A heat dissipation device for a vehicle-mounted circuit board and a vehicle-mounted host

Abstract

This application proposes a heat dissipation device for an automotive circuit board and an automotive host. Key technical features include a heat sink, a circuit board assembly, an antenna bracket, and a bottom cover. The circuit board assembly comprises several stacked circuit boards and several electronic components mounted on the circuit boards. At least one of the circuit boards has an exposed copper area. The heat sink contains ribbed walls adapted to the exposed copper area to form an electromagnetic shielding cavity. The bottom cover connects to the bottom of the heat sink, forming a circuit board receiving cavity. The circuit board assembly is housed within the circuit board receiving cavity, and at least some of the electronic components are in contact with the heat sink. An independent mounting cavity is provided on the outer surface of the heat sink, and the antenna bracket is disposed within the independent mounting cavity. This application effectively solves the heat dissipation problem of high-power components and the anti-interference problem of antenna signals within the product.

Description

Technical Field

[0001] This application relates to the field of vehicle host accessory technology, and in particular to a heat dissipation device for vehicle circuit boards and a vehicle host. Background Technology

[0002] The in-vehicle head unit is the core component of the in-vehicle audio-visual system and is usually placed on the vehicle's control panel. Existing in-vehicle head units typically have a separate metal heat sink on the high-power components, with a thermally conductive pad or thermally conductive gel placed between the metal heat sink and the shielding cover, and the antenna uses an external antenna module.

[0003] However, when an antenna module and multiple high-power components are integrated into a product, the components will interfere with the antenna signal. Multiple close components on a plane will also interfere with each other, resulting in a decrease in communication efficiency. At the same time, high-power components generate heat when they are working, requiring multiple heat sinks to dissipate heat from different high-power components, which increases the number of parts. Utility Model Content

[0004] To address the shortcomings of existing technologies, this application provides a heat dissipation device for automotive circuit boards and an automotive host system to solve the problems existing in related technologies. The technical solution is as follows:

[0005] In a first aspect, embodiments of this application provide a heat dissipation device for a vehicle-mounted circuit board, including a heat sink, a circuit board assembly, an antenna bracket, and a bottom cover. The circuit board assembly includes a plurality of stacked circuit boards and a plurality of electronic components disposed on the circuit boards, with exposed copper areas on at least one of the circuit boards. The heat sink has rib-shaped enclosures adapted to the exposed copper areas to form an electromagnetic shielding cavity. The bottom cover is connected to the bottom of the heat sink to form a circuit board receiving cavity, and the circuit board assembly is housed within the circuit board receiving cavity, with at least some of the electronic components in contact with the heat sink. An independent mounting cavity is provided on the outer surface of the heat sink, and the antenna bracket is disposed within the independent mounting cavity.

[0006] The heat dissipation device for vehicle circuit boards in this application forms an electromagnetic shielding cavity through the cooperation between the exposed copper area on the circuit board assembly and the inner rib wall of the heat sink. The electromagnetic shielding cavity protects the electronic components on the circuit board assembly inside the heat sink from electromagnetic interference from the external environment. The circuit board assembly includes several stacked circuit boards, which can distribute different electronic components on different layers of circuit boards to improve the heat dissipation effect.

[0007] In one embodiment, the circuit board includes a core board and a main board, with the exposed copper area located on the front side of the core board. The core board and the main board are stacked, and their outlines are partially misaligned by vertical projection. High-speed signal components and several first electronic components are disposed on the core board, while several second electronic components are disposed on the main board. The heat generated by the second electronic components is lower than that of the first electronic components. The core board and the main board are arranged in layers, with the high-heat-generating first electronic components disposed on the core board and the low-heat-generating second electronic components disposed on the main board. This allows the circuit board assembly to perform zoned heat dissipation for electronic components with different heat generation, improving the heat dissipation effect.

[0008] In one embodiment, a plurality of thermally conductive protrusions are provided inside the heat sink, and a first thermally conductive silicone pad is provided on each of the thermally conductive protrusions, the first thermally conductive silicone pad contacting the first electronic component. The multiple thermally conductive protrusions inside the heat sink contact the corresponding first electronic components through the first thermally conductive silicone pads, dispersing heat and improving the heat dissipation efficiency of the heat sink.

