Heat dissipation housing, domain controller, and vehicle

Abstract

A heat sink housing, a domain controller, and a vehicle are disclosed. The heat sink housing includes a first housing and a second housing. The first housing has a cooling cavity for coolant flow. The second housing is at least partially engaged with the first housing to form a receiving cavity for accommodating a circuit board. The first housing has a first water guide channel communicating with the receiving cavity. A drainage gap is formed between the sidewalls of the first and second housings facing each other, and the drainage gap communicates with the outside of the heat sink housing. The first water guide channel communicates with the drainage gap, enabling the condensate inside the heat sink housing to be discharged to the outside of the heat sink housing, thereby improving the reliability of the heat sink housing.

Description

Technical Field

[0001] This disclosure relates to the field of heat dissipation technology, and more particularly to a heat sink housing, a domain controller, and a vehicle. Background Technology

[0002] With the development of intelligent electric vehicles, domain controllers, as key computing units for realizing functions such as assisted driving, are typically cooled using liquid cooling. A domain controller consists of a circuit board and a heat sink housing. The circuit board is housed within the heat sink housing, which is equipped with a liquid cooling structure for heat dissipation.

[0003] However, due to the significant temperature difference between the gas inside the heat sink housing and the surface temperature of the liquid-cooled structure, condensation easily occurs when the hot, humid gas comes into contact with the low-temperature liquid-cooled surface. This condensate can drip onto the circuit board, causing a short circuit and potentially leading to malfunctions or even failure of some domain controller functions, severely impacting vehicle safety and reliability. Utility Model Content

[0004] To address the aforementioned technical issues, this disclosure provides a heat sink housing, a domain controller, and a vehicle, which can discharge condensate from inside the heat sink housing to the outside of the heat sink housing, thereby improving the reliability of the heat sink housing.

[0005] The first aspect of this disclosure provides a heat dissipation housing, comprising:

[0006] The first housing is provided with a cooling chamber for supplying coolant flow;

[0007] The second housing is at least partially engaged with the first housing to form a receiving cavity for accommodating the circuit board;

[0008] The first housing is provided with a first water guide groove that communicates with the receiving cavity. A drainage gap is formed between the side walls of the first housing and the second housing facing each other, and the drainage gap communicates with the outside of the heat dissipation housing.

[0009] The first water guide channel is connected to the drainage gap.

[0010] A second aspect of this disclosure provides a domain controller, comprising:

[0011] Circuit board;

[0012] The heat sink housing proposed in the first aspect of this disclosure has a circuit board located inside the heat sink housing and electrically connected to the heat sink housing.

[0013] A third aspect of this disclosure provides a vehicle comprising:

[0014] Vehicle body;

[0015] The domain controller proposed in the second aspect of this disclosure is disposed within the vehicle body, and the domain controller is disposed obliquely within the vehicle body.

[0016] The heat sink housing, domain controller, and vehicle disclosed herein utilize a first water guide groove provided in the first housing, which communicates with the receiving cavity. A drainage gap is formed between the sidewalls of the first and second housings facing each other, and the drainage gap connects to the outside of the heat sink housing. The first water guide groove connects to the drainage gap. Therefore, by providing the interconnected first water guide groove and drainage gap on the heat sink housing, multiple drainage channels are established on the outside of the receiving cavity and the heat sink housing. Each drainage channel includes a first water guide groove and a drainage gap, so that condensate dripping onto the circuit board or the inner wall of the first housing can be discharged to the outside of the heat sink housing along the first water guide groove and drainage gap. This prevents condensate from accumulating at the electrical connection between the circuit board and the heat sink housing and damaging electronic components, thereby improving the reliability of the heat sink housing. Attached Figure Description

[0017] Figure 1 This is an exploded structural diagram of the heat dissipation housing provided in an application scenario according to an exemplary embodiment of the present disclosure;

[0018] Figure 2 This is a schematic diagram of the structure of the first housing in a heat dissipation housing provided in an exemplary embodiment of the present disclosure;

[0019] Figure 3 yes Figure 2 An enlarged view of the structure at point A in the first housing shown;

[0020] Figure 4 This is a schematic diagram of the structure of the second housing in a heat dissipation housing provided in an exemplary embodiment of the present disclosure;

[0021] Figure 5 yes Figure 4 An enlarged structural diagram of point B in the second housing shown;

[0022] Figure 6 This is a cross-sectional structural diagram of the heat dissipation housing provided in an application scenario according to an exemplary embodiment of the present disclosure;

[0023] Figure 7 yes Figure 6 The diagram shows an enlarged structural schematic of the heat dissipation housing at point C in the application scenario.

[0024] Figure 8 This is a schematic diagram of the structure of a circuit board in a domain controller provided in an exemplary embodiment of this disclosure;

[0025] Figure 9 yes Figure 8 A magnified schematic diagram of the structure at point D on the circuit board shown.

