Printed circuit board

Abstract

This application discloses a printed circuit board, relating to the field of circuit board technology, comprising: a board body; and a device fixing assembly, wherein the device fixing assembly is fixed on the board body and is electrically connected to the board body. The device fixing assembly includes at least one device clamp, which has a clamping cavity for accommodating the pins of the clamped device, and is electrically connected to the pins of the clamped device. The device clamp allows the pins of the clamped device to slide within the clamping cavity, thereby solving the technical problem in related technologies where electrical components on circuit boards are easily damaged by mechanical stress, and achieving the technical effect of improving the stability and durability of the circuit board.

Description

Technical Field

[0001] This application relates to the field of circuit board technology, and more particularly to a printed circuit board. Background Technology

[0002] A large number of electrical components are mounted on a printed circuit board (PCB). Most of these components are fixed to the PCB by soldering, and some of them are quite fragile. When the PCB deforms due to external forces, these soldered electrical components will be subjected to significant mechanical stress, and some fragile components are easily damaged by this stress.

[0003] This shows that in related technologies, there is a problem that electrical components on PCBs are easily damaged by mechanical stress. Utility Model Content

[0004] This application provides a printed circuit board to at least solve the problem in the related art that electrical components on PCBs are easily damaged by mechanical stress.

[0005] This application provides a printed circuit board, including: a board body; a device fixing assembly, the device fixing assembly being fixed on the board body and electrically connected to the board body, the device fixing assembly including at least one device clamp, the device clamp having a clamping cavity for accommodating the pins of a clamped device, and the device clamp being electrically connected to the pins of the clamped device, the device clamp allowing the pins of the clamped device to slide within the clamping cavity.

[0006] By means of this application, the device (i.e., electrical device) is fixed to the circuit board by means of a device clamping assembly fixed to the board body, and the device can be indirectly fixed to the circuit board by means of a device clamp. When faced with mechanical stress, the device can slide within the range of the clamping cavity, thereby preventing mechanical stress from acting directly on the device. Therefore, the technical problem of electrical devices on PCBs being easily damaged by mechanical stress in related technologies can be solved, thereby achieving the technical effect of improving the stability and durability of PCBs. Attached Figure Description

[0007] To more clearly illustrate the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0008] Figure 1This is a structural block diagram of a printed circuit board according to an embodiment of this application.

[0009] Figure 2 This is a front view of a clamped device and a device clamp according to an embodiment of this application.

[0010] Figure 3 This is a pin diagram of a clamped device according to an embodiment of this application.

[0011] Figure 4 This is a side view of a clamped device and a device clamp according to an embodiment of this application.

[0012] Figure 5 This is a side view of another clamped device and device clamp according to an embodiment of this application.

[0013] Figure 6 This is a front view of a device clip according to an embodiment of this application.

[0014] Figure 7 This is a side view of a clamped device, device clamp, and baffle according to an embodiment of this application.

[0015] Figure 8 This is a front view of a device clip and baffle according to an embodiment of this application.

[0016] Figure 9 This is a front view of another device clip and baffle according to an embodiment of this application.

[0017] Figure 10 This is a front view of another device clip and baffle according to an embodiment of this application.

[0018] Figure 11 This is a front view of a guide segment and a receiving segment according to an embodiment of this application.

[0019] Figure 12 This is a schematic diagram of a first included angle and a second included angle according to an embodiment of this application.

[0020] Explanation of reference numerals in the attached figures:

[0021] 21, Device clamp; 211, Clamping cavity; 212, Clamping arm; 2121, Guide section; 21211, Guide surface; 2122, Receiving section; 21221, Receiving surface; 213, Conductive connector; 214, Baffle; 22, Clamped device; 221, Pin; 101, Plate; 102, Device fixing assembly. Detailed Implementation

[0022] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of this application.

[0023] It should be noted that, in the description of this application, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. The terms "first," "second," etc., in this application are used to distinguish similar objects and are not used to describe a specific order or sequence.

