An anti-interference electronic package shell

Abstract

This invention provides an anti-interference electronic packaging shell. A positioning groove is provided at the lower part of the sealed cavity. This design is used to stably install the anti-interference module. The anti-interference module is located in the positioning groove and inside the sealed cavity. The anti-interference module is completely attached to the circuit board body. Its inner surface is milled with honeycomb heat dissipation channels to help dissipate heat. The anti-interference module and the packaging shell are sealed to form an anti-interference cavity. The cavity is filled with nitrogen to reduce electromagnetic interference. The anti-interference module has a 0.8mm thick anti-interference absorbing layer along its inner wall. This absorbing layer adopts a gradient composite structure design using plasma spraying process and is coated with a ferrite absorbing layer to enhance its anti-interference performance.

Description

Technical Field

[0001] This utility model relates to the field of electronic housing technology, and in particular to an anti-interference electronic packaging housing. Background Technology

[0002] Currently, electronic packaging housings play a crucial role in electronic devices, needing not only to protect internal electronic components but also to possess excellent heat dissipation and anti-interference capabilities. However, traditional electronic packaging housings have many shortcomings in terms of anti-interference, such as susceptibility to external electromagnetic interference, leading to performance degradation or even damage to electronic devices. Therefore, there is an urgent need in the market for a new type of anti-interference electronic packaging housing to solve the problems existing in current technologies. Summary of the Invention

[0003] The purpose of this invention is to provide an anti-interference electronic packaging housing, which can significantly improve the anti-interference performance of the electronic packaging housing.

[0004] This utility model provides an anti-interference electronic packaging shell, comprising: The encapsulation housing has a sealed cavity inside, and a positioning groove is provided at the lower part of the sealed cavity; A retainer is fixedly disposed within a sealed cavity. A circuit board body is fixedly disposed on the retainer. The electronic connecting claws of the circuit board body extend out of the packaging shell. An anti-interference module is covered along the positioning groove and located within the sealed cavity. The anti-interference module is completely fastened to the circuit board body. The anti-interference module and the packaging shell are sealed to form an anti-interference cavity. An anti-interference absorbing layer is disposed along the inner wall of the anti-interference module. The anti-interference absorbing layer is coated with a ferrite absorbing layer.

[0005] As a further optimization, thermal grease is applied to both sides of the circuit board body. On one side, the thermal grease is placed between the circuit board body and the retainer, and on the other side, the thermal grease is placed between the circuit board body and the anti-interference module. The anti-interference module and the retainer are both in close contact with the thermal grease.

[0006] As a further optimization, a plurality of first heat dissipation fins are evenly arranged at the bottom of the cage, and the first heat dissipation fins extend out of the encapsulation housing.

[0007] As a further optimization, the anti-interference module is provided with multiple second heat dissipation fins that extend out of the encapsulation housing.

[0008] As a further optimization, the electronic connector claws of the circuit board body are plated with a gold plating layer.

[0009] As a further optimization, the outer surface of the packaging shell is provided with a nanoscale electromagnetic shielding coating.

[0010] As a further optimization, an electrical sealing strip is provided at the junction of the sealing cavity and the anti-interference module.

[0011] As a further optimization, the lower contour of the anti-interference module is inserted into the positioning slot.

[0012] As a further optimization, both the first and second heat dissipation fins are provided with dovetail-shaped flared structures at their ends.

[0013] As a further optimization, the sidewall of the encapsulation housing is provided with a multi-layer electromagnetic shielding structure.

[0014] This utility model provides an anti-interference electronic packaging shell through improvements, which has the following improvements and advantages compared with the prior art: Its structural design is more rational, which can significantly improve the anti-interference performance of the electronic packaging shell. Through the setting of anti-interference modules and anti-interference absorbing layers, external electromagnetic interference is effectively shielded, ensuring the stable operation of internal electronic components. Attached Figure Description

[0015] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0016] Figure 1 This is a schematic diagram of the main cross-sectional structure of this utility model; Figure 2 This is a schematic diagram of the right sectional view of the present invention; Figure 3 This is a three-dimensional cross-sectional view of the packaging shell of this utility model; Figure 4 This is a three-dimensional structural diagram of the present invention; Explanation of reference numerals in the attached figures: 100 - Encapsulation housing; 101 - Sealed cavity; 102 - Positioning groove; 200-Cage; 201-Circuit board body; 202-Anti-interference module; 203-Anti-interference cavity; 204-Anti-interference absorbing layer; 205-Thermal conductive grease; 206-First heat dissipation fin; 207-Second heat dissipation fin. Detailed Implementation