[0026] Explanation of reference numerals in the attached figures:

[0027] 1000 - Domain controller; 100 - Heat sink housing; 200 - Circuit board;

[0028] 10-First housing; 20-Second housing; 101-Cooling chamber; 102-Water inlet; 103-Water outlet; 104-Condensate; 11-First water guide groove; 12-Boss; 1003-Groove; 1002-Drainage gap; 1001-Accommodation cavity; 14-First sidewall; 22-Inclined guide surface; 24-Second sidewall; 26, 27-Inclined surface; 21-Second water guide groove; 23-Inner bottom wall; 10a-Inner wall of the first housing; 20a-Outer wall of the second housing; 210-Conductive elastic element; 201-Device area; 202-Overlap area; 2101-Spring gap; 2102-Support column;

[0029] T1 - First direction; T2 - Second direction; T3 - Spacing direction; m - Inclination angle between the heat sink housing and the horizontal plane; n - Angle between the inclined guide surface and the inner bottom wall. Detailed Implementation

[0030] To explain this disclosure, exemplary embodiments of the disclosure will now be described in detail with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the disclosure, and not all of them. It should be understood that the disclosure is not limited to exemplary embodiments.

[0031] To enable those skilled in the art to better understand the technical solutions in this disclosure, the technical solutions in the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this disclosure, and not all embodiments. Based on the embodiments in this disclosure, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of this disclosure.

[0032] It should be noted that many specific details are set forth in the following description in order to provide a full understanding of this disclosure. However, this disclosure may also be implemented in other ways different from those described herein. Therefore, the scope of protection of this disclosure is not limited to the specific embodiments disclosed below.

[0033] In the description of this disclosure, it should be understood that the terms "horizontal," "bottom," "inner," "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this disclosure and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this disclosure.

[0034] In this disclosure, unless otherwise expressly specified and limited, the term "connection" should be interpreted broadly, for example, it can be a fixed connection, a detachable connection, or an integral part; it can be a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this disclosure according to the specific circumstances.

[0035] In this disclosure, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features.

[0036] Domain controllers, as key computing units for enabling functions such as driver assistance, typically consist of a circuit board and a heat sink. The circuit board is housed within the heat sink, which incorporates a liquid cooling structure for heat dissipation. A significant temperature difference exists between the gas temperature inside the heat sink and the surface temperature of the liquid-cooled structure. When the hot, humid gas comes into contact with the cold surface of the liquid-cooled structure, condensation easily occurs. Preventing this condensation from damaging the circuit board and other components is a pressing issue that needs to be addressed.

[0037] In related technologies, a waterproof coating is typically applied to the circuit board to prevent damage from condensation. However, the edge of the circuit board is electrically connected to the inner wall of the heat sink without a waterproof coating. As a result, condensation easily accumulates at the electrical connection point and cannot drain to the outside of the heat sink. Over time, this can lead to circuit board failure.

[0038] This disclosure provides a heat sink housing to prevent condensation from remaining on a circuit board and damaging the circuit board, thereby improving the reliability of the heat sink housing. Figure 1 This is an exploded structural diagram of the heat dissipation housing provided in an application scenario according to an exemplary embodiment of the present disclosure.

[0039] Reference Figure 1 As shown, in some examples of this disclosure, a heat dissipation housing 100 is provided. The heat dissipation housing 100 includes a first housing 10 and a second housing 20. The first housing 10 is provided with a cooling cavity 101 for supplying coolant flow. The first housing 10 and the second housing 20 are at least partially engaged to form a receiving cavity 1001 (see...). Figure 2 The accommodating cavity 1001 is used to accommodate the circuit board 200. The first housing 10 is provided with a first water guide groove 11 that communicates with the accommodating cavity 1001 (see...). Figure 2 A drainage gap 1002 is formed between the sidewalls of the first housing 10 and the second housing 20 facing each other, and the drainage gap 1002 is connected to the outside of the heat dissipation housing 100; the first water guide groove 11 is connected to the drainage gap 1002.

[0040] A portion of the outer wall of the cooling cavity 101 is in thermal contact with the electronic components on the circuit board 200. As the coolant flows through the cooling cavity 101, the heat from the electronic components is transferred to the coolant through the wall of the cooling cavity 101, thus dissipating heat from the electronic components. Another portion of the outer wall of the cooling cavity 101 is exposed and not in thermal contact with the electronic components, allowing it to come into contact with the gas inside the heat sink 100. However, because the cooling cavity 101 has a coolant flowing through it, the temperature of the outer wall of the cooling cavity 101 is relatively low. Therefore, the gas inside the heat sink 100 comes into contact with the exposed outer wall of the cooling cavity 101, causing condensation and forming condensate. Based on the heat dissipation housing 100 provided by this utility model, by setting a first water guide groove 11 and a drainage gap 1002 that are interconnected in the heat dissipation housing 100, multiple drainage channels are established between the accommodating cavity 1001 and the outside of the heat dissipation housing 100. Each drainage channel includes a first water guide groove 11 and a drainage gap 1002, so that condensate dripping onto the circuit board 200 or onto the inner wall of the first housing 10 can be discharged to the outside of the heat dissipation housing along the first water guide groove 11 and the drainage gap 1002, preventing condensate from remaining on the circuit board 200 and damaging the circuit board, thereby ensuring the normal function of the circuit board 200 and improving the reliability of the heat dissipation housing 100.

[0041] In some embodiments, a thermally conductive medium layer is further provided between the electronic device and the outer wall of the cooling cavity 101, and the electronic device and the outer wall of the cooling cavity 101 achieve thermal contact through the thermally conductive medium layer. In addition, the thermally conductive medium layer has high thermal conductivity, which is beneficial to improving the efficiency of heat transfer from the electronic device to the cooling cavity 101 through the thermally conductive medium layer.