[0024] To enable those skilled in the art to better understand the present application, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0025] This embodiment provides a printed circuit board. Figure 1 This is a schematic diagram of a printed circuit board according to an embodiment of this application, such as... Figure 1 As shown, the printed circuit board includes:

[0026] Plate 101;

[0027] The device fixing assembly 102 is fixed to the board and is electrically connected to the board. The device fixing assembly includes at least one device clamp having a clamping cavity for accommodating the pins of the clamped device and being electrically connected to the pins of the clamped device. The device clamp allows the pins of the clamped device to slide within the clamping cavity.

[0028] In related technologies, a large number of electrical components, such as inductors, capacitors, resistors, transistors, integrated circuits, and switches, are placed on printed circuit boards (PCBs). Most of these components are fixed to the PCB by soldering. For example, surface mount devices (SMDs) are fixed to the PCB using surface mount technology (SMT), allowing for efficient assembly using automated pick-and-place machines. They are typically soldered onto the PCB using reflow soldering technology. SMDs have short leads and their bottom surface can completely conform to the PCB. They exhibit excellent high-frequency performance and heat dissipation, making them a common type of PCB component in related technologies.

[0029] However, when the PCB is deformed by external force, the electrical components soldered on the PCB will directly bear a large mechanical stress, and some fragile electrical components are easily damaged by mechanical stress.

[0030] For example, SMD ceramic capacitors (such as multilayer ceramic capacitors (MLCCs)) have advantages such as small size, excellent high-frequency characteristics, high temperature resistance, and low cost, making them commonly used components on PCBs. However, due to the brittleness of the ceramic dielectric, SMD ceramic capacitors are susceptible to mechanical stress damage. After damage, cracks may form at the SMD ceramic capacitor pads, causing internal electrode short circuits or a sudden drop in capacitance, leading to circuit signal distortion or power protection triggering, resulting in malfunction. Alternatively, as the cracks expand, the leakage current between the electrodes may increase, causing local overheating and even melting the metal layer, or even igniting surrounding components, thus posing a fire risk. Or, in the early stages of damage, the cracks may be small and difficult to detect, but after changes in temperature and humidity or long-term vibration, the cracks may expand, causing intermittent equipment failures, thus creating hidden potential faults.

[0031] In related technologies, methods such as PCB layout optimization, soldering process control, assembly and operation specifications, and material selection are typically used to try to reduce the effect of stress on electrical components, thereby preventing stress damage. However, these methods can only reduce the effect of stress on electrical components to a certain extent; they cannot prevent stress from directly acting on the components. When the PCB deforms, there is still a considerable probability of damage to the electrical components. Taking SMD ceramic capacitors as an example, SMD ceramic capacitors are generally hard and brittle. Their two solder joints are usually made of hard and brittle solder. When the PCB is bent and deformed, the internal structure of the SMD ceramic capacitor is prone to cracking, and the solder on its leads is also prone to breakage.

[0032] To at least partially solve the above-mentioned technical problems, in this embodiment, a device fixing assembly fixed on the circuit board is used to fix the clamped device (i.e., electrical device) by means of a device clamp. The clamped device can be indirectly fixed to the circuit board by means of a device clamp. When facing mechanical stress, the pins of the clamped device can slide slightly within the clamping cavity, thereby preventing mechanical stress from acting directly on the clamped device, and thus solving the above-mentioned technical problems.

[0033] In this embodiment, the printed circuit board includes a board body, namely the PCB board body, which is used to carry various electrical devices and circuit components and is the physical basis of electronic circuits.

[0034] The printed circuit board in this embodiment also includes a device fixing assembly, which is fixed to the board body and electrically connected to the board body. Here, the device fixing assembly can be fixed to the board body by soldering. The device fixing assembly is used to fix electrical devices, and one device fixing assembly is used to fix one electrical device. The electrical device fixed by the device fixing assembly is the clamped device. Multiple device fixing assemblies can be present on a single board body to fix multiple electrical devices.

