A motherboard with an anti-static heat dissipation mechanism

Abstract

This utility model relates to the field of imaging equipment technology and discloses a motherboard with an anti-static heat dissipation mechanism. The motherboard body has an embedding groove on its outer surface, an interface inside the embedding groove, and an anti-static protective pad at the front end of the interface via an adhesive groove. A hardware chip is disposed on the outer surface of the motherboard body, and a heat dissipation pad is fixedly connected to the front end of the hardware chip by mounting bolts. A heat dissipation copper foil is disposed inside the heat dissipation pad. This utility model utilizes a precise alignment structure between the mounting holes on the hardware chip connection frame and the limiting holes inside the heat dissipation pad, combined with the threaded connection of the mounting bolts, to allow the heat dissipation copper foil to directly contact the surface of the hardware chip and form an efficient heat conduction path. This allows the heat generated by the chip to be quickly and evenly diffused throughout the heat dissipation pad. The high thermal conductivity of the copper foil achieves passive cooling, avoiding performance degradation or lifespan reduction caused by localized overheating.

Description

Technical Field

[0001] This utility model relates to the field of imaging equipment technology, and in particular to a motherboard equipped with an anti-static heat dissipation mechanism. Background Technology

[0002] With the rapid popularization of 5G communication technology, in the process of smartphones achieving high-speed data transmission and multi-band signal switching, it is necessary to treat the precision interfaces on the motherboard with electrostatic protection and electromagnetic interference shielding, which requires the use of the motherboard.

[0003] In practical use, motherboards with similar structures still have many defects. For example, traditional motherboards that rely solely on coatings or discrete grounding points are easily affected by ambient temperature and humidity, leading to the failure of electrostatic protection. At the same time, the heat sinks that are fixed by strong pressure on traditional motherboards may damage the chip solder joints, while loose fit will lead to poor thermal contact. Therefore, it is necessary to design a motherboard with an anti-static heat dissipation mechanism. Utility Model Content

[0004] To solve the above-mentioned technical problems, this utility model provides a motherboard with an anti-static heat dissipation mechanism.

[0005] This utility model is achieved by the following technical solution: a motherboard with an anti-static heat dissipation mechanism, including a motherboard body, an embedding groove is formed on the outer surface of the motherboard body, an interface is provided inside the embedding groove, an anti-static protective pad is provided at the front end of the interface through an adhesive groove, a hardware chip is provided on the outer surface of the motherboard body, a heat dissipation pad is fixedly connected to the front end of the hardware chip through a mounting bolt, and a heat dissipation copper foil is provided inside the heat dissipation pad.

[0006] As a further improvement to the above solution, an adhesive groove is provided inside the embedding groove, and an antistatic protective pad is bonded to the front end of the adhesive groove.

[0007] The above technical solution enhances structural stability through groove fitting design, prevents protective pads from falling off due to vibration, and ensures reliable contact between conductive silicone and interface, thereby improving electrostatic discharge efficiency.

[0008] As a further improvement to the above solution, the antistatic protective pad is disposed on the outer surface of the interface, and the material of the antistatic protective pad is conductive silicone.

[0009] The above technical solution combines elastic buffering and conductivity in material selection, which not only protects the physical structure of the interface from impact but also achieves a uniform electrostatic shielding layer, avoiding the risk of partial discharge.

[0010] As a further improvement to the above solution, a connecting frame is fixedly connected to the outer surface of the hardware chip, and mounting holes are provided inside the connecting frame.

[0011] Through the above technical solutions, the frame structure provides a precise positioning reference for the heat dissipation components, and the mounting holes serve as standardized interfaces to simplify the assembly process and reduce the increase in thermal resistance caused by human alignment errors.

[0012] As a further improvement to the above solution, a limiting hole is provided inside the heat dissipation pad, and the limiting hole matches the mounting hole.

[0013] The above technical solution ensures optimal contact pressure distribution between the heat dissipation copper foil and the chip surface, thereby reducing contact thermal resistance.

[0014] As a further improvement to the above solution, a heat dissipation copper foil is fixedly connected inside the heat dissipation pad, and the heat dissipation copper foil is disposed on the surface of the hardware chip.