[0042] Figure 2 This is a schematic diagram of the structure of the first housing in a heat dissipation housing provided in an exemplary embodiment of the present disclosure. Figure 3 yes Figure 2 The enlarged structural diagram of point A in the first housing shown.

[0043] Reference Figure 2 and Figure 3 As shown, the first water guide groove 11 can be formed between the bosses 12 of the first housing 10, and the bosses 12 protrude from the inner sidewall 10a of the first housing 10.

[0044] To facilitate the description of the positional relationship between the first housing 10 and the first water guide groove 11, the direction in which the boss 12 extends from the inner sidewall 10a of the first housing 10 to the accommodating cavity 1001 is denoted as the first direction T1 (the width direction of the heat dissipation housing 100), and the depth direction of the first housing 10 (the direction away from the second housing 20 when it is fastened with the second housing 20) is denoted as the second direction T2; the direction in which adjacent first water guide grooves 11 are spaced apart is denoted as the spacing direction T3.

[0045] Specifically, the first water guide channel 11 can be disposed between the bosses 12 in the following manner: the surface of the bosses 12 facing the second housing 20 in the second direction T2 can support the circuit board 200, the first water guide channel 11 is disposed between two adjacent bosses 12, and the two ends of the first water guide channel 11 along the first direction T1 are connected to the receiving cavity 1001 and the drainage gap 1002. That is, the first water guide channel 11 penetrates the bosses 12 along the first direction T1, so that condensate can flow through the first water guide channel 11 to the drainage gap 1002.

[0046] Wherein, the extension direction of the first water guide groove 11 is consistent with the first direction T1, so that the connection path between the accommodating cavity 1001 and the drainage gap 1002 is shorter, thus shortening the drainage path; or, the extension direction of the first water guide groove 11 intersects with the first direction T1, which can separate the position on the boss 12 used for electrical connection with the circuit board 200 and the position used to form the first water guide groove 11, which is conducive to the flexible arrangement of the first water guide groove 11.

[0047] In this disclosure, the extension direction of the first water guiding channel 11 can be understood as the flow direction of the condensate in the first water guiding channel 11. It should be noted that the actual flow direction of the condensate may deviate; here, the extension direction is only interpreted based on the theoretical flow direction of the condensate in the first water guiding channel 11.

[0048] In some embodiments, the first water guide groove 11 can be distributed in the first housing 10 in the following manner: the first housing 10 includes two intersecting first sidewalls 14, and the spacing of the first water guide groove 11 near the intersection of the two first sidewalls 14 is smaller than the spacing of the first water guide groove 11 away from the intersection of the two first sidewalls 14.

[0049] Since condensate is more likely to stagnate at the intersection of the two first sidewalls 14, the first water guide grooves 11 are arranged more densely near the intersection of the two first sidewalls 14 to create more drainage channels connecting to the outside of the heat dissipation housing 100 at the intersection of the two first sidewalls 14, so as to facilitate the discharge of condensate at the intersection to the outside of the heat dissipation housing 100 and optimize the layout of multiple drainage channels.

[0050] In this disclosure, the spacing dimension of the first water guiding channel 11 can be understood as the distance along the spacing direction T3 between the sidewalls of adjacent first water guiding channels 11 facing each other. Accordingly, the smaller the spacing dimension, the denser the distribution of the first water guiding channels 11; the larger the spacing dimension, the sparser the distribution of the first water guiding channels 11.

[0051] In some specific embodiments, as the distance between the first water guide channel 11 and the intersection of the two first sidewalls 14 increases, the interval size between each pair of adjacent first water guide channels 11 increases; or, the interval sizes within a first distance from the intersection of the two first sidewalls 14 are equal, and are denoted as the first interval size; the interval sizes outside the first distance from the intersection of the two first sidewalls 14 are equal, and are denoted as the second interval size, and the first interval size is smaller than the second interval size.

[0052] In other embodiments, the first water guide channels 11 can be distributed in the first housing 10 in such a way that the first housing 10 is provided with a water inlet 102, which communicates with the cooling chamber 101 and is used to supply coolant. The spacing of the first water guide channels 11 near the water inlet 102 is smaller than the spacing of the first water guide channels 11 away from the water inlet 102.

[0053] As the coolant flows into the cooling chamber 101, it exchanges heat with the circuit board 100, thus increasing its temperature. As the coolant temperature rises, the temperature of the outer wall of the cooling chamber 101 also increases. The closer to the inlet 12, the lower the temperature of the outer wall of the cooling chamber 101, resulting in more severe condensation and a larger volume of condensate. By setting the spacing of the first water guide channels 11 near the inlet 102 smaller than that far from the inlet 102, and by arranging the first water guide channels 11 more densely near the inlet 102, it is beneficial for condensate to drain to the outside of the heat sink 100, thus optimizing the layout of the first water guide channels 11.

[0054] In some embodiments, the technical solution of setting the interval size of the first water guide groove 11 near the water inlet 102 to be smaller than the interval size of the first water guide groove 11 far from the water inlet 102 can refer to the aforementioned embodiment of "setting the interval size of the first water guide groove 11 near the intersection of the two first side walls 14 to be smaller than the interval size of the first water guide groove 11 far from the intersection of the two first side walls 14", which will not be repeated here.

