Multilayer heat conductive flexible wiring board
By setting heat-conducting pillars and heat sinks on the flexible circuit board, the problem of insufficient heat dissipation of the flexible circuit board is solved, achieving rapid heat dissipation and stable connection, and improving service life.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- ZHAOQING JIAMING ELECTRONICS CO LTD
- Filing Date
- 2025-07-11
- Publication Date
- 2026-07-31
AI Technical Summary
The lack of a heat dissipation structure in existing flexible circuit boards leads to increased surface temperature during use, affecting their service life.
Heat-conducting pillars and flexible heat sinks are set on the flexible circuit board. Heat is transferred to the heat sink by the heat-conducting pillars, and the heat dissipation area is increased by the arc-shaped protrusions. Stable connection is achieved with V-shaped spring sheets.
This technology enables rapid heat dissipation of flexible circuit boards, preventing high temperatures from affecting their lifespan and improving heat dissipation efficiency and stability.
Smart Images
Figure CN224583380U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of flexible circuit board technology, specifically relating to a multilayer thermally conductive flexible circuit board. Background Technology
[0002] Flexible printed circuit boards (FPCBs), also known as "flexible boards," are printed circuits made from flexible insulating substrates. Flexible circuits offer excellent electrical performance, meeting the design needs for smaller and higher-density installations, and also help reduce assembly steps and enhance reliability. FPCBs are the only solution for meeting the miniaturization and mobility requirements of electronic products. They can be freely bent, rolled, and folded, withstand millions of dynamic bends without damaging the wires, can be arranged arbitrarily according to spatial layout requirements, and can move and stretch freely in three-dimensional space, thereby achieving integration of component assembly and wire connection.
[0003] According to the multilayer thermally conductive flexible circuit board disclosed in patent number CN202320251392.3, it includes a board body, with contacts connected to both the left and right sides of the board body. A first clamping plate is overlapped on the lower surface of the board body, and there are two first clamping plates. A spring is fixedly connected to the upper surface of each of the two first clamping plates, and a second clamping plate is fixedly connected to the top of each of the two springs. The lower surfaces of the two second clamping plates overlap with the upper surface of the board body, and a rubber strip is fixedly connected between the two second clamping plates.
[0004] The above solution still has some drawbacks in use. Since no heat dissipation structure is set, and the flexible circuit board needs to carry a large current during use, the surface of the flexible circuit board will generate heat. After long-term use, the surface temperature of the flexible circuit board gradually increases, thus affecting its service life. Therefore, we propose a multi-layer thermally conductive flexible circuit board. Utility Model Content
[0005] The purpose of this invention is to provide a multilayer thermally conductive flexible circuit board to solve the existing problems mentioned in the background art.
[0006] To achieve the above objectives, this utility model provides the following technical solution: a multilayer thermally conductive flexible circuit board, comprising a flexible circuit board, thermally conductive pillars, and a flexible heat sink. Both sides of the flexible circuit board are covered with flexible plates. A circular through-slot is formed on the surface of the flexible plate, and a thermally conductive pillar is disposed inside the circular through-slot. One end of the thermally conductive pillar passes through the circular through-slot and is in close contact with the flexible circuit board. A flexible heat sink is disposed on the side of the flexible plate away from the flexible circuit board. The bottom of the flexible heat sink is tightly connected to the flexible plate. The thermally conductive pillar and the flexible heat sink are an integral structure. An arc-shaped protrusion is provided on the top surface of the flexible heat sink, and the arc-shaped protrusion evenly covers the surface of the flexible heat sink. The arc-shaped protrusion and the flexible heat sink are also an integral structure.
[0007] Preferably, a V-shaped spring sheet is provided at the middle of the outer periphery of the heat-conducting column, and one side of the V-shaped spring sheet is fixedly embedded in and fixedly connected to the outer peripheral surface of the heat-conducting column.
[0008] Preferably, a notch is provided at the middle of the inner part of the circular through groove. The position of the notch is opposite to the position of the V-shaped spring sheet. The side of the V-shaped spring sheet away from the heat-conducting column extends into the interior of the notch and is in close contact with its top wall.