[0009] In one embodiment, a plurality of heat dissipation protrusions are provided on the bottom cover, and a second thermally conductive silicone pad is provided on the heat dissipation protrusion. The second thermally conductive silicone pad contacts the motherboard, and the position of the second thermally conductive silicone pad corresponds to that of the second electronic component. The plurality of heat dissipation protrusions on the bottom cover contact the corresponding second electronic components through the second thermally conductive silicone pad, dispersing heat and improving the overall heat dissipation efficiency of the product.

[0010] In one embodiment, heat dissipation fins are provided on the outer surface of the radiator; the heat dissipation fins are located on one side of the independent mounting cavity. The heat dissipation fins can increase the heat dissipation area of ​​the radiator, thereby further improving the heat dissipation capacity of the product.

[0011] In one embodiment, the antenna bracket is a plastic bracket; an FPC antenna is attached to the inner side of the antenna bracket. The antenna bracket provides both antenna fixing and protection functions.

[0012] In one embodiment, the vertical projection area of ​​the antenna support is located outside the exposed copper area. The vertical projection area of ​​the antenna support does not intersect with the exposed copper area, completely isolating the antenna support from the components within the exposed copper area, thereby improving the antenna's anti-interference capability and reliability.

[0013] In one embodiment, a mounting bracket is further included; the mounting bracket is fixed to one side of the heat sink and connected to the bottom cover. The mounting bracket, together with the heat sink and the bottom cover, forms a receiving cavity that protects the circuit board.

[0014] In one embodiment, the device further includes at least one fastener for connecting to the vehicle; the fastener is disposed through one side of the radiator. The fastener allows for easier attachment of the product to the vehicle's dashboard.

[0015] Secondly, embodiments of this application provide an in-vehicle host, including the aforementioned heat dissipation device for in-vehicle circuit boards.

[0016] The advantages or beneficial effects of the above technical solutions include at least the following:

[0017] ①The circuit board assembly of this application adopts a multi-circuit board stacking scheme, in which electronic components with different heat generation are placed on different layers of circuit boards. By dividing the components with different heat generation into zones through circuit board layering, mutual interference between components can be reduced, heat concentration can be prevented, and heat dissipation efficiency can be improved.

[0018] ②The radiator's rib enclosure and the exposed copper area of ​​the upper circuit board together form an electromagnetic shielding cavity, which can isolate the internal components of the radiator from the outside world, improving the anti-interference ability and reliability of the circuit board assembly.

[0019] ③ The antenna bracket is set on the outer surface of the heat sink to isolate the components from the antenna, which can prevent the components inside the heat sink from interfering with the antenna signal, improve the antenna's anti-interference ability and reliability, and reduce the number of parts.

[0020] The above overview is for illustrative purposes only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments, and features described above, further aspects, embodiments, and features of this application will become readily apparent from the accompanying drawings and the following detailed description. Attached Figure Description

[0021] In the accompanying drawings, unless otherwise specified, the same reference numerals throughout the various drawings denote the same or similar parts or elements. These drawings are not necessarily drawn to scale. It should be understood that these drawings depict only some embodiments disclosed in this application and should not be construed as limiting the scope of this application.

[0022] Figure 1 This is an exploded view of the heat dissipation device for vehicle-mounted circuit boards in this utility model;

[0023] Figure 2 This is a plan view of the core plate in this utility model;

[0024] Figure 3 This is an internal schematic diagram of the radiator in this utility model;

[0025] Figure 4 This is a top view of the circuit board assembly in this utility model;

[0026] Figure 5 This is a plan view of the motherboard in this utility model;

[0027] Figure 6 This is a schematic diagram of the structure of the bottom cover of this utility model;

[0028] Figure 7 This is a partial schematic diagram of the antenna bracket installation in this utility model.

[0029] In the diagram: 101, Heat sink; 102, Circuit board assembly; 103, Antenna bracket; 104, Bottom cover; 105, Mounting bracket; 106, Fixing component; 201, Core board; 202, Main board; 203, Exposed copper area; 204, Rib enclosure; 205, Thermal boss; 301, Main chip; 302, Power chip; 401, Heat dissipation bump; 402, Heat dissipation fins; 501, Antenna bracket projection area; 601, Power amplifier chip; 602, Radio decoding chip; 603, DC-DC chip. Detailed Implementation

[0030] In the following description, only certain exemplary embodiments are briefly described to make the objectives, features, and advantages of this invention more apparent. As those skilled in the art will recognize, the described embodiments can be modified in various ways without departing from the spirit or scope of this application. Therefore, the drawings and description are considered exemplary in nature and not restrictive.