[0055] In this disclosure, the spacing size of the first water guide groove 11 can be determined comprehensively based on the temperature distribution of the cooling cavity 101 (e.g., the temperature is lower near the water inlet 102) and the structural characteristics of the heat dissipation shell 100 (e.g., condensate is easily retained at the intersection of the two first side walls 14). The embodiments of this disclosure do not limit the spacing size of the first water guide groove 11.

[0056] In some embodiments, the size of the first water guide channel 11 along the interval direction T3 is smaller than the preset critical radiation size.

[0057] Since a radiator can only be formed when the size of the first water guide channel along the interval direction T3 is greater than or equal to the preset critical radiation size, the size of the first water guide channel 11 along the interval direction T3 is set to be less than the preset critical radiation size, so that the first water guide channel 11 does not have a radiation function, thus ensuring the electromagnetic compatibility of the heat dissipation shell 100.

[0058] In some implementations, the preset critical radiation size is the ratio of the wavelength corresponding to the maximum operating frequency of the circuit board 200 to the preset critical value of radiation efficiency.

[0059] In this disclosure, the maximum operating frequency of the circuit board 200 is determined by the maximum operating frequency of the electronic devices thereon, and the embodiments of this disclosure do not limit the maximum operating frequency.

[0060] Figure 4 This is a schematic diagram of the structure of the second housing in a heat dissipation housing provided in an exemplary embodiment of the present disclosure. Figure 5 yes Figure 4 The enlarged structural diagram of point B in the second shell is shown.

[0061] Reference Figure 4 and Figure 5 As shown, in some embodiments, the second housing 20 is provided with a second water guide channel 21 that communicates with the receiving cavity 1001; the second water guide channel 21 is connected to the drainage gap 1002.

[0062] Because the heat sink 100 may be subjected to vibration during operation, condensate generated in the contact between the first housing 10 and the cooling chamber 101 may also flow to the second housing 20. By providing a second water guide groove 21 that communicates with the receiving chamber 1001 and the drainage gap 1002, multiple drainage channels are established in the area of ​​the receiving chamber 1001 corresponding to the second housing 20 and the outside of the heat sink 100. Each drainage channel includes a second water guide groove 21 and a drainage gap 1002, allowing condensate from the second housing 20 to be discharged along the second water guide groove 21 and the drainage gap 1002 to the outside of the heat sink 100, preventing condensate from remaining on the circuit board 200 and damaging the circuit board, and improving the reliability of the heat sink 100.

[0063] To facilitate the description of the positional relationship between the second housing 20 and the second water guide channel 21, similar to the first housing 10, the width direction of the second housing 20 is denoted as the first direction T1, and the depth direction of the second housing 20 (the direction away from the first housing 10 when the second housing 20 is fastened to the first housing 10) is denoted as the second direction T2; the direction in which adjacent second water guide channels 12 are spaced apart is the spacing direction T3.

[0064] In some embodiments, the end face of the second housing 20 facing the first housing 10 contacts the circuit board 200 to provide support for the circuit board 200. The second water guide groove 21 can be formed by the inward recess of the surface of the second housing 20 that contacts the circuit board 200, and its two ends along the first direction T1 are connected to the accommodating cavity 1001 and the drainage gap 1002. That is, the second water guide groove 21 penetrates the side wall of the second housing 20 along the first direction T1, so that condensate can flow through the second water guide groove 21 to the drainage gap 1002.

[0065] Wherein, the extension direction of the second water guide groove 21 is consistent with the first direction T1, so that the connection path between the accommodating cavity 1001 and the drainage gap 1002 is shorter, thus shortening the drainage path; or, the extension direction of the second water guide groove 21 intersects with the first direction T1, which can separate the position on the end face of the second housing 200 used for electrical connection with the circuit board 200 and the position used for forming the second water guide groove 21, which is conducive to the flexible layout of the second water guide groove 21.

[0066] In this disclosure, the extension direction of the second water guide channel 21 can be understood as the flow direction of condensate in the second water guide channel 21. It should be noted that the actual flow direction of condensate may deviate; here, the extension direction is only interpreted based on the theoretical flow direction of condensate in the second water guide channel 21.

[0067] In some embodiments, the second water guide grooves 21 can be distributed in the second housing 20 in such a way that the second housing 20 includes two intersecting second sidewalls 24, and the spacing of the second water guide grooves 21 near the intersection of the two second sidewalls 24 is smaller than the spacing of the second water guide grooves 21 away from the intersection of the two second sidewalls 24.

[0068] Because condensate tends to accumulate more easily at the intersection of the two second sidewalls 24, the amount of condensate at this intersection is higher. By densely arranging the second water guide channels 21 near the intersection of the two second sidewalls 24, more drainage channels are created, which facilitates the discharge of condensate from this intersection to the outside of the heat dissipation housing 100, thus optimizing the layout of multiple drainage channels.

[0069] In this disclosure, the spacing dimension of the second water guide channel 21 can be understood as the distance along the spacing direction T3 between the sidewalls of adjacent second water guide channels 21 facing each other. Accordingly, the smaller the spacing dimension, the denser the arrangement of the second water guide channels 21; the larger the spacing dimension, the sparser the arrangement of the second water guide channels 21.

