Integrated DCDC power supply, TBOX communication and BMS battery management multifunctional circuit board

Abstract

This utility model discloses a multifunctional circuit board integrating DC-DC power supply, TBOX communication, and BMS battery management, comprising: a main board and a daughter board, the daughter board being electrically connected to the main board via pins and screws; the main board is equipped with a DC-DC power supply and a BMS battery management system, and the daughter board is equipped with a TBOX communication module. By implementing this multifunctional circuit board, the functions of DC-DC power supply, TBOX communication, and BMS battery management can be effectively integrated, improving system performance, reducing production and installation costs, and enhancing data interaction capabilities.

Description

Technical Field

[0001] This utility model relates to the field of circuit board technology, and in particular to a multifunctional circuit board that integrates DC-DC power supply, TBOX communication and BMS battery management. Background Technology

[0002] Current power management systems on the market are typically designed independently, mainly consisting of a DC-DC power module, a TBOX (Telematics Box) communication module, and a BMS (Battery Management System). The DC-DC power module is responsible for converting the input voltage to the required stable output voltage and is widely used in various electronic devices; however, existing designs often face poor heat dissipation issues when handling high power demands, leading to increased operating temperatures and affecting system stability and lifespan. Meanwhile, the TBOX communication module primarily provides 4G communication and GPS positioning functions for remote data transmission and vehicle tracking; and the BMS focuses on battery pack status monitoring and management, including cell voltage, temperature acquisition, and insulation resistance detection. Although these components each have unique functions, they usually exist as independent controllers, lacking an effective integrated solution.

[0003] The aforementioned independent design approach presents several challenges and limitations. First, the independent operation of the DC-DC power module, TBOX communication module, and BMS battery management system increases the overall system complexity, leading to higher production costs and space requirements. This decentralized design is particularly problematic in battery pack applications, making installation cumbersome and hindering compact layouts. Second, the lack of direct data exchange mechanisms between modules, especially the TBOX communication module's inability to acquire and upload real-time status information from the BMS, limits remote monitoring and fault diagnosis capabilities. Furthermore, the DC-DC power module's poor heat dissipation under high loads further exacerbates the risk of system overheating and reduces overall reliability.

[0004] Therefore, it is necessary to design a new circuit board that effectively integrates DC-DC power supply, TBOX communication, and BMS battery management functions to improve system performance, reduce production and installation costs, and enhance data interaction capabilities. Utility Model Content

[0005] The purpose of this invention is to overcome the shortcomings of the prior art and provide a multifunctional circuit board that integrates DC-DC power supply, TBOX communication and BMS battery management.

[0006] To solve the above-mentioned technical problems, the purpose of this utility model is achieved through the following technical solution: providing a multifunctional circuit board integrating DC-DC power supply, TBOX communication and BMS battery management, including: a motherboard and a daughterboard, wherein the daughterboard is electrically connected to the motherboard through pins and screws; the motherboard is provided with DC-DC power supply and BMS battery management system, and the daughterboard is provided with TBOX communication module.

[0007] The further technical solution is as follows: the DC-DC power supply is located on the upper part of the motherboard, the BMS battery management system is located on the lower part of the motherboard, and the daughterboard is connected to the motherboard through pins and screws.

[0008] The further technical solution is as follows: the DC-DC power supply includes an isolated DC-DC flyback power supply, a DC-DC buck power supply, and an LDO power supply; the isolated DC-DC flyback power supply is connected to the DC-DC buck power supply; the DC-DC buck power supply is connected to the LDO power supply; and the LDO power supply is connected to the TBOX communication module and the BMS battery management system respectively.

[0009] The further technical solution is as follows: the BMS battery management system includes a control unit, an AFE chip, an AFE acquisition module, a high-voltage acquisition module, and a high-side drive module. The AFE chip is connected to the control unit, the AFE acquisition module, and the high-voltage acquisition module respectively. The AFE acquisition module is connected to the DC-DC power supply. The high-side drive module is connected to the control unit, and the high-side drive module is also connected to a high-side drive chip.

[0010] The further technical solution is as follows: the BMS battery management system includes an insulation resistance detection module, which is connected to the DC-DC power supply and the control unit.

[0011] The further technical solution is as follows: the BMS battery management system includes a Hall sensor current acquisition module, a CAN communication module, and a GPIO module; the Hall sensor current acquisition module is connected to the control unit; the insulation resistance detection module is connected to the DC-DC power supply and the control unit respectively; the GPIO module is connected to the control unit.

[0012] The further technical solution is as follows: the BMS battery management system includes an RTC timing module, a level and temperature detection module, and an interface module; the RTC timing module is connected to the control unit via an SPI interface; the level and temperature detection module is connected to the control unit via an SPI interface; the interface is connected to the control unit and to the daughterboard.

[0013] The further technical solution is as follows: the TBOX communication module includes a power conversion module, a voltage regulator module, and a 4G and GPS function integration module; the power conversion module is connected to the DC-DC power supply; the power conversion module is connected to the voltage regulator module; the voltage regulator module is connected to the 4G and GPS function integration module; and the 4G and GPS function integration module is connected to the interface.

[0014] The further technical solution is as follows: the TBOX communication module includes a SIM card, and the SIM card is connected to the 4G and GPS function integration module.

[0015] The further technical solution is as follows: the TBOX communication module also includes an antenna interface and a connector; the antenna interface and the connector are respectively connected to the 4G and GPS function integration module.

