PCB soft board film tearing and pre-pasting machine

Abstract

This utility model discloses a PCB flexible board film peeling and pre-attaching machine. Through the coordinated arrangement of two sets of flexible board loading mechanisms, two sets of robotic arm mechanisms, two sets of film peeling mechanisms, a chip conveying mechanism, a flexible board placement mechanism, and a flexible board pre-attaching mechanism, the flexible board loading mechanism feeds the flexible board with film paper. The chip conveying mechanism conveys the fixture with the chip board to a preset position. The robotic arm mechanism picks up the flexible board with film paper and moves it to the film peeling mechanism. After film peeling, the film-peeled flexible board is placed on the flexible board placement mechanism. The flexible board pre-attaching mechanism moves the fixture with the chip board to a limiting bracket, picks up the flexible board, and attaches it to the chip board. The entire flexible board film peeling and pre-attaching process is automatically completed by the equipment, improving processing efficiency and saving labor costs.

Description

Technical Field

[0001] This utility model relates to the technical field of PCB flexible board processing, specifically a PCB flexible board film peeling and pre-applying machine. Background Technology

[0002] Flexible printed circuit boards (FPCs) are bendable and foldable circuit boards made of flexible substrates (such as polyimide (PI) or polyester (PET). Unlike traditional rigid PCBs, they are thin, lightweight, dynamically bendable, and adaptable to complex spatial layouts, making them widely used in electronic devices that require high flexibility.

[0003] Currently, when pre-attaching flexible PCBs to chip boards, it is necessary to manually peel off the protective film from the flexible PCB and then manually attach the flexible PCB to the chip board. This results in low pre-attachment efficiency and increases labor costs. Utility Model Content

[0004] Therefore, it is necessary to provide a PCB flexible board film peeling and pre-attaching machine. This solves the problem mentioned in the background art, where the pre-attachment process of PCB flexible boards onto the chip board requires manual completion, resulting in low pre-attachment efficiency.

[0005] This application provides a PCB flexible board film peeling and pre-attaching machine, including a machine base, two sets of flexible board loading mechanisms, two sets of robotic arm mechanisms, two sets of film peeling mechanisms, a chip conveying mechanism, two sets of flexible board placement mechanisms, and a flexible board pre-attaching mechanism. The chip conveying mechanisms are installed in the middle of the machine base and are used to convey the chip boards to be attached to the flexible boards. The two sets of robotic arm mechanisms are symmetrically arranged on the machine base with the chip conveying mechanism as the axis of symmetry. The two sets of flexible board loading mechanisms are installed on the machine base and are correspondingly arranged with respect to the two sets of robotic arm mechanisms. The two sets of film peeling mechanisms are respectively installed on the side of the machine base near the flexible board loading mechanism. The flexible board placement mechanism is installed on one side of the chip conveying mechanism and is used to drive the flexible boards after film peeling to reciprocate. The flexible board pre-attaching mechanism is installed on the end of the machine base near the flexible board placement mechanism and is used to adsorb the chip boards with fixtures onto the limiting bracket and attach the flexible boards to the chip boards.

[0006] In one embodiment, the flexible board loading mechanism includes a placement platform with multiple flexible board placement slots.

[0007] In one embodiment, the robotic arm mechanism includes a robotic arm and an adsorption component. The robotic arm is mounted on the machine base, and the adsorption component is mounted on the robotic arm. The adsorption component is used to adsorb flexible plates.

[0008] In one embodiment, the adsorption assembly includes a first cylinder and a first suction nozzle, the first cylinder being mounted on the robotic arm and the first suction nozzle being mounted on the first cylinder.

[0009] In one embodiment, the film-tearing mechanism includes a flexible board placement platform, a barcode scanner, a film-tearing assembly, and a film paper recycling assembly. The flexible board placement platform and the film paper recycling assembly are respectively installed on the machine base. The barcode scanner is installed at the bottom of the flexible board placement platform and is used to scan whether there is a flexible board to be peeled on the flexible board placement platform. The film-tearing assembly is installed on the film paper recycling assembly and is used to peel off the film paper at the bottom of the flexible board.

