Audio modules and electronic devices
By forming a wire clamp through the deformation of the spring body, the problems of antenna signal interference and high production costs in electronic devices are solved, the structural stability and reliability are improved, and the miniaturization and integration design of the equipment are promoted.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- BEIJING XIAOMI MOBILE SOFTWARE CO LTD
- Filing Date
- 2025-07-29
- Publication Date
- 2026-07-31
AI Technical Summary
The miniaturization and integration of electronic devices have led to interference with antenna signals. In existing technologies, the grounding effect of the connection between the spring and the clamp is poor, and the production, processing and assembly processes are cumbersome and costly.
By deforming the main body of the spring to form a wire clamp, the dual functions of conductive connection and fixing of conductive wires are achieved, simplifying the production and assembly process, reducing space occupation, and improving structural stability and reliability.
It improves antenna efficiency, reduces production costs, simplifies processing procedures, and enables the compactness and miniaturization of electronic devices.
Smart Images
Figure CN224583309U_ABST
Abstract
Description
Technical Field
[0001] This disclosure relates to the field of electronic device technology, and in particular to an audio module and electronic device. Background Technology
[0002] With the continuous development of electronic device technology, the design of electronic devices is increasingly inclined towards miniaturization and integration. Therefore, the internal space of electronic devices is relatively cramped, which can easily cause interference with antenna signals, leading to reduced antenna efficiency and affecting the user's communication experience. Related technologies typically employ a combination of spring contacts and wire clamps, connecting the wire clamp to the spring contact and the conductive wire to the wire clamp to achieve grounding of the conductive wire. Utility Model Content
[0003] To overcome the problems existing in related technologies, this disclosure provides an audio module and an electronic device.
[0004] According to a first aspect of the present disclosure, an audio module is provided, comprising:
[0005] The housing includes a spring-loaded body for achieving conductive connections;
[0006] The wire clamp is shaped by the spring body and is used to install conductive wires.
[0007] In this embodiment, the audio module includes a housing. The original spring body of the housing is deformed to form a wire clamp, so that the original spring body can both provide electrical connection and fix the conductive wire, which improves the structural stability of the audio module and the reliability of the conductive connection. Since there is no need to set a separate wire clamp, the production and assembly process is simplified, which helps to reduce production costs. At the same time, integrating the wire clamp into the spring body also helps to reduce the space occupied inside the electronic device, thereby helping to achieve the compactness and miniaturization of the electronic device.
[0008] In one possible implementation, the spring body includes a first extension and a second extension connected together, and the wire clamp is formed in the second extension.
[0009] In this embodiment, the wire clamp is formed on the second extension. By separating the first extension from the wire clamp, mutual interference between the first extension and the wire clamp is avoided, thereby improving the stability and reliability of the conductive connection of the spring body.
[0010] In one possible implementation, the second extension is provided with a wiring portion, the wire clamp is formed in the wiring portion, and the conductive wire is electrically connected to the wiring portion and the wire clamp.
[0011] In this embodiment, the second extension is provided with a wiring section, and the conductive wire is electrically connected to the wiring section and the wire clamp. The wiring section realizes the wiring arrangement of the conductive wire and the conductive connection between the conductive wire and the spring body, thereby improving the stability and reliability of the conductive connection of the conductive wire.
[0012] In one possible implementation, the wire clamp includes a first fixing part and a second fixing part, the first fixing part and the second fixing part being disposed opposite to each other, and the first fixing part and the second fixing part being disposed on both sides of the extension direction of the wire routing part.
[0013] In this embodiment of the present disclosure, the wire clamp is configured to include a first fixing part and a second fixing part disposed opposite to each other. The first fixing part and the second fixing part together clamp and fix the conductive wire, which can limit the direction of the conductive wire and improve the fixing stability of the conductive wire and the reliability of the conductive connection.
[0014] In one possible implementation, the first fixing portion includes at least one bent section; and / or,
[0015] The second fixing part includes at least one bent section;
[0016] The bent section is used to limit the position of the conductive wire.
[0017] In this embodiment of the present disclosure, by providing at least one bent section through the first fixing part and / or the second fixing part of the wire clamp, the limiting effect of the wire clamp on the conductive wire is improved, thereby improving the stability and reliability of the conductive connection between the spring body and the conductive wire.