[0016] The advantages of this invention compared to existing technologies are as follows: This invention integrates the DC-DC power supply and BMS battery management system onto the motherboard, while configuring a TBOX communication module on the daughterboard. A stable electrical connection between the daughterboard and the motherboard is achieved using pins and screws, effectively integrating power supply, battery management, and remote communication functions. This design not only optimizes the spatial layout and improves the overall performance and stability of the system, but also significantly reduces production and installation costs by simplifying the structure and reducing the number of components. Furthermore, due to the enhanced real-time data interaction capability between the TBOX and BMS, the system can more efficiently perform status monitoring, fault diagnosis, and remote upgrades, further improving user experience and system reliability.

[0017] The present invention will be further described below with reference to the accompanying drawings and specific embodiments. Attached Figure Description

[0018] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 A schematic block diagram of a multifunctional circuit board integrating DC-DC power supply, TBOX communication and BMS battery management provided for embodiments of this utility model;

[0020] Figure 2 A schematic diagram of the principle of a multifunctional circuit board integrating DC-DC power supply, TBOX communication and BMS battery management provided for an embodiment of this utility model;

[0021] Figure 3A detailed circuit diagram of the DC-DC power supply provided in this embodiment of the utility model;

[0022] Figure 4 A detailed circuit diagram of the control unit provided in this embodiment of the utility model;

[0023] Figure 5 A detailed circuit diagram of the AFE communication module provided in this embodiment of the utility model;

[0024] Figure 6 A detailed circuit diagram of the AFE acquisition module provided in this embodiment of the utility model;

[0025] Figure 7 A detailed circuit diagram of the high-voltage acquisition module provided in this embodiment of the utility model;

[0026] Figure 8 A detailed circuit diagram of the high-side drive module provided in this embodiment of the utility model;

[0027] Figure 9 A detailed circuit diagram of the insulation resistance detection module provided in this embodiment of the utility model;

[0028] Figure 10 A detailed circuit diagram of the Hall sensor current acquisition module provided in this embodiment of the utility model;

[0029] Figure 11 A detailed circuit diagram of the CAN communication module provided in this embodiment of the utility model;

[0030] Figure 12 A detailed circuit diagram of the GPIO module provided in this embodiment of the utility model;

[0031] Figure 13 A detailed circuit diagram of the RTC timing module provided in this embodiment of the utility model;

[0032] Figure 14 A detailed circuit diagram of the level temperature detection module provided in this embodiment of the utility model;

[0033] Figure 15 Specific circuit schematic diagram of the interface module provided in the embodiments of this utility model;

[0034] Figure 16 The specific circuit diagram of the TBOX communication module provided in this embodiment of the utility model is shown below. Detailed Implementation

[0035] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0036] It should be understood that, when used in this specification and the appended claims, the terms "comprising" and "including" indicate the presence of the described features, integrals, steps, operations, elements and / or components, but do not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components and / or collections thereof.

[0037] It should also be understood that the terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to limit the scope of the invention. As used in this specification and the appended claims, the singular forms “a,” “an,” and “the” are intended to include the plural forms unless the context clearly indicates otherwise.

[0038] It should also be further understood that the term "and / or" as used in this specification and the appended claims refers to any combination of one or more of the associated listed items and all possible combinations, and includes such combinations.

[0039] Current power management systems on the market typically consist of independently designed DC-DC power modules, TBOX communication modules, and BMS battery management systems. These components are responsible for voltage conversion, remote data transmission and vehicle tracking, and battery status monitoring and management, respectively. However, this decentralized design presents multiple challenges: it not only increases system complexity and cost but also results in a large space footprint, especially in battery pack applications where installation is inconvenient; simultaneously, the lack of effective integration solutions leads to insufficient data exchange between modules, particularly the inability of the TBOX to upload BMS status information in real time, limiting remote monitoring and fault diagnosis capabilities; furthermore, the heat dissipation problem of the DC-DC power module under high load affects system stability and lifespan, ultimately reducing the overall reliability and performance of the system.

[0040] To this end, this utility model provides a multifunctional circuit board that integrates DC-DC power supply, TBOX communication and BMS battery management, effectively integrating DC-DC power supply 10, TBOX communication module 20 and BMS battery management functions, improving system performance, reducing production and installation costs, and enhancing data interaction capabilities.

[0041] Specifically, the circuit board achieves a compact layout through a separate main board 1 and daughter board 2. Main board 1 integrates the DC-DC power supply 10 and the BMS battery management system 30, while daughter board 2 houses the TBOX communication module 20 and is electrically connected to main board 1 via pins and screws. This design not only optimizes space utilization and reduces system complexity and production costs but also improves installation convenience. Furthermore, this solution refines the internal structure of each component, such as the isolated flyback power supply, buck power supply, and LDO power supply in the DC-DC power supply 10, ensuring high-efficiency output. The BMS system includes a control unit, AFE chip, and current acquisition module, enabling precise monitoring and management of battery status. The TBOX module enhances remote data transmission capabilities through 4G and GPS integration. Crucially, this highly integrated design facilitates direct data interaction between modules, particularly enabling the TBOX to acquire and upload BMS status information in real time, significantly improving remote monitoring and fault diagnosis capabilities. This effectively integrates power management, communication, and battery monitoring functions, substantially improving the overall system performance and reliability.

[0042] To better understand the above technical solutions, the following will provide a detailed explanation of the technical solutions in conjunction with the accompanying drawings and specific implementation methods.