[0070] In this disclosure, the technical solution of setting the interval size of the second water guide groove 21 near the intersection of the two second side walls 24 to be smaller than the interval size of the second water guide groove 21 far from the intersection of the two second side walls 24 can refer to the aforementioned embodiment of "setting the interval size of the first water guide groove 11 near the intersection of the two first side walls 14 to be smaller than the interval size of the first water guide groove 11 far from the intersection of the two first side walls 14", and will not be repeated here.

[0071] Figure 6 This is a cross-sectional structural diagram of the heat dissipation housing provided in an application scenario according to an exemplary embodiment of the present disclosure. Figure 7 yes Figure 6 The diagram shows an enlarged view of the heat dissipation housing at point C in the application scenario.

[0072] Reference Figure 6 and Figure 7 In one example shown, the second housing 20 is fastened within the first housing 10, forming a drainage gap 1002, and condensate 104 is exemplary distributed within the heat dissipation housing 100. Figure 7 The middle arrows a1, a2 and arrow a exemplarily illustrate the flow path of condensate 104 from the inside of the heat sink housing 100 to the outside of the heat sink housing 100.

[0073] In order to form a drainage gap 1002 between the sidewalls of the first housing 10 and the second housing 20 facing each other, some examples are given in this disclosure.

[0074] Reference Figure 6 and Figure 7 As shown, the first housing 10 and the second housing 20 are interlocked to form a drainage gap 1002 on their sidewalls facing each other.

[0075] In some embodiments, the opening of the drain gap 1002 faces downwards, allowing condensate within the drain gap 1002 to be directly discharged from the opening of the drain gap 1002 to the outside of the heat sink housing 100. In other embodiments, the opening of the drain gap 1002 faces upwards, requiring a drainage device to be provided. This drainage device is used to allow condensate within the heat sink housing 100 to overcome gravity and be discharged from the drain channel to the outside of the heat sink housing 100.

[0076] In this disclosure, the opening of the drainage gap 1002 is upward or downward, including: parallel to the direction of gravity; it may also include: relative to the horizontal direction α, the direction closer to the opposite direction of gravity is upward, and the direction closer to the direction of gravity is downward. Unless otherwise specified in the following paragraphs, "upward" or "downward" can be understood as described here.

[0077] Reference Figure 7As shown, in some embodiments, the inner wall of the second housing 20 is provided with an inclined guide surface 22, which is connected between the inner bottom wall 23 of the second housing 20 and the second water guide groove 21 of the second housing 20.

[0078] In this disclosure, the "inclination" in the inclined guide surface 22 can be understood as: the angle between the plane on which the inclined guide surface 22 is located and the plane on which the inner bottom wall 23 is located is an acute angle or an obtuse angle.

[0079] By providing an inclined guide surface 22 on the inner wall of the second housing 20, when the condensate flows from the inner bottom wall of the second housing 20 to the edge of the inner bottom wall, it can flow to the second water guide groove 21 under the guidance of the inclined guide surface 22, so that the condensate can be discharged to the outside of the heat dissipation housing 100 through the drainage channel formed by the second water guide groove 21 and the drainage gap 1002.

[0080] In some embodiments, the angle between the inclined guide surface 22 and the inner bottom wall 23 is an obtuse angle, and the inclined guide surface 22 connects the inner bottom wall 23 and the second water guide groove 21, making the channel between the inner bottom wall 23 and the second water guide groove 21 smoother. Based on the characteristic that droplets are more likely to linger at positions with smaller angles between the two planes, less energy is required for condensate to flow from the inner bottom wall 23 to the second water guide groove 21, which is beneficial for discharging condensate to the outside of the heat dissipation housing 100. This disclosure does not impose specific limitations on the size of the angle between the inclined guide surface 22 and the inner bottom wall 23.

[0081] Reference Figure 6 As shown, in some embodiments, the bottom wall of the second housing 20 is also provided with an inclined surface 26 (27), which intersects with the first direction T1 and is used to guide the condensate to flow to the second water guide groove 21.

[0082] In some embodiments, the inclined surface 26 is used for the heat dissipation housing 100 in Figure 6 The working position shown guides the condensate flow to the second water guide trough 21; or the inclined surface 27 is used for the heat dissipation housing 100 in... Figure 6 The working position shown after being upside down guides the condensate water to the second water guide tank 21.

[0083] In some embodiments, the technical solution of the inclined surface 26 (27) being provided on the inner bottom wall of the second housing 20 can refer to the aforementioned technical solution of "inclined guide surface 22", which will not be repeated here.

[0084] Reference Figure 2 or Figure 7 As shown, in some embodiments, the first housing 10 has a groove 1003 on the side wall corresponding to the drainage gap 1002, and the groove 1003 is connected to the outside of the first water guide groove 11 and the heat dissipation housing 100.

[0085] Since both the first water guide channel 11 and the second water guide channel 21 are connected to the drainage gap 1002, and the groove 1003 is connected to the outside of the first water guide channel 11 and the heat dissipation housing 100, the second water guide channel 21 is also connected to the groove 1003. By providing the groove 1003 on the side wall of the first housing 10 corresponding to the drainage gap 1002, the groove 1003 can also be used for condensate flow, thereby increasing the flow cross-sectional area of ​​the drainage gap 1002 in the drainage channel, thus improving the efficiency of draining condensate to the outside of the heat dissipation housing 100.

