A graphene copper PCB board

Abstract

The utility model relates to a kind of graphene copper PCB, including the laminar arrangement of several composite conductive layers and several semi-solidified sheets, the composite conductive layer includes the laminar arrangement of several graphene conductive layers and several copper conductive layers, and the graphene conductive layer at least one side is attached to the copper conductive layer.

Description

Technical Field

[0001] This utility model relates to the field of circuit boards, and in particular to a graphene copper PCB board. Background Technology

[0002] Existing PCBs mainly consist of prepreg and circuit layers, with copper foil being the primary material for the circuit layers. Due to the roughness of copper foil, it is prone to the skin effect, which causes current to tend to flow on the surface of the circuit layer rather than being evenly distributed across the entire longitudinal section of the circuit layer. This results in an increase in the effective resistance of the circuit layer and an increase in energy consumption.

[0003] The skin effect is particularly pronounced when transmitting high-frequency signals through the circuit layer, and the higher the signal frequency, the more severe the skin effect. Furthermore, the rising and falling edges of high-frequency signals may be distorted due to resistance changes caused by the skin effect, increasing the bit error rate and affecting data transmission accuracy. The increased resistance caused by the skin effect also leads to increased heat generation in the circuit layer, causing overheating and further impacting the efficiency and stability of the PCB board. In some circuit boards with extremely high signal quality requirements, such as RF circuit boards and high-speed communication circuit boards, the skin effect is one of the main factors affecting and limiting the performance of the circuit board. Utility Model Content

[0004] Therefore, it is necessary to provide a graphene copper PCB board to address the problem of insufficient high-frequency signal transmission capability of existing PCB boards.

[0005] A graphene copper PCB board includes a plurality of composite conductive layers and a plurality of prepregs arranged in layers. The composite conductive layers include a plurality of graphene conductive layers and a plurality of copper conductive layers arranged in layers, and at least one side of the graphene conductive layer is attached to the copper conductive layer.

[0006] In some embodiments, at least a portion of the graphene conductive layer is grown on the copper conductive layer via chemical vapor deposition.

[0007] In some embodiments, the prepreg is made of fiberglass cloth, nonwoven fabric or wood pulp paper, and the thickness of the prepreg is 50μm-228μm.

[0008] In some embodiments, the thickness of the copper conductive layer is 4μm-100μm.

[0009] In some embodiments, the number of composite conductive layers is 1 to 16, and the composite conductive layers and the prepreg are arranged alternately.

[0010] In some embodiments, the number of copper conductive layers in a single composite conductive layer is 5 to 20, and the graphene conductive layers and the copper conductive layers are alternately arranged.

[0011] In some embodiments, in a single composite conductive layer, the number of copper conductive layers is 9 to 10, the thickness of the copper conductive layers is 6 μm to 7 μm, and the thickness of the graphene conductive layers is 0.34 nm to 0.68 nm.

[0012] In some embodiments, in a single composite conductive layer, the number of copper conductive layers is 5 to 6, the thickness of the copper conductive layers is 90 μm to 100 μm, and the thickness of the graphene conductive layers is 1.36 nm to 1.7 nm.

[0013] In some embodiments, in a single composite conductive layer, the number of copper conductive layers is 19-20, the thickness of the copper conductive layers is 4μm-4.5μm, and the thickness of the graphene conductive layers is 2.34nm-2.72nm.

[0014] In some embodiments, the composite conductive layer and the prepreg are joined by thermocompression.

[0015] The beneficial effects of this utility model are as follows:

[0016] This invention introduces a graphene conductive layer outside the copper conductive layer. Based on the excellent conductivity of graphene, the graphene conductive layer can effectively improve the overall conductivity of the composite conductive layer and reduce the skin effect caused during high-frequency signal transmission.

[0017] Furthermore, graphene's excellent thermal conductivity also enables the graphene conductive layer to improve the overall heat dissipation capacity of the composite conductive layer, reduce the additional resistance generated by the increased temperature of the composite conductive layer, further improve signal transmission stability, and reduce losses.

[0018] In addition, the excellent mechanical properties of graphene itself can minimize or avoid the adverse effects of introducing a graphene conductive layer on the overall mechanical properties of the graphene copper PCB board. In some cases, the introduction of a graphene conductive layer can even further improve the overall mechanical properties of the graphene copper PCB board. Attached Figure Description

[0019] Figures 1-4 These are schematic diagrams of the graphene copper PCB board in different embodiments of this utility model;

[0020] Figures 5-11 This is a schematic diagram of the composite conductive layer in different embodiments of this utility model.

