Soldering layout structure of surface mount devices

Abstract

This utility model relates to the field of wireless communication technology and provides a soldering layout structure for surface mount devices, including: a low-noise amplifier, a first filter, a second filter, a substrate, a switch, first and second pads respectively mounted on the substrate for soldering SMD components at both ends, and third and fourth pads respectively mounted on the substrate for soldering SMD components at both ends; the first, second, third, and fourth pads are arranged in a 2×2 array; the fourth pad is connected to the input terminal of the first filter; the first and second pads are used to connect the two ends of the first SMD component, and the third and fourth pads are used to connect the two ends of the second SMD component; or, the first and fourth pads are used to connect the two ends of the first SMD component, and the second and third pads are used to connect the two ends of the second SMD component. The soldering layout of this utility model is compact and cost-effective.

Description

Technical Field

[0001] This utility model relates to the field of wireless communication technology, and in particular to a welding layout structure for surface mount devices. Background Technology

[0002] Radio frequency (RF) products require different component selection schemes to meet various needs. Manufacturing a separate PCB (Printed Circuit Board) for each scheme would be too costly. A common practice is to manufacture a single PCB compatible with multiple schemes, and then solder the appropriate components during SMT (Surface Mount Technology). For example, consider a combination of an LNA (Low Noise Amplifier), an SPDT (Single Pole Double Throw Switch), a Band 3 filter, and a Band 2 filter.

[0003] In related technologies, when targeting the global market, products need to include both B2 and B3 frequency bands. The aforementioned four components, along with the necessary SMD (Surface Mount Devices) resistors, capacitors, and inductors, all need to be soldered, such as... Figure 1 As shown. For the domestic market, the product does not require the B2 path, nor does it need the SPDT as a two-in-one switch. Through SMD selective soldering, the B3 path skips the SPDT, thus eliminating the need for the B2 filter and SPDT, reducing costs. Figure 2 As shown.

[0004] However, to enable selective soldering of the aforementioned surface mount devices, two SMD pads need to be left unused, wasting layout space. Additionally... Figure 2 When B3 is connected to an LNA alone, the path includes two series-connected SMD resistors, capacitors, and inductors, which increases circuit losses and costs. Utility Model Content

[0005] To address the shortcomings of the existing technologies, this utility model proposes a soldering layout structure for surface mount devices, thereby solving the problems of wasted soldering area and increased costs associated with existing surface mount devices.

[0006] To solve the above-mentioned technical problems, the present invention adopts the following technical solution:

[0007] This utility model provides a soldering layout structure for a surface mount device (SMD) device. The soldering layout structure includes: a low-noise amplifier, a first filter, a second filter, a substrate, a first pad and a second pad respectively mounted on the substrate for soldering SMD components at both ends, and a third pad and a fourth pad respectively mounted on the substrate for soldering SMD components at both ends; the first pad, the second pad, the third pad, and the fourth pad are arranged in a 2×2 array.

[0008] The first pad is connected to the output terminal of the low-noise amplifier, the second pad is connected to the control terminal of the switch, the first output terminal of the switch is connected to the input terminal of the second filter, the third pad is connected to the second input terminal of the switch, and the fourth pad is connected to the input terminal of the first filter; the first pad and the second pad are used to connect the two ends of the first SMD component, and the third pad and the fourth pad are used to connect the two ends of the second SMD component; or, the first pad and the fourth pad are used to connect the two ends of the first SMD component, and the second pad and the third pad are used to connect the two ends of the second SMD component.

[0009] Preferably, when the first filter and the second filter need to be connected in the circuit, the first SMD element and the second SMD element are placed side by side on a non-straight line and facing each other. The two ends of the first SMD element are respectively connected to the first pad and the second pad, and the two ends of the second SMD element are respectively connected to the third pad and the fourth pad.

[0010] When only the first filter needs to be connected in the circuit and the second filter needs to be disconnected, the first SMD element and the second SMD element are arranged side by side. The two ends of the first SMD element are respectively connected to the first pad and the fourth pad, and the two ends of the second SMD element are respectively connected to the second pad and the third pad.

[0011] Preferably, both the first SMD element and the second SMD element are any one of resistors, capacitors, and inductors.

[0012] Preferably, the first filter is in the Band 3 band and the second filter is in the Band 2 band.

[0013] Preferably, the switch is a single-pole double-throw switch.

[0014] Preferably, the length of the first SMD element is twice its width, and the length of the second SMD element is twice its width.

