSEL board, a full-through glass and a camera module. A first heat dissipation silicone is provided between the motherboard and the back shell to give the depth camera a better heat dissipation effect. The integrated design of the back shell gives the depth camera a better sealing effect to prevent external moisture from entering and damaging the depth camera.

Description

Technical Field

[0001] This utility model relates to the field of 3D cameras, and more particularly to a depth camera structure. Background Technology

[0002] Most existing depth cameras use screws to fix the front and rear shells together. After prolonged use, the front and rear shells are prone to slight deformation and misalignment, which can create gaps between them. This can affect the sealing of the depth camera, allowing external moisture to enter and damage it.

[0003] For example, CN202323080085.2 proposes a depth camera, including a housing, a 3D imaging module, and a silicone sleeve. The housing forms a receiving cavity; the 3D imaging module is disposed within the receiving cavity; and the silicone sleeve is disposed between the housing and the 3D imaging module. The silicone sleeve includes a main body and sleeves connected to both ends of the main body. The sleeves cover both ends of the 3D imaging module and contact the cavity walls at both ends of the receiving cavity. The main body fits against the front side of the 3D imaging module and contacts the front cavity wall of the receiving cavity. The silicone sleeve seals the gaps between the two ends and the front side of the 3D imaging module and the housing. The silicone sleeve can play a buffering role and has high thermal conductivity, giving the depth camera good impact resistance and heat dissipation performance, but it does not solve the above-mentioned problems. Utility Model Content

[0004] To address the aforementioned problems, the present invention aims to propose a depth camera structure that employs an integrated back shell design, combined with fully transparent glass with adhesive backing, to form a sealed structure, thereby ensuring the sealing performance of the depth camera.

[0005] This utility model provides a depth camera structure, including a rear shell, a motherboard, a sensor board, a VCSEL board, a through glass, and a camera module. The through glass is located at the front of the rear shell, while the motherboard, sensor board, and VCSEL board are located inside the rear shell. The motherboard is fixed to the rear shell with screws, and a first thermal silicone pad is provided between the motherboard and the rear shell. The sensor board is fixed to the rear shell with screws and is mounted to the front of the motherboard via a BTB connector. The VCSEL board is mounted to the front of the sensor board via pins and connectors, and a second thermal silicone pad is provided in front of the VCSEL board.

[0006] Furthermore, the motherboard is equipped with a Type-C interface, and the rear cover has an opening that fits the Type-C interface. The Type-C interface is equipped with a sealing ring, and the Type-C interface is press-fitted with the opening on the rear cover through the sealing ring.

[0007] Furthermore, the sensor board has three camera modules in front, with the two side camera modules being dual-channel 850nm modules on both sides and the middle RGB module.

[0008] Furthermore, the all-through glass is a filter with a wavelength range of 440-960nm, and a waterproof adhesive is provided on the back of the all-through glass, which is then bonded to the back cover using the waterproof adhesive.

[0009] Furthermore, the rear shell is provided with multiple grooves to form heat dissipation fins.

[0010] Furthermore, the copper is exposed at the contact points between the motherboard and the sensor board and the rear cover.

[0011] Furthermore, a shielding cover is fixed to the sensor board by screws, and the shielding cover has openings that fit the camera module. The shielding cover can shield electromagnetic interference.

[0012] Beneficial effects: 1. Multiple grooves are provided on the back cover to form heat dissipation fins. Copper is exposed at the contact points between the motherboard and the sensor board and the back cover. A first heat dissipation silicone is provided between the motherboard and the back cover, which makes the depth camera have better heat dissipation effect.

[0013] 2. Waterproof adhesive is provided on the back of the full-through glass. The full-through glass is attached to the back shell with waterproof adhesive. The one-piece design of the back shell gives the depth camera a better sealing effect and prevents external moisture from entering and damaging the depth camera. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the overall structure of this utility model. Figure 1 .

[0015] Figure 2 This is a schematic diagram of the overall structure of this utility model. Figure 2 .

[0016] Figure 3 This is the explosive of this utility model. Figure 1 .

[0017] Figure 4 This is the explosive of this utility model. Figure 2 .

[0018] Figure 5 This is a schematic diagram of the overall structure of the motherboard of this utility model.

[0019] Figure 6 This is a schematic diagram of the overall structure of the sensor plate of this utility model.

[0020] Figure 7 This is a schematic diagram of the overall structure of the VCSEL board of this utility model.

[0021] Reference numerals: 1. Rear cover; 2. First thermal silicone liner; 3. Motherboard; 4. Sensor board; 5. VCSEL board; 6. Second thermal silicone liner; 7. Shielding cover; 8. Full-coverage glass; 9. Type-C interface; 10. Camera module. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0023] The following disclosure provides many different embodiments or examples for implementing different structures of the present invention. To simplify the disclosure, specific examples of components and arrangements are described below. Of course, these are merely examples and are not intended to limit the scope of the present invention.