[0031] The present invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0032] Example 1

[0033] like Figures 1 to 7 As shown, this embodiment provides a heat dissipation device for a vehicle-mounted circuit board, including a heat sink 101, a circuit board assembly 102, an antenna bracket 103, and a bottom cover 104. The circuit board assembly 102 includes several stacked circuit boards and several electronic components disposed on the circuit boards. At least one of the circuit boards has an exposed copper area 203. The heat sink 101 has a rib wall 204 adapted to the exposed copper area 203 to form an electromagnetic shielding cavity. The bottom cover 104 is connected to the bottom of the heat sink 101 to form a circuit board receiving cavity. The circuit board assembly 102 is housed in the circuit board receiving cavity, and at least some of the electronic components are in contact with the heat sink 101. An independent mounting cavity is provided on the outer surface of the heat sink 101, and the antenna bracket 103 is disposed in the independent mounting cavity.

[0034] In this embodiment, the heat sink 101 is made of die-cast aluminum alloy. The heat sink 101 is used to dissipate heat and provide electromagnetic shielding for the circuit board assembly 102, preventing the circuit board assembly 102 from being subjected to electromagnetic interference from the external environment. The bottom cover 104 is made of SECC galvanized steel sheet. The bottom cover 104 is fixed to the heat sink 101 to form a surrounding cavity, in which the circuit board assembly 102 is housed, protecting the internal circuit board assembly 102 from electromagnetic interference from the external environment. In other embodiments, the heat sink 101 and the bottom cover 104 may also be made of other heat-dissipating materials.

[0035] The antenna bracket 103 is fixed in an independent mounting cavity on the outer surface of the heat sink 101. The antenna bracket 103 directly transmits and receives signals. The heat sink 101 can isolate the antenna bracket 103 from the circuit board assembly 102, preventing the components inside the heat sink 101 from interfering with the antenna signal and improving communication efficiency.

[0036] The circuit board assembly 102 adopts a multi-board stacking scheme, in which the upper circuit board mainly houses high-speed signal components and the chip 603 with the largest heat generation, while the lower circuit board mainly houses the chip 603 with smaller heat generation. Unlike the prior art, which places electronic components on the same plane, this vertical layered layout reduces mutual interference between components. Moreover, since multiple components are not located on the same plane, it can prevent the heat generation of the components from being too concentrated, thereby improving the heat dissipation efficiency. At the same time, this heat dissipation structure does not require multiple heat sinks 101, reducing the number of parts and saving production costs.

[0037] In addition, an exposed copper area 203 is provided on the front side of the upper circuit board. The exposed copper area 203 has a ring-shaped surrounding structure. The exposed copper area 203 encloses the high-speed signal components of the upper circuit board into an independent area. A rib wall 204 is provided on the heat sink 101. The shape and position of the rib wall 204 correspond to those of the exposed copper area 203 and make contact to complete the grounding connection. The electromagnetic shielding cavity formed between the rib wall 204 and the exposed copper area 203 can isolate the high-speed signal components in the independent area from the outside world, thereby improving the anti-interference ability and reliability of the circuit.

[0038] The circuit board includes a core board 201 and a main board 202. The exposed copper area 203 is disposed on the front side of the core board 201. The core board 201 and the main board 202 are stacked, and the vertical projections of the outlines of the core board 201 and the main board 202 are partially misaligned. High-speed signal components and several first electronic components are disposed on the core board 201, and several second electronic components are disposed on the main board 202. The heat generation of the second electronic components is lower than that of the first electronic components.

[0039] See details Figure 4The upper circuit board is the core board 201, which mainly houses high-speed signal components and the chip 603 that generates the most heat. The lower circuit board is the motherboard 202, which mainly houses the chip 603 that generates less heat. This vertical layered layout reduces mutual interference between components, and since multiple components are not located on the same plane, it can prevent the heat generated by the components from being too concentrated.

[0040] The core board 201 and the main board 202 are staggered to allow the heat sink 101 to have protrusions to conduct heat to different components. The first electronic components include the main chip 301 and the power chip 302. The main chip 301 and the power chip 302 are both set on the core board 201 and are located in the exposed copper area 203. The rib wall 204 can isolate the above components from the outside world to improve the anti-interference ability and reliability of the circuit board assembly 102.

[0041] The second electronic components include low-heat-generating chips such as power amplifier chip 601, radio decoding chip 602, and DC-DC chip 603. These different chips 603 are distributed on the motherboard 202 to avoid heat concentration.