[0009] Preferably, thermally conductive silicone grease is filled between the flexible board and the flexible circuit board, and the flexible board is tightly connected to the flexible circuit board through the thermally conductive silicone grease.
[0010] Preferably, one end of the flexible circuit board is provided with multiple line connectors, and the multiple line connectors are electrically connected to the flexible circuit board.
[0011] Preferably, one end of the flexible circuit board is provided with a few wire connectors, and the few wire connectors form an electrical connection with the flexible circuit board.
[0012] Compared with the prior art, the beneficial effects of this utility model are:
[0013] 1. By setting a flexible heat sink with heat-conducting pillars and arc-shaped protrusions on the outer periphery of the flexible circuit board, the heat-conducting pillars are used to transfer heat, so that the temperature on the flexible circuit board can be transferred to the flexible heat sink. The arc-shaped protrusions on the outer surface of the flexible heat sink are used to increase the surface area of the flexible heat sink, thereby improving the heat dissipation efficiency and achieving the purpose of quickly dissipating heat from the flexible circuit board.
[0014] 2. By creating a notch in the middle of the inner wall of the circular through groove on the flexible plate, and setting a V-shaped spring sheet in the middle of the outer periphery of the heat-conducting column, the elastic force of the V-shaped spring sheet is used to extend one end into the notch, so that the heat-conducting column can be stably connected to the flexible plate, thereby achieving the purpose of stably covering the flexible heat sink. Attached Figure Description
[0015] Figure 1 This is a schematic diagram of the overall structure of this utility model;
[0016] Figure 2 This is a schematic diagram of the cross-sectional structure of the flexible circuit board of this utility model;
[0017] Figure 3 For the present utility model Figure 2 A schematic diagram of the enlarged structure of A.
[0018] In the diagram: 1. Flexible circuit board; 2. Multi-line connector; 3. Few-line connector; 4. Thermal grease; 5. Flexible board; 6. Circular through-slot; 7. Notched slot; 8. Thermal pillar; 9. Flexible heat sink; 10. Arc-shaped protrusion; 11. V-shaped spring sheet. Detailed Implementation
[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0020] Please see Figure 1-3 This utility model provides a multi-layer thermally conductive flexible circuit board technical solution: including a flexible circuit board 1, heat-conducting pillars 8 and flexible heat sinks 9. Both sides of the flexible circuit board 1 are covered with flexible plates 5. A circular through groove 6 is opened on the surface of the flexible plate 5. A heat-conducting pillar 8 is arranged inside the circular through groove 6. One end of the heat-conducting pillar 8 passes through the circular through groove 6 and is in close contact with the flexible circuit board 1. A flexible heat sink 9 is arranged on the side of the flexible plate 5 away from the flexible circuit board 1. The bottom of the flexible heat sink 9 is tightly connected to the flexible plate 5. The heat-conducting pillars 8 and the flexible heat sink 9 are an integral structure. An arc-shaped protrusion 10 is arranged on the top surface of the flexible heat sink 9. The arc-shaped protrusion 10 is evenly covered on the surface of the flexible heat sink 9. The arc-shaped protrusion 10 and the flexible heat sink 9 are also an integral structure.
[0021] Specifically, a V-shaped spring sheet 11 is provided at the middle of the outer periphery of the heat-conducting column 8. One side of the V-shaped spring sheet 11 is fixedly embedded in the outer periphery surface of the heat-conducting column 8 and fixedly connected to it.
[0022] Specifically, a notch 7 is provided in the middle of the circular through groove 6. The position of the notch 7 is opposite to the position of the V-shaped spring plate 11. The side of the V-shaped spring plate 11 away from the heat-conducting column 8 extends into the interior of the notch 7 and is in close contact with its top wall.
[0023] Specifically, thermally conductive silicone grease 4 is filled between the flexible board 5 and the flexible circuit board 1, and the flexible board 5 is tightly connected to the flexible circuit board 1 through the thermally conductive silicone grease 4.