[0015] Compared with related technologies, in the embodiments of this utility model, a first and a second pad for soldering SMD components are mounted on the substrate, and a third and a fourth pad are respectively mounted on the substrate at both ends for soldering SMD components; the first, second, third, and fourth pads are arranged in a 2×2 array; the first pad is connected to the output terminal of the low-noise amplifier, the second pad is connected to the control terminal of the switch, the first output terminal of the switch is connected to the input terminal of the second filter, the third pad is connected to the second input terminal of the switch, and the fourth pad is connected to the input terminal of the first filter. The first and second pads are used to connect the two ends of the first SMD component, and the third and fourth pads are used to connect the two ends of the second SMD component; or, the first and fourth pads are used to connect the two ends of the first SMD component, and the second and third pads are used to connect the two ends of the second SMD component. In this way, the path selection is achieved by selectively soldering two SMD components. This invention only requires the area of ​​four SMD pads, and the layout is compact, with no empty pads causing area waste. At the same time, there are no redundant serial components on the path after selection, avoiding the introduction of additional losses and component costs. Attached Figure Description

[0016] The present invention will now be described in detail with reference to the accompanying drawings. The above and other aspects of the present invention will become clearer and easier to understand through the detailed description in conjunction with the following drawings. In the drawings:

[0017] Figure 1 A schematic diagram of the B3 and B2 filters being turned on in the soldering layout structure of surface mount devices provided for related technologies;

[0018] Figure 2 A schematic diagram of a single B3 filter conducting in a soldering layout structure for surface mount devices provided for related technologies;

[0019] Figure 3 A schematic diagram of the first and second filters being turned on in the soldering layout structure of the surface mount device provided in this embodiment of the utility model;

[0020] Figure 4 This is a schematic diagram of a single first filter conducting in a soldering layout structure of a surface mount device provided in an embodiment of the present invention.

[0021] Among them, 100 is the soldering layout structure of surface mount devices, 1 is the first SMD component, 2 is the second SMD component, 3 is the substrate, a is the first pad, b is the second pad, c is the third pad, and d is the fourth pad. Detailed Implementation

[0022] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains; the terminology used herein in the specification of the application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application; the terms "comprising" and "having," and any variations thereof, in the specification, claims, and foregoing drawings of this application, are intended to cover non-exclusive inclusion. The terms "first," "second," etc., in the specification, claims, or foregoing drawings of this application are used to distinguish different objects, not to describe a particular order.

[0023] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0024] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0025] Please see Figures 3-4As shown, this utility model embodiment provides a surface mount device (SMD) soldering layout structure 100, which includes: a low noise amplifier (LNA), a substrate 3, a switch SPDT, a first pad a and a second pad b respectively mounted on the substrate 3 for soldering SMD components, and a third pad c and a fourth pad d respectively mounted on the substrate 3 for soldering SMD components; the first pad a, the second pad b, the third pad c and the fourth pad d are arranged in a 2×2 array. The first pad a is connected to the output terminal of the low-noise amplifier (LNA), the second pad b is connected to the control terminal of the switch SPDT, the first output terminal of the switch SPDT is connected to the input terminal of the second filter B2, the third pad c is connected to the second input terminal of the switch, and the fourth pad d is connected to the input terminal of the first filter B3. The first pad a and the second pad b are used to connect the two ends of the first SMD component 1, and the third pad c and the fourth pad d are used to connect the two ends of the second SMD component 2; or, the first pad a and the fourth pad d are used to connect the two ends of the first SMD component 1, and the second pad b and the third pad c are used to connect the two ends of the second SMD component. The RF signal is filtered in the corresponding frequency band by the first filter B3 and the second filter B2, and then selected and connected by the switch SPDT. Finally, it is connected to the low-noise amplifier (LNA) through the switch SPDT, and the output of the low-noise amplifier (LNA) is sent to subsequent circuits. In this way, the path selection is also achieved by selectively soldering two SMD components. This invention only requires the area of ​​four SMD pads, and the layout is compact, with no empty pads causing wasted area. At the same time, there are no redundant serial components on the path after selection, avoiding the introduction of additional losses and component costs.

[0026] In this embodiment, the first pad a, the second pad b, the third pad c, and the fourth pad d are arranged in a 2×2 pattern with equal spacing. This facilitates selective soldering layout, utilizes the area of ​​four SMD pads, and features a compact layout with no wasted space. Specifically, the first pad a to the fourth pad d are arranged along the same circular direction. For example, in a 2×2 array, the first pad a is at the top left, the second pad b is at the top right, the third pad c is at the bottom right, and the fourth pad d is at the bottom left.

[0027] Of course, it's not just about 2×2 equal spacing; it can also be arranged in 3×3 equal spacing, 4×4 equal spacing, etc. The specific arrangement can be chosen according to the actual situation.

[0028] In this embodiment, the first pad a and the second pad b are arranged side by side with the fourth pad d and the third pad c, respectively. This side-by-side arrangement facilitates installation.

[0029] In this embodiment, the first pad a and the second pad b are arranged side by side with the fourth pad d and the third pad c, respectively. This side-by-side arrangement facilitates installation.

[0030] In this embodiment, as Figure 3 As shown, when the first filter B3 and the second filter B2 need to be connected in the circuit, the first SMD element and the second SMD element are placed side by side, not on the same straight line, and facing each other. The two ends of the first SMD element 1 are connected to the first pad a and the second pad b, respectively, and the two ends of the second SMD element 2 are connected to the third pad c and the fourth pad d, respectively. Specifically, when the first SMD element 1 and the second SMD element 2 are placed side by side, both the first filter B3 and the second filter B2 can be connected to the SPDT switch. The SPDT switch is connected to the low-noise amplifier (LNA). The path selection is achieved by selectively soldering the two SMD elements, requiring only the area of ​​four SMD pads. The layout is compact, and there are no empty pads causing wasted area.

