PCB screw hole pad structure, PCB board and control system

Abstract

This utility model discloses a PCB screw hole pad structure, a PCB board, and a control system. The PCB screw hole pad structure includes a pad body with an exhaust channel. The exhaust channel is parallel to the direction in which the printed circuit board enters the reflow oven. The PCB board includes the PCB screw hole pad structure. The control system includes the PCB board. When the solder paste is heated in the reflow oven, the gas in the solder paste can flow along the exhaust channel and diffuse outward, preventing gas from accumulating at the pad body and forming pores on the solder paste surface, thus not affecting the solderability of the solder paste. The direction of the exhaust channel being parallel to the direction in which the printed circuit board enters the reflow oven helps to improve the effect and efficiency of gas flow and diffusion, so that the pad body achieves the technical effects of good soldering effect, less solder paste accumulation, simple process, and high product reliability.

Description

Technical Field

[0001] This utility model relates to the field of printed circuit board technology, specifically to a PCB screw hole pad structure, a PCB board, and a control system. Background Technology

[0002] A PCB (Printed Circuit Board) is an important electronic component. It serves as the support for electronic components and the carrier for their electrical interconnections. Because it is manufactured using electronic printing techniques, it is called a "printed" circuit board.

[0003] With the development of electronic information technology, printed circuit boards (PCBs) are widely used in the electronics field, and their integration is becoming increasingly higher, their size smaller, and their weight lighter. PCBs have exposed copper pads for soldering components. During PCB surface mount assembly, solder paste is first applied to the pads, then the components are placed on the pads. The solder paste is then heated in a reflow oven to achieve soldering and electrical connections between the PCB and the electronic components. However, solder paste often contains a lot of gas. In existing screw hole closed annular pads, during the reflow oven heating process, the gas is trapped in the annular shape and does not easily diffuse outwards, thus creating pores on the solder paste surface and causing poor soldering. Utility Model Content

[0004] The technical problem to be solved by this utility model is that closed solder pads are prone to pores. The purpose is to provide a PCB screw hole solder pad structure, PCB board and control system to solve the above-mentioned problem.

[0005] This utility model is achieved through the following technical solution: In a first aspect, this utility model provides a PCB screw hole pad structure, including a pad body, on which an exhaust channel is provided, the direction of which is parallel to the direction in which the printed circuit board enters the reflow oven.

[0006] In one possible design, the width of the exhaust passage is no less than 0.8 mm.

[0007] In one possible design, the pad body includes two oppositely arranged sub-pads, with the straight gap between the sub-pads forming the exhaust channel.

[0008] In one possible design, the sub-pad is constructed as a semi-circular ring to make the pad body ring-shaped.

[0009] In one possible design, the inner diameter of the annular pad body is 0.4-0.6 mm, and the outer diameter is 1.4-1.6 mm.

[0010] In one possible design, the sub-pad is constructed as a concave ring to make the pad body rectangular.

[0011] In one possible design, the sub-pad is constructed as an arc-shaped ring to make the pad body elliptical.

[0012] In one possible design, a via is provided in the middle of the pad body.

[0013] Secondly, this utility model provides a PCB board, including the aforementioned PCB screw hole pad structure.

[0014] Thirdly, this utility model provides a control system, including the aforementioned PCB board.

[0015] Compared with the prior art, this utility model has the following advantages and beneficial effects: When the solder paste is heated in the reflow oven, the gas inside the solder paste can flow along the exhaust channel and diffuse outward, preventing gas from accumulating on the solder pads and forming pores on the surface of the solder paste, thus not affecting the solderability of the solder paste.

[0016] The exhaust channel is parallel to the direction in which the printed circuit board enters the reflow oven, which helps to improve the effect and efficiency of gas flow and diffusion, so that the solder pad body can achieve good soldering effect, less solder paste accumulation, simple process and high product reliability.

[0017] It also has the advantages of simple structure, saving on printed circuit board production costs, accelerating production cycle, strong solderability and good heat dissipation. Attached Figure Description

[0018] The accompanying drawings, which are included to provide a further understanding of the embodiments of the present invention and form part of this application, do not constitute a limitation thereof. In the drawings: Figure 1 This is a schematic diagram of a PCB screw hole pad structure.

[0019] The attached diagram shows the markings and corresponding component names: 1. Pad body; 2. Venting channel; 3. Sub-pad; 4. Via. Detailed Implementation

[0020] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the embodiments and accompanying drawings. The illustrative embodiments and descriptions of this utility model are only used to explain this utility model and are not intended to limit this utility model.