[0024] Specifically, one end of the flexible circuit board 1 is provided with a multi-line connector 2, which forms an electrical connection with the flexible circuit board 1.
[0025] Specifically, one end of the flexible circuit board 1 is provided with a few-line connector 3, which forms an electrical connection with the flexible circuit board 1.
[0026] In this embodiment, a flexible heat sink 9 is provided on the surface of the flexible circuit board 1, and a heat-conducting pillar 8 is used to make close contact with the flexible circuit board 1. Thermal grease 4 is then used to contact the heat-conducting pillar 8 and the flexible circuit board 1, thereby transferring the heat generated by the flexible circuit board 1 to the flexible heat sink 9 via the heat-conducting pillar 8. The arc-shaped protrusion 10 on the outer surface of the flexible heat sink 9 increases its surface area, thus improving its heat dissipation efficiency and achieving rapid heat dissipation of the flexible circuit board 1, preventing high temperatures from affecting its lifespan. A circular through-slot 6 is opened on the surface of the flexible board 5, and a notch 7 is opened in the inner wall of its middle section. A V-shaped spring 11 is provided in the middle of the outer periphery of the heat-conducting pillar 8. The elasticity of the V-shaped spring 11 allows one end of the V-shaped spring 11 to extend into the notch 7, thus achieving a fixed connection between the heat-conducting pillar 8 and the flexible board 5. Since the heat-conducting pillar 8 and the flexible heat sink 9 are an integral structure, this serves as a fixing plate for the flexible heat sink 9, improving its stability.
[0027] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, the phrase "comprising an element defined as..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.
[0028] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.
Claims
1. A multilayer heat conductive flexible wiring board comprising a flexible wiring board (1), a heat conductive pillar (8) and a flexible heat sink (9), characterized in that: Both sides of the flexible circuit board (1) are covered with flexible plates (5). A circular through groove (6) is opened on the surface of the flexible plate (5). A heat-conducting column (8) is arranged inside the circular through groove (6). One end of the heat-conducting column (8) passes through the circular through groove (6) and is in close contact with the flexible circuit board (1). A flexible heat sink (9) is arranged on the side of the flexible plate (5) away from the flexible circuit board (1). The bottom of the flexible heat sink (9) is tightly connected to the flexible plate (5). The heat-conducting column (8) and the flexible heat sink (9) are an integral structure. An arc-shaped protrusion (10) is arranged on the top surface of the flexible heat sink (9). The arc-shaped protrusion (10) is evenly covered on the surface of the flexible heat sink (9). The arc-shaped protrusion (10) and the flexible heat sink (9) are also an integral structure.
2. The multilayer heat conductive flexible wiring board according to claim 1, wherein: A V-shaped spring sheet (11) is provided at the middle of the outer periphery of the heat-conducting column (8). One side of the V-shaped spring sheet (11) is fixedly embedded in the outer periphery surface of the heat-conducting column (8) and fixedly connected to it.
3. The multilayer heat conductive flexible wiring board according to claim 1, wherein: The circular through groove (6) has a notch (7) at its middle. The position of the notch (7) is opposite to the position of the V-shaped spring sheet (11). The side of the V-shaped spring sheet (11) away from the heat-conducting column (8) extends into the interior of the notch (7) and is in close contact with its top wall.
4. The multilayer heat conductive flexible wiring board according to claim 1, wherein: Thermally conductive grease (4) is filled between the flexible board (5) and the flexible circuit board (1), and the flexible board (5) is tightly connected to the flexible circuit board (1) through the thermally conductive grease (4).
5. The multilayer heat conductive flexible wiring board according to claim 1, wherein: One end of the flexible circuit board (1) is provided with a multi-line connector (2), and the multi-line connector (2) is electrically connected to the flexible circuit board (1).
6. The multilayer thermal conductive flexible wiring board according to claim 1, wherein: One end of the flexible circuit board (1) is provided with a few-line connector (3), and the few-line connector (3) is electrically connected to the flexible circuit board (1).