A flexible printed circuit board assembly

Abstract

This utility model relates to the field of flexible circuit board technology, and provides a bend-resistant flexible circuit board assembly, including an bend-resistant structure: the bend-resistant structure is coaxially mounted on the outside of a substrate structure; the substrate structure includes a flexible substrate, a conductive circuit layer, and solder joints; the conductive circuit layer is printed on the top of the flexible substrate, and the solder joints are fixedly connected to both ends of the conductive circuit layer. This utility model, by setting the bend-resistant structure and ensuring the stress-dispersing block is tightly fitted to the solder joints, can disperse the concentrated stress at the solder joints to the surrounding area, preventing the solder joints from detaching. The fiber braided layer is made of glass fiber, and the embedded elastic buffer layer further enhances the tensile and bend resistance, thereby improving the bend resistance of the flexible circuit board. This effectively solves the problems of circuit breakage, substrate cracking, and solder joint detachment that easily occur with repeated bending of traditional flexible circuit boards, extending the service life of the flexible circuit board.

Description

Technical Field

[0001] This utility model relates to the field of flexible circuit board technology, and in particular to a flexible circuit board assembly that is resistant to bending. Background Technology

[0002] Flexible circuit boards, also known as flexible printed circuit boards, are printed circuit boards with high flexibility made of polyimide or polyester film as the substrate. Their core advantage is that they can be bent, folded, and rolled up, and can adapt to complex installation spaces.

[0003] Traditional flexible circuit boards have low strength at the junction of the substrate and conductive lines. Long-term bending can easily lead to breakage or loose connections in the conductive lines, causing interruption of circuit signal transmission, affecting the normal function of the equipment. Furthermore, the bending process can easily cause the solder joints to fall off, further increasing the risk of circuit failure and posing serious hidden dangers to the reliability and service life of the equipment. Utility Model Content

[0004] The purpose of this invention is to provide a flexible circuit board assembly that is resistant to bending, in order to solve the defects of existing flexible circuit board assemblies that are prone to conductive line breakage, substrate cracking, and solder joint detachment during repeated bending, which affect the normal use of equipment.

[0005] To solve the above-mentioned technical problems, the present invention provides the following technical solution: a flexible circuit board assembly with bending resistance, including a substrate structure;

[0006] Anti-bending structure: The anti-bending structure is coaxially mounted on the outside of the substrate structure;

[0007] Substrate structure: The substrate structure includes a flexible substrate, a conductive circuit layer, and solder joints;

[0008] The conductive circuit layer is printed on the top of the flexible substrate, and the solder joints are fixedly connected to both ends of the conductive circuit layer.

[0009] The anti-bending structure includes reinforcing ribs, an elastic buffer layer, stress dispersion blocks, and connecting strips.

[0010] The reinforcing ribs are symmetrically attached to both sides of the flexible substrate, the elastic buffer layer covers the surface of the conductive circuit layer, the stress dispersion block is fixedly connected to the outside of the welding point, and the connecting strip is evenly distributed at the bottom of the flexible substrate.

[0011] Preferably, the bending-resistant structure further includes a wear-resistant coating and a fiber braided layer;

[0012] The wear-resistant coating is sprayed on the outside of the reinforcing ribs, and the fiber braided layer is embedded inside the elastic buffer layer.

[0013] Preferably, the elastic buffer layer is made of silicone and has a thickness of 0.1-0.2 mm.

[0014] Preferably, the stress dispersion block is made of epoxy resin and is tightly fitted to the welding point.

[0015] Preferably, the substrate structure further includes positioning holes;

[0016] The positioning holes are drilled through the four corners of the flexible substrate.

[0017] Preferably, it also includes a protective structure;

[0018] The protective structure includes an insulating wrapping layer, a waterproof membrane, and heat dissipation holes;

[0019] The insulating wrapping layer is wrapped around the outside of the flexible substrate, the waterproof membrane is attached to the inside of the insulating wrapping layer, and the heat dissipation holes are evenly distributed on the surface of the insulating wrapping layer.

[0020] Preferably, the protective structure further includes an anti-corrosion layer and buffer protrusions;

[0021] The anti-corrosion layer is coated on the outside of the insulating wrapping layer, and the buffer protrusions are evenly distributed on the edge of the insulating wrapping layer.

[0022] The present invention provides a flexible circuit board assembly resistant to bending, which has the following advantages:

[0023] This invention, by setting an anti-bending structure and tightly fitting the stress-dispersing block with the welding point, can disperse the concentrated stress at the welding point to the surrounding area, preventing the welding point from falling off. The fiber braided layer is made of glass fiber, and the embedded elastic buffer layer can further improve the tensile and bending resistance. The wear-resistant coating is a polytetrafluoroethylene coating, which can reduce the wear of the reinforcing ribs during bending and extend the service life. It can improve the bending resistance of the flexible circuit board and effectively solve the problems of circuit breakage, substrate cracking and welding point detachment that are prone to occur when the flexible circuit board is repeatedly bent, thus extending the service life of the flexible circuit board.