[0018] In one possible implementation, the second extension has a hollowed-out area, and the wiring portion is disposed in the hollowed-out area.
[0019] In this embodiment of the disclosure, by setting a hollow area to accommodate the wire clamp and the wiring part, interference with the wire clamp and the conductive wire can be avoided, thereby improving the stability and reliability of the conductive connection of the conductive wire.
[0020] In one possible implementation, the wiring portion and the wire clamp are exposed to the outside of the housing, and the hollowed-out area around the wiring portion and the wire clamp is provided with an insulating layer.
[0021] In this embodiment, by setting the wiring portion and wire clamp of the spring body to be exposed to the outside of the housing, it is convenient to route and fix the conductive wires. At the same time, an insulating layer is set in the hollow area to prevent the wire clamp and conductive wires from interfering with other structures inside the electronic device and to improve the reliability of the grounding connection.
[0022] In one possible implementation, the first extension is provided with a connecting portion, the connecting portion including a first connecting portion and a second connecting portion;
[0023] The first connecting portion extends along the first extension portion, and the second connecting portion is disposed on both sides of the first connecting portion along the extending direction of the first extension portion.
[0024] In this embodiment of the disclosure, by setting the connecting part to include a first connecting part and a second connecting part, with the second connecting part disposed on both sides of the first connecting part, the connection stability of the connecting part is improved, thereby improving the connection effect of the wire clamp on the connected component and the reliability of the conductive connection of the spring body.
[0025] In one possible implementation, the first connecting portion includes a limiting groove and / or a limiting hole;
[0026] The housing includes a limiting part, which is disposed in the limiting groove and / or a portion of the limiting part extends into the limiting hole.
[0027] In this embodiment of the disclosure, by setting the first connecting part as a limiting groove and / or a limiting hole, and setting the limiting part of the housing in the limiting groove and / or extending part of the limiting part into the limiting hole, the connection stability and reliability of the spring body are improved, and the grounding effect of the component to be connected is enhanced.
[0028] In one possible implementation, at least a portion of the edge of the first extension and / or at least a portion of the edge of the second extension are provided with limiting ribs.
[0029] In this embodiment of the disclosure, limiting ribs are provided at least a portion of the edges of the first extension and / or at least a portion of the edges of the second extension. The limiting ribs increase the bonding area of the spring body or allow it to be snapped together with other structures, thereby improving the connection reliability of the spring body.
[0030] In one possible implementation, the second connection portion includes a mounting hole for grounding connection. The mounting hole includes a first hole and a second hole. One of the two second connection portions is provided with the first hole, and the other second connection portion is provided with the second hole. The axis of the first hole and the axis of the second hole are parallel to each other.
[0031] The second hole and the limiting rib are embedded inside the box.
[0032] In this embodiment of the disclosure, by providing a first hole and a second hole for grounding connection, and embedding the second hole and the limiting rib into the box, the reliability of the spring body connection can be effectively improved.
[0033] In one possible implementation, the diameter of the first hole is smaller than the diameter of the second hole, and the second hole has a notch for forming a clearance area.
[0034] In this embodiment of the disclosure, by setting a notch on the second hole with a larger diameter, a clearance area is formed to avoid other structures, thereby preventing the spring body from affecting the normal operation of other structures and improving the reliability of the spring body connection.
[0035] In one possible implementation, the first extension and the second extension are parallel to each other.
[0036] In this embodiment, the first extension and the second extension are arranged in parallel, that is, there is a preset distance between the plane where the first extension is located and the plane where the second extension is located, so as to increase the bonding area of the first extension and the second extension to connect with other structures respectively, thereby improving the connection stability.
[0037] In one possible implementation, the spring body is deformed by stamping to form the wire clamp.
[0038] In this embodiment, the wire clamp is directly formed by stamping the spring body, which helps to simplify the production and assembly process. At the same time, integrating the wire clamp into the spring body as a single piece also reduces the space occupied inside the electronic device, thereby helping to achieve the compactness and miniaturization of the electronic device.
[0039] In one possible implementation, the housing and the spring body are connected by injection molding.
[0040] In this embodiment, the housing and the spring body are connected by injection molding, which simplifies the connection process and ensures high connection stability, thereby improving the stability and reliability of the housing grounding connection.
[0041] According to a second aspect of the present disclosure, an electronic device is provided, the electronic device including an audio module as described in the first aspect of the present disclosure.
