A flexible printed circuit board processing device to prevent displacement

Abstract

This utility model discloses a flexible printed circuit board (PCB) processing device to prevent displacement, including a pressing mechanism comprising a body assembly for providing equipment installation space and PCB pressing space, a hydraulic assembly for providing pressing power, and an upper mold plate for pressing; and an adsorption mechanism comprising a vacuum assembly for providing vacuum and a vacuum suction cup for supporting the PCB. The vacuum assembly includes a vacuum pump, an air filter for vacuum gas filtration, and a pressure regulating valve for adjusting gas pressure. In this utility model, the vacuum assembly of the adsorption mechanism and the vacuum suction cup work together. The vacuum pump creates a vacuum, and the gas, after being filtered by the air filter and regulated by the pressure regulating valve, enters the vacuum suction cup through a negative pressure pipe. Under vacuum, the porous panel of the vacuum suction cup firmly adsorbs the PCB, preventing displacement during pressing and thus ensuring processing accuracy and product quality.

Description

Technical Field

[0001] This utility model relates to the field of flexible printed circuit board lamination processing technology, and specifically to a flexible printed circuit board processing device that prevents displacement. Background Technology

[0002] Flexible printed circuit board (PCB) processing equipment is specifically designed for the manufacturing, fixing, forming, and surface treatment of flexible substrate PCBs. It mainly includes drilling equipment, stamping equipment, pressing equipment, assembly equipment, and testing equipment. Among them, the pressing equipment is used to bond conductive layers, non-conductive layers, and encapsulation layers together to form a complete flexible PCB. The pressing operation is carried out by pressing the flexible PCB through the hard extrusion of steel plates. It utilizes the characteristics of the pressed materials to make the cover film and copper foil tightly bonded under specific temperature, time, and pressure conditions.

[0003] During the lamination process of flexible printed circuit boards, the flexible printed circuit boards are usually laid flat on the table. When the hydraulic cylinder is started, the hydraulic cylinder will vibrate. The vibration can easily cause the flexible printed circuit board to shift, thus affecting the lamination accuracy. Utility Model Content

[0004] In order to overcome the shortcomings of the prior art, this utility model provides a flexible printed circuit board processing device that prevents displacement, so as to solve the problems in the prior art.

[0005] To achieve the above objectives, this utility model provides the following technical solution:

[0006] A flexible printed circuit board (PCB) processing apparatus for preventing displacement includes a pressing mechanism, comprising a body assembly for providing equipment installation space and PCB pressing space, a hydraulic assembly for providing pressing power, and an upper mold plate for pressing; and a suction mechanism, comprising a vacuum assembly for providing vacuum, and a vacuum suction cup for supporting the PCB. The vacuum assembly includes a vacuum pump, an air filter for vacuum gas filtration, a pressure regulating valve for adjusting gas pressure, a connecting pipe for connecting the vacuum pump and the air filter, and a negative pressure pipe for connecting the pressure regulating valve and the vacuum suction cup. The vacuum suction cup includes an outer frame, a honeycomb valve core installed in the inner cavity of the outer frame, a perforated panel installed on the top of the outer frame for placing the PCB, a pressure relief valve for releasing the pressure, and a solenoid valve for controlling gas flow.

[0007] Preferably, the body assembly includes a body, a pressing chamber located in the middle of the body, a hydraulic chamber located in the upper part of the body, and an equipment chamber located in the lower part of the body.

[0008] Preferably, the hydraulic assembly includes a hydraulic cylinder fixed to the inner cavity of the hydraulic chamber, a base plate for supporting the vacuum suction cup, a top plate located at the upper end of the inner cavity of the pressing chamber, and a guide post and a guide sleeve for guiding the top plate. The output end of the hydraulic cylinder extends through the inner cavity of the pressing chamber and is fixedly connected to the top plate.

[0009] Preferably, the bottom plate is fixedly connected to the bottom of the inner cavity of the pressing chamber, the upper mold plate is fixed to the bottom of the top plate, four guide posts are provided and fixed to the four sides of the top of the bottom plate, four guide sleeves are provided and fixed to the four sides of the top of the top plate, and the end of the guide post away from the bottom plate passes through the top plate and the guide sleeve and is slidably connected to the inner cavity of the guide sleeve.

