Motherboard heat dissipation structure and air conditioning
By combining heat dissipation and heating components on the motherboard, the problem of condensation on the motherboard in high humidity environments is solved, thereby improving the stability and reliability of the motherboard without affecting heat dissipation efficiency.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- GREE ELECTRIC APPLIANCE INC OF ZHUHAI
- Filing Date
- 2025-09-22
- Publication Date
- 2026-07-31
AI Technical Summary
Existing heat dissipation structures cannot prevent condensation in high humidity environments, leading to motherboard instability and affecting lifespan and reliability.
It adopts a combination structure of heat dissipation component and heating component. The heat dissipation component dissipates heat from the motherboard, and the heating component increases the temperature of the heat dissipation component and its surroundings in high humidity environment to prevent condensation.
Without sacrificing heat dissipation efficiency, it effectively prevents condensation on the motherboard, improves the stability and lifespan of the motherboard, and ensures reliable operation of the motherboard in high humidity environments.
Smart Images
Figure CN224583389U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of electrical technology, and in particular to a motherboard heat dissipation structure and an air conditioner. Background Technology
[0002] In air conditioning systems, the mainboard, as the core control unit, generates a significant amount of heat during operation from its heat-generating components (such as the fan, compressor IPM, and rectifier bridge). To ensure stable operation, a heat dissipation structure (such as metal heat sinks or heat pipes) is typically used. However, in high-humidity environments, condensation can easily form on the surfaces of these heat-generating components or heat dissipation structures because their temperature is below the air dew point, leading to short circuits, corrosion, and even equipment damage.
[0003] Therefore, existing heat dissipation structures cannot prevent condensation, and cannot balance heat dissipation efficiency with anti-condensation function, resulting in unstable operation of the motherboard in high humidity environments, affecting its lifespan and reliability. Utility Model Content
[0004] This invention provides a motherboard heat dissipation structure and an air conditioner to solve the problem that existing heat dissipation structures cannot prevent condensation on the motherboard, which leads to unstable operation of the motherboard in high humidity environments, affecting its service life and reliability.
[0005] The technical solution of this utility model is a motherboard heat dissipation structure, including a motherboard with heat-generating components, and further including:
[0006] The heat dissipation assembly is oriented to match the spatial distribution of the heat-generating components, so that the heat-generating components are distributed on both sides of the heat dissipation assembly.
[0007] A heating component is provided in conjunction with the heat dissipation component, the heating component being used to increase the temperature of the heat dissipation component and its surroundings.
[0008] Furthermore, the heat dissipation component includes:
[0009] A heat sink housing fixed to the motherboard, wherein a mounting slot is provided inside the heat sink housing, and a heat dissipation pipe is installed inside the mounting slot, and a cooling circulating medium flows inside the heat dissipation pipe;
[0010] A cover plate that fits onto the side of the heat dissipation housing with the mounting groove has an inner surface with a limiting curved surface that matches the outer contour of the heat dissipation pipe.
[0011] When the cover plate matches and covers the heat dissipation housing, the limiting curved surface and the mounting groove together constitute a three-dimensional spatial constraint on the heat dissipation pipe.
[0012] Furthermore, a heating component is embedded within the heat dissipation housing, and the heating component is located on the side of the heat dissipation pipe facing the motherboard; the heating component is electrically connected to the motherboard through an interface.
[0013] Furthermore, the extension direction of the heating component is the same as that of the heat dissipation pipe.
[0014] Furthermore, at least one groove is provided on both sides of the heat dissipation housing corresponding to the heat-generating element, and the inner wall of any groove is in contact with the surface of the heat-generating element.
[0015] Furthermore, the heat sink housing is connected to the motherboard via multiple fixing posts on the side facing the motherboard; and a heat dissipation gap is formed between the motherboard and the heat sink housing.
[0016] Furthermore, the heat dissipation pipe is U-shaped, and the bend compensation section of the heat dissipation pipe extends out of the heat dissipation shell.
[0017] Furthermore, a temperature sensor is mounted on the surface of the heating element that generates the least amount of heat.