[0010] In one embodiment, the film-tearing assembly includes a rotary cylinder, a finger cylinder mounting base, and a plurality of finger cylinders. The rotary cylinder is mounted on the film paper recycling assembly, the finger cylinder mounting base is mounted on the rotary cylinder, and the plurality of finger cylinders are sequentially mounted on the finger cylinder mounting base.

[0011] In one embodiment, the membrane paper recycling assembly includes a membrane paper placement slot, a membrane suction device, and a membrane paper collection bag. The membrane paper placement slot is installed on the machine base, and the membrane suction device is connected to the membrane paper placement slot and the membrane paper collection bag at both ends, respectively. The membrane suction device is used to absorb the membrane paper from the membrane paper placement slot into the membrane paper collection bag.

[0012] In one embodiment, the flexible circuit board placement mechanism includes a mounting bracket, a first motor, a first slide rail, a first slider, and a flexible circuit board placement plate. The mounting bracket is mounted on one end of the chip transfer mechanism. The first motor and the first slide rail are respectively mounted on the mounting bracket. The first slider is driven by the first motor to slide back and forth on the first slide rail. The flexible circuit board placement plate is mounted on the first slider. The flexible circuit board placement plate has a plurality of flexible circuit board placement slots for placing flexible circuit boards after film removal.

[0013] In one embodiment, the flexible circuit board pre-attachment mechanism includes a bracket, a first X-axis assembly, a first Y-axis assembly, a first ZR-axis assembly, a second nozzle, a second X-axis assembly, a second Y-axis assembly, a second ZR-axis assembly, and a third nozzle. The first Y-axis assembly and the second Y-axis assembly are respectively mounted on the bracket. The first X-axis assembly is mounted on the first Y-axis assembly. The first ZR-axis assembly is mounted on the first X-axis assembly. The second nozzle is mounted on the first ZR-axis assembly. The second X-axis assembly is mounted on the second Y-axis assembly. The second ZR-axis assembly is mounted on the second X-axis assembly. The third nozzle is mounted on the second ZR-axis assembly.

[0014] In one embodiment, the first ZR axis assembly has a first vision unit and the second ZR axis assembly has a second vision unit, the first vision unit and the second vision unit being used to determine the position of the flexible plate after the film is peeled off.

[0015] The aforementioned PCB flexible board film peeling and pre-attaching machine, through the coordinated arrangement of two sets of flexible board loading mechanisms, two sets of robotic arm mechanisms, two sets of film peeling mechanisms, a chip conveying mechanism, a flexible board placement mechanism, and a flexible board pre-attaching mechanism, achieves the following: The flexible board loading mechanism loads the flexible board with film paper, the chip conveying mechanism conveys the fixture with chip board to a preset position, the robotic arm mechanism picks up the flexible board with film paper and moves it to the film peeling mechanism to complete the film peeling, and then places the film-peeled flexible board on the flexible board placement mechanism. The flexible board pre-attaching mechanism moves the fixture with chip board to a limiting bracket, picks up the flexible board and attaches it to the chip board. The entire flexible board film peeling and pre-attaching process is automatically completed by the equipment, improving processing efficiency and saving labor costs. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the structure of a PCB flexible board film peeling and pre-applying machine according to an embodiment of the present invention; Figure 2 for Figure 1 A schematic diagram of the robotic arm mechanism of a PCB flexible board film peeling and pre-applying machine according to an embodiment of this utility model; Figure 3 for Figure 1 A schematic diagram of the film-removing mechanism of a PCB flexible board film-removing and pre-applying machine according to an embodiment of the present invention; Figure 4 for Figure 1 A schematic diagram of the flexible board placement mechanism of a PCB flexible board film peeling and pre-applying machine according to an embodiment of the present invention; Figure 5 for Figure 1 A schematic diagram of the flexible board pre-attaching mechanism of a PCB flexible board film peeling and pre-attaching machine according to an embodiment of the present invention; Figure 6 for Figure 5 A schematic diagram of the structure of the first ZR axis assembly of a PCB flexible board film peeling and pre-applying machine according to an embodiment of the present invention; Figure 7 for Figure 5 A schematic diagram of the structure of the second ZR axis assembly of a PCB flexible board film peeling and pre-applying machine according to an embodiment of this utility model. Detailed Implementation

[0017] To make the above-mentioned objects, features, and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a full understanding of this utility model. However, this utility model can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this utility model. Therefore, this utility model is not limited to the specific embodiments disclosed below.