[0042] In this embodiment of the disclosure, the electronic device includes the audio module described above. The wire clamp is deformed by the spring body, so that the original spring body has both the function of wire clamp and conductive connection. There is no need to set up a separate wire clamp and connect the wire clamp to the spring body, which simplifies the production and assembly process, helps to reduce production costs, and also improves the integration level of the audio module design, which is conducive to realizing the compactness and miniaturization of electronic devices.
[0043] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this disclosure. Attached Figure Description
[0044] The accompanying drawings, which are incorporated in and form a part of this specification, illustrate embodiments consistent with this disclosure and, together with the description, serve to explain the principles of this disclosure.
[0045] Figure 1 This is a three-dimensional structural schematic diagram of a box according to an exemplary embodiment.
[0046] Figure 2 This is a front view of the housing shown according to an exemplary embodiment.
[0047] Figure 3 This is a three-dimensional structural schematic diagram of the main body of the spring according to an exemplary embodiment.
[0048] Figure 4 yes Figure 3 A magnified view of a portion of region A in the middle.
[0049] Figure 5 This is a front view of the spring body shown according to an exemplary embodiment.
[0050] Figure 6 This is a comparison chart of antenna efficiency curves before and after the conductive wire is grounded using the spring body of the embodiment of this disclosure. Detailed Implementation
[0051] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numerals in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this disclosure. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this disclosure as detailed in the appended claims.
[0052] With the continuous development of electronic device technology, the design of electronic devices is increasingly trending towards miniaturization and integration. Consequently, the internal space of electronic devices is relatively limited, making them prone to interference with antenna signals, leading to reduced antenna efficiency and impacting the user's communication experience. Related technologies typically employ a combination of spring clips and wire clamps, connecting the wire clamp to the spring clip and the conductive wire to the wire clamp to achieve grounding. However, due to the limited internal space of electronic devices, this grounding solution is easily constrained by space limitations, resulting in poor grounding performance and significant interference with antenna signals. Furthermore, the manufacturing and assembly processes are relatively complex, leading to high production costs and hindering the improvement of production efficiency.
[0053] To address the aforementioned technical problems, this disclosure proposes an audio module and an electronic device. The audio module includes a housing, and a wire clamp is formed by deforming the original spring body of the housing. This allows the original spring body to serve both as an electrical connection and as a means of fixing conductive wires, improving the structural stability and reliability of the conductive connection of the audio module. Since there is no need to set up a separate wire clamp, the production and assembly process is simplified, which helps to reduce production costs. At the same time, integrating the wire clamp into the spring body also helps to reduce the space occupied inside the electronic device, thereby facilitating the compactness and miniaturization of the electronic device.
[0054] According to an exemplary embodiment, such as Figures 1-5 As shown, this embodiment of the disclosure provides an audio module, which includes a housing 41 and a wire clamp 30. The housing 41 includes a spring body 10, which can be a conductive spring made of metal or alloy materials such as steel or copper sheets. It is used to achieve a conductive connection between two conductive structures that need to be electrically connected, and can also be used to achieve a grounding connection. When the spring body 10 is used to achieve a grounding effect, it is a grounding spring. One end of the spring body 10 can be connected to a component to be connected (not shown in the figure), and the other end can be connected to the motherboard grounding point, mid-frame, or other structures of the electronic device, so as to achieve grounding of the component to be connected through the spring body 10. The component to be connected can be, for example, a microphone, speaker, antenna, or other structures that require grounding connection; this embodiment of the disclosure does not impose excessive limitations on this.
[0055] The wire clamp 30 is deformed by the spring body 10 and is used to install a conductive wire (not shown in the figure). The conductive wire can be a cable for transmitting signal data, or it can be used only for conductive connection between different components. Since the conductive wire is conductive, it will cause interference to the nearby antenna. The conductive wire is electrically connected to the spring body 10 through the wire clamp 30, and then the spring body 10 is used to ground the conductive wire, which can reduce the interference of the conductive wire to the antenna signal and improve the antenna performance.