[0024] The depth camera structure according to an embodiment of the present invention will now be described with reference to the accompanying drawings, such as... Figures 1-7 As shown, the depth camera structure includes a rear shell 1, a motherboard 3, a sensor board 4, a VCSEL board 5, a through-glass 8, and a camera module 10. The through-glass 8 is located at the front of the rear shell 1. The motherboard 3, sensor board 4, and VCSEL board 5 are located inside the rear shell 1. The motherboard 3 is fixed to the rear shell 1 with screws. A first thermal pad 2 is provided between the motherboard 3 and the rear shell 1. The sensor board 4 is fixed to the rear shell 1 with screws and is mounted to the front of the motherboard 3 via a BTB connector. The VCSEL board 5 is mounted to the front of the sensor board 4 via pins and connectors. A second thermal pad 6 is provided in front of the VCSEL board 5. The motherboard 3 has a Type-C interface 9, and the rear shell 1 has an opening that mates with the Type-C interface 9. The Type-C interface 9 is equipped with a sealing ring. The Type-C interface 9 is press-fitted with the opening on the back cover 1 through the sealing ring, thereby achieving IP68 level dust and water resistance. There are three camera modules 10 in front of the sensor board 4. The two camera modules 10 on the sides are dual-pass 850nm modules, and the middle one is an RGB module. The all-pass glass 8 is a filter with a wavelength range of 440-960nm. The all-pass glass 8 is equipped with waterproof adhesive on the back. The all-pass glass 8 is attached to the back cover 1 through the waterproof adhesive, thereby making the depth camera structure achieve IPX5 waterproof effect.

[0025] Please refer to Figure 4 In some specific embodiments: multiple grooves are provided on the rear shell 1 to form heat dissipation fins on the rear shell 1, thereby enhancing the heat dissipation effect.

[0026] In some specific embodiments: copper is exposed at the contact points between the motherboard 3 and the sensor board 4 and the rear shell 1 to facilitate heat dissipation.

[0027] Please refer to Figure 3 In some specific embodiments: a shielding cover 7 is provided on the Sensor board 4.

[0028] Specifically, the shielding cover 7 is fixed to the sensor board 4 with screws and tapped onto the second heat dissipation silicone 6, thereby fixing the VCSEL board 5. The shielding cover 7 has openings that fit the camera module 10. The shielding cover 7 can shield electromagnetic interference and ensure EMC.

[0029] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A depth camera structure, characterized by, The device includes a rear shell (1), a motherboard (3), a sensor board (4), a VCSEL board (5), a full-through glass (8), and a camera module (10). The full-through glass (8) is located in front of the rear shell (1). The motherboard (3), sensor board (4), and VCSEL board (5) are located inside the rear shell (1). The motherboard (3) is fixed inside the rear shell (1) with screws. A first thermal silicone (2) is provided between the motherboard (3) and the rear shell (1). The sensor board (4) is fixed inside the rear shell (1) with screws. The sensor board (4) is installed in front of the motherboard (3) through a BTB connector. The VCSEL board (5) is installed in front of the sensor board (4) through pins and connectors. A second thermal silicone (6) is provided in front of the VCSEL board (5).

2. A depth camera structure as defined in claim 1, characterized in that The motherboard (3) is provided with a Type-C interface (9), and the back cover (1) has an opening that fits the Type-C interface (9). The Type-C interface (9) is provided with a sealing ring, and the Type-C interface (9) is press-fitted with the opening on the back cover (1) through the sealing ring.

3. The depth camera structure as described in claim 1, characterized in that, The Sensor board (4) has three camera modules (10) in front of it, of which the two camera modules (10) on both sides are dual-pass 850nm modules and the middle one is an RGB module.

4. The depth camera structure as described in claim 1, characterized in that, The all-through glass (8) is a filter with a wavelength range of 440-960nm. Waterproof adhesive is provided on the back of the all-through glass (8), and the all-through glass (8) is attached to the back shell (1) by the waterproof adhesive.

5. A depth camera structure as described in claim 1, characterized in that, The rear shell (1) has multiple grooves to form heat dissipation fins.

6. A depth camera structure as described in claim 1, characterized in that, The copper is exposed at the contact points between the motherboard (3) and the sensor board (4) and the back cover (1).

7. A depth camera structure as described in claim 1, characterized in that, The sensor board (4) is fixed with a shield (7) by screws. The shield (7) has an opening that fits the camera module (10). The shield (7) can shield electromagnetic interference.

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