[0017] The technical solution of this utility model will be clearly and completely described below with reference to the embodiments. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0018] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0019] In the description of this utility model, it should be understood that the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the stated features. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified. Furthermore, the terms "installed," "connected," and "linked" should be interpreted broadly; for example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0020] Please see Figure 1-4 The present invention provides a technical solution: an anti-interference electronic packaging shell comprising: The encapsulation housing 100 has a sealed cavity 101 inside. The sealed cavity 101 isolates dust to ensure the stable operation of the electronic device. A positioning groove 102 is provided at the bottom inside the sealed cavity 101. The positioning groove 102 is used to stably install the anti-interference module 202. A retainer 200 is fixedly disposed within the sealed cavity 101. A circuit board body 201 is fixedly mounted on the retainer 200. The retainer 200 serves as a support for the circuit board body 201, securing it within the encapsulation housing 1. Electronic connection claws of the circuit board body 201 extend out of the encapsulation housing 100 in an array. The ends of the claws are gold-plated to enhance conductivity. An anti-interference module 202 is mounted along the positioning groove 102 and within the sealed cavity 101. The anti-interference module 202 is completely secured to the circuit board body 201, and its inner surface is milled with honeycomb-shaped heat dissipation channels. The anti-interference module 202 and the encapsulation housing 100 are sealed to form an anti-interference cavity 203. The cavity is filled with nitrogen to reduce electromagnetic interference. An anti-interference absorbing layer 204 is provided along the inner wall of the anti-interference module 202. The anti-interference module 202 is provided with an anti-interference absorbing layer 204 with a thickness of 0.8 mm. The absorbing layer adopts a gradient composite structure design with plasma spraying process along the inner wall. The anti-interference absorbing layer 204 is coated with a ferrite absorbing layer. The body of the anti-interference module 202 is a beryllium copper material housing. This material has good conductivity and mechanical strength and can effectively protect the internal circuit board from external electromagnetic interference.

[0021] In some embodiments, both sides of the circuit board body 201 are coated with thermal grease 205 using a precision coating process. One side of the thermal grease 205 is disposed between the circuit board body 201 and the retainer 200, and the other side of the thermal grease 205 is disposed between the circuit board body 201 and the anti-interference module 202. The anti-interference module 202 and the retainer 200 are both in close contact with the thermal grease 205. In this way, the anti-interference module 202 and the retainer 200 are both in close contact with the thermal grease 205, forming a continuous thermally conductive medium layer. This design not only improves the heat dissipation efficiency of the circuit board, but also helps to enhance the performance of the anti-interference module 202, because good thermal management can reduce the heat generated by electronic components during operation, thereby improving their stability and reliability.

[0022] In some embodiments, a plurality of first heat dissipation fins 206 are evenly provided on the bottom of the retainer 200. The first heat dissipation fins 206 extend out of the encapsulation housing 100 to enhance the overall heat dissipation effect.

[0023] In some embodiments, a plurality of second heat dissipation fins 207 are uniformly arranged on the anti-interference module 202. The second heat dissipation fins 207 extend outside the packaging housing 100 to enhance the overall heat dissipation effect. The design of the first heat dissipation fins 206 and the second heat dissipation fins 207 not only increases the heat dissipation area, but also accelerates the dissipation of heat through air convection, ensuring the stability of the components inside the electronic packaging housing under long-term high-load operation.

[0024] In some embodiments, the electronic connector claws of the circuit board body 201 are plated with a gold plating layer. This gold plating layer not only improves the conductivity of the electronic connector claws, but also enhances their resistance to oxidation and corrosion, ensuring stable transmission of electronic signals and extending the service life of the electronic packaging shell.

[0025] In some embodiments, the outer surface of the packaging housing 100 is provided with a nano-level electromagnetic shielding coating. The shielding coating is formed by silver-nickel alloy microparticles through a plasma spraying process, which has excellent electromagnetic shielding performance and can effectively prevent external electromagnetic interference from affecting the internal circuitry of the electronic packaging housing.

[0026] In some embodiments, an electrical sealing strip is provided at the junction of the sealing cavity 101 and the anti-interference module 202 to ensure the sealing of the anti-interference cavity 203, prevent the intrusion of harmful substances such as external dust and moisture, and improve the protection level of the electronic packaging shell.

[0027] In some embodiments, the lower contour of the anti-interference module 202 is inserted into the positioning groove 102. This insertion method not only simplifies the installation process but also improves the stability of the anti-interference module 202, preventing it from shaking or falling off during operation.

