A waterproof structure for precision circuitry on a thin-film circuit board

Abstract

This utility model discloses a waterproof structure for precision circuits on a thin-film circuit board, belonging to the field of thin-film circuit waterproofing technology. The waterproof structure includes a lower circuit board, from which a protective layer, a cover plate, an upper circuit board, and an operating layer are sequentially connected from bottom to top via mounting lines L. It also includes a cover plate movably connected to the lower circuit board, with a sealing groove formed on the lower circuit board. A flap adapted to the sealing groove is provided on the edge of the cover plate, forming a sealing area between the cover plate and the lower circuit board. A soft sealant layer is provided within the sealing groove. This utility model achieves high-reliability waterproofing and moisture protection through a mechanical sealing structure. The sealing groove of the lower circuit board and the flap of the cover plate interlock, squeezing the soft sealant within the groove to fill the gap and form an elastic barrier, effectively blocking liquids, moisture, and corrosive media, thereby improving the stability and lifespan of the thin-film circuit in harsh environments.

Description

Technical Field

[0001] This utility model relates to the field of thin-film circuit waterproofing technology, and in particular to a waterproof structure for precision circuits on thin-film circuit boards. Background Technology

[0002] Thin-film circuit boards are high-tech circuits that use precision processes such as vacuum deposition and photolithography to create ultra-thin conductors on insulating substrates such as ceramics. Their linewidth can be in the micrometer range, and they can directly integrate high-precision passive components. They are characterized by excellent high-frequency performance, high stability, and high reliability. Although their cost is higher than that of ordinary PCBs, they are widely used in aerospace, medical equipment, automotive electronics, and high-end consumer electronics, which have stringent requirements for miniaturization and performance.

[0003] However, existing circuit board circuits are usually covered by only a very thin layer of silicon nitride or polyimide protective layer, which has limited mechanical strength and environmental resistance. In harsh environments such as high temperature and humidity, salt spray, moisture or corrosive gases may penetrate or damage this thin protective layer, leading to circuit corrosion, short circuits or performance degradation. Current common protection methods such as overall potting sacrifice heat dissipation and maintainability, and may introduce stress; while simply adding a shell makes it difficult to achieve reliable sealing on a small scale. Utility Model Content

[0004] The purpose of this invention is to solve the problem in the prior art that moisture or corrosive gases may penetrate or damage the thin protective layer in harsh environments such as high temperature, high humidity, and salt spray, leading to circuit corrosion, short circuits, or performance degradation. Therefore, this invention proposes a waterproof structure for precision circuits on thin-film circuit boards.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] A waterproof structure for precision circuitry on a thin-film circuit board includes a lower circuit board. From bottom to top, the lower circuit board is sequentially connected to a protective layer, a cover plate, an upper circuit board, and an operating layer via mounting lines L. The structure also includes a cover plate movably connected to the lower circuit board. A sealing groove is formed on the lower circuit board, and a flap adapted to the sealing groove is provided on the edge of the cover plate. A sealing area is formed between the cover plate and the lower circuit board. A soft sealant layer is provided within the sealing groove. When the flap engages with the sealing groove, the adhesive in the soft sealant layer is squeezed to fill the gap between the flap and the sealing groove.

[0007] Preferably, the lower circuit board has lower contact pieces arranged at equal intervals, a first connecting line is fixedly connected to the lower circuit board and electrically connected to the lower contact pieces to maintain the connection of the first connecting line, and a connecting part is fixedly connected to the end face of the lower circuit board for connecting the lower circuit board to external devices.

[0008] Preferably, a magnetic block is fixedly connected to the lower circuit board, and a magnet is fixedly connected to the cover plate corresponding to the magnetic block. When the magnet and the magnetic block are attracted and fixed, the flip plate provides a pre-tightening force to the lower circuit board and squeezes the soft sealant layer.

[0009] Preferably, an upper contact piece and a second connecting line are fixedly connected to the upper circuit board, and the second connecting line is electrically connected to the upper contact piece. When the upper contact piece moves, the circuit board remains in a closed circuit state.

