Camera devices and mobile devices

Abstract

This application provides a camera device and a mobile device, wherein the camera device includes: a camera assembly with a first connecting portion disposed on its side; a circuit board with a second connecting portion disposed at one end; and a connecting layer disposed between the first connecting portion and the second connecting portion to adhesively fix the camera assembly to the circuit board. This method allows the camera device to be manufactured according to the internal layout of the product being installed, effectively reducing the manufacturing time and improving the manufacturing efficiency of the camera device.

Description

Technical Field

[0001] This application relates to the field of mobile device technology, and in particular to a camera device and a mobile device. Background Technology

[0002] With the development of the mobile phone market, consumers have increasingly higher requirements for the aesthetics of mobile phone appearance. In order to pursue visual distinctiveness, different mobile phone terminals incorporate different design elements into the appearance design of different models. The appearance of the mobile phone is strongly tied to the layout of the CCM (CMOS Camera Module), resulting in various forms of CCM arrangement in the whole device. However, in the current technology, each mobile phone needs to customize the entire CCM, and only the shape of the R-FPCB (Radio Frequency Printed Circuit Board) is different. Multiple mobile phones cannot reuse the CCM, resulting in high customization costs and long production cycles. Utility Model Content

[0003] This application provides a camera device to solve the problem that camera modules cannot be reused in the prior art.

[0004] To address the aforementioned technical problems, this application provides a camera device, comprising: a camera assembly with a first connecting portion on its side; a circuit board with a second connecting portion at one end; and a connecting layer disposed between the first connecting portion and the second connecting portion to bond the camera assembly to the circuit board.

[0005] The first connecting part is provided with a number of first pins, and the second connecting part is provided with second pins corresponding to the first pins. The number of first pins and the number of second pins are arranged in a one-to-one correspondence.

[0006] The connecting layer is a conductive component that connects the first pin and the second pin.

[0007] The connecting layer is an adhesive layer used to bond the first connecting part and the second connecting part.

[0008] The circuit board includes a first substrate and a second substrate, which are connected. A second connecting portion is disposed at the end of the first substrate away from the second substrate. The first substrate is a flexible circuit board, and the second substrate is a rigid circuit board.

[0009] The second substrate has a third connecting part at one end, which is used to connect external components.

[0010] Wherein, the dimension of the second substrate along the first direction is greater than the dimension of the first substrate along the first direction; wherein, the first direction is the axial direction of the connection position between the first substrate and the second substrate.

[0011] Wherein, the side of the second substrate along one side of the first direction is flush with the side of the first substrate, and the side of the second substrate along the other side of the first direction is not flush with the side of the first substrate.

[0012] In this case, the side surfaces of the second substrate along both sides of the first direction are not flush with the side surfaces of the first substrate along the first direction.

[0013] To address the aforementioned issues, this application also provides a mobile device that includes a camera device according to any of the above-mentioned methods.

[0014] The beneficial effects of this application are as follows: Unlike the prior art, this application sets a first connecting part on the camera assembly and a second connecting part on the circuit board. The first connecting part and the second connecting part are bonded together by a connecting layer, so that the circuit board and the camera assembly form a camera device. This allows the camera device to be manufactured according to the internal layout of the product being installed, effectively reducing the manufacturing time of the camera device and improving the manufacturing efficiency of the camera device. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the exploded view of the camera device provided in this application;

[0016] Figure 2 This is a schematic diagram of the structure of one embodiment of the camera component of this application;

[0017] Figure 3 This is a schematic diagram of the structure of the first embodiment of the circuit board of this application;

[0018] Figure 4 This is a schematic diagram of the structure of the second embodiment of the circuit board of this application. Detailed Implementation

[0019] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0020] It should be noted that if the embodiments of this application involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicators will also change accordingly.

[0021] Furthermore, if the embodiments of this application involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, features defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the technical solutions of various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. If the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed in this application.

[0022] Please see Figure 1 , Figure 1 This is a structural schematic diagram of the exploded view of the camera device provided in this application.

[0023] This application provides a camera device. For example... Figure 1 As shown, the camera device of this embodiment includes: a camera assembly 10, a circuit board 20, and a connecting layer 30. A first connecting portion 11 is provided on the side of the camera assembly 10, a second connecting portion 21 is provided at one end of the circuit board 20, and the connecting layer 30 is disposed between the first connecting portion 11 and the second connecting portion 21 to bond and fix the camera assembly 10 and the circuit board 20.