[0043] Please see Figure 1 The multifunctional circuit board integrating DC-DC power supply, TBOX communication and BMS battery management includes: a main board 1 and a daughter board 2. The daughter board 2 is electrically connected to the main board 1 through pins and screws. The main board 1 is equipped with a DC-DC power supply 10 and a BMS battery management system 30, and the daughter board 2 is equipped with a TBOX communication module 20.

[0044] In this embodiment, the DC-DC power supply 10, the TBOX communication module 20, and the BMS battery management system 30 are integrated onto a single multi-functional circuit board to achieve high efficiency, low cost, and convenient installation. Specifically, this multi-functional circuit board comprises two main parts: a main board 1 and a daughter board 2.

[0045] Motherboard 1 integrates a DC-DC power supply unit 10 and a battery management system 30. The DC-DC power supply unit 10 is located in the upper part of motherboard 1 and is used to convert external power (36-120V) to the voltage levels required for system operation (such as 12V, 5.4V, 5V). The battery management system 30 is located in the lower half of motherboard 1 and is responsible for battery status monitoring, fault diagnosis, and handling.

[0046] Daughterboard 2: Primarily houses the TBOX communication module 20 and is electrically connected to the mainboard 1 via pins and screws. The design of daughterboard 2 allows it to be installed as an optional component, providing flexible configuration options. The TBOX communication module 20 supports 4G remote communication, GPS positioning, and other functions, and is capable of data exchange with the backend and OTA upgrades.

[0047] In one embodiment, the DC-DC power supply 10 is located on the upper part of the motherboard 1, the BMS battery management system 30 is located on the lower part of the motherboard 1, and the daughterboard 2 is connected to the motherboard 1 through pins and screws.

[0048] In one embodiment, the DC-DC power supply unit 10 is located in the upper half of the motherboard 1. It adopts a reinforced heat dissipation design to ensure effective heat dissipation even under high output power, maintaining stable system operation. The BMS battery management system 30 is distributed in the middle and lower half of the motherboard 1, and includes multiple sub-modules such as control units, AFE chips, and current acquisition modules. These components work together to achieve comprehensive monitoring and management of the power battery status.

[0049] The TBOX communication module 20 on daughterboard 2 not only simplifies the installation process but also enhances the system's communication capabilities. It receives data from motherboard 1 and utilizes a 4G+GPS integrated module to achieve remote data transmission, making real-time monitoring and fault diagnosis easier.

[0050] This highly integrated design not only significantly reduces the production space and cost of the battery pack, but also improves manual installation efficiency and reduces installation costs. Furthermore, the close data interaction between modules, especially the real-time data exchange between the TBOX and BMS, greatly enhances the performance and reliability of the entire system. Therefore, this invention is particularly suitable for battery pack assembly in industrial applications such as electric forklifts, loaders, AGVs, and tractors.

[0051] In one embodiment, please refer to Figure 2 The DC-DC power supply 10 includes an isolated DC-DC flyback power supply, a DC-DC buck power supply, and an LDO power supply; the isolated DC-DC flyback power supply is connected to the DC-DC buck power supply; the DC-DC buck power supply is connected to the LDO power supply; and the LDO power supply is connected to the TBOX communication module 20 and the BMS battery management system 30, respectively.

[0052] Specifically, the DC-DC power supply 10 is the core power supply component of the entire system. Its design aims to convert the 36-120V voltage provided by the external battery pack into multiple stable voltage levels required by the system. First, the isolated DC-DC flyback power supply circuit receives a wide range of input voltages from the external battery pack and achieves electrical isolation and voltage conversion through a transformer, outputting a stable 12V DC power. This process not only ensures the safe operation of the system but also provides the foundation for subsequent voltage regulation.

[0053] Next, the DC-DC buck converter circuit receives a 12V input and further steps it down to 5.4V. Buck converters typically employ high-efficiency switching regulators to reduce energy loss and improve conversion efficiency. By precisely controlling the switching frequency and duty cycle, this circuit can stably output a 5.4V voltage, meeting the medium-voltage requirements of modules in the system.

[0054] Finally, the LDO power supply circuit further reduces the 5.4V voltage to 5V, providing low-noise, high-precision power to the sensitive electronic components in the system. LDO regulators are known for their excellent ripple rejection and fast transient response, making them particularly suitable for microcontrollers and other digital circuits that require stable voltage.

[0055] In summary, the multi-stage voltage conversion process, from 36-120V to 12V, then to 5.4V, and finally to 5V, demonstrates the meticulous design and layout of the DC-DC power supply 10 in this circuit diagram. This hierarchical power supply strategy not only improves the overall energy efficiency of the system but also ensures the stable operation of each module under different voltage requirements, thereby supporting the reliable operation of the entire multi-functional circuit board.

[0056] Specifically, isolated DC-DC flyback power supplies include:

[0057] Input filters (C1, C2, L1): There is usually an EMI (electromagnetic interference) filter before receiving the 36-120V input voltage to suppress grid noise and prevent high-frequency noise propagating in the back.

[0058] Isolation transformer T1: This is a key component for achieving electrical isolation. By changing the turns ratio of the primary and secondary coils, high voltage can be converted into the required low voltage output.

[0059] Rectifier and filter circuit (D1, C3, C4): The AC voltage on the secondary side is rectified into DC and filtered by capacitors to smooth voltage fluctuations and ensure stable output.

[0060] Control IC (U1): Used to monitor the output voltage and adjust the operating state of the switching elements to ensure stable output voltage.

[0061] DCDC step-down power supplies include:

[0062] Power inductor (L2): As an energy storage element, it stores energy when the switch is on and releases energy to the load when the switch is off, which helps to stabilize the output current.