[0056] like Figure 6 The figure shows a comparison of antenna efficiency curves before and after the conductive wire is grounded using the spring body 10 of this embodiment. Figure 6The horizontal axis represents the antenna frequency in GHz, and the vertical axis represents the antenna efficiency in dB. Curves a and b largely overlap, representing antenna efficiency curves under different wiring methods without grounding the spring body 10 according to this embodiment. Curves c and d largely overlap, representing antenna efficiency curves under different wiring methods after grounding the spring body 10 according to this embodiment. By comparing the curves, it can be seen that after grounding the conductive wire using the spring body 10 according to this embodiment, the antenna efficiency is significantly improved in the commonly used 1GHz~1.1GHz and 1.3GHz~1.4GHz frequency bands.
[0057] Furthermore, the wire clamp 30 is formed by the deformation of the spring body 10. For example, the wire clamp 30 can be formed by stamping or sheet metal processing of a portion of the spring body 10, making the wire clamp 30 and the spring body 10 an integral structure. Since the wire clamp 30 is formed by deforming the original spring body 10 in the audio module, the spring body 10 simultaneously has the functions of conductive connection and clamping and fixing conductive wires. This improves the reliability and structural stability of the grounding connection, and avoids the need for additional welding and bonding processes when the wire clamp 30 is set separately. This simplifies the production and assembly process, helps reduce production costs and assembly difficulty, improves assembly efficiency, and also reduces the internal space occupied by the electronic device, which is conducive to the compact and integrated design of the electronic device.
[0058] In this embodiment, the audio module includes a housing 41 and a wire clamp 30. The wire clamp 30 is formed by the deformation of the spring body 10, which improves the structural stability and reliability of the conductive connection of the audio module. Since the wire clamp 30 is integrally formed by the spring body 10, there is no need to set the wire clamp 30 separately and connect the wire clamp 30 to the spring body 10 by means of bonding, welding or other methods. This simplifies the production and assembly process, which helps to reduce production costs. At the same time, it also improves the integration level of the structural design of the spring body 10, which helps to reduce space occupation, thereby helping to achieve the compactness and miniaturization of electronic devices.
[0059] In some embodiments, the spring body 10 includes a first extension 11 and a second extension 12 connected together. The first extension 11 is provided with a connecting portion 111, and a wire clamp 30 is disposed on the second extension 12. The connecting portion 111 is used to connect with the component to be connected so as to ground the component to be connected through the spring body 10; the wire clamp 30 is used to fix the conductive wire and electrically connect it to the conductive wire so as to ground the conductive wire through the spring body 10.
[0060] In this embodiment, the connecting part 111 is disposed on the first extension 11 and the wire clamp 30 is disposed on the second extension 12. By separating the connecting part 111 and the wire clamp 30, mutual interference between the connecting part 111 and the wire clamp 30 is avoided, thereby improving the stability and reliability of the conductive connection of the spring body 10.
[0061] In some embodiments, the second extension 12 is provided with a wiring portion 121. For example... Figures 1-5 As shown, a wire clamp 30 is disposed at the wiring portion 121, and the conductive wire is electrically connected to the wiring portion 121 and the wire clamp 30. The wire clamp 30 is electrically connected to the wiring portion 121 to improve the stability and reliability of the electrical connection between the conductive wire and the spring body 10. The wiring portion 121 can be, for example, a groove formed on the second extension 12 to accommodate at least a portion of the conductive wire, thereby limiting the direction of the conductive wire. Of course, it is understood that the wiring portion 121 can also be a conductive layer disposed on the surface of the second extension 12, or it can be that no additional processing is applied to the wiring portion 121, and only a portion of the second extension 12 is used for the wiring arrangement. The extension direction of the wiring portion 121 can also be adjusted according to the wiring design requirements. This embodiment does not impose excessive restrictions on the form of the wiring portion 121.
[0062] In this embodiment of the present disclosure, the second extension 12 is provided with a wiring section 121, and the conductive wire is electrically connected to the wiring section 121 and the wire clamp 30. The wiring section 121 realizes the wiring arrangement of the conductive wire and the conductive connection between the conductive wire and the spring body 10, thereby improving the stability and reliability of the grounding of the conductive wire.
[0063] In some embodiments, the wire clamp 30 includes a first fixing part 31 and a second fixing part 32. For example... Figure 4 As shown, the first fixing part 31 and the second fixing part 32 are arranged opposite to each other, the wiring part 121 is configured as a groove, and the first fixing part 31 and the second fixing part 32 are respectively arranged on both sides along the extension direction of the wiring part 121, so as to fix the conductive wire by the joint clamping of the first fixing part 31 and the second fixing part 32, and at the same time limit the direction of the conductive wire.