[0021] In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. However, it will be apparent to those skilled in the art that these specific details are not necessary to implement the present invention. In other embodiments, well-known structures, circuits, materials, or methods are not specifically described in order to avoid obscuring the present invention.

[0022] Throughout this specification, references to "an embodiment," "an example," or "an example" mean that a particular feature, structure, or characteristic described in connection with that embodiment or example is included in at least one embodiment of the present invention. Therefore, the phrases "an embodiment," "an example," "an example," or "an example" appearing in various places throughout the specification do not necessarily refer to the same embodiment or example. Furthermore, specific features, structures, or characteristics can be combined in one or more embodiments or examples in any suitable combination and / or sub-combination. Moreover, those skilled in the art will understand that the illustrations provided herein are for illustrative purposes and are not necessarily drawn to scale. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0023] In the description of this utility model, the terms "front", "rear", "left", "right", "up", "down", "vertical", "horizontal", "high", "low", "inner", and "outer" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting the scope of protection of this utility model.

[0024] Example: In surface mount assembly of printed circuit boards (PCBs), solder paste is first applied to the pads, then components are placed on the pads. The solder paste is then heated in a reflow oven to achieve soldering and electrical connections between the PCB and electronic components. Solder paste often contains a lot of gas. In existing screw hole closed annular pads, during the reflow oven heating process, the gas is trapped in the annular shape and does not easily diffuse outward, thus creating pores on the solder paste surface and causing poor soldering.

[0025] To address this issue, a PCB screw hole pad structure, a PCB board, and a control system are provided to solve the aforementioned problems. Specifically: like Figure 1 As shown, in a first aspect, the present invention provides a PCB screw hole pad structure, including a pad body 1, on which an exhaust channel 2 is provided, the direction of the exhaust channel 2 being parallel to the direction in which the printed circuit board enters the reflow oven.

[0026] When the PCB screw hole pad structure enters the reflow oven to heat the solder paste, the exhaust channel 2 improves the problem of airflow blockage in the reflow oven. Specifically, when the solder paste is heated in the reflow oven, the gas in the solder paste can flow along the exhaust channel 2 and diffuse outward, avoiding the accumulation of gas at the pad body 1 and preventing the formation of pores on the surface of the solder paste, thus not affecting the solderability of the solder paste.

[0027] It is worth noting that the direction of the exhaust channel 2 is parallel to the direction in which the printed circuit board enters the reflow oven, which helps to improve the effect and efficiency of gas flow and diffusion, so that the pad body 1 can achieve the technical effects of good welding effect, less solder paste accumulation, simple process and high product reliability.

[0028] Furthermore, compared to existing pads, the PCB screw hole pad structure greatly improves process performance through the setting of exhaust channel 2, and also has the advantages of simple structure, saving printed circuit board production costs, accelerating production cycle, strong solderability and good heat dissipation.

[0029] In addition, when used on a PCB board, the exhaust channel 2 can also serve as an electrical isolation mechanism to prevent short circuits caused by bridging of molten metal during soldering or plating.

[0030] In one possible implementation, the width of the venting channel 2 is not less than 0.8 mm. Based on the above design, in through-hole components, the venting channel 2 ensures both venting and solder penetration, preventing copper foil peeling. In surface mount technology, bridging is avoided and space is provided for gas escape.

[0031] It is easy to understand that, based on different usage scenarios, the specific value of the width of exhaust channel 2 should be further determined in order to better adapt to the usage scenario and achieve better working results.

[0032] In one possible implementation, the pad body 1 includes two oppositely arranged sub-pads 3, and the straight gap between the sub-pads 3 constitutes the exhaust channel 2. Based on the above design, the two sub-pads 3 are arranged opposite each other, and the exhaust channel 2 is the gap between the two sub-pads 3, corresponding to the direction in which the printed circuit board enters the reflow oven, that is, reciprocating linear movement. The direction of the exhaust channel 2 is parallel to the direction in which the printed circuit board enters the reflow oven, thereby improving the effect and efficiency of gas flow and diffusion.

[0033] It is worth noting that, based on the structural improvement of the pad body 1, the exhaust channel 2 is formed by splicing two opposing sub-pads 3, rather than processing the exhaust channel 2 on the entire pad body 1, so as to avoid damaging the PCB board and help ensure the performance and service life of the PCB board.