[0024] Generally speaking, in existing camera modules, the camera and PCB (Printed Circuit Board) are integrated into one unit. However, a camera module with an integrated design cannot be reused in multiple mobile phones. That is, when installing a camera module in a mobile device such as a mobile phone, different PCBs need to be connected to the camera because the internal installation space of different mobile phones is different. Therefore, a camera module with an integrated design cannot be reused in multiple mobile phones.

[0025] Based on this, the camera device in this application adopts a split design, that is, the camera assembly 10 and the circuit board 20 are detachably connected. Specifically, a first connecting part 11 is provided on the side of the camera assembly 10, which is integrally formed with the camera to form the camera assembly 10. A second connecting part 21 is provided at one end of the circuit board 20, wherein the first connecting part 11 and the second connecting part 21 are electrically connected so that the camera assembly 10 can transmit signals through the circuit board.

[0026] In this embodiment, the camera assembly 10 and the circuit board are designed as separate units. When assembling the camera assembly 10 and the circuit board 20, they can be bonded and fixed together by the connecting layer 30. Specifically, the connecting layer 30 is disposed on one end face of the first connecting part 11, and the other side of the connecting layer 30 is connected to the circuit board 20, thereby bonding and fixing the first connecting part 11 and the second connecting part 21 to fix the circuit board 20 and the camera assembly 10.

[0027] When bonding the first connecting part 11 and the second connecting part 21, the connecting layer 30 can be placed between the first connecting part 11 and the second connecting part 21, and the first connecting part 11 and the second connecting part 21 can be pressed together by processes such as hot pressing.

[0028] It should be noted that the camera assembly 10 is a standard part, meaning that the model, size, performance, etc., of the camera assembly 10 are all the same. The circuit board 20 can be customized according to the internal space of mobile devices such as mobile phones. The customized circuit board 20 is then installed on the camera assembly 10 to form the camera device. Therefore, this camera device can be configured for different mobile phone models, and the camera assembly 10 is reusable. Only the circuit board 20 needs to be customized according to the space inside the mobile device, thus effectively reducing the manufacturing time and improving the manufacturing efficiency of the camera device.

[0029] In the above embodiment, by providing a first connecting part 11 on the camera assembly 10 and a second connecting part 21 on the circuit board 20, the first connecting part 11 and the second connecting part 21 are bonded together by a connecting layer 30, so that the circuit board 20 and the camera assembly 10 form a camera device. This allows the camera device to be manufactured according to the internal layout of the product being installed, effectively reducing the manufacturing time of the camera device and improving the manufacturing efficiency of the camera device.

[0030] In an optional embodiment, such as Figure 1 and Figure 2 As shown, the first connecting part 11 is provided with a plurality of first pins 12, and the second connecting part 21 is provided with second pins 22 corresponding to the first pins 12. When connecting the first connecting part 11 and the second connecting part 21, the plurality of first pins 12 and the plurality of second pins 22 are arranged in a one-to-one correspondence to enable signal transmission between the camera assembly 10 and the circuit board 20. When mounting the circuit board 20 onto the camera assembly 10, the end face of the second connecting part 21 with the second pins 22 can be oriented towards the first connecting part 11, and then the second pins 22 are aligned with the first pins 12. The first pins 12 and the second pins 22 are then bonded and fixed by the connecting layer 30, thereby bonding and fixing the camera assembly 10 and the circuit board 20.

[0031] In an optional embodiment, the connecting layer 30 is a conductive element that connects the first pin 12 and the second pin 22. That is, when the first connecting portion 11 and the second connecting portion 21 are bonded together using the connecting layer 30, since the circuit board 20 and the camera assembly 10 need to be connected through the first connecting portion 11 and the second connecting portion 21, the connecting layer 30 is needed to achieve this connection. Therefore, by connecting the first connecting portion 11 and the second connecting portion 21 through the conductive connecting layer 30, the circuit board 20 and the camera assembly 10 are connected, enabling signal transmission between the circuit board 20 and the camera assembly 10.

[0032] In an optional embodiment, the connecting layer 30 is an adhesive layer to bond the first connecting portion 11 and the second connecting portion 21. Specifically, the connecting layer 30 can be an ACF (Anisotropic Conductive Film) adhesive, which uses conductive particles to connect the electrodes between the IC chip and the substrate, making them conductive while preventing short circuits between adjacent electrodes. That is, by sampling the ACF adhesive, a certain number of first pins 12 and a certain number of second pins 22 can be made conductive in a one-to-one correspondence, and adjacent first pins 12 on the first connecting portion 11 and adjacent second pins 22 on the second connecting portion 21 are not conductive, thereby preventing short circuits between the conductive circuit board 20 and the camera assembly 10.