[0064] In this embodiment of the present disclosure, the wire clamp 30 is configured to include a first fixing part 31 and a second fixing part 32 disposed opposite to each other. The first fixing part 31 and the second fixing part 32 jointly clamp and fix the conductive wire, which can limit the direction of the conductive wire and improve the fixing stability of the conductive wire and the reliability of the conductive connection.
[0065] In some embodiments, the wire clamp 30 further includes at least one bent section 301. For example... Figure 4As shown, the first fixing part 31 includes at least one bent section 301; and / or, the second fixing part 32 includes at least one bent section 301. The bent section 301 is used to limit the movement of the conductive wire.
[0066] In one example, the first fixing part 31 includes at least one bent segment 301. In another example, the second fixing part 32 includes at least one bent segment 301. In yet another example, both the first fixing part 31 and the second fixing part 32 include at least one bent segment 301. The number of bent segments 301 in the first fixing part 31 and / or the second fixing part 32 can be one or more segments; this embodiment does not impose excessive restrictions on the number of bent segments 301.
[0067] In one example, the number of bent segments 301 in the first fixing part 31 and / or the second fixing part 32 can be one segment. This not only limits the movement of the conductive wire but also eliminates the need for multiple processing steps to form multiple bent segments 301, thus simplifying the processing steps and reducing production costs. In another example, the number of bent segments 301 in the first fixing part 31 and / or the second fixing part 32 can also be multiple segments. Setting multiple bent segments 301 can improve the limiting effect on the conductive wire, thereby improving connection reliability.
[0068] In this embodiment of the present disclosure, by providing at least one bent section 301 through the first fixing part 31 and / or the second fixing part 32 of the wire clamp 30, the limiting effect of the wire clamp 30 on the conductive wire is improved, thereby improving the stability and reliability of the conductive connection between the spring body 10 and the conductive wire.
[0069] In some embodiments, the second extension 12 is provided with a hollowed-out area 122. For example... Figure 4 As shown, the wiring portion 121 is disposed in the hollow area 122. The hollow area 122 is used to accommodate the wire clamp 30 and the wiring portion 121, avoiding interference with the wire clamp 30 and the conductive wire. It is worth noting that before the hollow area 122 is formed on the spring body 10, at least a portion of the material in the corresponding area of the spring body 10 at this position can be formed into the wire clamp 30 by stamping.
[0070] In this embodiment of the present disclosure, by providing a hollow area 122 to accommodate the wire clamp 30 and the wiring portion 121, interference with the wire clamp 30 and the conductive wire can be avoided, thereby improving the stability and reliability of the conductive connection of the conductive wire.
[0071] In some embodiments, the connecting portion 111 includes a first connecting portion 112 and a second connecting portion 113. For example... Figures 1-5As shown, a first connecting portion 112 is disposed on the first extension portion 11, and a second connecting portion 113 is disposed on both sides of the first connecting portion 112 along the extending direction of the first extension portion 11. The connecting portion 111 is used to connect with the component to be connected, so that the component to be connected is grounded through the spring body 10. The first connecting portion 112 can be used to connect with the component to be connected, and the second connecting portion 113 can be used for grounding. The component to be connected can be, for example, a microphone, a speaker, an antenna, or other structures that require grounding connection; this embodiment does not impose excessive limitations on this.
[0072] In this embodiment of the present disclosure, by configuring the connecting portion 111 to include a first connecting portion 112 and a second connecting portion 113, with the second connecting portion 113 disposed on both sides of the first connecting portion 112, the connection stability of the connecting portion 111 is improved, thereby improving the grounding effect of the spring body 10 on the connected component and the reliability of the grounding connection.
[0073] In some embodiments, the first connecting portion 112 and the second connecting portion 113 may have various configuration methods.
[0074] In some embodiments, the first connecting portion 112 includes a limiting groove 1121 and / or a limiting hole 1122, the limiting groove 1121 and / or the limiting hole 1122 being used to connect with the component to be connected; and / or, the second connecting portion 113 includes a mounting hole, the mounting hole being used to realize a grounding connection. In this embodiment of the present disclosure, by setting the first connecting portion 112 as a limiting groove 1121 and / or a limiting hole 1122, and the second connecting portion 113 as a mounting hole, the reliability of the connection of the spring body 10 is improved, thereby improving the connection effect of the grounding connection.