[0031] like Figure 4 As shown, when only the first filter B3 needs to be connected in the circuit and the second filter B2 is disconnected, the first SMD element 1 and the second SMD element 2 are arranged side by side. The two ends of the first SMD element 1 are connected to the first pad a and the fourth pad d, respectively, and the two ends of the second SMD element 2 are connected to the second pad b and the third pad c, respectively. Specifically, when the path of the second filter B2 is not needed, there is no need to modify the wiring. Simply rotate the first SMD element 1 by 90 degrees and solder it. The first filter B3 is directly connected to the low-noise amplifier (LNA). The switch SPDT and the second filter B2 can be simplified, effectively saving costs. That is to say, at this time, the first SMD element 1 only needs to be rotated 90 degrees and its two ends soldered to the first pad a and the fourth pad d, and the second SMD element 2 only needs to be rotated 90 degrees and its two ends soldered to the second pad b and the third pad c. In other words, the second SMD element 2 is not installed in the circuit.

[0032] In this embodiment, the first SMD element 1 and the second SMD element 2 are either resistors, capacitors, or inductors. The first SMD element 1 and the second SMD element 2 are resistors, capacitors, inductors, etc., characterized by having two pads and a length approximately twice the width, facilitating 90-degree rotation for soldering.

[0033] In this embodiment, the first filter B3 operates in the Band 3 band, and the second filter B2 operates in the Band 2 band. The Band 2 and Band 3 bands in the filters refer to specific frequency ranges. The Band 2 band typically refers to the 1900MHz band, and in some communication standards, its frequency range is generally 1850-1910MHz uplink and 1930-1990MHz downlink. The Band 3 band typically refers to the 1800MHz band, with an uplink frequency range of 1710-1785MHz and a downlink frequency range of 1805-1880MHz. By designing the filters, signals within the Band 2 or Band 3 bands can pass through while suppressing signals from other bands, thus achieving frequency selection and ensuring the purity and stability of the communication signals.

[0034] In this embodiment, the SPDT switch is a single-pole double-throw switch. Single-pole double-throw switches facilitate the control of two outputs, making operation convenient.

[0035] In this embodiment, the length of the first SMD element is twice its width, and the length of the second SMD element is twice its width.

[0036] It should be noted that the various embodiments described above with reference to the accompanying drawings are only illustrative of the present invention and not intended to limit its scope. Those skilled in the art should understand that any modifications or equivalent substitutions made to the present invention without departing from its spirit and scope should be covered within the scope of the present invention. Furthermore, unless the context otherwise requires, singular terms include plural forms, and vice versa. Additionally, unless specifically stated otherwise, all or part of any embodiment may be used in conjunction with all or part of any other embodiment.

Claims

1. A solder layout structure for a surface mount device, characterized by, The surface mount device's soldering layout structure includes: a low-noise amplifier, a first filter, a second filter, a substrate, a switch, a first pad and a second pad respectively mounted on the substrate for soldering SMD components at both ends, and a third pad and a fourth pad respectively mounted on the substrate for soldering SMD components; the first pad, the second pad, the third pad, and the fourth pad are arranged in a 2×2 array. The first pad is connected to the output terminal of the low-noise amplifier, the second pad is connected to the control terminal of the switch, the first output terminal of the switch is connected to the input terminal of the second filter, the third pad is connected to the second input terminal of the switch, and the fourth pad is connected to the input terminal of the first filter; the first pad and the second pad are used to connect the two ends of the first SMD component, and the third pad and the fourth pad are used to connect the two ends of the second SMD component; or, the first pad and the fourth pad are used to connect the two ends of the first SMD component, and the second pad and the third pad are used to connect the two ends of the second SMD component.

2. The soldering layout structure of the surface mount device according to claim 1, characterized in that, When the first filter and the second filter need to be connected in the circuit, the first SMD element and the second SMD element are placed side by side on a non-straight line and facing each other. The two ends of the first SMD element are respectively connected to the first pad and the second pad, and the two ends of the second SMD element are respectively connected to the third pad and the fourth pad. When only the first filter needs to be connected in the circuit and the second filter needs to be disconnected, the first SMD element and the second SMD element are arranged side by side. The two ends of the first SMD element are respectively connected to the first pad and the fourth pad, and the two ends of the second SMD element are respectively connected to the second pad and the third pad.

3. The soldering layout structure for surface mount devices according to claim 1, characterized in that, Both the first SMD element and the second SMD element are any one of resistors, capacitors, and inductors.

4. The soldering layout structure of the surface mount device according to claim 1, characterized in that, The first filter operates in the Band 3 frequency band, and the second filter operates in the Band 2 frequency band.

5. The soldering layout structure of the surface mount device according to claim 1, characterized in that, The switch is a single-pole double-throw switch.

6. The soldering layout structure of the surface mount device according to claim 1, characterized in that, The length of the first SMD element is twice its width, and the length of the second SMD element is twice its width.

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