[0033] In other embodiments, the connecting layer 30 may also be other adhesive layers, as long as it can connect the circuit board 20 and the camera assembly 10 and prevent short circuits between adjacent first pins 12 and adjacent second pins 22. The specific settings can be made according to actual needs, and this application does not limit them here.

[0034] In an optional embodiment, the circuit board 20 includes a first substrate 23 and a second substrate 24, which are connected. A second connecting portion 21 is disposed at the end of the first substrate 23 away from the second substrate 24. The first substrate 23 is a flexible circuit board, and the second substrate 24 is a rigid circuit board. The circuit board 20 includes a first substrate 23 and a second substrate 24. The first substrate 23 is a flexible circuit board, and the second substrate 24 is a rigid circuit board. That is, after the circuit board 20 is bonded to the camera assembly 10 to form a camera device, because the first substrate 23 is a flexible circuit board, when the camera device is installed inside the product, the first substrate 23 can be bent to reach a preset installation path. In other words, when installing the camera device inside the product, it can be flexibly adjusted according to the layout space within the product.

[0035] In this embodiment, the second connecting part 21 is disposed at the end of the first substrate 23 away from the second substrate 24. When connecting the camera assembly 10 and the circuit board 20, the second connecting part 21 at one end of the first substrate 23 can be connected to the first connecting part 11 of the camera assembly 10. The first substrate 23 is a flexible circuit board, that is, the circuit board 20 near the camera assembly 10 is a flexible circuit board. When installing the camera device, the installation position of the camera assembly 10 can be flexibly controlled.

[0036] In one optional embodiment, the camera assembly 10 is configured as a standard component, thus its imaging angle is fixed. However, after mounting the circuit board 20 onto the camera, the space required for installation on one side of the camera assembly 10 is relatively large due to the presence of the circuit board 20. Therefore, the connection between the camera assembly 10 and the circuit board 20 can be configured according to the available space within the product; that is, the circuit board 20 can be connected to any side of the camera assembly 10. The specific configuration can be determined based on actual needs, and this application does not impose any specific limitations.

[0037] In an optional embodiment, such as Figure 3 and Figure 4 As shown, a third connecting portion 25 is provided at one end of the second substrate 24, which is used to connect to external components. Specifically, the second substrate 24 is a rigid circuit board, so when the camera device is installed in the product, it needs to be connected to other components in the product, namely the aforementioned external components, through the circuit board 20. Specifically, a third connecting portion 25 is provided on one side end face of the second substrate 24, and a pin (not shown) may be provided on the third connecting portion 25. This pin may be provided on the same side end face of the circuit board 20 as the second pin 22 provided on the second connecting portion 21. The pin provided on the third connecting portion 25 can be used to connect with external components, thereby enabling the camera assembly 10 to establish a connection with external components through the circuit board 20. Specifically, the camera assembly 10 is bonded and fixed to the circuit board 20 through the connecting layer 30, so the camera assembly 10 realizes information transmission with external components through the first pin 12 of the first connecting portion 11, the second pin 22 of the second connecting portion 21, the first substrate 23, the second substrate 24, and the third connecting portion 25.

[0038] In some embodiments, a connector (not shown) may be provided on the third connecting part 25. That is, by providing a connector on the third connecting part 25, when the camera device is installed in the product, it can be connected to the external component through the connector, thereby reducing the connection steps. Specifically, the third connecting part 25 can be directly soldered to the external component. This application does not make specific limitations here.

[0039] In an optional embodiment, the dimension of the second substrate 24 along the first direction is larger than the dimension of the first substrate 23 along the first direction. The first direction is the axial direction of the connection point between the first substrate 23 and the second substrate 24. The connection point between the first substrate 23 and the second substrate 24 is formed as a straight line and is arranged along the width direction of either the first substrate 23 or the second substrate 24. Specifically, the connection point between the first substrate 23 and the second substrate 24 can be parallel to the side of the camera assembly 10, that is, the first direction can be the width direction of the circuit board 20. The second connecting portion 21 and the third connecting portion 25 provided on the circuit board 20 are both arranged along the first direction, that is, a plurality of pins on the second connecting portion 21 are arranged along the first direction. The dimension of the second substrate 24 along the first direction is larger than the dimension of the first substrate 23 along the first direction. In other words, the dimension of the first substrate 23 along the first direction is smaller than the dimension of the second substrate 24 along the first direction. Therefore, when the camera device is installed in the product, it is easier to bend the first substrate 23, thereby improving the layout capability of the camera assembly 10 and the circuit board 20 within the product.