[0021] Figure label:

[0022] 1. Composite conductive layer; 11. Graphene conductive layer; 12. Several copper conductive layers; 2. Prepreg. Detailed Implementation

[0023] To make the above-mentioned objects, features, and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a full understanding of this utility model. However, this utility model can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this utility model. Therefore, this utility model is not limited to the specific embodiments disclosed below.

[0024] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0025] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this utility model, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0026] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0027] In this utility model, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0028] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0029] This application provides a graphene copper PCB board, including a plurality of composite conductive layers 1 and a plurality of prepreg sheets 2 arranged in layers. The specific stacking arrangement of the composite conductive layers 1 and the prepreg sheets 2 is not particularly limited. The composite conductive layers 1 and the prepreg sheets 2 can be arranged in an alternating manner.

[0030] like Figure 1 As shown, in some embodiments, there is one composite conductive layer 1 and one prepreg 2. The composite conductive layer 1 can be laminated onto the surface of the prepreg 2 by, for example, lamination or hot pressing. In this embodiment, the top layer of the graphene copper PCB board is the composite conductive layer 1, and the bottom layer is the prepreg 2.

[0031] like Figure 2 As shown, in some embodiments, there are two composite conductive layers 1 and one prepreg 2. The two composite conductive layers 1 can be laminated on both sides of the prepreg 2 by means of, for example, lamination or hot pressing. In this embodiment, the top and bottom layers of the graphene copper PCB board are both composite conductive layers 1.

[0032] like Figure 3 As shown, in some embodiments, there are three composite conductive layers 1 and two prepreg sheets 2. The composite conductive layers 1 and prepreg sheets 2 can be alternately arranged, for example, by lamination or hot pressing. In this embodiment, the top and bottom layers of the graphene copper PCB board are both composite conductive layers 1.

[0033] like Figure 4As shown, in some embodiments, there are three composite conductive layers 1 and three prepreg sheets 2. The composite conductive layers 1 and prepreg sheets 2 can be alternately arranged, for example, by lamination or hot pressing. In this embodiment, the uppermost layer of the graphene copper PCB board is the composite conductive layer 1, and the lowermost layer of the graphene copper PCB board is the prepreg sheet 2.

[0034] like Figure 5 As shown, in a portion of the embodiments, the single composite conductive layer 1 contains one graphene conductive layer 11 and one copper conductive layer 12. The graphene conductive layer 11 can be deposited on the upper surface of the copper conductive layer 12, for example, by spraying or chemical vapor deposition. Since the copper conductive layer 12 has catalytic activity for graphene growth, when the graphene conductive layer 11 is grown on the copper conductive layer 12 by chemical vapor deposition, the connection strength between the graphene conductive layer 11 and the copper conductive layer 12 can be sufficiently guaranteed, reducing the contact resistance between them. In this portion of the embodiments, the uppermost layer of the composite conductive layer 1 is the graphene conductive layer 11, and the lowermost layer is the copper conductive layer 12.

[0035] like Figure 6 As shown, in a portion of the embodiments, in a single composite conductive layer 1, there are two graphene conductive layers 11 and two copper conductive layers 12. The two graphene conductive layers 11 are stacked between the two copper conductive layers 12; in other words, the graphene conductive layers 11 and the copper conductive layers 12 are not arranged in an alternating manner. For example, the two graphene conductive layers 11 are grown on the two copper conductive layers 12 respectively by chemical vapor deposition, and the two graphene conductive layers 11 are connected by vacuum hot pressing sintering. In this portion of the embodiments, the uppermost and lowermost layers of the composite conductive layer 1 are both copper conductive layers 12.

[0036] like Figure 7 As shown, in a portion of the embodiments, a single composite conductive layer 1 contains one graphene conductive layer 11 and two copper conductive layers 12, with the two copper conductive layers 12 respectively deposited on opposite sides of the graphene conductive layer 11. Exemplarily, the graphene conductive layer 11 is grown on one of the copper conductive layers 12 by chemical vapor deposition, while the other copper conductive layer 12 is connected to the graphene conductive layer 11 by vacuum hot pressing sintering. In this portion of the embodiments, both the uppermost and lowermost layers of the composite conductive layer 1 are copper conductive layers 12.

