Shielded sealed electronic equipment heat sink
By employing a layered isolation structure and cooling fan design in the electronic device chassis, the contradiction between shielding and sealing performance and high power consumption heat dissipation is resolved, achieving efficient heat dissipation in a sealed environment and ensuring the reliability and protection of electronic devices.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- THE NAT RES INST OF RADIO SPECTRUM MANAGEMENT CO LTD
- Filing Date
- 2025-09-15
- Publication Date
- 2026-07-31
AI Technical Summary
Existing electronic device enclosures, while ensuring shielding and sealing performance, are unable to effectively meet the heat dissipation requirements of high-power electronic components. Traditional designs cannot balance heat dissipation efficiency and sealing protection.
The design adopts a layered isolation structure. The electronic equipment mounting plate is horizontally arranged inside the shell, which divides it into an upper electronic equipment mounting cavity and a lower isolated heat dissipation channel. The upper cover, front panel and upper half of the shell are combined to form a sealed electronic equipment mounting cavity. The lower cover and lower half of the shell form an independent heat dissipation channel. A cooling fan is installed at the air inlet of the heat dissipation channel, and heat is conducted in combination with copper heat pipes and a heat spreader.
While maintaining the shielding and sealing performance of the chassis, it achieves efficient heat dissipation, ensuring the heat dissipation needs of high-power electronic components inside and preventing the intrusion of external contaminants.
Smart Images
Figure CN224583472U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of electronic device chassis structure design technology, and more specifically, to a shielded and sealed electronic device heat dissipation chassis. Background Technology
[0002] Electronic equipment enclosures face harsh environmental challenges in fields such as communications and military. As equipment integration increases, the power consumption of internal electronic components rises significantly. However, the trend towards miniaturization limits the heat dissipation area of the enclosure, while harsh outdoor conditions such as dust and salt spray require the enclosure to maintain shielding and sealing. Traditional enclosure designs cannot simultaneously meet the demands of high-power heat dissipation and fully sealed protection, creating a common technological bottleneck in the industry. The conventional solution contains a fundamental contradiction: 1. Open-hole air-cooled chassis: Forced heat dissipation through fans but damages the chassis's shielding and sealing structure, leading to electromagnetic interference intrusion and dust and salt spray corrosion of components; 2. Fully sealed chassis: Relying on natural heat dissipation cannot meet the needs of high-power chips, and heat accumulation leads to a decrease in equipment reliability.
[0003] Existing technologies have always struggled to balance "heat dissipation efficiency" and "sealing protection".
[0004] In summary, the technical problem of effectively meeting the heat dissipation requirements of high-power electronic components inside electronic equipment while ensuring the shielding and sealing performance of the equipment chassis is an urgent issue that needs to be addressed. Utility Model Content
[0005] The main objective of this invention is to provide a shielded and sealed heat dissipation enclosure for electronic devices, in order to solve the technical problem of how to effectively meet the heat dissipation requirements of high-power electronic components inside the enclosure while ensuring the shielding and sealing performance of the enclosure. This achieves the goal of effectively solving the heat dissipation requirements of high-power electronic components while maintaining the overall shielding and sealing performance of the enclosure.
[0006] To achieve the above objectives, this utility model provides a shielded and sealed heat dissipation enclosure for electronic devices.
[0007] This utility model provides a shielded and sealed heat dissipation enclosure for electronic devices: The heat dissipation chassis includes a shell, a front panel, an upper cover, a lower cover, a heat spreader, and a cooling fan; The housing includes an electronic device mounting plate, which is horizontally disposed inside the housing and divides the interior of the housing into an upper electronic device mounting cavity and a lower isolated heat dissipation duct. The top cover plate is connected to the opening at the top of the housing, the front panel is connected to the opening at the front of the housing, and the heat spreader plate covers the opening on the electronic device mounting plate. The top cover plate, the front panel, the heat spreader plate and the upper part of the housing are combined to form a sealed electronic device mounting cavity. The lower cover plate seals the opening at the bottom of the housing, and the lower cover plate and the lower half of the housing are combined to form an independent heat dissipation duct; The cooling fan is located at the air inlet of the cooling duct.
[0008] Specifically, the housing also includes a front frame, a left upright plate, a right upright plate, and a rear upright plate; The electronic device mounting plate is arranged horizontally inside the housing. The left and right upright plates are respectively located on the left and right sides of the electronic device mounting plate. The front frame is located on the front side of the electronic device mounting plate, and the rear upright plate is located on the rear side of the electronic device mounting plate.