[0040] In some embodiments, the side surface of the second substrate 24 along one side of the first direction is flush with the side surface of the first substrate 23, while the side surface of the second substrate 24 along the other side of the first direction is not flush with the side surface of the first substrate 23. Specifically, as shown... Figure 3 As shown, the side of the second substrate 24 along one side of the first direction is flush with the side of the first substrate 23, thereby abutting against other devices in the product. The side of the second substrate 24 along the other side of the first direction is not flush with the end face of the first substrate 23, that is, the second substrate 24 extends at least partially beyond one side of the first substrate 23, thereby securing the circuit board 20 in the product. Alternatively, a corresponding connector can be provided on the third connecting part 25 according to the size of the second substrate 24 to connect external components.

[0041] In some embodiments, such as Figure 4 As shown, the sides of the second substrate 24 along the first direction are not flush with the sides of the first substrate 23. That is, the sides of the second substrate 24 along the first direction partially extend beyond the sides of the first substrate 23. In other words, by changing the shape of the first substrate 23 and the second substrate 24, different products can be adapted.

[0042] In other embodiments, the dimension of the second substrate 24 along the first direction may be smaller than the dimension of the first substrate 23 along the first direction. The specific dimension can be set according to the internal space of the product, and this application does not make specific limitations here.

[0043] By detachably configuring the camera assembly 10 and the circuit board 20 and connecting them via the connecting layer 30, the camera assembly 10 can be configured as a standard component of the same type. The circuit board 20 can be installed within the product space as needed, effectively reducing the manufacturing time and improving the manufacturing efficiency of the camera device. By providing several first pins 12 on the first connecting portion 11 and several second pins 22 on the second connecting portion 21, signal transmission between the circuit board 20 and the camera assembly 10 can be achieved through the first pins 12 and second pins 22. By configuring the connecting layer 30 as a conductive element, the first pins 12 and second pins 22 can be bonded together, achieving conductivity between them. By configuring the connecting layer 30 as an adhesive layer, the connection between the camera assembly 10 and the circuit board 20 can be achieved through pressing. By configuring the circuit board 20 as both a flexible and rigid circuit board, the circuit board 20 can be arbitrarily arranged within the product, improving the layout capability of the camera device. By providing a third connecting portion 25 at one end of the second substrate 24, the camera device can communicate with external components through the third connecting portion 25. By setting the size of the second substrate 24 to be larger than the size of the first substrate 23, the circuit board 20 can be easily bent inside the product, thereby reducing interference with other components inside the product.

[0044] The above description is merely an embodiment of this application and does not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. A camera device, characterized by, The camera device includes: A camera assembly, wherein a first connecting portion is provided on the side of the camera assembly; A circuit board, one end of which is provided with a second connecting portion; A connecting layer is disposed between the first connecting portion and the second connecting portion to bond and fix the camera assembly and the circuit board.

2. The camera device of claim 1, wherein, The first connecting part is provided with a plurality of first pins, and the second connecting part is provided with second pins corresponding to the first pins, with the plurality of first pins and the plurality of second pins being configured in a one-to-one correspondence.

3. The camera device of claim 2, wherein, The connection layer is a conductive element, which connects the first pin and the second pin.

4. The camera device according to any one of claims 1-3, characterized in that, The connecting layer is an adhesive layer, used to bond the first connecting part and the second connecting part.

5. The camera device of claim 1, wherein, The circuit board includes a first substrate and a second substrate, the first substrate and the second substrate are connected, and the second connection portion is disposed at the end of the first substrate away from the second substrate; The first substrate is a flexible circuit board, and the second substrate is a rigid circuit board.

6. The camera device of claim 5, wherein, The second substrate has a third connecting portion at one end, which is used to connect external components.

7. The camera device of claim 5, wherein, The dimension of the second substrate along the first direction is larger than the dimension of the first substrate along the first direction; Wherein, the first direction is the axial direction of the connection position between the first substrate and the second substrate.

8. The camera device according to claim 7, characterized in that, The side of the second substrate along one side of the first direction is flush with the side of the first substrate, while the side of the second substrate along the other side of the first direction is not flush with the side of the first substrate.

9. The camera device of claim 7, wherein, The sides of the second substrate along the first direction are not flush with the sides of the first substrate along the first direction.

10. A mobile device, comprising: The mobile device includes a camera device as described in any one of claims 1-9.

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