[0063] MOSFET switch (Q1): A high-efficiency electronic switch that achieves voltage conversion through rapid switching. Its operating frequency determines the conversion efficiency and ripple magnitude.

[0064] Freewheeling diode (D2): When the MOSFET is off, it provides a low-impedance path for the inductor current to continue flowing, preventing excessive voltage from damaging other components.

[0065] Feedback loop (U2, R1, R2, optocoupler PC1): Includes error amplifier, optocoupler and other components, used to precisely regulate the output voltage and ensure that the output voltage is stable at 5.4V.

[0066] LDO regulators include:

[0067] LDO chip (U3): The core component, through its internal transistor structure, can maintain a very stable output voltage even with slight changes in the input voltage.

[0068] Input and output capacitors (C5, C6): These are crucial for LDOs, as they not only help filter out voltage fluctuations but also have a significant impact on the system's transient response.

[0069] In one embodiment, please refer to Figures 4 to 8 The aforementioned BMS battery management system 30 includes a control unit, an AFE chip, an AFE acquisition module, a high-voltage acquisition module, and a high-side drive module. The AFE chip is connected to the control unit, the AFE acquisition module, and the high-voltage acquisition module, respectively. The AFE acquisition module is connected to the DC-DC power supply 10. The high-side drive module is connected to the control unit, and the high-side drive module is also connected to a high-side drive chip.

[0070] In this embodiment, please refer to Figure 4 The control unit includes, but is not limited to, the control chip UCU1 with model number FS32K144UFT0VLLT.

[0071] Please see Figure 5 The AFE communication module uses a digital isolator to enable SPI communication between the control unit and the AFE chip to obtain unit voltage and temperature data.

[0072] In this embodiment, please refer to Figure 6 The AFE acquisition module includes the following:

[0073] AFE chip (U1): As the core of the entire AFE acquisition module, it integrates the acquisition, conversion, and processing functions of multiple voltage and temperature signals. This chip typically features a high-precision ADC (Analog-to-Digital Converter), capable of converting analog signals into digital signals for subsequent data processing and analysis.

[0074] Voltage sampling resistor network (R1-R14): Used to perform voltage division sampling of the 14 series cells. Each cell is connected to the input terminal of the AFE chip through a corresponding resistor network to ensure that the voltage signal is properly attenuated before entering the chip to match the chip's input range.

[0075] Filter capacitors (C1-C14): Connected after the voltage sampling resistor network, they are used to filter out high-frequency noise in the voltage signal and improve the accuracy of the acquired data.

[0076] Temperature sensors (T1-T5): Five temperature sensors are distributed in different locations within the battery pack to monitor temperature changes in critical areas. These sensors typically employ NTC thermistors or digital temperature sensors, offering high temperature measurement accuracy and stability.

[0077] Temperature signal conditioning circuit (U2-U6): Each temperature sensor is connected to the AFE chip through a signal conditioning circuit. This circuit includes components such as amplifiers and filters, used to amplify and filter the weak signals output by the temperature sensors to make them meet the input requirements of the AFE chip.

[0078] Power Regulator (U7): Provides a stable operating power supply for the AFE chip and its peripheral circuits. It typically employs an LDO regulator or a DC-DC converter to ensure a stable output voltage under varying input voltage conditions.

[0079] Reset circuit (R15, C15): Provides a reset signal to the AFE chip when the system is powered on or when an abnormality occurs, ensuring its normal startup and operation.

[0080] SPI Interface (P1): The AFE chip communicates with the host MCU via the SPI bus. This interface includes data lines (MOSI / MISO), clock lines (SCLK), and chip select lines (CS), supporting high-speed, synchronous data transmission.

[0081] Isolation transformer (T6): In some applications, an isolation transformer is added to the SPI interface to achieve electrical isolation and interference immunity. This helps improve the reliability and security of the system.

[0082] In summary, the AFE acquisition module, through its meticulously designed peripheral circuitry and high-performance AFE chip, achieves accurate acquisition of voltage from 14 battery cells and temperature data from 5 channels. The collaborative operation of all core components ensures the accuracy and reliability of the data, providing a solid foundation for the effective operation of the battery management system.

[0083] In one embodiment, please refer to Figure 7 The aforementioned high-voltage acquisition module uses a resistor divider to acquire voltage values ​​from an AFE chip. Software then calculates the external total voltage acquisition, three positive relay sticking detections, two negative relay sticking detections, and shunt current acquisition, filtering, and protection design based on the circuit resistance ratio formula. Specifically, the high-voltage acquisition module includes:

[0084] Resistor voltage divider network:

[0085] High-precision resistors (RTP1, RTP2, RTP3): These resistors are used to perform voltage division sampling of the total voltage of the battery pack. Each resistor network consists of multiple precision resistors connected in series to ensure the accuracy and stability of the voltage division ratio. For example, RTP1, RTP2, and RTP3 correspond to different voltage measurement points.

[0086] Precision resistors (RSS28-RSS40): These resistors are used to further refine the voltage division ratio, ensuring that the AFE chip can accurately read the voltage value. They typically have extremely high accuracy and temperature stability to reduce measurement errors.

[0087] AFE chip and peripheral circuitry:

[0088] AFE chip (U551): As the core of the entire high-voltage acquisition module, it is responsible for acquiring and processing voltage signals from the resistor divider network. The AFE chip integrates a high-precision ADC, which can convert analog voltage signals into digital signals and transmit them to the main control MCU via the SPI interface.