[0015] Through the above technical solutions, high thermal conductivity materials construct efficient heat conduction paths, rapidly diffusing hotspot heat to the entire heat dissipation plane and slowing down the formation rate of temperature gradients.

[0016] As a further improvement to the above solution, the internal thread of the limiting hole is connected to a mounting bolt, and the mounting bolt is threaded into the interior of the mounting hole.

[0017] Through the above technical solution, the preload generated by the threaded pair ensures mechanical stability under long-term operation and prevents loosening failure caused by differences in thermal expansion coefficients.

[0018] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0019] This invention utilizes the combination of the embedded groove and adhesive groove in the motherboard body to drive the anti-static protective pad to fit tightly against the front end of the interface, thereby achieving the effect of static discharge and electromagnetic interference shielding in the interface area. By utilizing the low resistance characteristics of conductive silicone material, a reliable path is constructed from the interface to the motherboard ground line, effectively suppressing the potential damage of electrostatic discharge (ESD) to precision electronic components, while reducing crosstalk noise during high-frequency signal transmission and improving system stability.

[0020] This invention utilizes a precise alignment structure between the mounting holes on the hardware chip connection frame and the limiting holes inside the heat sink, along with a threaded connection and fixing method using mounting bolts. This allows the heat dissipation copper foil to directly contact the surface of the hardware chip and form an efficient heat conduction path. This integrated design of mechanical locking and heat conduction can quickly and evenly diffuse the heat generated by the chip to the entire heat sink. By utilizing the high thermal conductivity of the copper foil, passive cooling is achieved, avoiding performance degradation or lifespan reduction caused by local overheating. This ensures that electronic devices can maintain stable operation under long-term high-load conditions. Attached Figure Description

[0021] Figure 1This is a schematic diagram of the overall structure of this utility model;

[0022] Figure 2 This utility model Figure 1 Enlarged schematic diagram of the structure at point A;

[0023] Figure 3 This is an exploded view of the overall structure of this utility model;

[0024] Figure 4 This is a schematic diagram of the antistatic protective pad structure of this utility model;

[0025] Figure 5 This is a schematic diagram of the heat dissipation pad structure of this utility model.

[0026] Explanation of key symbols:

[0027] 1. Mainboard body; 2. Embedded slot; 3. Adhesive slot; 4. Interface; 5. Antistatic protective pad; 6. Hardware chip; 7. Connecting frame; 8. Mounting hole; 9. Heat dissipation pad; 10. Limiting hole; 11. Heat dissipation copper foil; 12. Mounting bolt. Detailed Implementation

[0028] The present invention will be further described below with reference to the accompanying drawings and specific embodiments. It should be noted that, without conflict, the various embodiments or technical features described below can be arbitrarily combined to form new embodiments.

[0029] Example:

[0030] Please combine Figure 1-5 This embodiment of a motherboard with an anti-static heat dissipation mechanism includes a motherboard body 1. An embedding groove 2 is provided on the outer surface of the motherboard body 1. An interface 4 is provided inside the embedding groove 2. An anti-static protective pad 5 is provided at the front end of the interface 4 through an adhesive groove 3. A hardware chip 6 is provided on the outer surface of the motherboard body 1. A heat dissipation pad 9 is fixedly connected to the front end of the hardware chip 6 through a mounting bolt 12. A heat dissipation copper foil 11 is provided inside the heat dissipation pad 9.

[0031] An adhesive groove 3 is provided inside the embedded groove 2, and an antistatic protective pad 5 is bonded to the front end of the adhesive groove 3.

[0032] An antistatic protective pad 5 is disposed on the outer surface of the interface 4, and the material of the antistatic protective pad 5 is conductive silicone.

[0033] Through the operation of the combination structure of the embedded groove 2 and the adhesive groove 3 on the outer surface of the motherboard body 1, the anti-static protective pad 5 is tightly attached to the front end of the interface 4, thereby achieving the effect of static discharge and electromagnetic interference shielding of the interface area.

[0034] A connecting frame 7 is fixedly connected to the outer surface of the hardware chip 6, and a mounting hole 8 is provided inside the connecting frame 7.