[0037] like Figure 8As shown, in a portion of the embodiments, the single composite conductive layer 1 contains three graphene conductive layers 11 and two copper conductive layers 12, with the graphene conductive layers 11 and copper conductive layers 12 arranged alternately. The graphene conductive layers 11 can be directly grown on the copper conductive layers 12 by chemical vapor deposition, or they can be connected to the copper conductive layers 12 by coating, spraying, or screen printing. In this portion of the embodiments, the uppermost and lowermost layers of the composite conductive layer 1 are both graphene conductive layers 11.

[0038] like Figure 9 As shown, in a portion of the embodiments, in a single composite conductive layer 1, there are two graphene conductive layers 11 and three copper conductive layers 12, arranged alternately. The graphene conductive layers 11 can be directly grown on the copper conductive layers 12 by chemical vapor deposition, or they can be connected to the copper conductive layers 12 by coating, spraying, or screen printing. In this portion of the embodiments, the uppermost and lowermost layers of the composite conductive layer 1 are both copper conductive layers 12.

[0039] like Figure 10 As shown, in a portion of the embodiments, in a single composite conductive layer 1, there are two graphene conductive layers 11 and two copper conductive layers 12, arranged alternately. The graphene conductive layers 11 can be directly grown on the copper conductive layers 12 by chemical vapor deposition, or they can be connected to the copper conductive layers 12 by coating, spraying, or screen printing. In this portion of the embodiments, the uppermost layer of the composite conductive layer 1 is the graphene conductive layer 11, and the lowermost layer of the composite conductive layer 1 is the copper conductive layer 12.

[0040] like Figure 11 As shown, in a portion of the embodiments, the single composite conductive layer 1 contains two graphene conductive layers 11 and two copper conductive layers 12. The two copper conductive layers 12 are disposed between the two graphene conductive layers 11. The two graphene conductive layers 11 can be directly grown on the copper conductive layers 12 by chemical vapor deposition. In this portion of the embodiments, the uppermost and lowermost layers of the composite conductive layer 1 are both graphene conductive layers 11.

[0041] For example, the thickness of the copper conductive layer 12 is 4μm-100μm.

[0042] Example 1:

[0043] This embodiment provides a graphene copper PCB board, including a composite conductive layer 1 and a prepreg 2 arranged in layers. The composite conductive layer 1 is disposed on the upper surface of the prepreg 2 and bonded together by hot pressing using a laminator.

[0044] The composite conductive layer 1 comprises five graphene conductive layers 11 and five copper conductive layers 12, which are staggered and stacked. In other words, a copper conductive layer 12 is disposed between two adjacent graphene conductive layers 11, and a graphene conductive layer 11 is disposed between two adjacent copper conductive layers 12. The copper conductive layer 12 has a thickness of 100 μm, the graphene conductive layer 11 has a thickness of 1.36 nm-1.7 nm, and the prepreg 2 is made of glass fiber cloth with a thickness of 135 μm.

[0045] The preparation method of the composite conductive layer 1 in this embodiment is as follows: A copper conductive layer 12 is placed in a vacuum tube, and a graphene conductive layer 11 is grown on one side of the copper conductive layer 12 by chemical vapor deposition, thereby forming a repeating unit; five repeating units are prepared and stacked, and then connected together by vacuum hot pressing sintering process. In this embodiment, the graphene conductive layer 11 is grown using a roll-to-roll dynamic continuous growth process, with a hydrogen flow rate of 100 sccm, a methane flow rate of 150 sccm, a growth rate of 1 meter / minute, and a temperature of 1000℃.

[0046] During vacuum hot pressing, the copper grains will further increase in size, thereby further improving its electrical conductivity.

[0047] Example 2:

[0048] This embodiment provides a graphene copper PCB board, including four composite conductive layers 1 and three prepreg sheets 2 arranged in layers. The composite conductive layers 1 and the prepreg sheets 2 are stacked alternately, that is, a prepreg sheet 2 is disposed between two adjacent composite conductive layers 1, and a composite conductive layer 1 is disposed between two adjacent prepreg sheets 2. The composite conductive layers 1 and the prepreg sheets 2 are bonded together by hot pressing with a vacuum hot press.

[0049] The composite conductive layer 1 comprises eight graphene conductive layers 11 and eight copper conductive layers 12, which are staggered and stacked. In other words, a copper conductive layer 12 is disposed between two adjacent graphene conductive layers 11, and a graphene conductive layer 11 is disposed between two adjacent copper conductive layers 12. The thickness of the copper conductive layer 12 is 50 μm, the thickness of the graphene conductive layer 11 is 1.02 nm–1.36 nm, and the prepreg 2 is made of glass fiber cloth with a thickness of 122 μm.

