Anti-falling four-layer circuit board

Abstract

This utility model relates to the field of four-layer circuit board technology and discloses a four-layer circuit board with anti-detachment capability, including a circuit board body and several glue-filling blocks soldered to the surface of the circuit board body. Several fixed pins for soldering are fixed on one side of the surface of the circuit board body, and movable pins are soldered to the surface of the fixed pins. When the circuit board body and the PCIe slot body are connected, the side blocks can provide initial guidance to the PCIe slot body, allowing for a preliminary connection between the PCIe slot body and the circuit board body. This facilitates soldering of the fixed pins and movable pins. After soldering, glue flows out of the glue outlet, causing the PCIe slot body and the glue-filling blocks to bond together, improving the stability of the PCIe slot body and preventing it from detaching due to insertion and removal forces during prolonged use.

Description

Technical Field

[0001] This utility model relates to the field of four-layer circuit board technology, specifically a four-layer circuit board that is resistant to falling off. Background Technology

[0002] A four-layer circuit board is a multilayer printed circuit board (PCB) made of four layers of conductive copper foil and three layers of insulating dielectric alternately laminated. It is one of the most common structures in modern electronic devices (such as computer motherboards, communication equipment, industrial control equipment, high-end consumer electronics, etc.) and has significant advantages over single / double-sided boards in terms of complexity, signal integrity, power integrity, and electromagnetic compatibility (EMC).

[0003] During the production of four-layer circuit boards, PCIe slots are usually soldered onto the surface of the circuit board for electrical connection with other electronic products. However, as PCIe slots undergo a certain number of insertions and removals during long-term use, the force exerted during insertion and removal can affect the stability of the soldered pins, which may cause the PCIe slot to fall off the surface of the circuit board and affect the normal use of the circuit board. Utility Model Content

[0004] The purpose of this invention is to provide a four-layer circuit board that prevents detachment, so as to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a four-layer circuit board for preventing detachment, comprising a circuit board body and several potting blocks soldered to the surface of the circuit board body, wherein several fixed pins for soldering are fixed on one side of the surface of the circuit board body, movable pins are soldered to the surface of the fixed pins, and a PCIe slot body is fixed to the surface of the movable pins, and further comprising:

[0006] An injection port is provided on one side of the surface of the injection block, and side blocks are connected to both sides of the surface of the injection block. A glue flow groove is provided in the inner cavity of the injection block, and several glue outlet holes are provided on the surface of the injection block and the side blocks.

[0007] Preferably, the glue injection port is inclined, and the inclination angle is far away from the glue injection block.

[0008] Preferably, the surface of the injection block is provided with a working groove, and the working groove is made of metal.

[0009] Preferably, the glue outlet holes are equidistantly arranged on the surface of the glue injection port, and the glue outlet holes are equidistantly arranged on the surface of the side block.

[0010] Preferably, the glue-filling block and the side block form a "┌" shape, with the opening facing the circuit board body.

[0011] Preferably, the bottom of the glue dispensing groove is located near the bottom of the glue outlet.

[0012] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0013] When connecting the circuit board body and the PCIe slot body, this utility model can initially guide the PCIe slot body under the action of the side block, so that the PCIe slot body and the circuit board body can form an initial connection, which facilitates the soldering of fixed pins and movable pins. After soldering, under the action of the glue injection port, glue can flow out of the glue outlet, which can then bond the PCIe slot body and the glue injection block together, improving the stability of the PCIe slot body and preventing the PCIe slot body from falling off due to insertion and extraction forces during long-term use. Attached Figure Description

[0014] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0015] Figure 2 This is a partial three-dimensional structural diagram of the present invention;

[0016] Figure 3 This is a partial three-dimensional structural diagram of the present invention;

[0017] Figure 4 This is a partial three-dimensional structural diagram of the present invention.

[0018] In the diagram: 1. Circuit board body; 2. Fixed pin; 3. Moving pin; 4. PCIe slot body; 5. Glue injection block; 6. Side block; 7. Glue injection port; 8. Glue flow channel; 9. Glue outlet hole; 10. Functional groove. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0020] Please see Figure 1-4 As shown, a four-layer circuit board for preventing detachment includes a circuit board body 1 and several glue-filling blocks 5 soldered to the surface of the circuit board body 1. The surface of the glue-filling blocks 5 is provided with an action groove 10. The action groove 10 is made of metal. Under the action of the action groove 10, the top of the glue-filling block 5 becomes thinner. After the glue is filled, it is convenient for the staff to use a heat gun to bake the glue-filling block 5 and accelerate the drying of the glue inside the glue-filling block 5.