[0018] Furthermore, the maximum operating temperature of the heating component is 50°C.
[0019] This utility model also proposes an air conditioner, which includes the motherboard heat dissipation structure described above.
[0020] Compared with the prior art, the present invention has at least the following beneficial effects:
[0021] This invention uses a heat dissipation component to cool the motherboard and a heating component to increase the temperature of the heat dissipation component and surrounding heat-generating components, thereby preventing condensation on the motherboard and thus avoiding short circuits, corrosion, or even equipment damage. It ensures that the motherboard can maintain its anti-condensation function without sacrificing heat dissipation efficiency, thereby making the motherboard operate stably and improving its service life and reliability. Attached Figure Description
[0022] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains; the terminology used herein in the specification is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention; the terms "comprising" and "having," and any variations thereof, in the specification, claims, and accompanying drawings of this invention are intended to cover non-exclusive inclusion. The terms "first," "second," etc., in the specification, claims, or accompanying drawings of this invention are used to distinguish different objects and not to describe a particular order.
[0023] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0024] Figure 1 This is a schematic diagram of the motherboard structure proposed in this utility model;
[0025] Figure 2 for Figure 1 An enlarged schematic diagram of reference numeral A in the attached figure;
[0026] Figure 3 A schematic diagram of part of the internal structure of the motherboard proposed for the utility model;
[0027] Figure 4 A cross-sectional view of the heat dissipation housing proposed in this utility model;
[0028] Figure 5 Left view of the heat dissipation housing proposed in the utility model;
[0029] Figure 6 A bottom view of the heat dissipation housing proposed in this utility model;
[0030] Figure 7 A flowchart of the heating component proposed for this utility model.
[0031] Figure label:
[0032] 10. Motherboard;
[0033] 20. Heating components
[0034] 30. Heat dissipation components;
[0035] 301, Heat sink housing; 3011, Mounting slot; 3012, Groove; 3013, Mounting through hole;
[0036] 302. Heat dissipation pipe; 3021. Bend compensation section;
[0037] 303, cover plate; 3031, limiting curved surface;
[0038] 304. Fixed column;
[0039] 40. Heating components;
[0040] 401. Interface;
[0041] 50. Temperature sensor. Detailed Implementation
[0042] To make the technical problem to be solved, the technical solution, and the beneficial effects of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model. Therefore, a feature pointed out in this specification is used to describe one feature of one embodiment of the present utility model, and does not imply that every embodiment of the present utility model must have the described feature. Furthermore, it should be noted that this specification describes many features. Although certain features may be combined to illustrate possible system designs, these features may also be used in other combinations not explicitly stated. Therefore, unless otherwise stated, the described combinations are not intended to be limiting.
[0043] The principle and structure of this utility model will be described in detail below with reference to the accompanying drawings and embodiments.
[0044] In air conditioning systems, the mainboard, as the core control unit, generates a significant amount of heat during operation from its heat-generating components (such as the fan, compressor IPM, and rectifier bridge). To ensure stable operation, a heat dissipation structure (such as metal heat sinks or heat pipes) is typically used. However, in high-humidity environments, condensation can easily form on the surfaces of these heat-generating components or heat dissipation structures because their temperature is below the air dew point, leading to short circuits, corrosion, and even equipment damage.
[0045] Existing heat dissipation structures cannot prevent condensation, and cannot balance heat dissipation efficiency with anti-condensation function, resulting in unstable operation of the motherboard in high humidity environments, affecting its lifespan and reliability.
[0046] Therefore, in some embodiments, to ensure that the motherboard 10 balances heat dissipation efficiency and anti-condensation function, such as Figure 1 As shown, this utility model proposes a motherboard heat dissipation structure, including a motherboard 10 with heat-generating components 20, and further including:
[0047] The heat dissipation component 30 is oriented to match the spatial distribution of the heat-generating components 20, so that the heat-generating components 20 are distributed on both sides of the heat dissipation component 30.