[0010] Preferably, the upper molding plate includes a frame fixed to the bottom of the base plate, a heater fixed to the inner cavity of the frame for providing heat, a heat-conducting plate fixed to the bottom of the frame for pressing the flexible printed circuit board and heat transfer, and a heat insulation plate fixed to the top of the heater for heat insulation.

[0011] Preferably, the vacuum pump, air filter, and pressure regulating valve are all fixed inside the equipment chamber, one end of the connecting pipe is connected to the outlet of the vacuum pump, and the other end of the connecting pipe is connected to the inlet of the air filter.

[0012] Preferably, the outlet of the air filter is connected to the inlet of the pressure regulating valve, the outlet of the pressure regulating valve is connected to one end of the negative pressure pipe, and the other end of the negative pressure pipe is connected to the air inlet of the vacuum suction cup.

[0013] Preferably, the honeycomb valve core is fixed to the inner cavity of the outer frame, the porous panel is fixed to the top of the outer frame, the pressure relief valve is connected to the inner cavity of the outer frame, and the solenoid valve is installed at the air inlet.

[0014] Compared with existing technologies, the beneficial effects of this utility model are as follows:

[0015] This invention utilizes the vacuum components of the adsorption mechanism in conjunction with a vacuum suction cup. A vacuum pump creates a vacuum, and gas, after being filtered by an air filter and regulated by a pressure regulating valve, enters the vacuum suction cup through a negative pressure pipe. Under vacuum, the porous panel of the vacuum suction cup firmly adsorbs the flexible printed circuit board, preventing displacement during the pressing process and ensuring processing accuracy and product quality. The hydraulic components of the pressing mechanism provide stable pressing power through a hydraulic cylinder, whose output pushes the top plate, causing the upper mold plate to press the flexible printed circuit board, ensuring a smooth pressing process. The guide pillars and guide sleeves guide the movement of the top plate, making the pressing action of the upper mold plate more precise and improving the pressing effect. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the main structure of this utility model;

[0017] Figure 2 This is a schematic diagram showing the connection structure between the body assembly, hydraulic assembly, and adsorption mechanism of this utility model.

[0018] Figure 3 This is a schematic diagram showing the connection structure between the body assembly, vacuum assembly, and vacuum suction cup of this utility model;

[0019] Figure 4 This is a schematic diagram showing the connection structure between the vacuum component and the vacuum suction cup of this utility model;

[0020] Figure 5 This is a front view cross-sectional structural diagram of the upper molding plate and vacuum suction cup of this utility model.

[0021] In the attached diagram, 100 is the pressing mechanism; 110 is the body assembly; 111 is the body; 112 is the pressing chamber; 113 is the hydraulic chamber; 114 is the equipment chamber; 120 is the hydraulic assembly; 121 is the hydraulic cylinder; 122 is the base plate; 123 is the top plate; 124 is the guide column; 125 is the guide sleeve; 130 is the upper mold plate; 131 is the frame; 132 is the heater; 133 is the heat-conducting plate; 134 is the heat insulation plate; 200 is the adsorption mechanism; 210 is the vacuum assembly; 211 is the vacuum pump; 212 is the air filter; 213 is the pressure regulating valve; 214 is the connecting pipe; 215 is the negative pressure pipe; 220 is the vacuum suction cup; 221 is the outer frame; 222 is the honeycomb valve core; 223 is the porous panel; 224 is the pressure relief valve; and 225 is the solenoid valve. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0023] Example 1

[0024] like Figures 1 to 5As shown, this is the first embodiment of the present invention. This embodiment provides a flexible printed circuit board processing device to prevent displacement, including a pressing mechanism 100, comprising a body assembly 110 for providing equipment installation space and flexible printed circuit board pressing space, a hydraulic assembly 120 for providing pressing power, and an upper mold plate 130 for pressing; and an adsorption mechanism 200, comprising a vacuum assembly 210 for providing vacuum, and a vacuum suction cup 220 for supporting the flexible printed circuit board. The vacuum assembly 210 includes a vacuum pump 211 and a vacuum suction cup for holding the flexible printed circuit board. The system includes an air filter 212 for body filtration, a pressure regulating valve 213 for adjusting gas pressure, a connecting pipe 214 for connecting the vacuum pump 211 and the air filter 212, and a negative pressure pipe 215 for connecting the pressure regulating valve 213 and the vacuum suction cup 220. The vacuum suction cup 220 includes an outer frame 221, a honeycomb valve core 222 installed in the inner cavity of the outer frame 221, a perforated panel 223 installed on the top of the outer frame 221 for placing a flexible printed circuit board, a pressure relief valve 224 for releasing the fixed pressure, and a solenoid valve 225 for controlling the gas flow.