[0035] The heat dissipation pad 9 has a limiting hole 10 inside, which matches the mounting hole 8.

[0036] A heat dissipation copper foil 11 is fixedly connected inside the heat dissipation pad 9, and the heat dissipation copper foil 11 is disposed on the surface of the hardware chip 6.

[0037] The internal thread of the limiting hole 10 is connected to the mounting bolt 12, which is threaded into the interior of the mounting hole 8.

[0038] The hardware chip 6 is precisely aligned with the limiting hole 10 inside the heat sink 9 through the mounting hole 8 on the connecting frame 7, and fixed with the threaded connection of the mounting bolt 12, so that the heat dissipation copper foil 11 directly contacts the surface of the hardware chip, forming a heat conduction path, and evenly conducts the heat generated by the chip to the entire heat sink for heat exchange.

[0039] The implementation principle of a motherboard with an anti-static heat dissipation mechanism in this application embodiment is as follows: Through the operation of the combination structure of the embedded groove 2 and the adhesive groove 3 on the outer surface of the motherboard body 1, the anti-static protective pad 5 is driven to tightly adhere to the front end of the interface 4, thereby achieving the effect of static discharge and electromagnetic interference shielding in the interface area. At the same time, the hardware chip 6 is precisely aligned with the limiting hole 10 inside the heat dissipation pad 9 through the mounting hole 8 on the connecting frame 7, and fixed by the threaded connection of the mounting bolt 12, so that the heat dissipation copper foil 11 directly contacts the surface of the hardware chip, forming a heat conduction path, and uniformly conducting the heat generated by the chip to the entire heat dissipation pad for heat exchange. Finally, the hardware system achieves the dual functions of stable cooling and static protection. Through the synergistic effect of mechanical structure and material properties, it is ensured that the electronic equipment effectively suppresses static accumulation and maintains the operating temperature of key components within a safe range during operation.

[0040] The above embodiments are merely preferred embodiments of this utility model and should not be construed as limiting the scope of protection of this utility model. Any non-substantial changes and substitutions made by those skilled in the art based on this utility model shall fall within the scope of protection claimed by this utility model.

Claims

1. A main board provided with an anti-static heat dissipation mechanism, characterized in that, The motherboard body (1) includes an embedded groove (2) on its outer surface. An interface (4) is provided inside the embedded groove (2). An anti-static protective pad (5) is provided at the front end of the interface (4) through an adhesive groove (3). A hardware chip (6) is provided on the outer surface of the motherboard body (1). A heat dissipation pad (9) is fixedly connected to the front end of the hardware chip (6) through a mounting bolt (12). A heat dissipation copper foil (11) is provided inside the heat dissipation pad (9).

2. A motherboard with an anti-static heat dissipation mechanism as described in claim 1, characterized in that: The embedding groove (2) has an adhesive groove (3) inside, and an antistatic protective pad (5) is bonded to the front end of the adhesive groove (3).

3. A motherboard with an anti-static heat dissipation mechanism as described in claim 2, characterized in that: The antistatic protective pad (5) is disposed on the outer surface of the interface (4), and the material of the antistatic protective pad (5) is conductive silicone.

4. A motherboard with an anti-static heat dissipation mechanism as described in claim 1, characterized in that: A connecting frame (7) is fixedly connected to the outer surface of the hardware chip (6), and an installation hole (8) is provided inside the connecting frame (7).

5. A motherboard with an anti-static heat dissipation mechanism as described in claim 1, characterized in that: The heat dissipation pad (9) has a limiting hole (10) inside, which matches the mounting hole (8).

6. A motherboard with an anti-static heat dissipation mechanism as described in claim 5, characterized in that: The heat dissipation pad (9) has a heat dissipation copper foil (11) fixedly connected inside, and the heat dissipation copper foil (11) is disposed on the surface of the hardware chip (6).

7. A motherboard with an anti-static heat dissipation mechanism as described in claim 5, characterized in that: The limiting hole (10) is internally threaded with a mounting bolt (12), which is threaded into the mounting hole (8).

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