[0035] The device fixing assembly includes at least one device clamp having a clamping cavity for accommodating the pins of the clamped device, and the device clamp is electrically connected to the pins of the clamped device. Here, because the device clamp is electrically connected to the pins of the clamped device, and the device fixing assembly is electrically connected to the board, the pins of the clamped device can be electrically connected to the board. The indirect fixing method via the device clamp does not affect the clamped device from providing normal functionality to the PCB.

[0036] Optionally, such as Figure 2 As shown, the clamped device 22 is fixed in the clamping cavity 211 of the device clamp 21. In order to clamp the clamped device 22, the device clamp 21 can be made of an elastic material. When the PCB board deforms, the stress will directly act on the device clamp 21, causing the device clamp 21 to deform. Since the device clamp 21 is elastic, when the PCB board deforms, the contact point between the clamped device 22 and the device clamp 21 can slide, so that the clamped device 22 can move within a small range in the clamping cavity 211 of the device clamp 21, avoiding the stress from acting directly on the clamped device 22, thereby eliminating the mechanical stress caused by the deformation of the PCB that could damage the clamped device 22. Here, the device clamp 21 provides clamping force to fix the clamped device 22 through the included angle. The size of the included angle can be set according to experience. The included angle must ensure that the device clamp 21 has sufficient clamping force, but also prevent the clamping force from being too large and damaging the clamped device 22. The size of the included angle can be determined according to the stress generated after the clamped device 22 is placed in (the magnitude of the stress is mainly related to the material of the device clamp 21) and the stress value that the pins of the clamped device 22 can withstand, so as to ensure that the clamped device 22 will not be damaged.

[0037] Furthermore, to ensure conductive connection between the device clamp and the pins of the clamped device, the device clamp can hold the clamped device at the pin positions. For example, taking an SMD ceramic capacitor as an example, its pins can be positioned as follows: Figure 3 As shown, pin 221 is a metal terminal for electrical connection. These terminals typically cover both ends of the SMD ceramic capacitor and can be connected to the internal electrodes by sintering or electroplating to provide an interface with external circuits. In related technologies, the pins are usually soldered to the PCB board to fix the SMD ceramic capacitor and enable the SMD ceramic capacitor to conduct electricity with the board.

[0038] Optionally, the pins of the clamped device can be square or cylindrical in shape, and the sliding of the pins within their corresponding clamping cavities can be an overall sliding of the clamped device. For example, the clamped device can be a square or cylindrical sheet structure, with its pins being metal layers coated at both ends. Alternatively, the clamped device can be a triangular or cross-shaped sheet structure, with each end being a square or cylindrical structure, and its pins being metal layers coated at each end.

[0039] The device clamp can be electrically connected to the board. To facilitate pin clamping and provide the possibility of pin sliding when necessary, the clamping cavity can be a non-closed structure. For example, it can be open at locations other than the point of conductive connection with the board. Combined with an elastic material, it can ensure that under normal conditions, the pin is fixed by the force between itself and the clamped pin, while allowing the pin to move slightly within the clamping cavity under mechanical stress.

[0040] In this embodiment, a device fixing assembly includes at least one device clamp, and the device fixing assembly is used to fix a clamped device. Optionally, in this embodiment, as... Figure 4 As shown, a device fixing assembly may include two device clips 21, which can clamp the device 22 at the pins 221 at both ends of the device 22; or, to reduce costs, it may be as follows: Figure 5 As shown, a device fixing assembly may include a device clamp 21, which clamps the device 22 at one end of its pin 211. The other end of the device 22 is fixed to the board 101 by soldering. Both of these methods allow the clamped device to have a certain amount of room to move when the PCB is deformed, preventing the clamped device from being directly subjected to stress. The number of device clamps included in the device fixing assembly can be selected based on experience.

[0041] The printed circuit board provided in this application includes: a board body; and a device fixing assembly, which is fixed to the board body and electrically connected to the board body. The device fixing assembly includes at least one device clamp, which has a clamping cavity for accommodating the pins of the clamped device and is electrically connected to the pins of the clamped device. The device clamp allows the pins of the clamped device to slide within the clamping cavity, thus solving the technical problem in the related art that electrical components on PCBs are easily damaged by mechanical stress, and improving the stability and durability of the PCB.