[0048] A heating component 40 is provided in conjunction with the heat dissipation component 30, and the heating component 40 is used to increase the temperature of the heat dissipation component 30 and its surroundings.
[0049] It should be noted that the motherboard heat dissipation structure proposed in this embodiment also includes a main control unit (not shown, the same applies throughout the text). This main control unit is electrically connected to the heat dissipation component 30 and the heating component 40, respectively.
[0050] Thus, when the motherboard 10 is running, the heat-generating components 20 located on the motherboard 10 will continuously generate heat. At this time, the main control unit will activate the heat dissipation component 30 to dissipate heat from the heat-generating components 20 distributed on both sides, reducing the surface temperature of the heat-generating components 20, thereby preventing the heat-generating components 20 from experiencing performance degradation or shutdown due to overheating. However, in high humidity environments, the heat-generating components 20 are prone to condensation due to the ambient temperature being lower than the air dew point temperature. Therefore, when the main control unit receives a signal that the ambient temperature around the heat-generating components 20 is lower than the ambient dew point temperature, the main control unit will activate the heating component 40 to raise the temperature of the heat dissipation component 30 and the surrounding heat-generating components 20, so that the ambient temperature around the heat-generating components 20 is higher than the ambient dew point temperature, thereby preventing condensation.
[0051] Therefore, this utility model dissipates heat from the motherboard 10 through the heat dissipation component 30 and increases the temperature of the heat dissipation component 30 and the surrounding heat-generating components 20 through the heating component 40, so as to prevent condensation from forming on the motherboard 10, thereby preventing short circuits, corrosion or even equipment damage to the motherboard 10. It ensures that the motherboard 10 can take into account the anti-condensation function without sacrificing heat dissipation efficiency, so as to make the motherboard 10 operate stably and improve the service life and reliability of the motherboard 10.
[0052] Even in high humidity environments, this embodiment can ensure the stable operation of the motherboard 10 without sacrificing heat dissipation efficiency, while also providing anti-condensation function, thereby improving the lifespan and reliability of the motherboard 10, and at a low cost.
[0053] In a further embodiment, such as Figures 2-4 As shown in the figure, this embodiment proposes one composition of a heat dissipation component 30, including:
[0054] A heat sink 301 is fixed on the motherboard 10. A mounting groove 3011 is provided inside the heat sink 301. A heat dissipation pipe 302 is installed inside the mounting groove 3011. A cooling circulating medium flows inside the heat dissipation pipe 302.
[0055] A cover plate 303 is provided on the side of the heat dissipation housing 301 that has a mounting groove 3011, and its inner surface is provided with a limiting curved surface 3031 that matches the outer contour of the heat dissipation pipe 302.
[0056] When the cover plate 303 matches and covers the heat dissipation housing 301, the limiting curved surface 3031 and the mounting groove 3011 together constitute a three-dimensional spatial constraint on the heat dissipation pipe 302.
[0057] It should be noted that the cooling circulating working fluid proposed in this embodiment is preferably a low-temperature refrigerant. Of course, the cooling circulating working fluid can also be low-temperature water or other low-temperature fluids, which are not limited here. The heat dissipation shell 301 is preferably a cuboid or cubic metal frame structure.
[0058] In this way, the heat-generating components 20 on the motherboard 10 are located on both sides of the width direction of the heat sink 301. Then, the heat dissipation pipe 302 is matched and installed in the mounting groove 3011 of the heat sink 301. Then, the cover plate 303 is fixed to the heat sink 301 with bolts, so that the limiting curved surface 3031 of the cover plate 303 and the mounting groove 3011 of the heat sink 301 together constitute a three-dimensional spatial constraint on the heat dissipation pipe 302.
[0059] When the motherboard 10 is running, the heat-generating components 20 on the motherboard 10 will continuously generate heat. At this time, the main control unit will control the low-temperature refrigerant to circulate in the heat dissipation pipe 302 so that the low-temperature refrigerant absorbs the heat in the heat dissipation shell 301. The heat dissipation shell 301 receives the cooling energy transferred by the refrigerant through heat conduction. Then, the heat dissipation shell 301 transfers the cooling energy to the heat dissipation pipe 302 and the surrounding heat-generating components 20 through heat convection / radiation to cool down, thereby achieving the purpose of heat dissipation.