[0018] It should be noted that when a component is considered to be "connected" to another component, it can be directly connected to the other component or there may be an intermediary component present. Conversely, when a component is said to be "directly" connected to another component, there is no intermediary component.

[0019] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0020] like Figure 1 As shown, a PCB flexible board film peeling and pre-attaching machine includes a machine base 1, two sets of flexible board loading mechanisms 2, two sets of robotic arm mechanisms 3, two sets of film peeling mechanisms 4, a chip conveying mechanism 5, two sets of flexible board placement mechanisms 6, and a flexible board pre-attaching mechanism 7. The chip conveying mechanism 5 is installed in the middle of the machine base 1 and is used to convey the chip board to be attached to the flexible board. The two sets of robotic arm mechanisms 3 are symmetrically arranged on the machine base 1 with the chip conveying mechanism 5 as the axis of symmetry. The two sets of flexible board loading mechanisms 2 are installed on the machine base 1 and are correspondingly arranged with the two sets of robotic arm mechanisms 3. The two sets of film peeling mechanisms 4 are respectively installed on the side of the machine base 1 near the flexible board loading mechanism 2. The flexible board placement mechanism 6 is installed on one side of the chip conveying mechanism 5 and is used to drive the flexible board after film peeling to move back and forth. The flexible board pre-attaching mechanism 7 is installed on the end of the machine base 1 near the flexible board placement mechanism 6 and is used to adsorb the chip board with the fixture onto the limiting bracket 8 and attach the flexible board to the chip.

[0021] The flexible board loading mechanism 2 includes a placement platform 21 with multiple flexible board placement slots. The robotic arm mechanism 3 includes a robotic arm 31 and an adsorption component 32. The robotic arm 31 is mounted on the machine base 1, and the adsorption component 32 is mounted on the robotic arm 31. The adsorption component 32 is used to adsorb flexible boards. The adsorption component 32 includes a first cylinder 321 and a first suction nozzle 322. The first cylinder 321 is mounted on the robotic arm 31, and the first suction nozzle 322 is mounted on the first cylinder 321.

[0022] like Figure 2 As shown, when the PCB flexible board needs to have its film removed and be pre-attached to the chip board, the flexible board with the film paper is placed manually or by machine into multiple flexible board placement slots on the placement platform 21. The robot arm 31 controls the first cylinder 321 and the first suction nozzle 322 to move to a preset position. The first cylinder 321 controls the first suction nozzle 322 to move towards the flexible board with the film paper, adsorbing the flexible board with the film paper. The robot arm 31 moves the flexible board with the film paper to the film removal mechanism 4. At the same time, the chip conveying mechanism 5 conveys the chip board to be attached to the chip board to the preset position and stops conveying. After the film removal mechanism 4 removes the bottom film paper of the flexible board with the film paper, the robot arm 3 places the flexible board with the film paper removed on the flexible board placement mechanism 6. The flexible board pre-attachment mechanism 7 adsorbs the chip board with the fixture onto the limiting bracket 8 for fixation. Then, the flexible board pre-attachment mechanism 7 adsorbs the flexible board with the film paper removed and pre-attaches it to the chip board.