[0042] In one exemplary embodiment, the device clamp includes a conductive connector and two opposing clamping arms located on both sides of the conductive connector, a clamping cavity is formed between the conductive connector and the two clamping arms, and the conductive connector is fixed to the plate and is conductively connected to the plate.

[0043] For example, such as Figure 6 As shown, the conductive connector 213, which is the bottom of the device clamp 21, can be fixed to the plate 101 by welding. For conductive connection with the plate 101, the conductive connector 213 can be made of a conductive metal material, such as copper, nickel, aluminum, silver, iron, or their alloys. Optionally, the two clamping arms can be integrally made of the same material as the conductive connector. Since the two clamping arms do not require conductivity, they can also be made of a different material and connected to the conductive connector by welding or other methods to reduce material costs.

[0044] In this embodiment, the device clamp includes a conductive connector and two clamping arms. The conductive connector can provide conductivity to make the clamped part conductively connected to the plate, and the clamping arms can provide clamping force to fix the clamped part.

[0045] In one exemplary embodiment, the device retaining assembly further includes at least one baffle disposed on the side of the device clamp away from the retaining pin, for preventing the clamped device from slipping out of the device clamp.

[0046] Because the device clamp can only provide lateral clamping force, and longitudinal fixation relies solely on friction, under normal conditions, lateral force is sufficient to prevent longitudinal sliding of the clamped component. However, under external force, the clamped component may slide longitudinally out of the clamp's fixed range. To prevent longitudinal sliding, the device clamp is equipped with a baffle, positioned on the side of the clamp away from the fixed leads. For example, as... Figure 7 As shown, by setting two device clamps 21 on baffles 214 on both sides of the clamped device 22, it is ensured that the clamped device 22 will not fall out of the fixed range of the device fixing assembly, thereby ensuring the electrical stability of the clamped device.

[0047] Optionally, such as Figure 8 As shown, the baffle 214 can be disposed on the conductive connector 213 of the device clamp 21, or as... Figure 9 As shown, the baffle 214 can be disposed on the clamping arm 212 on one side of the device clamp 21, or as... Figure 10 As shown, the baffle 214 can also be disposed on the clamping arms 212 on both sides of the device clamp 21, but this is not limited in this embodiment.

[0048] In this embodiment, by setting a baffle on the device clamp of the device fixing assembly, the longitudinal sliding range of the clamped device can be limited, preventing the clamped device from sliding out of the device clamp and ensuring the electrical stability of the clamped device.

[0049] In one exemplary embodiment, such as Figure 9 and Figure 10 As shown, at least one of the two opposing clamping arms 212 is provided with a baffle 214. In practical applications, the number of baffles can be determined based on the application scenario and production cost.

[0050] In this embodiment, by providing a baffle on at least one clamping arm, similar to the previous embodiment, the longitudinal sliding range of the clamped device can be limited, preventing the clamped device from sliding out of the device clamp.

[0051] In one exemplary embodiment, to ensure the device clamp can hold the clamped device and to simplify the manufacturing process of the device clamp, the device clamp is integrally molded from an elastic material. That is, the clamping arms and conductive connectors of the device clamp are made of the same material. It should be noted that, in order to ensure the conductive connection between the conductive connectors and the plate, the elastic material of the device clamp needs to be a conductive metal material as well. Optionally, the baffle can be integrally molded from the same elastic material as other parts of the device clamp, or it can be manufactured separately from other materials; this embodiment does not limit this.

[0052] Optionally, in order to reduce the space occupied by the device fixing components on the PCB, the device clamp can be made as thin as possible while ensuring that the material can generate sufficient stress. The specific thickness of the device clamp can be determined according to the actual material used and the clamping force requirements. This embodiment does not limit this.

[0053] In this embodiment, the device clamp is integrally molded from an elastic material, which simplifies the device clamp production process, improves the production efficiency of the device clamp, and ensures that the device clamp can provide the required clamping force and conductivity.