[0042] A plurality of thermally conductive protrusions 205 are provided inside the heat sink 101, and a first thermally conductive silicone pad is provided on the thermally conductive protrusion 205, the first thermally conductive silicone pad being in contact with the first electronic component.

[0043] See details Figure 2 and Figure 3 The heat sink 101 is provided with a plurality of heat-conducting protrusions 205. The positions of the multiple heat-conducting protrusions 205 correspond to the positions of the main chip 301 and the power chip 302 on the core board 201, respectively. Each heat-conducting protrusion 205 is provided with a first thermally conductive silicone pad. The corresponding first thermally conductive silicone pad is in contact with the main chip 301 and the power chip 302, respectively. The heat generated by the main chip 301 and the power chip 302 during operation can be transferred to the heat sink 101 through the first thermally conductive silicone pad and the heat-conducting protrusions 205, dispersing the heat and thereby improving the heat dissipation efficiency of the heat sink 101.

[0044] A plurality of heat dissipation protrusions 401 are provided on the bottom cover 104, and a second thermally conductive silicone pad is provided on the heat dissipation protrusions 401. The second thermally conductive silicone pad is in contact with the motherboard 202, and the position of the second thermally conductive silicone pad corresponds to that of the second electronic component.

[0045] See details Figure 5 and Figure 6The bottom cover 104 is provided with multiple heat dissipation bumps 401. The positions of the multiple heat dissipation bumps 401 correspond to the positions of the power amplifier chip 601, the radio decoding chip 602, and the DCDC chip 603 on the motherboard 202, respectively. Each heat dissipation bump 401 is provided with a second thermal conductive silicone pad. The second thermal conductive silicone pad corresponds to the position of the power amplifier chip 601, the radio decoding chip 602, and the DCDC chip 603, respectively, and abuts against the motherboard 202. The heat generated by the power amplifier chip 601, the radio decoding chip 602, and the DCDC chip 603 during operation can be transferred to the bottom cover 104 through the second thermal conductive silicone pad and the heat dissipation bumps 401, dispersing the heat and thereby improving the heat dissipation efficiency of the product.

[0046] Heat dissipation fins 402 are provided on the outer surface of the radiator 101; the heat dissipation fins 402 are located on one side of the independent mounting cavity.

[0047] Heat dissipation fins 402 are disposed on the outer surface of the radiator 101. The heat dissipation fins 402 are composed of several fin structures, which can increase the heat dissipation area of ​​the radiator 101, thereby further improving the heat dissipation capacity of the product.

[0048] The antenna bracket 103 is a plastic bracket; an FPC antenna is attached to the inside of the antenna bracket 103.

[0049] The antenna bracket 103 is made of plastic. The FPC antenna is attached to the inside of the antenna bracket 103 and fixed to the outside of the heat sink 101. The antenna bracket 103 can provide antenna fixing and protection functions. The FPC antenna directly transmits and receives signals.

[0050] The vertical projection area of ​​the antenna support 103 is located outside the exposed copper area 203.

[0051] See details Figure 2 The antenna bracket 103 is located outside the exposed copper area 203 on the core board 201 in the vertical projection area of ​​the circuit board assembly 102 (hereinafter referred to as the antenna bracket projection area 501). That is, the antenna bracket projection area 501 is located outside the exposed copper area 203, and the two do not intersect in the vertical projection relationship. This completely isolates the antenna bracket 103 from the components in the exposed copper area 203, improves the antenna's anti-interference ability and reliability, and reduces the number of parts, thus saving costs.

[0052] It also includes a mounting bracket 105; the mounting bracket 105 is fixed to one side of the radiator 101 and is connected to the bottom cover 104.

[0053] The mounting bracket 105 is made of SECC galvanized steel plate. The mounting bracket 105 is fixed on the heat sink 101 and together with the bottom cover 104 forms a surrounding cavity. This surrounding cavity can protect the internal circuit board assembly 102 and prevent the circuit board assembly 102 from being affected by electromagnetic interference from the external environment.

[0054] It also includes at least one fastener 106 for connecting to the vehicle; the fastener 106 is disposed through one side of the radiator 101.

[0055] The fastener 106 is made of metal and can adopt a bolt tail post structure. The fastener 106 is fixed to the radiator 101. One end of the fastener 106 extends into the inside of the product and the other end is exposed on the outside of the product, which makes it easy to fix the device to the vehicle dashboard and is easy to install and remove.