[0025] like Figures 1 to 5 As shown, the vacuum component 210 and vacuum suction cup 220 in the adsorption mechanism 200 work together to firmly adsorb and fix the flexible printed circuit board. In the vacuum component 210, the vacuum pump 211 generates a vacuum, the air filter 212 filters the vacuum gas, the pressure regulating valve 213 regulates the gas pressure, the connecting pipe 214 connects the vacuum pump 211 to the air filter 212, and the negative pressure pipe 215 connects the pressure regulating valve 213 to the vacuum suction cup 220 to ensure a stable negative pressure environment. In the vacuum suction cup 220, the porous panel 223 is used to place the flexible printed circuit board, and the honeycomb valve core 222 is installed in the inner cavity of the outer frame 221. The vacuum suction cup 220 is used to create a uniform adsorption force on the surface of the porous panel 223. The solenoid valve 225 controls the gas flow. When it is opened, it creates a negative pressure inside the vacuum suction cup 220, which firmly adsorbs the flexible printed circuit board onto the porous panel 223, effectively preventing it from shifting when the hydraulic cylinder vibrates. The pressure relief valve 224 can release the fixation when needed, making it easy to remove the circuit board. The adsorption mechanism 200 firmly adsorbs the flexible printed circuit board onto the vacuum suction cup 220, and the pressing mechanism 100 maintains stable movement during the pressing process. The two work together to effectively avoid the flexible printed circuit board from shifting during the pressing process, thereby improving the pressing accuracy.

[0026] Example 2

[0027] like Figure 1 , Figure 2 , Figure 3 and Figure 5 The image shows the second embodiment of this utility model, which is based on the previous embodiment.

[0028] In this embodiment, the body assembly 110 includes a body 111, a pressing chamber 112 located in the middle of the body 111, a hydraulic chamber 113 located in the upper half of the body 111, and an equipment chamber 114 located in the lower half of the body 111.

[0029] The hydraulic assembly 120 includes a hydraulic cylinder 121 fixed to the inner cavity of the hydraulic chamber 113, a base plate 122 for supporting the vacuum suction cup 220, a top plate 123 located at the upper end of the inner cavity of the pressing chamber 112, and a guide post 124 and a guide sleeve 125 for guiding the top plate 123. The output end of the hydraulic cylinder 121 extends through the inner cavity of the pressing chamber 112 and is fixedly connected to the top plate 123.

[0030] The bottom plate 122 is fixedly connected to the bottom of the inner cavity of the pressing chamber 112. The upper mold plate 130 is fixed to the bottom of the top plate 123. Four guide pillars 124 are provided and fixed to the four sides of the top of the bottom plate 122 respectively. Four guide sleeves 125 are provided and fixed to the four sides of the top of the top plate 123 respectively. The end of the guide pillar 124 away from the bottom plate 122 passes through the top plate 123 and the guide sleeve 125 and is slidably connected to the inner cavity of the guide sleeve 125.

[0031] The upper molding plate 130 includes a frame 131 fixed to the bottom of the base plate 122, a heater 132 fixed to the inner cavity of the frame 131 for providing heat, a heat-conducting plate 133 fixed to the bottom of the frame 131 for pressing the flexible printed circuit board and heat transfer, and a heat insulation plate 134 fixed to the top of the heater 132 for heat insulation.

[0032] like Figure 1 , Figure 2 , Figure 3 and Figure 5 As shown, the machine body assembly 110 includes a body 111, a pressing chamber 112, a hydraulic chamber 113, and an equipment chamber 114, providing a stable installation and pressing space for the entire device. The base plate 122 in the hydraulic assembly 120 is fixedly connected to the bottom of the inner cavity of the pressing chamber 112. The top plate 123 is guided by guide posts 124 and guide sleeves 125, making the pressing process more stable and reducing swaying caused by vibration. The guide posts 124 and guide sleeves 125 ensure the top plate 123 moves smoothly up and down. To ensure accuracy and stability during the process, the upper mold plate 130 is fixed to the bottom of the top plate 123. The stable movement of the top plate 123 ensures the precision of the upper mold plate 130 in pressing the flexible printed circuit board. The frame 131, heater 132, heat-conducting plate 133 and heat insulation plate 134 of the upper mold plate 130 work together to provide appropriate heat and ensure the stability of the pressing process. The heater 132 can be an electric heating rod, and the pressing heating temperature required for the flexible printed circuit board can be controlled by a PID controller.