[0023] In this way, a PCB flexible board film peeling and pre-attaching machine is set up with two sets of flexible board loading mechanisms 2, two sets of robotic arm mechanisms 3, two sets of film peeling mechanisms 4, a chip conveying mechanism 5, a flexible board placement mechanism 6, and a flexible board pre-attaching mechanism 7. The flexible board loading mechanism 2 loads the flexible board with film paper, the chip conveying mechanism 5 conveys the fixture with chip board to the preset position, the robotic arm mechanism 3 picks up the flexible board with film paper and moves it to the film peeling mechanism 4 to complete the film peeling, and then places the film-peeled flexible board on the flexible board placement mechanism 6. The flexible board pre-attaching mechanism 7 moves the fixture with chip board to the limiting bracket 8, picks up the flexible board and attaches it to the chip board. The entire flexible board film peeling and pre-attaching process is completed automatically by the equipment, which improves processing efficiency and saves labor costs.

[0024] like Figure 3 As shown, in one embodiment, the film-tearing mechanism 4 includes a flexible board placement platform 41, a barcode scanner 42, a film-tearing assembly 43, and a film paper recycling assembly 44. The flexible board placement platform 41 and the film paper recycling assembly 44 are respectively installed on the machine base 1. The barcode scanner 42 is installed at the bottom of the flexible board placement platform 41 and is used to scan whether there is a flexible board 9 to be peeled on the flexible board placement platform 41. The film-tearing assembly 43 is installed on the film paper recycling assembly 44 and is used to peel off the film paper at the bottom of the flexible board.

[0025] In one embodiment, the film-tearing assembly 43 includes a rotary cylinder 431, a finger cylinder mounting base 432, and a plurality of finger cylinders 433. The rotary cylinder 431 is mounted on the film paper recycling assembly 44, the finger cylinder mounting base 432 is mounted on the rotary cylinder 431, and the plurality of finger cylinders 433 are sequentially mounted on the finger cylinder mounting base 432.

[0026] Several finger cylinders 433 can be equidistantly arranged on the finger cylinder mounting base 432. When it is necessary to peel the film off the flexible board, the robotic arm mechanism 3 moves the flexible board with the film paper to a preset position on the flexible board placement table 41. The barcode scanner 42 scans the flexible board 9 with the film to be peeled on the flexible board placement table 41 and sends a signal to the control module of the rotary cylinder 431. The control module is a microcontroller. The rotary cylinder 431 drives several finger cylinders 433 to rotate to the preset position through the finger cylinder mounting base 432. The finger cylinders 433 move towards the film paper of the flexible board and clamp the film paper. The rotary cylinder 431 drives several finger cylinders 433 to rotate in the preset direction through the finger cylinder mounting base 432, tearing the film paper off from the bottom of the flexible board and quickly completing the peeling of the flexible board.

[0027] In one embodiment, the membrane paper recycling assembly 44 includes a membrane paper placement slot 441, a membrane suction device 442, and a membrane paper collection bag 443. The membrane paper placement slot 441 is installed on the machine base 1. The membrane suction device 442 is connected to the membrane paper placement slot 441 and the membrane paper collection bag 443 at both ends, respectively. The membrane suction device 442 is used to suction the membrane paper from the membrane paper placement slot 441 into the membrane paper collection bag 443.

[0028] The membrane paper placement slot 441 has a funnel-shaped structure. The membrane paper held by several finger cylinders 433 is placed in the membrane paper placement slot 441 during the rotation process. At this time, the membrane suction device 442 is activated, and the membrane suction device 442 adsorbs the membrane paper into the membrane paper collection bag 443, avoiding the membrane paper from being thrown away and making it more environmentally friendly.

[0029] like Figure 4 As shown, in one embodiment, the flexible circuit board placement mechanism 6 includes a mounting bracket 61, a first motor 62, a first slide rail 63, a first slider 64, and a flexible circuit board placement plate 65. The mounting bracket 61 is mounted on one end of the chip transfer mechanism 5. The first motor 62 and the first slide rail 63 are respectively mounted on the mounting bracket 61. The first slider 64 is driven by the first motor 62 to slide back and forth on the first slide rail 63. The flexible circuit board placement plate 65 is mounted on the first slider 64. The flexible circuit board placement plate 65 has a plurality of flexible circuit board placement slots 651 for placing flexible circuit boards after film removal.