[0075] In some embodiments, the first connecting portion 112 includes a limiting groove 1121 and / or a limiting hole 1122. In one example, the first connecting portion 112 includes a limiting groove 1121, through which the spring body 10 is connected to the component to be connected, improving the reliability of the connection between the spring body 10 and the component to be connected. In another example, the first connecting portion 112 includes a limiting hole 1122, through which the spring body 10 is connected to the component to be connected, improving the reliability of the connection between the spring body 10 and the component to be connected. In yet another example, the first connecting portion 112 includes a limiting groove 1121 and a limiting hole 1122, wherein the limiting groove 1121 and the limiting hole 1122 can be provided separately, or as shown in the figure. Figures 1-5 As shown, the limiting hole 1122 is provided in the limiting groove 1121 to increase the contact area between the first connecting part 112 and the part to be connected, thereby improving the connection reliability.
[0076] In some embodiments, the second connection portion 113 includes a mounting hole. The mounting hole is used to implement a grounding connection, and the mounting hole can be, for example, a slot in the shape of a round hole, a square hole, or the like.
[0077] In some embodiments, the first connecting portion 112 includes a limiting groove 1121 and a limiting hole 1122, and the second connecting portion 113 includes a mounting hole for implementing a grounding connection.
[0078] In this embodiment of the disclosure, by setting the first connecting part 112 as a limiting groove 1121 and / or a limiting hole 1122, and the second connecting part 113 including a mounting hole, the connection stability and reliability of the spring body 10 are improved, and the grounding effect of the component to be connected is enhanced.
[0079] In some embodiments, the second connecting portion 113 includes a mounting hole, which includes a first hole 1131 and a second hole 1132. In one example, the second connecting portion 113 includes a first hole 1131 and a second hole 1132, and the axes of the first hole 1131 and the second hole 1132 are parallel to each other. In this embodiment of the present disclosure, by providing the first hole 1131 and the second hole 1132 for grounding connection, the reliability of the grounding connection of the spring body 10 can be effectively improved.
[0080] In one example, the diameter of the first hole 1131 is smaller than the diameter of the second hole 1132. The second hole 1132 has a notch 1133, which is used to form a clearance area. The smaller diameter first hole 1131 can be grounded, for example, by fasteners such as screws or bolts (not shown in the figure), while the second hole 1132 can be used to fix it to the part to be connected. The clearance area formed by the notch 1133 can be used to avoid other structures, such as antennas, circuit boards, electronic devices, or functional modules, thereby preventing the spring body 10 from interfering with the normal operation of other structures.
[0081] In this embodiment of the disclosure, by setting a notch 1133 on the second hole 1132 with a larger diameter, a clearance area is formed to avoid other structures, thereby preventing the spring body 10 from affecting the normal operation of other structures and improving the reliability of the connection of the spring body 10.
[0082] In some embodiments, the second hole 1132 and the limiting rib 13 of the second connecting portion 113 of the spring body 10 are embedded in the interior of the housing 41; and / or, the housing 41 includes a limiting portion 43, which is disposed in the limiting groove 1121 of the spring body 10, and a portion of the structure of the limiting portion 43 extends into the limiting hole 1122 of the spring body 10.
[0083] In one example, the second hole 1132 and the limiting rib 13 of the second connecting part 113 of the spring body 10 are embedded into the inside of the housing 41, thereby increasing the bonding force between the second connecting part 113 and the housing 41 by increasing the bonding area, thereby improving the connection reliability between the spring body 10 and the housing 41.
[0084] In another example, the housing 41 includes a limiting part 43, which is disposed in the limiting groove 1121 of the spring body 10. Part of the structure of the limiting part 43 extends into the limiting hole 1122 of the spring body 10. Through the cooperation between the limiting part and the limiting groove 1121 and the limiting hole 1122, the bonding strength between the spring body 10 and the housing 41 is improved.
[0085] In another example, the second hole 1132 and the limiting rib 13 of the second connecting part 113 of the spring body 10 are embedded inside the housing 41. The housing 41 includes a limiting part 43, which is disposed in the limiting groove 1121 of the spring body 10. Part of the structure of the limiting part 43 extends into the limiting hole 1122 of the spring body 10, thereby improving the bonding force between the spring body 10 and the housing 41 and improving the connection reliability.