[0089] Filter capacitors (CSS37-CSS46): Connected to the input terminal of the AFE chip, used to filter out high-frequency noise in the voltage signal and improve the accuracy of the acquired data.

[0090] Relay adhesion detection circuit:

[0091] Positive relay sticking detection (CTRL_RTP1, CTRL_RTP2): By controlling the switching state of the relay and monitoring the corresponding voltage changes, it is possible to detect whether the positive relay has stuck. This circuit includes control signal lines and feedback signal lines to ensure the reliability of the detection results.

[0092] Negative relay sticking detection (CTRL_RTN1, CTRL_RTN2): Similar to positive relay sticking detection, this circuit is used to detect the status of the negative relay to prevent safety hazards caused by relay sticking.

[0093] Shunt current acquisition and filtering protection circuit:

[0094] Shunts (RSS57, RSS58): Used to measure the charging and discharging current of the battery pack. When current flows through the shunt, a small voltage drop proportional to the current is generated. The AFE chip calculates the current value by measuring this voltage drop.

[0095] Filter capacitors (CSS55, CSS56): Connected to the output of the shunt to filter out high-frequency noise in the current signal and improve measurement accuracy.

[0096] Protection diodes (DS55, DS56): Used to prevent overvoltage or reverse current from damaging the AFE chip, providing additional circuit protection.

[0097] Power supply and reset circuit:

[0098] Power Regulator (U552): Provides a stable operating power supply for the AFE chip and its peripheral circuits. It typically employs an LDO regulator or a DC-DC converter to ensure a stable output voltage under varying input voltage conditions.

[0099] Reset circuit (RSS59, CSS57): Provides a reset signal to the AFE chip when the system is powered on or an abnormality occurs, ensuring its normal startup and operation.

[0100] In summary, the high-voltage acquisition module, through a meticulously designed resistor divider network, AFE chip and its peripheral circuits, relay sticking detection circuit, and shunt current acquisition and filtering protection design, achieves accurate detection of one external total voltage, three positive relay sticking points, and two negative relay sticking points, as well as precise current measurement. The collaborative operation of all core components ensures data accuracy and system reliability.

[0101] In one embodiment, please refer to Figure 8 The aforementioned high-side driver module enables 8-channel high-side output by controlling the high-side driver chip's enable and output protection through the control unit, specifically including:

[0102] High-side driver chips (U1-U8): These chips are the core components of the entire high-side driver module, responsible for controlling 8 high-side outputs. Each chip typically has multiple independent channels, and each channel can control a high-side switch individually. For example, U1, U2, etc., correspond to different high-side output channels.

[0103] Enable pin (EN): Used to enable or disable the high-side driver chip's operating state. When the EN pin is high, the chip is in the operating state; when the EN pin is low, the chip is disabled, and all output channels are turned off.

[0104] Control signal inputs (IN1-IN8): Control signals from the control unit are input to the high-side driver chip through these pins. Each pin corresponds to a high-side output channel, and the control unit controls the switching state of the corresponding channel by sending high and low level signals.

[0105] Feedback signal output (OUT1-OUT8): The high-side driver chip uses these pins to feed back output status information to the control unit so that the control unit can monitor the operation of each channel in real time.

[0106] Freewheeling diodes (D1-D8): Connected between the high-side switch and the load, these diodes prevent reverse flow of load current from damaging the high-side driver chip. When the high-side switch is off, the freewheeling diodes provide a low-impedance path, allowing the load current to continue flowing and preventing excessive voltage spikes.

[0107] Current-limiting resistors (R1-R8): These are connected in series between the high-side switch and the load to limit the maximum current and prevent overload. The selection of these resistors needs to be calculated based on the load characteristics and system requirements to ensure the safe operation of the system.

[0108] Filter capacitors (C1-C8): Connected between the high-side switch and the load, used to filter out high-frequency noise in the output voltage and improve the stability of the output voltage.

[0109] Power Regulator (U9): Provides a stable operating power supply for the high-side driver chip and its peripheral circuits. It typically employs an LDO regulator or a DC-DC converter to ensure a stable output voltage under varying input voltage conditions.

[0110] Reset circuit (R9, C9): When the system is powered on or an abnormality occurs, it provides a reset signal to the high-side driver chip to ensure its normal startup and operation.

[0111] Relays (K1-K8): These are high-side output actuators used to control the on / off state of external loads. Each relay corresponds to one high-side output channel, and the switching operation is achieved through the control signal from the high-side driver chip.

[0112] External interfaces (J1-J8): Used to connect external loads and power supplies. Each interface includes a power input terminal, a load output terminal, and a ground terminal to ensure proper connection between the high-side drive module and external devices.

[0113] In summary, the high-side drive module achieves precise control and protection of eight external high-side outputs through the coordinated operation of core components such as the high-side drive chip, control unit interface, output protection design, power supply and reset circuit, relays, and external interfaces. The design and selection of each component must fully consider system requirements and safety to ensure reliable system operation.

[0114] In one embodiment, please refer to Figure 9 The BMS (Battery Management System) 30 includes an insulation resistance detection module, which is connected to the DC-DC power supply 10 and the control unit. By using an unbalanced bridge method to switch the photorelay and collect different voltage values ​​of the sampling resistor, the software calculates the external insulation resistance of the PACK battery pack according to the circuit resistance ratio formula.

[0115] Specifically, it includes the following:

[0116] High Voltage Input Terminal (GPV): This is the high voltage positive input terminal of the battery pack, which is connected to the positive terminal of the battery pack.