[0086] In this disclosure, the flow cross-sectional area is the cross-sectional area of ​​the inner contour of the groove 1003 perpendicular to the flow direction of the condensate within the groove 1003.

[0087] The groove 1003 extends along its own extension direction through the end face of the first housing 10 facing the second housing 20 and the first water guide groove 11. The groove 1003 extends to the end face of the first housing 10 facing the second housing 20 to connect to the outside of the heat dissipation housing 100.

[0088] In this disclosure, the extension direction of the groove 1003 can be understood as the flow direction of the condensate in the groove 1003. It should be noted that the actual flow direction of the condensate may deviate; here, the extension direction is only interpreted based on the theoretical flow direction of the condensate in the groove 1003.

[0089] In some embodiments, the extension direction of the groove 1003 is consistent with the second direction T2, so that the communication path between the first water guide groove 11 and the outside of the heat dissipation housing 100 is shorter, thus shortening the drainage path; or the extension direction of the groove 1003 intersects with the second direction T2, thereby improving the layout flexibility of the groove 1003.

[0090] In some embodiments, the dimension of the second water guide channel 21 along the spacing direction T3 is smaller than the preset critical radiation dimension.

[0091] Since a radiator can only be formed if the dimension of the second water guide trough 21 along the interval direction T3 is greater than or equal to the preset critical radiation dimension, the second water guide trough 21 is made to have no radiation function by setting the dimension of the second water guide trough 21 along the interval direction T3 to be less than the preset critical radiation dimension, thus ensuring the electromagnetic compatibility of the heat dissipation housing 100.

[0092] In this disclosure, the setting of the second water guide channel 21 with a dimension of less than the preset critical radiation dimension along the interval direction T3 can refer to the aforementioned implementation method of "setting the first water guide channel 11 with a dimension of less than the preset critical radiation dimension along the interval direction T3", and will not be repeated here.

[0093] Reference Figure 1As shown, based on the same concept, this disclosure also provides a domain controller 1000, which includes a circuit board 200 and a heat sink 100 of any of the foregoing embodiments. The circuit board 200 is located within the heat sink 100 and is electrically connected to the heat sink 100.

[0094] In some implementations, the circuit board 200 can serve as the core hardware carrier of the domain controller, and can be a printed circuit board (PCB), integrated circuit board, etc.

[0095] In some implementations, the circuit board 200 is electrically connected to the heat sink 100 to form a ground loop, ensuring electromagnetic compatibility (EMC).

[0096] In some examples, the edge of the circuit board 200 is rigidly connected to the heat sink 100. Alternatively, the edge of the circuit board 200 is electrically connected to the heat sink 100 using conductive foam; or, the edge of the circuit board 200 is electrically connected to the heat sink 100 using conductive adhesive.

[0097] The domain controller 1000 disclosed herein includes a heat sink housing 100 and a circuit board 200. By providing a first water guide groove 11 and a drainage gap 1002 that are interconnected on the heat sink housing 100, multiple drainage channels are established outside the accommodating cavity 1001 and the heat sink housing 100. Each drainage channel includes a first water guide groove 11 and a drainage gap 1002, so that condensate dripping onto the circuit board 200 or onto the inner wall of the first housing 10 can be discharged outside the heat sink housing along the first water guide groove 11 and the drainage gap 1002. This prevents condensate from accumulating at the electrical connection between the circuit board 200 and the heat sink housing 100 and damaging electronic components, ensuring the normal functioning of the circuit board 200, thereby improving the reliability of the domain controller 1000.

[0098] It should be noted that the domain controller 1000 is conceived in relation to the aforementioned heat sink 100 and has the same technical effects as the aforementioned heat sink 100. Technical features and implementation methods not described in this embodiment can be referred to the technical solution of the aforementioned heat sink 100, and will not be repeated here.

[0099] Figure 8 This is a schematic diagram of the structure of a circuit board in a domain controller provided in an exemplary embodiment of this disclosure.

[0100] Reference Figure 8As shown, the circuit board 200 includes a device area 201 and an overlap area 202. The overlap area 202 is located on the outer periphery of the device area 201. The device area 201 is provided with an insulating hydrophobic layer (not shown). The overlap area 202 is used to electrically overlap with the heat sink housing 100.

[0101] In the above scheme, the device area 201 for laying out electronic devices is provided with an insulating hydrophobic layer. The hydrophobic properties of the insulating hydrophobic layer can be used to guide condensate to the overlap area 202 of the circuit board 200, and then discharge it to the outside of the heat dissipation housing 100 through the drainage channel, so as to avoid condensate remaining in the device area 201 and damaging the electronic devices.

[0102] In some embodiments, the contact angle of the insulating hydrophobic layer is relatively large, so that condensate can flow and roll more easily in the device area 201. The contact angle can be understood as the angle between the tangent at the contact point between the condensate droplet on the insulating hydrophobic layer and the surface of the insulating hydrophobic layer, and the surface of the insulating hydrophobic layer. With a larger contact angle, condensate droplets falling onto the insulating hydrophobic layer are more likely to form water droplets and roll to the overlap area 202.

[0103] In some embodiments, the insulating hydrophobic layer may include, but is not limited to, being formed from one or more insulating hydrophobic materials such as parylene, fluorocarbon resin, or nano-silica modified epoxy resin. Parylene, fluorocarbon resin, or nano-silica modified epoxy resin are merely examples of materials for forming the insulating hydrophobic layer, and the embodiments of this disclosure do not limit the type of insulating hydrophobic layer.