[0050] The preparation method of the composite conductive layer 1 in this embodiment is as follows: A copper conductive layer 12 is placed in a vacuum tube, and a graphene conductive layer 11 is grown on one side of the copper conductive layer 12 by chemical vapor deposition, thereby forming a repeating unit; eight repeating units are prepared and stacked, and then connected together by vacuum hot pressing sintering process. In this embodiment, the graphene conductive layer 11 is grown using a roll-to-roll dynamic continuous growth process, with a hydrogen flow rate of 100 sccm, a methane flow rate of 120 sccm, a growth rate of 1.5 m / min, and a temperature of 1000℃.

[0051] Example 3:

[0052] This embodiment provides a graphene copper PCB board, comprising sixteen composite conductive layers 1 and fifteen prepreg sheets 2 arranged in layers. The composite conductive layers 1 and the prepreg sheets 2 are staggered and stacked, that is, a layer of prepreg sheet 2 is disposed between two adjacent composite conductive layers 1, and a layer of composite conductive layer 1 is disposed between two adjacent prepreg sheets 2. The composite conductive layers 1 and the prepreg sheets 2 are bonded together by hot pressing with a vacuum hot press.

[0053] The composite conductive layer 1 comprises ten graphene conductive layers 11 and ten copper conductive layers 12, which are staggered and stacked. In other words, a copper conductive layer 12 is disposed between two adjacent graphene conductive layers 11, and a graphene conductive layer 11 is disposed between two adjacent copper conductive layers 12. The thickness of the copper conductive layer 12 is 7 μm, the thickness of the graphene conductive layer 11 is 0.34 nm-0.68 nm, and the prepreg 2 is made of non-woven fabric with a thickness of 74 μm.

[0054] The preparation method of the composite conductive layer 1 in this embodiment is as follows: A copper conductive layer 12 is placed in a vacuum tube, and a graphene conductive layer 11 is grown on one side of the copper conductive layer 12 by chemical vapor deposition, thereby forming a repeating unit; ten repeating units are prepared and stacked, and then connected together by vacuum hot pressing sintering process. In this embodiment, the graphene conductive layer 11 is grown using a roll-to-roll dynamic continuous growth process, with a hydrogen flow rate of 100 sccm, a methane flow rate of 100 sccm, a growth rate of 2 m / min, and a temperature of 1000℃.

[0055] Example 4:

[0056] This embodiment provides a graphene copper PCB board, including eight composite conductive layers 1 and seven prepreg sheets 2 arranged in layers. The composite conductive layers 1 and prepreg sheets 2 are stacked alternately, that is, a layer of prepreg sheet 2 is disposed between two adjacent composite conductive layers 1, and a layer of composite conductive layer 1 is disposed between two adjacent prepreg sheets 2. The composite conductive layers 1 and prepreg sheets 2 are bonded together by hot pressing with a vacuum hot press.

[0057] The composite conductive layer 1 comprises twenty graphene conductive layers 11 and twenty copper conductive layers 12, which are staggered and stacked. In other words, a copper conductive layer 12 is disposed between two adjacent graphene conductive layers 11, and a graphene conductive layer 11 is disposed between two adjacent copper conductive layers 12. The thickness of the copper conductive layer 12 is 4.5 μm, the thickness of the graphene conductive layer 11 is 2.34 nm-2.72 nm, and the prepreg 2 is made of glass fiber cloth with a thickness of 185 μm.

[0058] The preparation method of the composite conductive layer 1 in this embodiment is as follows: A copper conductive layer 12 is placed in a vacuum tube, and a graphene conductive layer 11 is grown on one side of the copper conductive layer 12 by chemical vapor deposition, thereby forming a repeating unit; twenty repeating units are prepared and stacked, and then connected together by vacuum hot pressing sintering process. In this embodiment, the graphene conductive layer 11 is grown using a roll-to-roll dynamic continuous growth process, with a hydrogen flow rate of 100 sccm, a methane flow rate of 180 sccm, a growth rate of 0.5 m / min, and a temperature of 1000℃.

[0059] Comparative Example 1:

[0060] This comparative example provides a PCB board including a conductive copper film and a prepreg 2 arranged in layers. The conductive copper film is disposed on the upper surface of the prepreg 2 and bonded by hot pressing using a laminator. The conductive copper film has a thickness of 500 μm, and the prepreg 2 is made of fiberglass cloth with a thickness of 135 μm.