[0117] High-voltage divider resistor network (R1-R8): These high-precision resistors are used to divide high-voltage signals, ensuring that the voltage input to subsequent circuits is within a safe range. For example, resistors R3 and R4, etc., are connected in series to form a voltage divider network, which divides a 200V high-voltage signal to a lower voltage value.

[0118] Power resistors (R9, R10): Since the current in this part of the circuit is relatively large, power resistors are needed to withstand the large power loss and to ensure normal operation through heat dissipation measures.

[0119] Sampling resistors (R16, R17): These two resistors are key components of the unbalanced bridge circuit, used to collect different voltage values. When the insulation resistance of the battery pack changes, the output voltage of the bridge also changes, thus reflecting the state of the insulation resistance.

[0120] Operational amplifiers (U1A, U1B): Used to amplify the output voltage signal of the unbalanced bridge, improving the signal sensitivity and accuracy. U1A and U1B correspond to different amplification channels, ensuring signal independence and reliability.

[0121] Optical relays (SI1, SI2): These act as switching elements to control the on / off state of the unbalanced bridge. By controlling the switching state of the optical relays, the operating mode of the bridge can be changed, thereby enabling the acquisition of different voltage values.

[0122] Control signal input (CTRL_VB, CTRL_IT): Control signals from the MCU are input to the control terminal of the photorelay through these pins to control the switching state of the photorelay.

[0123] Sampling resistors (R25, R26): Used to acquire the voltage signal output by the bridge and convert it into a current signal for subsequent signal processing and measurement.

[0124] Filter capacitors (C1, C2): Connected to the output of the sampling resistor, they are used to filter out high-frequency noise in the voltage signal and improve the accuracy of the measurement data.

[0125] Power Regulator (U2): Provides a stable operating power supply for the entire circuit. Typically, an LDO regulator or DC-DC converter is used to ensure a stable output voltage under different input voltage conditions.

[0126] Reset circuit (R11, C3): Provides a reset signal to the circuit when the system is powered on or when an abnormality occurs, ensuring its normal startup and operation.

[0127] The control unit receives the voltage signal from the unbalanced bridge circuit and calculates the external insulation resistance of the battery pack according to the circuit resistance ratio formula. The control unit typically has high-speed computing capabilities and abundant peripheral interfaces, enabling it to process large amounts of data and perform precise calculations in real time.

[0128] In summary, the measurement of the external insulation resistance of a battery pack is achieved by using an unbalanced bridge method to switch a photorelay and collect different voltage values ​​of the sampling resistor, followed by software calculation. This involves the coordinated operation of multiple core components. The design and selection of each component must fully consider system requirements and safety to ensure the accuracy of the measurement results and the reliable operation of the system.

[0129] In one embodiment, please refer to Figures 10 to 12 The aforementioned BMS battery management system 30 includes a Hall sensor current acquisition module, a CAN communication module, and a GPIO module; the Hall sensor current acquisition module is connected to the control unit; the insulation resistance detection module is connected to the DC-DC power supply 10 and the control unit respectively; and the GPIO module is connected to the control unit.

[0130] Specifically, the CTA / CTB voltage value of the Hall sensor feedback channel is filtered by an RC filter before being sent to the ADC of the control unit for acquisition. The CAN communication module utilizes an isolated power supply, digital isolator, and CAN transceiver to implement two independent isolated CAN communication interfaces for data exchange with external devices. The GPIO module uses diode switching for level input detection and controls the MOSFET switch for level output.

[0131] In one embodiment, please refer to Figures 13 to 14The aforementioned BMS battery management system 30 includes an RTC timing module, a level and temperature detection module, and an interface module; the RTC timing module is connected to the control unit via an SPI interface; the level and temperature detection module is connected to the control unit via an SPI interface; the interface is connected to the control unit and also to the daughter board 2.

[0132] In this embodiment, the RTC timing module implements the timing function through the design of related peripheral circuits of the RTC chip and SPI communication with the control unit.

[0133] The control unit in this embodiment is equipped with a JTAG MCU program burning and debugging interface, an external FLASH storage circuit, an external EEPROM storage circuit, and an external reference source circuit.

[0134] The interface function is defined using connectors, and a pin header and screw header are added to the motherboard 1 to enable assembly with the daughterboard 2.

[0135] In one embodiment, please refer to Figure 15 The aforementioned TBOX communication module 20 includes a power conversion module, a voltage regulator module, and a 4G and GPS function integration module; the power conversion module is connected to the DC-DC power supply 10; the power conversion module is connected to the voltage regulator module; the voltage regulator module is connected to the 4G and GPS function integration module; and the 4G and GPS function integration module is connected to the interface.

[0136] In one embodiment, please refer to Figure 15 The aforementioned TBOX communication module 20 includes a SIM card, which is connected to a 4G and GPS integrated module.

[0137] In one embodiment, please refer to Figure 16 The aforementioned TBOX communication module 20 also includes an antenna interface and connectors; the antenna interface and connectors are respectively connected to the 4G and GPS function integration modules.

[0138] Specifically, please refer to Figure 16 DC-DC step-down power supply (U1): Converts the 12V power output from motherboard 1 to 3.8V. It typically uses a high-efficiency synchronous step-down converter, featuring high conversion efficiency and low ripple characteristics, ensuring the stability and reliability of the output voltage.