[0030] In this way, the first motor 62 can control the first slider 64 to reciprocate on the first slide rail 63 through the lead screw. One end of the first slider 64 is fixedly connected to the lead screw. When the first motor 62 rotates forward or in reverse, it drives the lead screw to rotate. The lead screw drives the first slider 64 to move closer to or away from the motor. When the flexible board placement plate 65 with the flexible board is close to the flexible board pre-applying mechanism 7, the flexible board pre-applying mechanism 7 can adsorb the software after the film has been peeled off for pre-applying.

[0031] like Figure 5 As shown, in one embodiment, the flexible circuit board pre-attachment mechanism 7 includes a bracket 71, a first X-axis assembly 72, a first Y-axis assembly 73, a first ZR-axis assembly 74, a second nozzle 75, a second X-axis assembly 76, a second Y-axis assembly 77, a second ZR-axis assembly 78, and a third nozzle 79. The first Y-axis assembly 73 and the second Y-axis assembly 77 are respectively mounted on the bracket 71. The first X-axis assembly 72 is mounted on the first Y-axis assembly 73. The first ZR-axis assembly 74 is mounted on the first X-axis assembly 72. The second nozzle 75 is mounted on the first ZR-axis assembly 74. The second X-axis assembly 76 is mounted on the second Y-axis assembly 77. The second ZR-axis assembly 78 is mounted on the second X-axis assembly 76. The third nozzle 79 is mounted on the second ZR-axis assembly 78.

[0032] like Figure 6 and Figure 7As shown, in one embodiment, the first ZR axis assembly 74 has a first vision unit 741, and the second ZR axis assembly 78 has a second vision unit 781. The first vision unit 741 and the second vision unit 781 are used to determine the position of the flexible board after the film is peeled off. The first ZR axis assembly 74 is used to control the second suction nozzle 75 to move vertically and rotate, and the second ZR axis assembly 78 is used to control the third suction nozzle 79 to move vertically and rotate. When the flexible board needs to be pre-attached, the first X-axis assembly 72, the first Y-axis assembly 73, and the first ZR axis assembly 74 control the second suction nozzle 75 to move to a preset position to adsorb the chip board with the fixture onto the limiting bracket 8. Then, the first X-axis assembly 72, the first Y-axis assembly 73, and the first ZR axis assembly 74 control the second suction nozzle 75 to move to the preset position. After the position of the flexible board is determined by the first vision unit 741, the flexible board is adsorbed and pre-attached to the chip board by the second suction nozzle 75. Simultaneously, the second X-axis assembly 76, the second Y-axis assembly 77, and the second ZR-axis assembly 78 control the third suction nozzle 79 to move to a preset position to adsorb the chip board with the fixture onto the limiting bracket 8. Then, the second X-axis assembly 76, the second Y-axis assembly 77, and the second ZR-axis assembly 78 control the third suction nozzle 79 to move to the preset position. After the second vision unit 781 determines the position of the flexible circuit board, the third suction nozzle 79 picks up the flexible circuit board and pre-attaches it to the chip board. This allows for the simultaneous pre-attachment of two flexible circuit boards, making the pre-attachment process more efficient.

[0033] The embodiments described above are merely illustrative of several implementations of this utility model, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

Claims

1. A PCB soft board film tearing and pre-pasting machine, characterized in that: The system includes a machine base, two sets of flexible circuit board (FCB) loading mechanisms, two sets of robotic arm mechanisms, two sets of film-removing mechanisms, a chip transfer mechanism, two sets of FCB placement mechanisms, and a FCB pre-attachment mechanism. The chip transfer mechanisms are installed in the middle of the machine base and are used to transfer the chip boards to be attached to the FCBs. The two sets of robotic arm mechanisms are symmetrically arranged on the machine base with the chip transfer mechanism as the axis of symmetry. The two sets of FCB loading mechanisms are installed on the machine base and are corresponding to the two sets of robotic arm mechanisms. The two sets of film-removing mechanisms are respectively installed on the side of the machine base near the FCB loading mechanism. The FCB placement mechanism is installed on one side of the chip transfer mechanism and is used to drive the FCBs after film removal to reciprocate. The FCB pre-attachment mechanism is installed on the end of the machine base near the FCB placement mechanism and is used to adsorb the chip boards with fixtures onto the limiting bracket and attach the FCBs to the chip boards.