[0086] In this embodiment, a portion of the structure of the spring body 10 is embedded inside the housing 41, and / or a portion of the structure of the housing 41 extends into the limiting groove 1121 and the limiting hole 1122 of the spring. By increasing the bonding area, the bonding strength and reliability between the spring and the housing 41 are improved.
[0087] In some embodiments, the first extension 11 and the second extension 12 are parallel to each other. That is, as shown in the figure... Figures 1-5 As shown, there is a preset distance between the plane where the first extension 11 is located and the plane where the second extension 12 is located, so as to increase the bonding area of the first extension 11 and the second extension 12 to connect with other structures respectively, thereby improving the connection stability. Of course, it can be understood that when the bonding force requirement of the spring body 10 is low, the first extension 11 and the second extension 12 can also be set to be located on the same plane, and this embodiment does not impose too many restrictions on this.
[0088] In some embodiments, at least a portion of the edges of the first extension 11 and / or at least a portion of the edges of the second extension 12 are provided with limiting ribs 13. The limiting ribs 13 are used to increase the contact area between the spring body 10 and the component to be connected, or to engage with a limiting structure (not shown in the figure) on the component to be connected that mates with the limiting ribs 13. The limiting ribs 13 protrude from the edges of the spring body 10, and can also be bent at a preset angle to improve the connection effect.
[0089] The number of limiting ribs 13 can be one or more. When the number of limiting ribs 13 is multiple, they can be evenly distributed along at least part of the edge of the first extension 11 and / or at least part of the edge of the second extension 12, or they can be unevenly distributed. This embodiment does not impose too many restrictions on this.
[0090] In one example, the limiting rib 13 is disposed at least partially along the edge of the first extension 11. The limiting rib 13 may be disposed only in the area of the first extension 11 where the bonding strength needs to be improved, or it may be disposed uniformly or unevenly along the entire edge of the first extension 11, thereby improving the bonding force between the first extension 11 and the component to be connected. This disclosure does not impose too many limitations on this aspect.
[0091] In another example, the limiting rib 13 is provided at least part of the edge of the second extension 12. The limiting rib 13 may be provided only in the area of the edge of the second extension 12 where the bonding strength needs to be improved, or it may be provided uniformly or unevenly along the entire edge of the second extension 12, thereby improving the bonding force between the second extension 12 and the component to be connected.
[0092] In yet another example, the limiting rib 13 is provided at least part of the edge of the first extension 11 and at least part of the edge of the second extension 12 to improve the bonding force between the spring body 10 as a whole and the part to be connected.
[0093] In this embodiment of the present disclosure, limiting ribs 13 are provided at least a portion of the edges of the first extension 11 and / or at least a portion of the edges of the second extension 12. The limiting ribs 13 increase the bonding area of the spring body 10 or allow it to be snapped together with other structures, thereby improving the connection reliability of the spring body 10.
[0094] In some embodiments, the housing 41 and the spring body 10 are connected by injection molding. Connecting the housing 41 and the spring body 10 by injection molding has the advantages of simple process and high connection stability. Of course, it is understood that the housing 41 and the spring body 10 can also be connected by other methods such as bonding, snap-fitting, or integral molding; this disclosure does not impose excessive limitations on these methods.
[0095] In this embodiment, the housing 41 and the spring body 10 are connected by injection molding, which simplifies the connection process and provides high connection stability, thereby improving the stability and reliability of the housing grounding connection.
[0096] In some embodiments, such as Figures 1-5As shown, the wiring portion 121 and wire clamp 30 of the spring body 10 are exposed to the outside of the housing 41, and an insulating layer 42 is provided in the hollow area 122 around the wiring portion 121 and wire clamp 30. The wiring portion 121 and wire clamp 30 are set to be exposed to the outside of the housing 41 to facilitate the routing of conductive wires and the fixing of conductive wires by the wire clamp 30. The insulating layer 42 is used to provide insulation and prevent the wire clamp 30 and conductive wires from interfering with other structures inside the electronic device. The insulating layer 42 can be, for example, insulating foam, which provides insulation and a certain cushioning effect to prevent the spring body 10 from being damaged by collisions with other structures inside the electronic device.