[0024] Based on the aforementioned beneficial effects, a protective structure is provided. The anti-corrosion layer is a fluorocarbon coating, which can resist chemical corrosion and is suitable for harsh working environments. The buffer protrusion is made of rubber, which can buffer the impact when the component edge is hit, reducing damage. This provides comprehensive protection for the flexible circuit board, enabling it to adapt to different working environments and improving the reliability and applicability of the component. Attached Figure Description

[0025] Figure 1 This is an axonometric view of the present invention;

[0026] Figure 2This is another isometric view of the present invention;

[0027] Figure 3 This is a three-dimensional schematic diagram of the reinforcing rib of this utility model;

[0028] Figure 4 For the present utility model Figure 1 Enlarged view of point A in the middle;

[0029] Figure 5 This is a three-dimensional schematic diagram of the protective structure of this utility model.

[0030] The following are the annotations in the figure: 11. Flexible substrate; 12. Conductive circuit layer; 13. Soldering point; 14. Positioning hole; 21. Reinforcing rib; 22. Elastic buffer layer; 23. Stress dispersion block; 24. Connecting strip; 25. Wear-resistant coating; 26. Fiber braided layer; 31. Insulating wrapping layer; 32. Waterproof membrane; 33. Heat dissipation hole; 34. Anti-corrosion layer; 35. Buffer protrusion. Detailed Implementation

[0031] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0032] Please see Figures 1-5 The present invention provides a flexible circuit board assembly with bending resistance, including a substrate structure;

[0033] Anti-bending structure: The anti-bending structure is coaxially mounted on the outside of the base plate structure;

[0034] Substrate structure: The substrate structure includes a flexible substrate 11, a conductive circuit layer 12, and solder joints 13;

[0035] The conductive circuit layer 12 is printed on the top of the flexible substrate 11, and the solder joints 13 are fixedly connected to both ends of the conductive circuit layer 12.

[0036] The substrate structure also includes positioning holes 14;

[0037] Positioning holes 14 are formed through the four corners of the flexible substrate 11;

[0038] The flexible substrate 11 is made of high-temperature resistant polyimide film, which has excellent flexibility and insulation properties, providing stable support for the conductive circuit layer 12. The conductive circuit layer 12 is made of oxygen-free copper foil and forms a preset circuit pattern through etching process to ensure the stability of signal transmission. The positioning hole 14 is used to assist the precise installation of the flexible circuit board in the device and avoid damage to the circuit caused by positional deviation during installation.

[0039] The bending-resistant structure includes a reinforcing rib 21, an elastic buffer layer 22, a stress-dispersing block 23, and a connecting strip 24.

[0040] Reinforcing ribs 21 are symmetrically pasted on both sides of the flexible substrate 11, elastic buffer layer 22 covers the surface of conductive circuit layer 12, stress dispersion block 23 is fixedly connected to the outside of welding point 13, and connecting strip 24 is evenly distributed at the bottom of flexible substrate 11.

[0041] The bending-resistant structure also includes a wear-resistant coating 25 and a fiber braided layer 26;

[0042] A wear-resistant coating 25 is sprayed on the outside of the reinforcing rib 21, and a fiber braided layer 26 is embedded inside the elastic buffer layer 22;

[0043] The reinforcing rib 21 is made of stainless steel sheet with a thickness of 0.05-0.1mm, which does not affect the overall flexibility of the flexible circuit board and can effectively enhance the edge bending resistance; the elastic buffer layer 22 is made of silicone with a thickness of 0.1-0.2mm, which can absorb external stress when bending and reduce the impact on the conductive circuit layer 12; the stress dispersion block 23 is made of epoxy resin.

[0044] By tightly fitting the stress dispersion block 23 to the welding point 13, the concentrated stress at the welding point 13 can be dispersed to the surrounding area, preventing the welding point 13 from falling off. The fiber braided layer 26 is made of glass fiber and can further improve tensile and bending resistance after being embedded in the elastic buffer layer 22. The wear-resistant coating 25 is a polytetrafluoroethylene coating, which can reduce the wear of the reinforcing rib 21 during bending and extend its service life.

[0045] Working principle: When the flexible circuit board assembly is bent by an external force;

[0046] First, the reinforcing ribs 21 on both sides of the flexible substrate 11 bear part of the bending stress. Utilizing the rigidity of their metallic material, they limit excessive bending of the substrate and prevent edge cracking. Meanwhile, the elastic buffer layer 22 on the surface of the conductive circuit layer 12 deforms during bending, absorbing most of the external impact force. At the same time, the fiber braided layer 26 inside the elastic buffer layer 22 enhances the tensile strength, preventing the elastic buffer layer 22 from breaking due to excessive stretching.

[0047] Next, the stress dispersion block 23 on the outside of the welding point 13 can quickly disperse the concentrated stress at the welding point 13 to the flexible substrate 11 and the insulating wrapping layer 31, preventing the welding point 13 from falling off due to excessive local stress. At the same time, the connecting strip 24 at the bottom of the flexible substrate 11 further improves the overall structural stability of the substrate and prevents the substrate from delaminating when bent.

[0048] This step can effectively reduce the damage to the conductive circuit layer 12 and the substrate caused by repeated bending, and extend the service life of the flexible circuit board.