[0009] Specifically, the front of the electronic device mounting plate is provided with a heat-conducting protrusion structure, which corresponds to the position of the heat-generating element in the electronic device mounting cavity; the back of the electronic device mounting plate is provided with a heat dissipation fin structure; and the rear upright plate is provided with a heat dissipation air duct outlet.
[0010] Specifically, the front panel includes a liquid crystal display screen, a first conductive pad, an electromagnetic shielding glass, a second conductive pad, an electrical connector, and a metal pressure plate; The front panel is equipped with the electrical connector and the liquid crystal display screen; The LCD screen is provided with an electromagnetic shielding glass on the side near the front panel, and a first conductive pad and a second conductive pad are respectively provided on the left and right sides of the electromagnetic shielding glass. The first conductive pad is attached to the groove on the inner side of the front panel, and the electromagnetic shielding glass is placed between the first conductive pad and the second conductive pad, and is pressed against the inner side of the front panel by a metal pressure plate.
[0011] Specifically, a copper heat pipe is arranged on the heat spreader; a heat dissipation fin structure is provided on the back of the heat spreader; a thermal pad is connected to the front of the heat spreader, with one end of the thermal pad attached to the copper heat pipe and the other end attached to the high-power chip inside the electronic device mounting cavity.
[0012] Specifically, a shielding sealing gasket is embedded at the joint surface of the upper cover plate, front panel, heat spreader plate and the shell; a silicone rubber sealing ring is embedded at the joint surface of the lower cover plate and the shell.
[0013] Specifically, the heat dissipation chassis also includes electronic equipment, which includes a power control module, a temperature detector, a main control module, an RF module, and a timing module; the power control module, temperature detector, main control module, RF module, and timing module are disposed within the mounting cavity of the electronic equipment; the temperature detector is electrically connected to the power control module, and the power control module is electrically connected to the cooling fan.
[0014] Specifically, an air inlet dustproof net is provided at the air inlet of the heat dissipation duct; an air outlet dustproof net is provided at the air outlet of the heat dissipation duct.
[0015] Specifically, the electronic device mounting plate has a recessed cavity near the right upright plate, and the radio frequency module is located in the recessed cavity; a heat-conducting platform is provided on the inner side of the right upright plate, and a heat dissipation fin structure is provided on the outer side.
[0016] Specifically, the heat spreader is made of copper; the shell, upper cover, lower cover, and front panel are made of aluminum alloy.
[0017] This application provides a shielded and sealed electronic device heat dissipation chassis, which includes a shell, a front panel, an upper cover, a lower cover, a vapor chamber, and a cooling fan. An electronic device mounting plate is horizontally arranged inside the shell, dividing the interior into an upper electronic device mounting cavity and a lower isolated heat dissipation duct. The upper cover connects to the top opening of the shell, the front panel connects to the front opening of the shell, and the vapor chamber covers the opening on the electronic device mounting plate. These three components, together with the upper part of the shell, form a sealed electronic device mounting cavity, protecting the internal electronic devices from external interference. The lower cover covers the bottom opening of the shell, forming an independent heat dissipation duct with the lower part of the shell. The cooling fan is located at the air inlet of the heat dissipation duct, accelerating airflow to achieve heat dissipation. This heat dissipation chassis solves the technical challenge of ensuring the shielding and sealing performance of the chassis while meeting the heat dissipation requirements of high-power electronic components, effectively maintaining the overall shielding and sealing performance of the chassis and achieving efficient heat dissipation. Attached Figure Description
[0018] The accompanying drawings, which form part of this application, are used to provide a further understanding of the present invention. The illustrative embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an undue limitation of the present invention. In the drawings: Figure 1 This is a schematic diagram of the external structure of a shielded and sealed electronic device heat dissipation enclosure provided in this embodiment; Figure 2 This is an exploded view of the overall structure of a shielded and sealed electronic device heat dissipation enclosure provided in this embodiment; Figure 3 This is a schematic diagram of the housing structure of a shielded and sealed electronic device heat dissipation enclosure provided in this embodiment; Figure 4 This is an exploded view of the front panel of a shielded and sealed electronic device heat dissipation chassis provided in this embodiment; Figure 5 This is a schematic diagram of an electronic device inside a shielded and sealed electronic device heat dissipation chassis provided in this embodiment; Figure 6 This is an exploded schematic diagram of the heat dissipation plate of a shielded and sealed electronic device heat sink provided in this embodiment.