[0010] Preferably, a first contact piece is fixedly connected to the protective layer, and the first contact piece is installed corresponding to the lower contact piece. A second contact piece is fixedly connected to the cover plate, and the second contact piece is installed corresponding to the first contact piece. When the upper contact piece moves, the first contact piece, the second contact piece, and the lower contact piece are connected, and the upper and lower contact pieces are kept in a pass-through state.

[0011] Preferably, a button is fixedly connected to the operating layer. When the button is pushed, the upper contact piece presses the second contact piece downward and makes the upper contact piece electrically connected to the lower contact piece.

[0012] Compared with the prior art, this utility model provides a waterproof structure for precision circuits on thin-film circuit boards, which has the following beneficial effects:

[0013] 1. The waterproof structure of this thin-film circuit board features a sealing groove on the lower circuit board and a flap that precisely engages with the edge of the cover plate. When the two are combined, the soft sealant layer pre-placed in the groove is squeezed by the flap, thus fully deforming and filling all assembly gaps to form an elastic sealing barrier. This avoids the unstable methods of traditional glue bonding or simple covering. Through the dual action of mechanical fastening and material deformation, it can effectively block the intrusion of liquid water, moisture and corrosive media, greatly improving the long-term working stability and service life of the thin-film circuit board in harsh environments.

[0014] 2. The waterproof structure of this thin-film circuit board precision circuitry utilizes magnetic blocks and magnets at corresponding positions on the lower circuit board and the cover plate. The magnetic attraction provides a continuous, stable, and uniform pre-tightening force to the entire sealing structure. When the flap is snapped into the sealing groove, the magnets and magnetic blocks automatically align and attract each other, pulling the cover plate downwards. This allows the flap to continuously and evenly compress the soft sealant layer within the sealing groove, avoiding excessive local stress or uneven force distribution that may occur with mechanical fastening. This ensures the sealant fully fills all microscopic gaps, significantly improving the overall sealing performance of the sealing area and effectively preventing leakage risks caused by pressure attenuation due to vibration or thermal expansion and contraction.

[0015] The parts not mentioned in this device are the same as or can be implemented using existing technologies. This utility model achieves high reliability waterproof and moisture-proof through a mechanical sealing structure. The sealing groove of the lower circuit board is fastened to the cover plate flap, and the soft sealant in the groove is squeezed to fill the gap and form an elastic barrier, which effectively blocks liquid, moisture and corrosive media, thereby improving the stability and life of the thin film circuit in harsh environments. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the isometric structure of this utility model;

[0017] Figure 2 This is a schematic diagram of the exploded structure of this utility model;

[0018] Figure 3 This is a partial structural schematic diagram of the present invention;

[0019] Figure 4 For the present utility model Figure 3 Enlarged structural diagram at point A in the middle;

[0020] Figure 5 This is a schematic diagram of the upper circuit board structure of this utility model.

[0021] In the diagram: 1. Lower circuit board; 11. Lower contact piece; 12. Connecting line one; 13. Connecting part; 2. Sealing groove; 3. Protective layer; 31. Contact piece one; 4. Cover plate; 41. Flip plate; 42. Contact piece two; 43. Magnet; 5. Magnetic block; 6. Soft sealant layer; 7. Upper circuit board; 71. Upper contact piece; 72. Connecting line two; 8. Operating layer; 81. Button. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0023] In the description of this utility model, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0024] Example:

[0025] Reference Figures 1-5A waterproof structure for precision circuitry on a thin-film circuit board includes a lower circuit board 1. From bottom to top, the lower circuit board 1 is connected by mounting lines L to a protective layer 3, a cover plate 4, an upper circuit board 7, and an operating layer 8. The structure also includes a cover plate 4 movably connected to the lower circuit board 1, a sealing groove 2 formed on the lower circuit board 1, and a flap 41 adapted to the sealing groove 2 on the edge of the cover plate 4. A sealing area is formed between the cover plate 4 and the lower circuit board 1. A soft sealant layer 6 is provided in the sealing groove 2. When the flap 41 is engaged with the sealing groove 2, the adhesive in the soft sealant layer 6 is squeezed to fill the gap between the flap 41 and the sealing groove 2.