[0033] Example 3

[0034] like Figures 3 to 5 This is the third embodiment of the present invention, which is based on the first two embodiments.

[0035] In this embodiment, the vacuum pump 211, the air filter 212, and the pressure regulating valve 213 are all fixed in the inner cavity of the equipment chamber 114. One end of the connecting pipe 214 is connected to the outlet of the vacuum pump 211, and the other end of the connecting pipe 214 is connected to the inlet of the air filter 212.

[0036] The outlet of the air filter 212 is connected to the inlet of the pressure regulating valve 213, the outlet of the pressure regulating valve 213 is connected to one end of the negative pressure pipe 215, and the other end of the negative pressure pipe 215 is connected to the air inlet of the vacuum suction cup 220.

[0037] The honeycomb valve core 222 is fixed to the inner cavity of the outer frame 221, the porous panel 223 is fixed to the top of the outer frame 221, the pressure relief valve 224 is connected to the inner cavity of the outer frame 221, and the solenoid valve 225 is installed at the air inlet.

[0038] like Figures 3 to 5 When the vacuum pump 211 is working, a negative pressure is formed at the air inlet of the vacuum suction cup 220 through the connecting pipe 214, air filter 212, pressure regulating valve 213 and negative pressure pipe 215. The flexible printed circuit board is placed on the porous panel 223 in the vacuum suction cup 220. The honeycomb valve core 222 can make the negative pressure evenly distributed, thereby firmly adsorbing the flexible printed circuit board on the porous panel 223 and effectively preventing it from being displaced when the hydraulic cylinder vibrates.

[0039] In use, the pressing chamber 112 of the body 111 provides space for pressing flexible printed circuit boards, the hydraulic chamber 113 is used to install the hydraulic components 120, and the equipment chamber 114 is used to install equipment such as the vacuum pump 211, the air filter 212, and the pressure regulating valve 213.

[0040] After the vacuum pump 211 is started, gas is drawn through the connecting pipe 214. The air filter 212 filters the drawn vacuum gas to remove impurities. The pressure regulating valve 213 adjusts the gas pressure. Then, the gas at the appropriate pressure is delivered to the vacuum suction cup 220 through the negative pressure pipe 215. The negative pressure pipe 215 is connected to the air inlet of the vacuum suction cup 220. The solenoid valve 225 controls the gas flow. When the solenoid valve 225 is opened, the gas enters the inner cavity of the outer frame 221. The honeycomb valve core 222 helps to evenly disperse the gas. A flexible printed circuit board is placed on the porous panel 223. Under the action of vacuum, the flexible printed circuit board is adsorbed and fixed on the porous panel 223 to prevent displacement during the pressing process. When it is necessary to release the fixation, the pressure relief valve 224 is opened to connect the inner cavity of the outer frame 221 with the outside world and release the vacuum adsorption.

[0041] After the hydraulic cylinder 121 is started, the output end pushes the top plate 123 to slide along the guide post 124 in the guide sleeve 125, providing stable power and guidance for pressing. The bottom plate 122 is used to support the vacuum suction cup 220. The top plate 123 moves downward to drive the upper mold plate 130 to approach the flexible printed circuit board. The heater 132 generates heat, which is transferred to the flexible printed circuit board through the heat conduction plate 133. At the same time, the heat conduction plate 133 performs the pressing operation on the flexible printed circuit board.

[0042] The foregoing description of specific exemplary embodiments of the present invention is for illustrative and explanatory purposes. These descriptions are not intended to limit the present invention to the precise forms disclosed, and it is obvious that many changes and variations can be made based on the above teachings. Although embodiments of the present invention have been shown and described, these specific embodiments are merely explanations of the present invention and are not intended to limit the invention. The specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. The purpose of selecting and describing exemplary embodiments is to explain the specific principles of the present invention and its practical application, so that those skilled in the art, after reading this specification, can make modifications, substitutions, variations, and various choices and changes to the embodiments as needed without departing from the principles and spirit of the present invention, provided that such modifications, substitutions, variations, and choices and changes are within the scope of the claims of the present invention and are protected by patent law.