[0097] In this embodiment, by setting the wiring portion 121 and the wire clamp 30 of the spring body to be exposed to the outside of the housing 41, it is convenient to route and fix the conductive wires. At the same time, an insulating layer 42 is provided in the hollow area 122 to prevent the wire clamp 30 and the conductive wires from interfering with other structures inside the electronic device and to improve the reliability of the grounding connection.
[0098] According to an exemplary embodiment, such as Figures 1-5 As shown, this disclosure provides an electronic device, such as a mobile terminal, tablet computer, or laptop computer. The electronic device includes an audio module as described in the above embodiments. The audio module includes a housing 41 and a wire clamp 30. The housing 41 includes a spring-loaded body 10, which is used to achieve conductive connection. The wire clamp 30 is shaped by the spring-loaded body 10 and is used to mount conductive wires.
[0099] In this embodiment, the electronic device includes the aforementioned audio module. The wire clamp 30 is deformed by the spring body 10, so that the original spring body has both the function of electrical connection and the function of fixing the conductive wire, which improves the structural stability of the spring body 10 and the reliability of grounding connection. There is no need to set up the wire clamp 30 separately and connect the wire clamp 30 to the spring body 10, which simplifies the production and assembly process, helps to reduce production costs, and also improves the integration level of the audio module design, which is conducive to realizing the compactness and miniaturization of electronic devices.
[0100] Other embodiments of this disclosure will readily occur to those skilled in the art upon consideration of the specification and practice of the utility models disclosed herein. This disclosure is intended to cover any variations, uses, or adaptations of this disclosure that follow the general principles of this disclosure and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this disclosure are indicated by the following claims.
[0101] It should be understood that this disclosure is not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this disclosure is limited by the appended claims.
Claims
1. An audio module, characterized by, include: The housing includes a spring-loaded body for achieving conductive connections; The wire clamp is shaped by the spring body and is used to install conductive wires.
2. The audio module of claim 1, wherein, The spring body includes a first extension and a second extension connected together, and the wire clamp is formed in the second extension.
3. The audio module of claim 2, wherein, The second extension is provided with a wiring section, the wire clamp is formed in the wiring section, and the conductive wire is electrically connected to the wiring section and the wire clamp.
4. The audio module of claim 3, wherein, The wire clamp includes a first fixing part and a second fixing part, which are disposed opposite to each other and are respectively disposed on both sides of the extension direction of the wire routing part.
5. The audio module of claim 4, wherein, The first fixing part includes at least one bent section; and / or, The second fixing part includes at least one bent section; The bent section is used to limit the position of the conductive wire.
6. The audio module of claim 3, wherein, The second extension has a hollow area, and the wiring part is disposed in the hollow area.
7. The audio module of claim 6, wherein, The wiring section and wire clamp are exposed to the outside of the housing, and the hollow area around the wiring section and wire clamp is provided with an insulating layer.
8. The audio module of claim 2, wherein, The first extension is provided with a connecting portion, which includes a first connecting portion and a second connecting portion; The first connecting portion extends along the first extension portion, and the second connecting portion is disposed on both sides of the first connecting portion along the extending direction of the first extension portion.
9. The audio module of claim 8, wherein, The first connecting part includes a limiting groove and / or a limiting hole; The housing includes a limiting part, which is disposed in the limiting groove and / or a portion of the limiting part extends into the limiting hole.
10. The audio module according to claim 8 or 9, characterized in that, Limiting ribs are provided on at least a portion of the edge of the first extension and / or at least a portion of the edge of the second extension.
11. The audio module of claim 10, wherein, The second connecting part includes a mounting hole for grounding connection. The mounting hole includes a first hole and a second hole. One of the two second connecting parts is provided with the first hole, and the other second connecting part is provided with the second hole. The axis of the first hole and the axis of the second hole are parallel to each other. The second hole and the limiting rib are embedded inside the box.
12. The audio module of claim 11, wherein, The diameter of the first hole is smaller than the diameter of the second hole, and the second hole has a notch, which is used to form a clearance area.
13. The audio module of any one of claims 2-9, wherein, The first extension and the second extension are parallel to each other.
14. The audio module of any one of claims 1-9, wherein, The spring body is deformed by stamping to form the wire clamp.
15. The audio module of any one of claims 1-9, wherein, The housing and the spring body are connected by injection molding.
16. An electronic device, comprising: The electronic device includes the audio module as described in any one of claims 1 to 15.