[0054] In one exemplary embodiment, in order for the device clamp to provide clamping force and prevent the clamped device from falling out of the clamp from above, the distance between the two opposing clamping arms gradually increases along the direction approaching the conductive connector. That is, Figure 6 The structure shown is narrow at the top and wide at the bottom.

[0055] It should be noted that the maximum distance between the two clamping arms, i.e. the width of the conductive connector, needs to be greater than the width of the clamped device to ensure that the clamped device can be placed in the device clamp. However, the width of the conductive connector should not be too large. An excessively large width will cause the device clamp to occupy too much PCB area, which is not conducive to high-density board layout and thus affects the mass application of device fixing components.

[0056] In this embodiment, the device clamp adopts a structure that is narrow at the top and wide at the bottom, which can ensure that the device clamp can provide clamping force and prevent the clamped device from falling out of the device clamp from above.

[0057] In an exemplary embodiment, the clamping arm includes a guide section and a receiving section connected in sequence, the receiving section being closer to the conductive connector than the guide section; the distance between the receiving sections of two opposing clamping arms gradually increases as they approach the conductive connector; the distance between the guide sections of two opposing clamping arms gradually decreases as they approach the conductive connector, so that the clamping cavity forms a constricted state at the connection between the guide section and the receiving section.

[0058] For example, such as Figure 11 As shown, the upper part of the clamping arm 212 is the guide section 2121, and the lower part is the receiving section 2122. Similar to the previous embodiment, the distance between the receiving sections 2122 of the two opposing clamping arms 212 gradually increases as it approaches the conductive connector 213, forming a structure that is narrow at the top and wide at the bottom. The distance between the guide sections 2121 of the two opposing clamping arms 212 gradually decreases as it approaches the conductive connector 213, forming a structure that is wide at the top and narrow at the bottom. The clamping cavity 211 forms a constricted state at the connection between the guide section 2121 and the receiving section 2122. The constriction can prevent the clamped device 22 from slipping out of the device clamp 21. The guide section 2121 can facilitate the insertion of the clamped device 22 into the device clamp 21. The guide sections 2121 and the receiving sections 2122 of the two clamping arms 212 can form an X-shaped structure. It should be noted that, in order to ensure that the clamped device does not fall out after being placed in the device holder, the height of the receiving section needs to be greater than the height of the clamped device, and the narrowing formed at the connection between the guide section and the receiving section needs to be smaller than the width of the clamped device.

[0059] In this embodiment, the clamping arm includes a guide section and a receiving section connected in sequence. The design of the guide section facilitates the placement of the clamped device into the device clamp, and the narrowing formed at the connection between the guide section and the receiving section can prevent the clamped device from falling out, thereby improving the ease of use and stability of the device clamp.

[0060] In an exemplary embodiment, the surfaces of the guide segments of the two clamping arms facing each other form a guide surface, and the acute angle formed by the guide surface and the perpendicular plane of the plate is a first included angle. The surfaces of the receiving segments of the two clamping arms facing each other form a receiving surface, and the acute angle formed by the receiving surface and the plane of the plate is a second included angle. The angle value of the first included angle is greater than the angle value of the second included angle.

[0061] For example, such as Figure 12 As shown, the acute angle formed by the guide surface 21211 and the perpendicular plane of the plate is the first included angle, and the acute angle formed by the receiving surface 21221 and the plate is the second included angle.

[0062] In this embodiment, the guide surface has a larger angle, which allows the guide segment to have greater elasticity and a gentler guiding effect. This allows the pins of the clamped device to be smoothly guided along the tilt angle of the guide surface during the process of entering the clamping cavity, reducing the initial stress between the pins and the device clamp, while providing a certain preload to ensure that the pins are positioned more accurately and stably in the device clamp.

[0063] In an exemplary embodiment, in order to ensure that the device clamp can provide appropriate clamping force and facilitate the placement of the clamped device into the clamping cavity, the angle value of the first included angle is in the range of 60° to 70°, and the angle value of the second included angle is in the range of 50° to 60°.

[0064] By maintaining the first and second included angles within an appropriate range, this embodiment ensures the performance of the device clamp, improves stress absorption capacity, reduces the risk of pin damage, and enhances the compatibility of assembling the clamped device.