[0060] In some embodiments, to ensure that the main control unit can monitor the ambient temperature around the heat-generating component 20 in real time, such as... Figure 1 As shown, a temperature sensor 50 is mounted on the surface of the heating element 20, which generates the least amount of heat.
[0061] It should be noted that the temperature sensor 50 is electrically connected to the main control unit. The temperature sensor 50 is placed on the surface of the heat-generating component 20, which has the least heat generation and the lowest temperature, so as to more accurately reflect the lower limit of the actual operating temperature of the motherboard 10. The lowest temperature point usually represents the stable temperature reference point of the motherboard 10 under thermal equilibrium state, which is less affected by environmental fluctuations and the detection data is more stable and reliable.
[0062] In this way, the temperature sensor 50 monitors the corresponding ambient temperature in real time and uploads it to the main control unit. The main control unit then compares the received ambient temperature with the ambient dew point temperature. If the ambient temperature is lower than or equal to the ambient dew point temperature, the main control unit will activate the heating component 40 to raise the surface temperature of the heat dissipation pipe 302 and the surrounding heat-generating components 20, thereby raising the ambient temperature above the ambient dew point temperature and preventing condensation from forming on the motherboard 10. When the ambient temperature is higher than the ambient dew point temperature + 3°C, the main control unit will turn off the heating component 40 to put it into standby mode. During this period, the temperature sensor 50 will monitor the ambient temperature in real time. When the ambient temperature is lower than or equal to the dew point temperature, the main control unit will restart the heating component 40, and this cycle will repeat continuously. Figure 7As shown in the figure, this process achieves proactive prevention of condensation while avoiding unnecessary energy consumption.
[0063] In some embodiments, to ensure that the heating assembly 40 can better increase the surface temperature of the heat dissipation pipe 302 and the surrounding heat-generating components 20, such as Figure 1 and Figure 3 As shown, a heating component 40 is embedded in the heat dissipation housing 301. The heating component 40 is located on the side of the heat dissipation pipe 302 facing the motherboard 10. The heating component 40 is electrically connected to the motherboard 10 through the interface 401.
[0064] It is understood that a mounting through hole 3013 is provided inside the heat sink housing 301 along the direction of the mounting groove 3011, and the heating component 40 is embedded in the mounting through hole 3013.
[0065] In this way, when the main control unit receives a signal that the ambient temperature around the heating element 20 is lower than the ambient dew point temperature, the main control unit will start the heating component 40. The heat generated by the heating component 40 will first be transferred to the heat dissipation housing 301, and then the heat dissipation housing 301 will heat up the heat dissipation pipe 302 and the surrounding heating element 20 through heat convection / radiation, thereby achieving the purpose of preventing condensation.
[0066] In some embodiments, such as Figure 1 As shown, the heat dissipation pipe 302 is U-shaped, and the bend compensation section 3021 of the heat dissipation pipe 302 extends out of the heat dissipation housing 301.
[0067] It should be noted that the shape of the heat dissipation pipe 302 can also be V-shaped or other shapes with bends, and is not limited here. Of course, the shape of the heating component 40 can also be U-shaped, V-shaped or other shapes with bends, and is not limited here.
[0068] In this way, the bend compensation section 3021 can compensate for installation errors; and the heat dissipation pipe 302 will be severely impacted and worn due to sudden changes in flow direction. Therefore, the bend compensation section 3021 can reduce the impact of sudden changes in flow direction on the heat dissipation pipe 302 and alleviate the scouring and wear of the heat dissipation pipe 302.
[0069] In some embodiments, the extension direction of the heating component 40 is the same as that of the heat dissipation pipe 302.
[0070] In this way, the heating component 40 can simultaneously heat the heat dissipation pipe 302, preventing condensation from forming on the heat dissipation pipe 302 due to excessively low temperature. This also avoids uneven heating of the cooling circulating medium within the heat dissipation pipe 302.