[0026] In this embodiment, the cooperation between the flap 41 and the sealing groove 2, combined with the elastic deformation characteristics of the soft sealing adhesive layer 6, forms a highly efficient and reliable sealing interface, which enables automatic compensation of manufacturing tolerances during assembly and maintains stable sealing performance even after multiple opening and closing. This effectively prevents external moisture and contaminants from intruding into the precision circuit area, providing long-lasting protection for thin-film circuits.

[0027] Reference Figure 2 and Figure 3 As shown, lower contact pieces 11 are arranged at equal intervals on the lower circuit board 1. A connecting line 12 is fixedly connected to the lower circuit board 1, and the connecting line 12 is electrically connected to the lower contact pieces 11 to keep the connecting line 12 in a continuous state. A connecting part 13 is fixedly connected to the end face of the lower circuit board 1 for connecting the lower circuit board 1 to external devices.

[0028] In this embodiment, the equidistantly arranged lower contact pieces 11 and the connecting line 12 form a stable and reliable electrical connection foundation, ensuring uniform transmission of circuit signals. The connection part 13 provides a standardized interface, facilitating quick and stable connection with external devices and improving the integration and applicability of the entire module.

[0029] Reference Figure 2 , Figure 3 and Figure 4 As shown, a magnetic block 5 is fixedly connected to the lower circuit board 1, and a magnet 43 is fixedly connected to the cover plate 4 corresponding to the magnetic block 5. When the magnet 43 and the magnetic block 5 are attracted and fixed, the flip plate 41 provides a pre-tightening force to the lower circuit board 1 and squeezes the soft sealant layer 6.

[0030] In this embodiment, the magnetic block 5 and the magnet 43 are used together to achieve uniform pressing of the cover plate 4 by magnetic attraction. This not only simplifies the assembly operation and avoids stress concentration problems that may be caused by mechanical fasteners, but also ensures that the sealing layer is subjected to continuous and uniform pressure, thereby maintaining the best sealing state.

[0031] Reference Figure 5As shown, an upper contact piece 71 and a second connecting line 72 are fixedly connected to the upper circuit board 7, and the second connecting line 72 is electrically connected to the upper contact piece 71. When the upper contact piece 71 moves, the circuit board remains in a closed state.

[0032] In this embodiment, the design of the upper contact piece 71 and the second connecting line 72 ensures that the circuit can maintain the continuity of electrical connection during dynamic operation, thereby allowing the upper contact piece 71 to make necessary displacement in the vertical direction, while ensuring that the circuit is always in a closed state, thus improving the operational reliability and service life of the equipment.

[0033] Reference Figure 2 As shown, a first contact piece 31 is fixedly connected to the protective layer 3, and the first contact piece 31 is installed corresponding to the lower contact piece 11. A second contact piece 42 is fixedly connected to the cover plate 4, and the second contact piece 42 is installed corresponding to the first contact piece 31. When the upper contact piece 71 moves, the first contact piece 31, the second contact piece 42 and the lower contact piece 11 are connected, and the upper contact piece 71 and the lower contact piece 11 are kept in a closed circuit state.

[0034] In this embodiment, a vertical conductive path is formed by the multi-layer conductive connection of contact piece 31, contact piece 42 and upper and lower contact pieces 11. This connection method not only realizes the smooth transmission of signals, but also provides necessary mechanical buffering, reduces wear between contact parts, and ensures connection stability under long-term use.

[0035] Reference Figure 1 and Figure 2 As shown, a button 81 is fixedly connected to the operation layer 8. When the button 81 is pushed, the upper contact piece 71 presses the second contact piece 42 downward and makes the upper contact piece 71 electrically connected to the lower contact piece 11.

[0036] In this embodiment, the operation layer 8 and button 81 work together to provide an intuitive and convenient operation method. The circuit can be turned on by a simple pushing action, which not only ensures the reliability of operation, but also maintains the sealing integrity of the overall structure.