[0139] LDO regulator (U2): Further regulates the 3.8V output voltage from the DC-DC converter to 3.3V, providing a stable operating power supply for all modules on daughterboard 2. LDO regulators are characterized by low noise and fast transient response, making them suitable for circuits with high power quality requirements.

[0140] 4G+GPS Module (U3): As the core communication module, it is responsible for handling 4G communication and GPS positioning functions. This module integrates key components such as a baseband processor, RF transceiver, and GPS receiver, and works with external circuits to achieve data transmission and positioning services.

[0141] Power supply filter capacitors (C1-C6): Connected to the power input terminal of the 4G+GPS module, used to filter out high-frequency noise in the power supply and improve the stability of the module operation.

[0142] Crystal oscillator (X1): Provides the clock signal for the 4G+GPS module, ensuring the normal operation of its internal circuitry. The selection of the crystal oscillator needs to consider frequency accuracy and temperature stability to meet the requirements of different application scenarios.

[0143] SIM card slot (J1): Used to insert a SIM card, providing connectivity to a 4G network. SIM card slots typically feature anti-misinsertion and anti-reverse insertion designs to ensure the security and reliability of the SIM card.

[0144] SIM card interface circuit (R7-R10, C7-C9): Includes components such as resistors and capacitors, used to match the electrical characteristics of the SIM card and provide necessary protection functions to prevent damage to the SIM card from static electricity and overvoltage.

[0145] Main antenna interface (J2): Used to connect the 4G communication antenna, providing a channel for transmitting and receiving wireless signals. The main antenna interface typically uses standard interfaces such as SMA or U.FL, which have good radio frequency performance and mechanical strength.

[0146] GNSS Antenna Interface (J3): Used to connect a GPS positioning antenna to receive satellite signals for positioning. The GNSS antenna interface also adopts a standard interface design to ensure compatibility with various types of GPS antennas.

[0147] RF filters (L1-L3): Connected between the antenna interface and the 4G+GPS module, used to filter out unnecessary RF interference and improve signal quality and communication distance.

[0148] Indicator light circuit (LED1-LED3): Used to display the system's operating status, such as power status and network connection status. Indicator light circuits typically include light-emitting diodes and current-limiting resistors, and are simple in design and easy to maintain.

[0149] Reset circuit (R11, C10): Provides a reset signal to the 4G+GPS module when the system is powered on or an abnormality occurs, ensuring its normal startup and operation.

[0150] In summary, Figure 15This design encompasses multiple aspects, including power management, 4G+GPS module peripheral circuit design, SIM card design, 4G+GPS signal antenna circuit and interface connector design. The core components work together to support 4G communication and GPS positioning functions. In practical applications, further circuit optimization and debugging are necessary to ensure system stability and reliability.

[0151] The multifunctional circuit board in this embodiment consists of two main parts: a main board 1 and a daughter board 2. The main board 1 integrates a DC-DC power supply 10 and a BMS battery management system 30, while the daughter board 2 is the TBOX communication module 20. The daughter board 2 is electrically connected to the main board 1 via pins and screws. This design not only ensures physical fixation but also guarantees reliable data transmission. The design of the daughter board 2 allows it to be used as an optional component, enabling users to flexibly configure it according to their needs and simplifying the installation process. The TBOX and BMS can exchange data in real time to achieve efficient data processing and remote monitoring functions.

[0152] Considering the need for high power output, the DC-DC power supply section 10 adopts a reinforced heat dissipation design to ensure effective heat dissipation even under high load conditions and meet the required temperature rise standards.

[0153] By directly mounting the DC-DC power supply 10 and TBOX onto the BMS board, a high degree of integration and unification of battery PACK data acquisition and processing is achieved. This design not only significantly reduces the space and cost required for PACK production but also improves manual installation efficiency and reduces installation costs.

[0154] The relevant circuits for the DC-DC power supply 10 are located in the upper half of the motherboard 1;

[0155] The relevant circuits of the BMS battery management system 30 are distributed in the middle and lower half of the main board 1;

[0156] The TBOX communication module 20 is designed on the daughter board 2 and is connected to the motherboard 1 via pins and screws. It is located in the space above the middle part of the motherboard 1.

[0157] This distribution method not only optimizes space utilization but also improves the overall performance and stability of the system, demonstrating the advantages of a highly integrated design concept.

[0158] like Figure 2As shown, the DC-DC power supply 10 employs a flyback design, designed to provide a stable operating voltage for the entire system. It has a wide input voltage range, from 36V to 120V, adaptable to different battery configurations and application scenarios, while simultaneously outputting a stable 12V DC power with a maximum output power of 60W. Furthermore, the unit's design takes heat dissipation into account, ensuring a temperature rise of no more than 60°C under full load, guaranteeing long-term stable system operation. This design is particularly suitable for self-powered PACK battery pack systems, enabling reliable operation in complex industrial environments.

[0159] The BMS (Battery Management System) 30 is responsible for the comprehensive management and monitoring of the power battery pack. This unit supports real-time monitoring of the individual voltages of up to 28 series-connected cells and data acquisition from 10 temperature points, ensuring that each cell operates within a safe range. In addition, it features insulation resistance detection, total voltage and current acquisition, and relay sticking detection, and exchanges data with other systems via two CAN communication interfaces. Furthermore, the BMS 30 is equipped with eight high-side drivers to execute various control commands. Based on the reported information, the BMS 30 can intelligently determine and control the operating status of the power battery, promptly diagnose faults and take corrective measures, making it ideal for power battery pack information acquisition and management.