[0104] Figure 9 yes Figure 8 A magnified schematic diagram of the structure at point D on the circuit board shown.

[0105] Reference Figure 8 and Figure 9 As shown, in some embodiments of this disclosure, the overlapping area 202 is provided with a conductive elastic element 210, which is used to abut against the inner wall of the first water channel 11.

[0106] In some embodiments, the conductive elastic element 210 is disposed on the side surface of the overlapping area 202 facing the first housing 10, and the conductive elastic element 210 and the first water guide groove 11 are correspondingly disposed in the interval direction T3, so as to realize that the conductive elastic element 210 abuts against the inner wall of the first water guide groove 11.

[0107] Specifically, for example, if the dimension of the conductive elastic element 210 along the second direction T2 is small compared to the dimension of the first water guiding groove 11 along the second direction T2, the deformation of the conductive elastic element 210 is small, and the conductive elastic element 210 abuts against the inner bottom wall of the first water guiding groove 11. Alternatively, if the dimension of the conductive elastic element 210 along the second direction T2 is large compared to the dimension of the first water guiding groove 11 along the second direction T2, the deformation of the conductive elastic element 210 is large, and the conductive elastic element 210 abuts against the inner bottom wall and part of the inner side wall of the first water guiding groove 11.

[0108] In this disclosure, the inner bottom wall of the first water guide channel 11 is the inner wall of the first water guide channel 11 in the second direction T2; the inner side wall of the first water guide channel 11 is the inner wall of the first water guide channel 11 in the interval direction T3.

[0109] Based on the domain controller 1000 provided in this disclosure: by providing a conductive elastic element 210 on the side of the overlap area 202 facing the first housing 10, the conductive elastic element 210 abuts against the inner wall of the first water guide groove 11, thereby destroying the slotted structure of the first water guide groove 11, so that the first water guide groove 11 cannot radiate, thus ensuring the electromagnetic compatibility of the heat dissipation housing 100.

[0110] In some embodiments, when the conductive elastic element 210 abuts against the first water guide groove 11, the outer contour dimension of the conductive elastic element 210 is smaller than the outer contour dimension of the first water guide groove 11 in the direction of condensate flow, so that the first water guide groove 11 is connected to the accommodating cavity 1001 and the drainage gap 1002.

[0111] Specifically, in some embodiments, when the conductive elastic element 210 abuts against the first water guide groove 11, the dimension of the conductive elastic element 210 along the interval direction T3 is smaller than the dimension of the first water guide groove 11 along the interval direction T3. Then there is a gap between the conductive elastic element 210 and the inner wall of the first water guide groove 11. This gap can be used for condensate to flow through, thereby realizing that the condensate is discharged to the outside of the heat dissipation housing 100 through the first water guide groove 11 and the drainage gap 1002.

[0112] In other embodiments, the conductive elastic element 210 is configured as a conductive sheet (see...). Figure 9 The conductive spring is deformed to create a gap 2101, through which condensate can flow. This allows condensate to flow through the first water guide groove 11 to the drain gap 1002 and finally be discharged to the outside of the heat dissipation housing 100.

[0113] The conductive spring can be formed by bending a conductive elastic plate in both directions along the second direction T2. ​​The gap 2101 of the spring connects the accommodating cavity 1001 and the drainage gap 1002. The size of the conductive spring in the second direction T2 matches the size of the first water guide groove 11 in the second direction T2, so that the conductive spring can abut against the circuit board 200 and the first water guide groove 11.

[0114] In some other embodiments of this disclosure, the conductive spring sheet is provided with a support post 2102. When the conductive spring sheet is deformed, the support post 2102 can support the bent conductive elastic plate, thereby improving the stability of the conductive spring sheet against the inner wall of the first water channel 11.

[0115] In this disclosure, since the conductive elastic element 210 can disrupt the slotted structure of the first water channel 11, preventing the first water channel 11 from radiating and thus ensuring the electromagnetic compatibility of the heat dissipation housing 100, the size design of the first water channel 11 is more flexible in the embodiment where the conductive elastic element 210 is provided.

[0116] Reference Figure 8 and Figure 9 As shown, in some other embodiments of this disclosure, the overlapping area 202 is provided with a conductive elastic element 210, which is used to abut against the inner wall of the second water channel 21.

[0117] Specifically, in some embodiments, the conductive elastic element 210 is disposed on the side surface of the overlapping area 202 facing the second housing 20, and the conductive elastic element 210 and the second water guide groove 21 are correspondingly disposed in the interval direction T3, so that the conductive elastic element 210 abuts against the inner wall of the second water guide groove 21.

[0118] The technical solution in which the conductive elastic element 210 is disposed on the side surface of the overlapping area 202 facing the second housing 20 and abuts against the second water guide groove 21, such as its position, size and structure, can refer to the implementation of the conductive elastic element 210 disposed on the side surface of the overlapping area 202 facing the first housing 10 and the first water guide groove 11, and will not be described again here.

[0119] Based on the domain controller 1000 provided in this disclosure: by providing a conductive elastic element 210 on the side of the overlap area 202 facing the second housing 20, the conductive elastic element 210 abuts against the inner wall of the second water channel 21, thereby destroying the slotted structure of the second water channel 21, so that the second water channel 21 cannot radiate, thus ensuring the electromagnetic compatibility of the heat dissipation housing 100.