[0019] 1. Housing; 2. Front panel; 3. Top cover; 4. Bottom cover; 5. Heat spreader; 6. Cooling fan; 101. Electronic device mounting plate; 102. Front frame; 103. Left upright plate; 104. Right upright plate; 105. Rear upright plate; 201. LCD screen; 202. First conductive gasket; 203. Electromagnetic shielding glass; 204. Second conductive gasket; 205. Electrical connector; 206. Metal pressure plate; 501. Copper heat pipe; 502. Thermal pad; 7. Shielding sealing gasket; 8. Silicone rubber sealing ring; 9. Electronic device; 901. Power control module; 902. Temperature detector; 903. Main control module; 904. Radio frequency module; 905. Time synchronization module; 12. Air inlet dustproof net; 10. Air outlet dustproof net.
[0020] The accompanying drawings illustrate specific embodiments of this application, which will be described in more detail below. These drawings and descriptions are not intended to limit the scope of the concept in any way, but rather to illustrate the concept of this application to those skilled in the art through reference to particular embodiments. Detailed Implementation
[0021] To make the objectives, technical solutions, and advantages of this application clearer, the technical solutions of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.
[0022] The terms "first," "second," "third," "fourth," etc. (if present) in the specification, claims, and accompanying drawings of this utility model are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of the utility model described herein can be implemented in orders other than those illustrated or described herein.
[0023] In this invention, the terms "exemplary" or "for example" are used to indicate examples, illustrations, or descriptions. Any embodiment or design described as "exemplary" or "for example" in this application should not be construed as being more preferred or advantageous than other embodiments or designs. Specifically, the use of terms such as "exemplary" or "for example" is intended to present the relevant concepts in a concrete manner.
[0024] The shielded and sealed electronic equipment heat dissipation chassis provided in this application includes a housing, a front panel, an upper cover, a lower cover, a vapor chamber, and a cooling fan. An electronic equipment mounting plate is horizontally arranged inside the housing, separating the upper electronic equipment mounting cavity from the lower isolated heat dissipation duct. The upper cover, front panel, and vapor chamber, together with the upper part of the housing, form a sealed mounting cavity, ensuring shielding and sealing performance. The lower cover and the lower part of the housing form an independent heat dissipation duct, with the cooling fan located at the air inlet. This design balances shielding and heat dissipation requirements, ensuring that the chassis effectively solves the heat dissipation problem of high-power electronic components while maintaining overall performance.
[0025] The technical solution of this application and how the technical solution of this application solves the above-mentioned technical problems are described in detail below with specific embodiments. These specific embodiments can be combined with each other, and the same or similar concepts or processes may not be described again in some embodiments. The embodiments of this application will be described below with reference to the accompanying drawings.
[0026] like Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 and Figure 6 As shown in the figure, this embodiment provides a shielded and sealed electronic device heat dissipation chassis. The heat dissipation chassis includes a shell 1, a front panel 2, an upper cover 3, a lower cover 4, a heat spreader 5, and a cooling fan 6. The shell 1 includes an electronic device mounting plate 101, which is horizontally disposed inside the shell 1. The electronic device mounting plate 101 divides the interior of the shell 1 into an upper electronic device mounting cavity and a lower isolated heat dissipation duct. The upper cover 3 is connected to an opening at the top of the shell 1, the front panel 2 is connected to an opening at the front of the shell 1, and the heat spreader 5 covers the opening on the electronic device mounting plate 101. The upper cover 3, the front panel 2, and the heat spreader 5 are combined with the upper half of the shell 1 to form a sealed electronic device mounting cavity. The lower cover 4 covers the opening at the bottom of the shell 1 and is combined with the lower half of the shell 1 to form an independent heat dissipation duct. The cooling fan 6 is disposed at the air inlet of the heat dissipation duct.
[0027] Specifically, the housing 1 further includes a front frame 102, a left upright plate 103, a right upright plate 104, and a rear upright plate 105; the electronic device mounting plate 101 is arranged laterally inside the housing 1, the left upright plate 103 and the right upright plate 104 are respectively disposed on the left and right sides of the electronic device mounting plate 101, the front frame 102 is disposed on the front side of the electronic device mounting plate 101, and the rear upright plate 105 is disposed on the rear side of the electronic device mounting plate 101.
[0028] Specifically, the front side of the electronic device mounting plate 101 is provided with a heat-conducting protrusion structure, which corresponds to the position of the heat-generating element in the electronic device mounting cavity; the back side of the electronic device mounting plate 101 is provided with a heat dissipation fin structure; and the rear upright plate 105 is provided with a heat dissipation air duct outlet.