[0021] The circuit board body 1 is a four-layer circuit board. Several fixed pins 2 for soldering are fixed on one side of the surface of the circuit board body 1. Movable pins 3 are soldered on the surface of the fixed pins 2. The PCIe slot body 4 is fixed on the surface of the movable pins 3.

[0022] An injection port 7 is provided on one side of the surface of the injection block 5. The injection port 7 is inclined and the angle of inclination is away from the injection block 5. Because the injection port 7 is inclined, the injection port 7 is far away from the injection block 5, which makes it easier for the staff to pour the glue into the injection block 5.

[0023] Both sides of the surface of the glue injection block 5 are connected to the side blocks 6. The glue injection block 5 and the side blocks 6 form a "┌" shape, and the opening faces the circuit board body 1. With this setting, it is convenient for the staff to attach the PCIe slot body 4 to the surface of the circuit board body 1 through the slot, thereby facilitating the contact between the fixed pin 2 and the movable pin 3.

[0024] The inner cavity of the glue injection block 5 is provided with a glue flow groove 8. The surfaces of the glue injection block 5 and the side block 6 are provided with a plurality of glue outlet holes 9. The glue outlet holes 9 are equidistantly arranged on the surface of the glue injection port 7 and the surface of the side block 6, which improves the uniformity of the glue flow when the glue outlet holes 9 are dispensing, and improves the adhesion of the glue to the PCIe slot body 4. The bottom of the glue flow groove 8 is located close to the bottom of the glue outlet holes 9. In this embodiment, this arrangement reduces the capacity of the inner cavity of the glue injection block 5 and improves the practicality of the device.

[0025] Working principle: When it is necessary to install the PCIe slot body 4, the operator can insert the PCIe slot body 4 through the notch on one side of the side block 6, and use the fixed pin 2 and the moving pin 3 to connect the PCIe slot body 4 and the circuit board body 1.

[0026] After the fixed pin 2 and the movable pin 3 are connected, the operator can inject adhesive into the adhesive block 5 through the adhesive injection port 7. The adhesive then flows through the adhesive flow channel 8 to the adhesive outlet hole 9, and the adhesive block 5 and the PCIe slot body 4 come into contact through the adhesive outlet hole 9, thereby achieving the purpose of applying adhesive.

[0027] After the adhesive is applied, the staff uses a heat gun to heat the action groove 10 to accelerate the drying of the adhesive in the inner cavity of the glue injection block 5 and improve the practicality of the device.

[0028] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0029] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An anti-falling four-layer circuit board, comprising a circuit board body (1) which is a four-layer circuit board and a plurality of glue injection blocks (5) welded on the surface of the circuit board body (1), characterized in that: A plurality of fixed pins (2) for soldering are fixed on one side of the surface of the circuit board body (1), and movable pins (3) are soldered to the surface of the fixed pins (2). A PCIe slot body (4) is fixed to the surface of the movable pins (3), and the circuit board body (1) also includes: An injection port (7) is provided on one side of the surface of the injection block (5). Side blocks (6) are connected to both sides of the surface of the injection block (5). A glue flow groove (8) is provided in the inner cavity of the injection block (5). Several glue outlet holes (9) are provided on the surfaces of the injection block (5) and the side blocks (6).

2. The four-layer anti-drop circuit board according to claim 1, wherein: The glue injection port (7) is inclined, and the inclination angle is far away from the glue injection block (5).

3. The four-layer anti-drop circuit board according to claim 1, wherein: The surface of the glue injection block (5) is provided with a working groove (10), and the working groove (10) is made of metal.

4. The four-layer anti-drop circuit board according to claim 1, wherein: The dispensing holes (9) are equidistantly arranged on the surface of the dispensing port (7), and the dispensing holes (9) are equidistantly arranged on the surface of the side block (6).

5. A four-layer circuit board for preventing detachment according to claim 1, characterized in that: The glue injection block (5) and the side block (6) form a "┌" shape, with the opening facing the circuit board body (1).

6. The four-layer anti-drop circuit board according to claim 1, wherein: The bottom of the glue dispensing groove (8) is located near the bottom of the glue outlet (9).

Images