Claims

1. A flexible printed circuit board processing device for preventing displacement, characterized in that: include, The pressing mechanism (100) includes a body assembly (110) for providing equipment mounting space and flexible printed circuit board pressing space, a hydraulic assembly (120) for providing pressing power, and an upper mold plate (130) for pressing. The adsorption mechanism (200) includes a vacuum assembly (210) for providing a vacuum and a vacuum suction cup (220) for carrying a flexible printed circuit board. The vacuum assembly (210) includes a vacuum pump (211), an air filter (212) for filtering vacuum gas, a pressure regulating valve (213) for regulating gas pressure, a connecting pipe (214) for connecting the vacuum pump (211) and the air filter (212), and a negative pressure pipe (215) for connecting the pressure regulating valve (213) and the vacuum suction cup (220). The vacuum suction cup (220) includes an outer frame (221), a honeycomb valve core (222) installed in the inner cavity of the outer frame (221), a perforated panel (223) installed on the top of the outer frame (221) and used to place a flexible printed circuit board, a pressure relief valve (224) for releasing the fixed pressure, and a solenoid valve (225) for controlling the flow of gas.

2. A device for processing a flexible printed circuit board against displacement according to claim 1, characterized in that: The fuselage assembly (110) includes a body (111), a pressing chamber (112) located in the middle of the body (111), a hydraulic chamber (113) located in the upper part of the body (111), and an equipment chamber (114) located in the lower part of the body (111).

3. A device for processing a flexible printed circuit board against displacement according to claim 2, characterized in that: The hydraulic assembly (120) includes a hydraulic cylinder (121) fixed to the inner cavity of the hydraulic chamber (113), a base plate (122) for supporting the vacuum suction cup (220), a top plate (123) located at the upper end of the inner cavity of the pressing chamber (112), and a guide post (124) and a guide sleeve (125) for guiding the top plate (123). The output end of the hydraulic cylinder (121) extends through the inner cavity of the pressing chamber (112) and is fixedly connected to the top plate (123).

4. The flexible printed circuit board processing device for preventing displacement according to claim 3, characterized in that: The bottom plate (122) is fixedly connected to the bottom of the inner cavity of the pressing chamber (112), the upper mold plate (130) is fixed to the bottom of the top plate (123), four guide pillars (124) are provided and fixed around the top of the bottom plate (122) respectively, four guide sleeves (125) are provided and fixed around the top of the top plate (123) respectively, and one end of the guide pillar (124) away from the bottom plate (122) passes through the top plate (123) and the guide sleeve (125) and slides in connection with the inner cavity of the guide sleeve (125).

5. A device for processing a flexible printed circuit board against displacement according to claim 3, wherein: The upper molding plate (130) includes a frame (131) fixed to the bottom of the base plate (122), a heater (132) fixed to the inner cavity of the frame (131) for providing heat, a heat-conducting plate (133) fixed to the bottom of the frame (131) for pressing the flexible printed circuit board and transferring heat, and a heat insulation plate (134) fixed to the top of the heater (132) for heat insulation.

6. A device for processing a flexible printed circuit board that prevents displacement according to claim 1, wherein: The vacuum pump (211), air filter (212) and pressure regulating valve (213) are all fixed in the inner cavity of the equipment chamber (114). One end of the connecting pipe (214) is connected to the outlet of the vacuum pump (211), and the other end of the connecting pipe (214) is connected to the inlet of the air filter (212).

7. The flexible printed circuit board processing device for preventing displacement according to claim 1, characterized in that: The outlet of the air filter (212) is connected to the inlet of the pressure regulating valve (213), the outlet of the pressure regulating valve (213) is connected to one end of the negative pressure pipe (215), and the other end of the negative pressure pipe (215) is connected to the air inlet of the vacuum suction cup (220).

8. A device for processing a flexible printed circuit board that prevents displacement according to claim 1, wherein: The honeycomb valve core (222) is fixed to the inner cavity of the outer frame (221), the porous panel (223) is fixed to the top of the outer frame (221), the pressure relief valve (224) is connected to the inner cavity of the outer frame (221), and the solenoid valve (225) is installed at the air inlet.

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