2. The PCB soft board film tearing and pre-pasting machine according to claim 1, characterized in that: The flexible board loading mechanism includes a placement platform, on which multiple flexible board placement slots are provided.

3. A PCB flexible board film peeling and pre-applying machine according to claim 1, characterized in that: The robotic arm mechanism includes a robotic arm and an adsorption component. The robotic arm is mounted on the machine base, and the adsorption component is mounted on the robotic arm. The adsorption component is used to adsorb flexible plates.

4. The PCB soft board film tearing and pre-pasting machine according to claim 3, characterized in that: The adsorption assembly includes a first cylinder and a first suction nozzle. The first cylinder is mounted on the robotic arm, and the first suction nozzle is mounted on the first cylinder.

5. The PCB soft board film tearing and pre-pasting machine according to claim 1, characterized in that: The film-tearing mechanism includes a flexible board placement platform, a barcode scanner, a film-tearing assembly, and a film paper recycling assembly. The flexible board placement platform and the film paper recycling assembly are respectively installed on the machine base. The barcode scanner is installed at the bottom of the flexible board placement platform and is used to scan whether there is a flexible board to be peeled on the flexible board placement platform. The film-tearing assembly is installed on the film paper recycling assembly and is used to peel off the film paper at the bottom of the flexible board.

6. The PCB soft board film tearing and pre-pasting machine according to claim 5, characterized in that: The film-tearing assembly includes a rotary cylinder, a finger cylinder mounting base, and a plurality of finger cylinders. The rotary cylinder is mounted on the film paper recycling assembly, the finger cylinder mounting base is mounted on the rotary cylinder, and the plurality of finger cylinders are sequentially mounted on the finger cylinder mounting base.

7. The PCB soft board film tearing and pre-pasting machine according to claim 6, characterized in that: The membrane paper recycling assembly includes a membrane paper placement slot, a membrane suction device, and a membrane paper collection bag. The membrane paper placement slot is installed on the machine base. The membrane suction device is connected to the membrane paper placement slot and the membrane paper collection bag at both ends, respectively. The membrane suction device is used to suction the membrane paper from the membrane paper placement slot into the membrane paper collection bag.

8. The PCB soft board film tearing and pre-pasting machine according to claim 6, characterized in that: The flexible circuit board placement mechanism includes a mounting bracket, a first motor, a first slide rail, a first slider, and a flexible circuit board placement plate. The mounting bracket is installed at one end of the chip transfer mechanism. The first motor and the first slide rail are respectively installed on the mounting bracket. The first slider is driven by the first motor to slide back and forth on the first slide rail. The flexible circuit board placement plate is installed on the first slider. The flexible circuit board placement plate has a plurality of flexible circuit board placement slots for placing flexible circuit boards after film removal.

9. The PCB soft board film tearing and pre-pasting machine according to claim 6, characterized in that: The flexible circuit board pre-attachment mechanism includes a bracket, a first X-axis assembly, a first Y-axis assembly, a first ZR-axis assembly, a second nozzle, a second X-axis assembly, a second Y-axis assembly, a second ZR-axis assembly, and a third nozzle. The first Y-axis assembly and the second Y-axis assembly are respectively mounted on the bracket. The first X-axis assembly is mounted on the first Y-axis assembly. The first ZR-axis assembly is mounted on the first X-axis assembly. The second nozzle is mounted on the first ZR-axis assembly. The second X-axis assembly is mounted on the second Y-axis assembly. The second ZR-axis assembly is mounted on the second X-axis assembly. The third nozzle is mounted on the second ZR-axis assembly.

10. The PCB soft board film tearing and pre-pasting machine according to claim 9, characterized in that: The first ZR axis assembly has a first vision unit, and the second ZR axis assembly has a second vision unit. The first vision unit and the second vision unit are used to determine the position of the flexible plate after the film is peeled off.

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