[0037] In this invention, when the lower circuit board 1 and the cover plate 4 are fastened to the sealing groove 2 by the flap 41, the flap 41 on the edge of the cover plate 4 is embedded in the sealing groove 2 of the lower circuit board 1. The soft sealant pre-placed in the groove is squeezed and undergoes elastic deformation, fully filling all assembly gaps and forming the first sealing barrier. At this time, the magnetic block 5 set on the lower circuit board 1 and the magnet 43 installed on the cover plate 4 generate magnetic attraction, providing a uniform and continuous vertical pre-tightening force for the cover plate 4. This force further enhances the compression effect of the flap 41 on the sealant, ensuring that the sealing interface is stable and tight for a long time, effectively blocking the intrusion of external liquids, moisture and corrosive media. When the button 81 on the operating layer 8 is pressed, it drives the upper contact piece 71 of the upper circuit board 7 to move down. The upper contact piece 71 presses the second contact piece 42 on the cover plate 4 and the first contact piece 31 on the protective layer 3 in sequence, and finally forms an electrical connection with the lower contact piece 11 on the lower circuit board 1, ensuring uninterrupted signal transmission.

[0038] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A waterproof structure of a thin film circuit board precision circuit, comprising a lower circuit board (1), the lower circuit board (1) is connected with a protective layer (3), a cover plate (4), an upper circuit board (7) and an operation layer (8) in turn from bottom to top according to the installation line L, characterized in that, Also includes: The cover plate (4) is connected to the lower circuit board (1). Among them, a sealing groove (2) is provided on the lower circuit board (1), and a flap (41) adapted to the sealing groove (2) is provided on the edge of the cover plate (4). A sealing area is formed between the cover plate (4) and the lower circuit board (1). A soft sealing adhesive layer (6) is provided in the sealing groove (2). When the flap (41) and the sealing groove (2) are fastened together, the adhesive in the soft sealing adhesive layer (6) is squeezed to fill the gap between the flap (41) and the sealing groove (2).

2. The waterproof structure for a thin film circuit board precision circuit according to claim 1, wherein The lower circuit board (1) has lower contact pieces (11) arranged at equal intervals. A connecting line (12) is fixedly connected to the lower circuit board (1), and the connecting line (12) is electrically connected to the lower contact pieces (11) to keep the connecting line (12) in a connected state. A connecting part (13) is fixedly connected to the end face of the lower circuit board (1) for connecting the lower circuit board (1) to external devices.

3. The waterproof structure for a thin film circuit board precision circuit according to claim 2, wherein A magnetic block (5) is fixedly connected to the lower circuit board (1), and a magnet (43) is fixedly connected to the cover plate (4) corresponding to the magnetic block (5). When the magnet (43) and the magnetic block (5) are attracted and fixed, the flip plate (41) provides a pre-tightening force to the lower circuit board (1) and squeezes the soft sealant layer (6).

4. The waterproof structure for a fine circuit of a thin film circuit board according to claim 3, wherein The upper circuit board (7) is fixedly connected to an upper contact piece (71) and a second connecting line (72), and the second connecting line (72) is electrically connected to the upper contact piece (71). When the upper contact piece (71) moves, the circuit board remains in a closed state.

5. The waterproof structure for precision circuitry on a thin-film circuit board according to claim 4, characterized in that, The protective layer (3) is fixedly connected to a contact piece 1 (31), and the contact piece 1 (31) is installed corresponding to the lower contact piece (11). The cover plate (4) is fixedly connected to a contact piece 2 (42), and the contact piece 2 (42) is installed corresponding to the contact piece 1 (31). When the upper contact piece (71) moves, the contact piece 1 (31), the contact piece 2 (42) and the lower contact piece (11) are connected, and the upper contact piece (71) and the lower contact piece (11) are kept in a pass-through state.

6. The waterproof structure for precision circuitry on a thin-film circuit board according to claim 1, characterized in that, A button (81) is fixedly connected to the operation layer (8). When the button (81) is pushed, the upper contact piece (71) presses the second contact piece (42) downward and makes the upper contact piece (71) electrically connected to the lower contact piece (11).

Images