[0071] In some embodiments, such as Figures 5-6 As shown, at least one groove 3012 is provided on both sides of the heat dissipation housing 301 corresponding to the heat-generating component 20, and the inner wall of any groove 3012 is in contact with the surface of the heat-generating component 20.
[0072] In this way, the heat sink 301 can better absorb the heat emitted by the heat-generating component 20, and then the cooling circulating medium in the heat dissipation pipe 302 absorbs the heat in the heat sink 301, thereby achieving the purpose of heat dissipation for the heat-generating component 20; similarly, the heat sink 301 can also better transfer the heat generated by the heating component 40 to the heat-generating component 20, so that the ambient temperature around the heat-generating component 20 is higher than the ambient dew point temperature, thus preventing condensation from occurring on the motherboard 10.
[0073] In some embodiments, to further improve the heat dissipation effect of the motherboard 10, such as... Figure 5 As shown, the heat sink 301 is connected to the motherboard 10 via a plurality of fixing posts 304 on the side facing the motherboard 10; and a heat dissipation gap is formed between the motherboard 10 and the heat sink 301.
[0074] In a further embodiment, the maximum operating temperature of the heating component 40 is 50°C.
[0075] It should be noted that the maximum operating temperature of the heating element 40 can be selected to other values depending on the actual situation, and is not limited here.
[0076] The heating element 40 is preferably a self-limiting heating belt, which is an electrothermal material with self-regulating temperature function. Its core heating layer is composed of a polymer and conductive particles (such as carbon particles). At low temperatures, the conductive particles are tightly connected to form a circuit, resulting in low resistance, high current, and high heating power. When the temperature rises to a set threshold (equivalent to the maximum operating temperature), the polymer material expands, causing the conductive particles to separate. The resistance increases sharply, the current is limited, and the heating power automatically decreases (equivalent to the resistance increasing with temperature, thus limiting the maximum operating temperature).
[0077] Thus, this embodiment limits the maximum operating temperature of the heating component 40 to 50°C, which can prevent the motherboard 10 from overheating and causing performance degradation or crashes, thereby ensuring the safety and reliability of the motherboard 10.
[0078] In some embodiments, the present invention also provides an air conditioner, which includes the motherboard heat dissipation structure described above.
[0079] In this way, when the motherboard 10 is running, the heat-generating components 20 located on the motherboard 10 will continuously generate heat. At this time, the main control unit will control the cooling working fluid to circulate in the heat dissipation pipe 302 so that the heat dissipation pipe 302 can dissipate heat from the heat-generating components 20 distributed on both sides, reduce the surface temperature of the heat-generating components 20, and thus prevent the heat-generating components 20 from overheating and causing performance degradation or shutdown.
[0080] However, in high humidity environments, the heating element 20 is prone to condensation due to the ambient temperature being lower than the air dew point temperature. The temperature sensor 50 monitors the ambient temperature on the motherboard 10 in real time and uploads the data to the main control unit. The main control unit then compares the received ambient temperature with the ambient dew point temperature. If the ambient temperature is lower than or equal to the ambient dew point temperature, the main control unit activates the heating component 40 to raise the surface temperature of the heat dissipation pipe 302 and the surrounding heating element 20, thus raising the ambient temperature above the ambient dew point temperature and preventing condensation on the motherboard 10. When the ambient temperature is higher than the ambient dew point temperature + 3°C, the main control unit shuts down the heating component 40, putting it into standby mode. During this period, the temperature sensor 50 monitors the ambient temperature in real time. When the ambient temperature is lower than or equal to the dew point temperature, the main control unit restarts the heating component 40, and this cycle repeats continuously. Figure 7 As shown in the figure, this process achieves proactive prevention of condensation while avoiding unnecessary energy consumption.