[0028] In some embodiments, the ends of the first heat dissipation fin 206 and the second heat dissipation fin 207 are provided with a dovetail-shaped flared structure. This structure not only increases the heat dissipation area, but also improves the mechanical strength of the heat dissipation fin, preventing it from deforming or breaking during long-term use.

[0029] In some embodiments, the sidewalls of the packaging housing 100 are provided with a multi-layer electromagnetic shielding structure. This structure consists of alternating layers of copper mesh shielding and insulating dielectric layers, which further improves the electromagnetic shielding performance of the electronic packaging housing and ensures its stable operation in complex electromagnetic environments.

[0030] Working principle: The enclosure 100 has a sealed cavity 101, which is designed to isolate dust, thereby ensuring that the internal electronic equipment can operate in a stable environment. Inside the sealed cavity 101, at the bottom, a positioning groove 102 is provided, designed for the stable mounting of the anti-interference module 202.

[0031] An anti-interference module 202 is placed at the positioning groove 102, within the sealed cavity 101. This anti-interference module 202 is completely secured to the circuit board body 201, and its inner surface is milled with honeycomb-shaped heat dissipation channels to aid in heat dissipation. The anti-interference module 202 and the package housing 100 are sealed together to form an anti-interference cavity 203, which is filled with nitrogen gas to reduce electromagnetic interference.

[0032] An anti-interference module 202 has a 0.8mm thick anti-interference absorbing layer 204 along its inner wall. This absorbing layer adopts a gradient composite structure design using plasma spraying and is coated with a ferrite absorbing layer to enhance its anti-interference performance. The body of the anti-interference module 202 uses a beryllium copper material shell, which not only has good conductivity and mechanical strength, but also effectively protects the internal circuit board from external electromagnetic interference.

[0033] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this utility model.

Claims

1. An interference-resistant electronic package housing, characterized by, include: The encapsulation housing (100) has a sealing cavity (101) inside, and a positioning groove (102) is provided at the bottom inside the sealing cavity (101). A retainer (200) is fixedly disposed in a sealed cavity (101). A circuit board body (201) is fixedly disposed on the retainer (200). The electronic connection claws of the circuit board body (201) extend out of the package housing (100). An anti-interference module (202) is covered along the positioning groove (102) and located inside the sealed cavity (101). The anti-interference module (202) is completely fastened to the circuit board body (201). The anti-interference module (202) and the package housing (100) are sealed to form an anti-interference cavity (203). An anti-interference absorbing layer (204) is disposed along the inner wall of the anti-interference module (202). The anti-interference absorbing layer (204) is coated with a ferrite absorbing layer.

2. The tamper-resistant electronic package housing of claim 1, wherein, The circuit board body (201) is coated with thermal grease (205) on both sides. On one side, the thermal grease (205) is placed between the circuit board body (201) and the retainer (200), and on the other side, the thermal grease (205) is placed between the circuit board body (201) and the anti-interference module (202). The anti-interference module (202) and the retainer (200) are both in close contact with the thermal grease (205).

3. The tamper-resistant electronic package housing of claim 1, wherein, The bottom of the retainer (200) is provided with a plurality of first heat dissipation fins (206), which extend out of the encapsulation housing (100).

4. The tamper-resistant electronic package housing of claim 1, wherein, Multiple second heat dissipation fins (207) are evenly arranged on the anti-interference module (202), and the second heat dissipation fins (207) extend out of the encapsulation housing (100).

5. The tamper-resistant electronic package housing of claim 1, wherein, The electronic connector claws of the circuit board body (201) are plated with a gold plating layer.

6. The tamper-resistant electronic package housing of claim 1, wherein, The outer surface of the encapsulation housing (100) is provided with a nano-level electromagnetic shielding coating, which is formed by silver-nickel alloy microparticles through a plasma spraying process.

7. The tamper-resistant electronic package housing of claim 1, wherein, An electrical sealing strip is provided at the junction of the sealed cavity (101) and the anti-interference module (202).

8. The tamper-resistant electronic package housing of claim 1, wherein, The lower contour of the anti-interference module (202) is inserted into the positioning groove (102).

9. The tamper-resistant electronic package housing of claim 3 or 4, wherein, Both the first heat dissipation fin (206) and the second heat dissipation fin (207) are provided with a dovetail-shaped flared structure at their ends.

10. The tamper-resistant electronic package housing of claim 1, wherein, The sidewall of the encapsulation housing (100) is provided with a multi-layer electromagnetic shielding structure, which consists of alternating copper mesh shielding layers and insulating dielectric layers.

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