[0065] In one exemplary embodiment, the number of device clips is two, and the device being clipped is a surface-mount ceramic capacitor.

[0066] Surface mount ceramic capacitors, also known as SMD ceramic capacitors, are commonly used components on PCBs due to their advantages such as small size, excellent high-frequency characteristics, high temperature resistance, and low cost. However, because the ceramic dielectric is brittle, SMD ceramic capacitors are susceptible to mechanical stress damage. To protect them, component clips are used for fixing. SMD ceramic capacitors have leads on both sides, and two component clips are used to fix one capacitor. Figure 7 As shown, the baffles 214 of the two device clips 21 can block the SMD ceramic capacitors on both sides to prevent the SMD ceramic capacitors from sliding out of the device clips 21.

[0067] Alternatively, in addition to the aforementioned surface-mount ceramic capacitors, other stress-sensitive electrical devices with two leads can also be fixed to the PCB using a similar two-device clip method.

[0068] In this embodiment, the two component clamps can not only fix the surface mount ceramic capacitors, but also solve the risk of stress damage to the surface mount ceramic capacitors caused by PCB deformation. In addition, the baffle design of the two component clamps can ensure that the surface mount ceramic capacitors will not fall out, thus improving the stability of the PCB.

[0069] The foregoing has provided a detailed description of a printed circuit board provided in this application. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the embodiments above are only intended to help understand the method and core ideas of this application. It should be noted that those skilled in the art can make various improvements and modifications to this application without departing from its principles, and these improvements and modifications also fall within the protection scope of the claims of this application.

Claims

1. A printed circuit board, characterized in that, include: plate body; A device fixing assembly is fixed to the plate and is electrically connected to the plate. The device fixing assembly includes at least one device clamp having a clamping cavity for accommodating the pins of the clamped device and being electrically connected to the pins of the clamped device. The device clamp allows the pins of the clamped device to slide within the clamping cavity.

2. The printed circuit board according to claim 1, characterized in that, The device clamp includes a conductive connector and two opposing clamping arms located on both sides of the conductive connector. The clamping cavity is formed between the conductive connector and the two clamping arms. The conductive connector is fixed to the plate and is conductively connected to the plate.

3. The printed circuit board according to claim 2, characterized in that, The device fixing assembly further includes at least one baffle, which is disposed on the side of the device clamp away from fixing the pin, for preventing the clamped device from sliding out of the device clamp.

4. The printed circuit board according to claim 3, characterized in that, The baffle is provided on at least one of the two opposing clamping arms.

5. The printed circuit board according to claim 1, characterized in that, The device clip is integrally formed from an elastic material.

6. The printed circuit board according to claim 2, characterized in that, The distance between the two opposing clamping arms gradually increases along the direction closer to the conductive connector.

7. The printed circuit board according to claim 2, characterized in that, The clamping arm includes a guide section and a receiving section connected in sequence, wherein the receiving section is closer to the conductive connector than the guide section; The distance between the receiving segments of the two opposing clamping arms gradually increases as they approach the conductive connector; The distance between the guide sections of the two opposing clamping arms gradually decreases as they approach the conductive connector, so that the clamping cavity forms a constricted state at the connection between the guide section and the receiving section.

8. The printed circuit board according to claim 7, characterized in that, The surfaces of the guide sections of the two clamping arms facing each other form a guide surface, and the acute angle formed by the guide surface and the perpendicular plane of the plate is a first included angle. The surfaces of the receiving sections of the two clamping arms facing each other form a receiving surface, and the acute angle formed by the receiving surface and the plane of the plate is a second included angle. The angle value of the first included angle is greater than the angle value of the second included angle.

9. The printed circuit board according to claim 8, characterized in that, The angle value of the first included angle ranges from 60° to 70°, and the angle value of the second included angle ranges from 50° to 60°.

10. The printed circuit board according to any one of claims 1 to 9, characterized in that, The number of device clamps is two, and the clamped device is a surface-mount ceramic capacitor.

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