[0034] Optionally, such as Figure 1As shown, the sub-pad 3 is constructed as a semi-circular ring, making the pad body 1 ring-shaped. Based on the above design, the ring-shaped pad body 1 has good versatility, is suitable for regularly arranged components, and has good soldering performance, helping to prevent detachment.

[0035] Furthermore, the inner diameter of the annular pad body 1 is 0.4-0.6 mm, and the outer diameter is 1.4-1.6 mm. Based on the above design, the dimensions of the annular pad body 1 are further determined according to different usage scenarios to better adapt to the usage scenarios and achieve better working results.

[0036] Optionally, the sub-pad 3 is constructed as a concave ring, making the pad body 1 rectangular. Based on the above design, the rectangular pad body 1 effectively increases the contact area for soldering, improves the stability of the connection, and is more suitable for high-current devices and high-reliability connection scenarios.

[0037] Optionally, the sub-pad 3 is constructed as an arc-shaped ring, making the pad body 1 elliptical. Based on the above design, the elliptical pad body 1 effectively enhances the peel resistance and reduces the risk of pad detachment, and is commonly used in dual in-line package devices.

[0038] It is worth noting that sub-pad 3 can also be constructed into any other suitable shape to form teardrop pads, cross-shaped pads, plum blossom pads, or other suitable shapes of pads, to better adapt to the application scenario and achieve better working results.

[0039] Based on this, those skilled in the art can determine the shape of the pad body 1 according to the actual usage scenario, and then design the shape of the sub-pad 3. This utility model does not impose any restrictions on this.

[0040] In one possible implementation, a via 4 is provided in the center of the pad body 1. Based on the above design, the via 4 serves as an electrical connection, enabling electrical conduction between different circuit layers, especially as a key channel for signal transmission in multilayer boards. Simultaneously, the via 4 can enhance heat dissipation, transferring heat from components to the back of the PCB or inner copper foil. Combined with the bottom-side window design, it accelerates airflow, reduces thermal resistance, and significantly improves heat dissipation efficiency. Furthermore, the via 4 can enhance soldering reliability and optimize soldering quality.

[0041] Secondly, this utility model provides a PCB board including the aforementioned PCB screw hole pad structure. Based on this, the PCB board can also include other suitable functional modules on top of the aforementioned PCB screw hole pad structure, resulting in richer functionality to meet different operational requirements and improved practicality. Furthermore, it is readily understood that these functional modules can be selected from any suitable existing equipment, offering a wide range of choices.

[0042] Thirdly, this utility model provides a control system, including the aforementioned PCB board. Based on this, the control system can further include other suitable functional modules on the PCB board, resulting in richer functionality to meet different operational requirements and improved practicality. Furthermore, it is readily understood that the functional modules can be any suitable existing equipment, offering a wide range of choices.

[0043] The specific embodiments described above further illustrate the purpose, technical solution, and beneficial effects of this utility model. It should be understood that the above description is only a specific embodiment of this utility model and is not intended to limit the scope of protection of this utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the scope of protection of this utility model.

Claims

1. A PCB screw hole pad structure, characterized in that, It includes a pad body (1), and the pad body (1) is provided with an exhaust channel (2). The direction of the exhaust channel (2) is parallel to the direction of the printed circuit board entering the reflow oven.

2. The PCB screw hole pad structure of claim 1, wherein, The width of the exhaust channel (2) is not less than 0.8 mm.

3. The PCB screw hole pad structure of claim 2, wherein, The pad body (1) includes two oppositely arranged sub-pads (3), and the straight gap between the sub-pads (3) is configured as the exhaust channel (2).

4. The PCB screw hole pad structure of claim 3, wherein, The sub-pad (3) is constructed as a semi-circular ring so that the pad body (1) is in a ring shape.

5. The PCB screw hole pad structure of claim 4, wherein, The inner diameter of the annular pad body (1) is 0.4-0.6 mm and the outer diameter is 1.4-1.6 mm.

6. The PCB screw hole pad structure of claim 3, wherein, The sub-pad (3) is constructed as a concave ring so that the pad body (1) is rectangular.

7. The PCB screw hole pad structure of claim 3, wherein, The sub-pad (3) is constructed as an arc ring so that the pad body (1) is elliptical.

8. The PCB screw hole pad structure of any one of claims 1-7, wherein, A via (4) is provided in the middle of the pad body (1).

9. A PCB board characterized by, The PCB screw hole pad structure includes any one of claims 1-8.

10. A control system characterized by, Includes the PCB board as described in claim 9.

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