[0061] Comparative Example 2:

[0062] This comparative example provides a PCB board comprising four layers of conductive copper film and three layers of prepreg 2 arranged in a layered manner. The conductive copper film and prepreg 2 are staggered, that is, a layer of prepreg 2 is placed between two adjacent layers of conductive copper film, and a layer of conductive copper film is placed between two adjacent layers of prepreg 2. The conductive copper film and prepreg 2 are bonded together by vacuum hot pressing. The thickness of the conductive copper film is 400μm.

[0063] Several tests were conducted on the individual composite conductive layer 1 in Examples 1-4, and the individual conductive copper films in Comparative Examples 1 and 2. The test results are shown in Table 1. The conductivity test was conducted according to T / CSTM 005912022. IACS refers to the International Annealed Copper Standard, a conductivity benchmark standard established by the International Electrotechnical Commission. It uses the resistivity of annealed high-purity copper (99.9995%) at 20°C as 0.017241 Ω×mm² / m as the benchmark, corresponding to a conductivity of 100%. The conductivity of other materials is obtained as a percentage by comparing it to this benchmark. For example, if a material has a conductivity of 100% IACS, it means that its conductivity is the same as annealed copper. Skin depth test conditions: 20 GHz, temperature 20°C. Tensile strength was tested according to GB / T228-2002.

[0064] Table 1

[0065]

[0066] As can be seen from Table 1, compared with Comparative Examples 1 and 2, Examples 1-4 show that: the conductivity of a single composite conductive layer 1 is significantly improved compared with that of a single conductive copper film, with the highest conductivity of a single composite conductive layer 1 in Example 3; the skin depth of the composite conductive layer 1 is also significantly improved compared with that of the conductive copper film, with the largest skin depth of the composite conductive layer 1 in Example 1; and the tensile strength of the composite conductive layer 1 is generally higher than that of the conductive copper film.

[0067] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0068] The embodiments described above are merely illustrative of several implementations of this utility model, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

Claims

1. A graphene copper PCB board characterized by, It includes a plurality of composite conductive layers (1) arranged in layers and a plurality of prepreg sheets (2). The composite conductive layer (1) includes a plurality of graphene conductive layers (11) and a plurality of copper conductive layers (12) arranged in layers. At least one side of the graphene conductive layer (11) is attached to the copper conductive layer (12).

2. The graphene copper PCB board of claim 1, wherein, At least a portion of the graphene conductive layer (11) is grown on the copper conductive layer (12) by chemical vapor deposition.

3. The graphene copper PCB board of claim 1, wherein, The material of the semi-cured sheet (2) is glass fiber cloth, non-woven fabric or wood pulp paper, and the thickness of the semi-cured sheet (2) is 50μm-228μm.

4. The graphene copper PCB board of claim 1, wherein, The thickness of the copper conductive layer (12) is 4μm-100μm.

5. The graphene copper PCB board of claim 1, wherein, The number of composite conductive layers (1) is 1 to 16 layers, and the composite conductive layers (1) and the prepreg (2) are arranged alternately.

6. The graphene copper PCB board of claim 5, wherein, In a single composite conductive layer (1), the number of copper conductive layers (12) is 5 to 20, and the graphene conductive layer (11) and the copper conductive layer (12) are arranged alternately.

7. The graphene copper PCB board of claim 6, wherein, In a single composite conductive layer (1), the number of copper conductive layers (12) is 9-10, the thickness of the copper conductive layer (12) is 6μm-7μm, and the thickness of the graphene conductive layer (11) is 0.34nm-0.68nm.

8. The graphene copper PCB board of claim 6, wherein, In a single composite conductive layer (1), the number of copper conductive layers (12) is 5-6 layers, the thickness of the copper conductive layer (12) is 90μm-100μm, and the thickness of the graphene conductive layer (11) is 1.36nm-1.7nm.

9. The graphene copper PCB board of claim 6, wherein, In a single composite conductive layer (1), the number of copper conductive layers (12) is 19-20, the thickness of the copper conductive layer (12) is 4μm-4.5μm, and the thickness of the graphene conductive layer (11) is 2.34nm-2.72nm.

10. The graphene copper PCB board of claim 1, wherein, The composite conductive layer (1) and the semi-cured sheet (2) are connected by hot pressing.

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