[0056] Example 2

[0057] This embodiment provides an in-vehicle host, including a heat dissipation device for an in-vehicle circuit board.

[0058] In this embodiment, the heat dissipation device for the vehicle circuit board can be applied to different vehicle host units. The heat dissipation device for the vehicle circuit board has all the technical effects of Embodiment 1, which will not be repeated here.

[0059] This utility model discloses a heat dissipation device for vehicle-mounted circuit boards and a vehicle-mounted host. The functions of each module in each device in the embodiments can be found in the corresponding descriptions in the above methods. It effectively solves the heat dissipation problem of high-power components in the product and the anti-interference problem of antenna signals.

[0060] In this specification, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances. The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include one or more of that feature.

[0061] In this invention, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" of the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature. The terms "vertical," "horizontal," "left," "right," "above," "below," and similar expressions are for illustrative purposes only and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed or operated in a specific orientation, and therefore should not be construed as limiting the invention.

[0062] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any person skilled in the art can easily conceive of various variations or substitutions within the technical scope disclosed in this application, and these should all be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A heat dissipation device for a vehicle-mounted circuit board, comprising a heat sink (101), a circuit board assembly (102), an antenna bracket (103), and a bottom cover (104), characterized in that: The circuit board assembly (102) includes a plurality of stacked circuit boards and a plurality of electronic components disposed on the circuit boards, and at least one of the circuit boards has an exposed copper area (203). The radiator (101) is provided with a ribbed enclosure (204) that is adapted to the exposed copper area (203) to form an electromagnetic shielding cavity; The bottom cover (104) is connected to the bottom of the heat sink (101) to form a circuit board receiving cavity. The circuit board assembly (102) is housed in the circuit board receiving cavity, and at least some of the electronic components are in contact with the heat sink (101). An independent mounting cavity is provided on the outer surface of the heat sink (101), and the antenna bracket (103) is disposed in the independent mounting cavity.

2. The heat dissipating device for an in-vehicle circuit board according to claim 1, characterized by The circuit board includes a core board (201) and a main board (202), and the exposed copper area (203) is disposed on the front side of the core board (201); The core board (201) and the motherboard (202) are stacked together, and the vertical projection of the outlines of the core board (201) and the motherboard (202) are partially misaligned. High-speed signal components and several first electronic components are provided on the core board (201), and several second electronic components are provided on the main board (202); The second electronic component generates less heat than the first electronic component.

3. The heat dissipation device for vehicle-mounted circuit boards according to claim 2, characterized in that, A plurality of thermally conductive protrusions (205) are provided inside the heat sink (101), and a first thermally conductive silicone pad is provided on the thermally conductive protrusions (205), and the first thermally conductive silicone pad is in contact with the first electronic component.

4. The heat dissipating device for a vehicle-mounted circuit board according to claim 2, characterized by A plurality of heat dissipation protrusions (401) are provided on the bottom cover (104), and a second thermal conductive silicone pad is provided on the heat dissipation protrusions (401). The second thermal conductive silicone pad is in contact with the motherboard (202), and the position of the second thermal conductive silicone pad corresponds to that of the second electronic component.

5. The heat dissipating device for an in-vehicle circuit board according to claim 1, characterized by Heat dissipation fins (402) are provided on the outer surface of the radiator (101); the heat dissipation fins (402) are located on one side of the independent mounting cavity.

6. The heat dissipating device for an in-vehicle circuit board according to claim 1, characterized by The antenna bracket (103) is a plastic bracket; an FPC antenna is attached to the inside of the antenna bracket (103).

7. The heat dissipating device for a vehicle-mounted circuit board according to claim 6, characterized by The vertical projection area of ​​the antenna support (103) is located outside the exposed copper area (203).

8. The heat dissipating device for an in-vehicle circuit board according to claim 1, characterized by It also includes a mounting bracket (105); the mounting bracket (105) is fixed to one side of the radiator (101) and the mounting bracket (105) is connected to the bottom cover (104).

9. The heat dissipating device for an in-vehicle circuit board according to claim 1, characterized by It also includes at least one fastener (106) for connecting to the vehicle; the fastener (106) is disposed through one side of the radiator (101).

10. An in-vehicle host characterized by comprising: Includes the heat dissipation device for vehicle circuit boards as described in any one of claims 1-9.

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