[0160] The TBOX communication module 20 integrates a China Mobile ML302 module to achieve powerful 4G remote communication capabilities and incorporates GPS positioning technology. It can be connected to an external 4G+GPS signal antenna to enhance signal reception. This design makes the unit ideal for scenarios requiring remote monitoring and location tracking, such as forklifts, loaders, AGVs (Automated Guided Vehicles), and tractors in industrial machinery and vehicle rental operations. The TBOX unit not only improves equipment management efficiency but also enables rapid location and response in emergency situations, significantly enhancing equipment safety and availability.

[0161] This circuit board can be used in the assembly of PACK batteries in automated industrial machinery, including but not limited to the following types of engineering machinery:

[0162] Forklifts: Used for loading, unloading, and stacking goods;

[0163] Loaders: mainly used for earthmoving and material handling;

[0164] AGV (Automated Guided Vehicle): Automated logistics transportation tools;

[0165] Tractor: Used for towing heavy goods or carriages.

[0166] These devices share the common characteristic of using batteries as a power source, thus placing high demands on their battery management systems. The solution provided by this invention can significantly improve the performance, safety, and maintenance efficiency of these devices, making it suitable for a wide range of industrial applications.

[0167] The aforementioned multi-functional circuit board integrating DC-DC power supply, TBOX communication, and BMS battery management integrates the DC-DC power supply 10 and the BMS battery management system 30 onto the main board 1, while configuring the TBOX communication module 20 on the daughter board 2. A secure electrical connection between the daughter board 2 and the main board 1 is achieved using pins and screws, effectively integrating power supply, battery management, and remote communication functions. This design not only optimizes space layout and improves the overall system performance and stability but also significantly reduces production and installation costs by simplifying the structure and reducing the number of components. Furthermore, the enhanced real-time data interaction capability between the TBOX and BMS enables more efficient status monitoring, fault diagnosis, and remote upgrades, further improving user experience and system reliability.

[0168] The above description is merely a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in this utility model, and these modifications or substitutions should all be covered within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the scope of the claims.

Claims

1. A multifunctional circuit board integrating DCDC power supply, TBOX communication and BMS battery management, characterized in that, include: The motherboard and the daughterboard are electrically connected to the motherboard via pins and screws. The motherboard is equipped with a DC-DC power supply and a BMS battery management system, and the daughterboard is equipped with a TBOX communication module.

2. The multi-functional circuit board of integrated DCDC power supply, TBOX communication and BMS battery management according to claim 1, characterized in that, The DC-DC power supply is located on the upper part of the motherboard, the BMS battery management system is located on the lower part of the motherboard, and the daughterboard is connected to the motherboard via pins and screws.

3. The multi-functional circuit board of integrated DCDC power supply, TBOX communication and BMS battery management according to claim 2, characterized in that, The DC-DC power supply includes an isolated DC-DC flyback power supply, a DC-DC buck power supply, and an LDO power supply; the isolated DC-DC flyback power supply is connected to the DC-DC buck power supply; the DC-DC buck power supply is connected to the LDO power supply; and the LDO power supply is connected to the TBOX communication module and the BMS battery management system, respectively.

4. The multi-functional circuit board of integrated DCDC power supply, TBOX communication and BMS battery management according to claim 3, characterized in that, The BMS battery management system includes a control unit, an AFE chip, an AFE acquisition module, a high-voltage acquisition module, and a high-side drive module. The AFE chip is connected to the control unit, the AFE acquisition module, and the high-voltage acquisition module, respectively. The AFE acquisition module is connected to the DC-DC power supply. The high-side drive module is connected to the control unit, and the high-side drive module is also connected to a high-side drive chip.

5. The multi-functional circuit board of integrated DCDC power supply, TBOX communication and BMS battery management according to claim 4, characterized in that, The BMS battery management system includes an insulation resistance detection module, which is connected to the DC-DC power supply and the control unit.

6. The multi-functional circuit board of integrated DCDC power supply, TBOX communication and BMS battery management according to claim 5, characterized in that, The BMS battery management system includes a Hall sensor current acquisition module, a CAN communication module, and a GPIO module; the Hall sensor current acquisition module is connected to the control unit; the insulation resistance detection module is connected to the DC-DC power supply and the control unit respectively; the GPIO module is connected to the control unit.

7. The multi-functional circuit board of integrated DCDC power supply, TBOX communication and BMS battery management according to claim 6, characterized in that, The BMS battery management system includes an RTC timing module, a level and temperature detection module, and an interface module; the RTC timing module is connected to the control unit via an SPI interface; the level and temperature detection module is connected to the control unit via an SPI interface; the interface is connected to the control unit and also to the daughterboard.

8. The multi-functional circuit board of integrated DCDC power supply, TBOX communication and BMS battery management according to claim 7, characterized in that, The TBOX communication module includes a power conversion module, a voltage regulator module, and a 4G and GPS integrated function module; the power conversion module is connected to the DC-DC power supply; the power conversion module is connected to the voltage regulator module; the voltage regulator module is connected to the 4G and GPS integrated function module; and the 4G and GPS integrated function module is connected to the interface.

9. The multi-functional circuit board of integrated DCDC power supply, TBOX communication and BMS battery management according to claim 8, characterized in that, The TBOX communication module includes a SIM card, which is connected to the 4G and GPS integrated module.

10. The multi-functional circuit board of integrated DCDC power supply, TBOX communication and BMS battery management according to claim 9, characterized in that, The TBOX communication module also includes an antenna interface and a connector; the antenna interface and the connector are respectively connected to the 4G and GPS function integration modules.

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