[0081] Therefore, this utility model dissipates heat from the motherboard 10 through the heat dissipation component 30 and increases the temperature of the heat dissipation component 30 and the surrounding heat-generating components 20 through the heating component 40, so as to prevent condensation from forming on the motherboard 10, thereby preventing short circuits, corrosion, or even damage to the air conditioner. This ensures that the motherboard 10 can maintain its anti-condensation function without sacrificing heat dissipation efficiency, thus enabling the air conditioner to operate stably and improving its service life and reliability.
[0082] Even when the air conditioner is operating in a high humidity environment, this embodiment can also take into account the anti-condensation function without sacrificing heat dissipation efficiency, so as to ensure the stable operation of the air conditioner, improve the service life and reliability of the air conditioner, and at a low cost.
[0083] Obviously, the embodiments described above are only some embodiments of this utility model, not all embodiments. The accompanying drawings show preferred embodiments of this utility model, but do not limit the patent scope of this utility model. This utility model can be implemented in many different forms; rather, the purpose of providing these embodiments is to provide a more thorough and comprehensive understanding of the disclosure of this utility model. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing specific embodiments, or make equivalent substitutions for some of the technical features. Any equivalent structures made using the content of this utility model specification and drawings, directly or indirectly applied to other related technical fields, are similarly within the patent protection scope of this utility model.
Claims
1. A mainboard heat dissipation structure comprising a mainboard (10) provided with a heat generating component (20), characterized in that, Also includes: The heat dissipation assembly (30) is oriented to match the spatial distribution of the heat-generating components (20) so that the heat-generating components (20) are distributed on both sides of the heat dissipation assembly (30); A heating component (40) is provided in conjunction with the heat dissipation component (30) to increase the temperature of the heat dissipation component (30) and its surroundings.
2. The motherboard heat dissipation structure according to claim 1, characterized in that, The heat dissipation assembly (30) includes: A heat sink housing (301) is fixed on the motherboard (10). A mounting groove (3011) is provided in the heat sink housing (301). A heat dissipation pipe (302) is installed in the mounting groove (3011). A cooling circulating medium flows in the heat dissipation pipe (302). A cover plate (303) is provided on the side of the heat dissipation housing (301) with a mounting groove (3011), and its inner surface is provided with a limiting curved surface (3031) that matches the outer contour of the heat dissipation pipe (302). When the cover plate (303) matches and covers the heat dissipation housing (301), the limiting curved surface (3031) and the mounting groove (3011) together constitute a three-dimensional spatial constraint on the heat dissipation pipe (302).
3. The motherboard heat dissipation structure according to claim 2, characterized in that, The heat dissipation housing (301) is embedded with a heating component (40), which is located on the side of the heat dissipation pipe (302) facing the motherboard (10); the heating component (40) is electrically connected to the motherboard (10) through an interface (401).
4. The motherboard heat dissipation structure according to claim 2 or 3, characterized in that, The extension direction of the heating component (40) is the same as that of the heat dissipation pipe (302).
5. The motherboard heat dissipation structure according to claim 2, characterized in that, The heat dissipation housing (301) has at least one groove (3012) on each side corresponding to the heat-generating element (20), and the inner wall of any groove (3012) is in contact with the surface of the heat-generating element (20).
6. The motherboard heat dissipation structure according to claim 2, characterized in that, The heat sink (301) is connected to the motherboard (10) on the side facing the motherboard (10) by a plurality of fixing posts (304); and a heat dissipation gap is formed between the motherboard (10) and the heat sink (301).
7. The motherboard heat dissipation structure according to claim 2, characterized in that, The heat dissipation pipe (302) is U-shaped, and the bend compensation section (3021) of the heat dissipation pipe (302) extends out of the heat dissipation shell (301).
8. The motherboard heat dissipation structure according to claim 1, characterized in that, A temperature sensor (50) is mounted on the surface of the heating element (20) that generates the least amount of heat.
9. The motherboard heat dissipation structure according to claim 1, characterized in that, The maximum operating temperature of the heating component (40) is 50°C.
10. An air conditioner, characterized in that, The air conditioner includes the motherboard heat dissipation structure as described in any one of claims 1 to 9.