[0120] In this disclosure, since the conductive elastic element 210 can disrupt the slotted structure of the second water channel 21, preventing the second water channel 21 from radiating and thus ensuring the electromagnetic compatibility of the heat dissipation housing 100, the size design of the second water channel 21 is more flexible in the embodiment where the conductive elastic element 210 is provided.

[0121] Reference Figure 1 As shown, based on the same concept, this disclosure also provides a vehicle, which includes a vehicle body and a domain controller 1000 of any of the foregoing embodiments. The domain controller 1000 is disposed obliquely within the vehicle body.

[0122] In some implementations, the domain controller 1000 is fixedly mounted relative to the vehicle body.

[0123] In the vehicle disclosed herein, the domain controller 1000 is tilted within the vehicle body, making it easier for condensate in the heat sink housing 100 of the domain controller 1000 to collect at the lower part of the heat sink housing 100 under gravity. Then, using multiple drainage channels connecting the accommodating cavity 1001 and the outside of the heat sink housing 100, the condensate is discharged to the outside of the heat sink housing 100, preventing condensate from remaining on the circuit board 200 and damaging the circuit board, ensuring the normal functioning of the circuit board 200, improving the reliability of the domain controller 1000, and thus improving the reliability of the vehicle.

[0124] It should be noted that the vehicle is conceived in relation to the aforementioned domain controller 1000 and has the same technical effects as the aforementioned domain controller 1000. Technical features and implementation methods not described in this embodiment can be referred to the technical solution of the aforementioned domain controller 1000, and will not be repeated here.

[0125] In this disclosure, "domain controller 1000 tilt setting" can be understood as: the heat sink housing 100 is tilted relative to the horizontal plane in the working position.

[0126] It should be noted that the various implementations of the heat dissipation housing provided in the above embodiments can be combined according to the actual application scenario, and the various implementations of the domain controller provided in the above embodiments can be combined according to the actual application scenario.

[0127] Various modifications and variations can be made to this disclosure without departing from its spirit and scope. Therefore, this disclosure is also intended to include such modifications and variations if they fall within the scope of the claims of this disclosure and their equivalents.

Claims

1. A heat dissipation housing, characterized in that, include: The first housing has a cooling chamber for supplying coolant flow. The second housing is at least partially engaged with the first housing to form a receiving cavity for accommodating a circuit board; The first housing is provided with a first water guide groove that communicates with the accommodating cavity, and a drainage gap is formed between the side walls of the first housing and the second housing facing each other, the drainage gap communicating with the outside of the heat dissipation housing; The first water guide channel is connected to the drainage gap.

2. The heat dissipating enclosure of claim 1, wherein, The second housing is provided with a second water guide groove that communicates with the accommodating cavity; the second water guide groove is connected to the drainage gap.

3. The heat dissipating enclosure of claim 2, wherein, The first housing includes two intersecting first sidewalls, and the spacing of the first water guide grooves near the intersection of the two first sidewalls is smaller than the spacing of the first water guide grooves away from the intersection of the two first sidewalls. And / or, The second housing includes two intersecting second sidewalls, and the spacing of the second water guide grooves near the intersection of the two second sidewalls is smaller than the spacing of the second water guide grooves away from the intersection of the two second sidewalls.

4. The heat dissipating enclosure of claim 1, wherein, The first housing is provided with a water inlet, which is connected to the cooling chamber and is used to supply the coolant to flow in; The spacing between the first water guide channels near the water inlet is smaller than the spacing between the first water guide channels far from the water inlet.

5. The heat dissipating housing according to any one of claims 1 to 4, characterized in that The inner wall of the second housing is provided with an inclined guide surface, which is connected between the inner bottom wall of the second housing and the second water guide groove of the second housing.

6. The heat dissipating housing according to any one of claims 1 to 4, characterized in that The first housing has a groove on its side wall corresponding to the drainage gap, and the groove is connected to the outside of the first water guide groove and the heat dissipation housing.

7. The heat dissipating enclosure of claim 2 or 3, wherein, The dimensions of the first water guide channel and / or the second water guide channel along the interval direction are smaller than the preset critical radiation dimension; The preset critical radiation size is the ratio of the wavelength corresponding to the maximum operating frequency of the circuit board to the preset critical value of radiation efficiency.

8. A domain controller, characterized by include: Circuit board; The heat dissipation housing as described in any one of claims 1 to 7, wherein the circuit board is located inside the heat dissipation housing and is electrically connected to the heat dissipation housing.

9. The domain controller of claim 8, wherein, The circuit board includes a device area and a bonding area. The bonding area is located on the outer periphery of the device area and the device area is provided with an insulating hydrophobic layer. The bonding area is used for electrical bonding with the heat sink housing.

10. The domain controller of claim 9, wherein, The overlapping area is provided with a conductive elastic element, which is used to abut against the inner wall of the first water guide channel and / or the inner wall of the second water guide channel.

11. The domain controller of claim 10, wherein, The conductive elastic element is a conductive spring sheet.

12. A vehicle, characterized in that, include: Vehicle body; A domain controller as described in any one of claims 8 to 11 is disposed within the vehicle body, the domain controller being disposed obliquely within the vehicle body.

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