[0049] Please see Figure 3-5 As shown, this embodiment, based on the above embodiment, also includes a protective structure;

[0050] The protective structure includes an insulating wrapping layer 31, a waterproof membrane 32, and heat dissipation holes 33;

[0051] An insulating wrapping layer 31 is wrapped around the outside of the flexible substrate 11, a waterproof membrane 32 is attached to the inside of the insulating wrapping layer 31, and heat dissipation holes 33 are evenly distributed on the surface of the insulating wrapping layer 31.

[0052] The protective structure also includes an anti-corrosion layer 34 and a buffer protrusion 35;

[0053] The anti-corrosion layer 34 is coated on the outside of the insulating wrapping layer 31, and the buffer protrusions 35 are evenly distributed on the edge of the insulating wrapping layer 31.

[0054] The insulating wrapping layer 31 is made of polyimide tape, which has good insulation and high temperature resistance, and can fully protect the internal structure from external interference. The waterproof membrane 32 is made of polyvinyl chloride, which can effectively block moisture from entering and prevent the conductive circuit layer 12 from getting damp and short-circuiting. The heat dissipation holes 33 have a diameter of 0.5-1mm and a spacing of 5-8mm, which can dissipate the heat generated during circuit operation in time and avoid high temperature affecting component performance.

[0055] The anti-corrosion layer 34 is a fluorocarbon coating, which can resist chemical corrosion and is suitable for harsh working environments. The buffer protrusion 35 is made of rubber, which can cushion the component edges when they are hit, reducing damage.

[0056] Working principle: During daily use;

[0057] First, a double protective barrier is formed between the insulating wrapping layer 31 and the anti-corrosion layer 34 wrapped around the flexible substrate 11, which can isolate external current interference and resist the corrosion of chemical substances, ensuring the normal operation of the circuit. The waterproof membrane 32 is tightly attached to the inside of the insulating wrapping layer 31, which can effectively block moisture and liquid in the air from seeping in and prevent the conductive circuit layer 12 from getting damp and short-circuiting.

[0058] Next, the heat generated during circuit operation is quickly dissipated through the heat dissipation hole 33 to prevent the internal temperature of the component from becoming too high and causing performance degradation. When the edge of the flexible substrate 11 is hit, the buffer protrusion 35 deforms to absorb the impact energy, reduce the impact on the internal structure, and play a protective role.

[0059] This step provides comprehensive protection for flexible circuit boards, enabling them to adapt to different working environments and improving the reliability and applicability of the components.

[0060] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A bend-resistant flexible circuit board assembly, comprising a substrate structure, characterized in that: Anti-bending structure: The anti-bending structure is coaxially mounted on the outside of the substrate structure; Substrate structure: The substrate structure includes a flexible substrate (11), a conductive circuit layer (12), and solder joints (13). The conductive circuit layer (12) is printed on the top of the flexible substrate (11), and the solder joint (13) is fixedly connected to both ends of the conductive circuit layer (12). Anti-bending structure: The anti-bending structure includes reinforcing ribs (21), elastic buffer layer (22), stress dispersion block (23) and connecting strip (24); The reinforcing ribs (21) are symmetrically pasted on both sides of the flexible substrate (11), the elastic buffer layer (22) covers the surface of the conductive circuit layer (12), the stress dispersion block (23) is fixedly connected to the outside of the welding point (13), and the connecting strip (24) is evenly distributed at the bottom of the flexible substrate (11).

2. The bend-resistant flexible circuit board assembly according to claim 1, characterized in that, The bending-resistant structure also includes a wear-resistant coating (25) and a fiber braided layer (26). The wear-resistant coating (25) is sprayed on the outside of the reinforcing rib (21), and the fiber braided layer (26) is embedded inside the elastic buffer layer (22).

3. The bend-resistant flexible circuit board assembly according to claim 2, characterized in that, The elastic buffer layer (22) is made of silicone and has a thickness of 0.1-0.2 mm.

4. The bend-resistant flexible circuit board assembly according to claim 2, characterized in that, The stress dispersion block (23) is made of epoxy resin and is tightly attached to the welding point (13).

5. The bend-resistant flexible circuit board assembly according to claim 1, characterized in that, The substrate structure also includes positioning holes (14). The positioning holes (14) are opened through the four corners of the flexible substrate (11).

6. The bend-resistant flexible circuit board assembly according to claim 1, characterized in that, It also includes protective structures; The protective structure includes an insulating wrapping layer (31), a waterproof membrane (32), and heat dissipation holes (33). The insulating wrapping layer (31) is wrapped around the outside of the flexible substrate (11), the waterproof membrane (32) is attached to the inside of the insulating wrapping layer (31), and the heat dissipation holes (33) are evenly opened on the surface of the insulating wrapping layer (31).

7. A bend-resistant flexible circuit board assembly according to claim 6, characterized in that, The protective structure also includes an anti-corrosion layer (34) and a buffer protrusion (35). The anti-corrosion layer (34) is coated on the outside of the insulating wrapping layer (31), and the buffer protrusions (35) are evenly distributed on the edge of the insulating wrapping layer (31).

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