[0029] Specifically, the front panel 2 includes a liquid crystal display screen 201, a first conductive pad 202, an electromagnetic shielding glass 203, a second conductive pad 204, an electrical connector 205, and a metal pressure plate 206. The front panel 2 is equipped with the electrical connector 205 and the liquid crystal display screen 201; the liquid crystal display screen 201 is provided with an electromagnetic shielding glass 203 on the side near the front panel 2, and a first conductive pad 202 and a second conductive pad 204 are respectively provided on the left and right sides of the electromagnetic shielding glass 203; the first conductive pad 202 is tightly attached to the groove on the inner side of the front panel 2, and the electromagnetic shielding glass 203 is placed between the first conductive pad 202 and the second conductive pad 204, and is pressed tightly on the inner side of the front panel 2 by a metal pressure plate 206.
[0030] Specifically, a copper heat pipe 501 is arranged on the heat spreader 5; a heat dissipation fin structure is provided on the back of the heat spreader 5; a thermal pad 502 is connected to the front of the heat spreader 5, with one end of the thermal pad 502 attached to the copper heat pipe 501 and the other end attached to the high-power chip in the mounting cavity of the electronic device.
[0031] Specifically, a shielding and sealing gasket 7 is embedded at the joint surface of the upper cover plate 3, the front panel 2, the heat spreader plate 5 and the housing 1; a silicone rubber sealing ring 8 is embedded at the joint surface of the lower cover plate 4 and the housing 1.
[0032] Specifically, the heat dissipation chassis also includes an electronic device 9, which includes a power control module 901, a temperature detector 902, a main control module 903, a radio frequency module 904, and a timing module 905. The power control module 901, temperature detector 902, main control module 903, radio frequency module 904, and timing module 905 are disposed within the mounting cavity of the electronic device. The temperature detector 902 is electrically connected to the power control module 901, and the power control module 901 is electrically connected to the cooling fan 6.
[0033] Specifically, an air inlet dustproof net 12 is provided at the air inlet of the heat dissipation duct; and an air outlet dustproof net 10 is provided at the air outlet of the heat dissipation duct.
[0034] Specifically, the electronic device mounting plate 101 is provided with a sunken receiving cavity on the side near the right upright plate 104, and the radio frequency module 904 is disposed in the sunken receiving cavity; a heat conduction platform is provided on the inner side of the right upright plate 104, and a heat dissipation fin structure is provided on the outer side.
[0035] Specifically, the material of the heat spreader 5 is copper; the materials of the shell 1, the upper cover 3, the lower cover 4, and the front panel 2 are aluminum alloy.
[0036] This embodiment provides a shielded and sealed heat dissipation enclosure for electronic devices, including a housing 1, a front panel 2, an upper cover 3, a lower cover 4, a heat spreader 5, and a cooling fan 6.
[0037] The specific implementation includes: 1. Layered isolation structure 1.1 Core Structure: An electronic device mounting plate 101 (either welded or integrally formed with the housing 1) is horizontally fixed inside the housing 1. The electronic device mounting plate 101 divides the interior of the housing 1 into an upper electronic device mounting cavity and a lower isolated heat dissipation duct. This layered design completely isolates the sealed environment of the electronic devices from the heat dissipation airflow, preventing external contaminants from entering the mounting cavity.
[0038] 1.2 Formation of the sealed cavity: The top cover 3 is connected to the top opening of the housing 1 by screws; the front panel 2 is connected to the front opening of the housing 1 by screws; the heat spreader 5 is fitted and sealed into the rectangular opening of the electronic equipment mounting plate 101 (fitting gap ≤ 0.1mm). The three components, together with the upper part of the housing 1, form a fully enclosed electronic equipment mounting cavity, ensuring electromagnetic shielding continuity and IP65 dustproof sealing.
[0039] 1.3 Independent air duct construction: The lower cover plate 4 is connected to the bottom opening of the housing 1 by screws, forming an independent heat dissipation air duct with the lower half of the housing 1. The cooling fan 6 is fixedly installed at the air inlet of the heat dissipation air duct (bolted connection), forcing cold air to flow unidirectionally through the air duct to carry away heat.
[0040] 2. Connection relationship of housing components Housing 1 includes an electronic device mounting plate 101, a front frame 102, a left upright plate 103, a right upright plate 104, and a rear upright plate 105. 2.1 The left upright plate 103 is vertically connected to the left edge of the electronic device mounting plate 101 by welding; 2.2 The right vertical plate 104 is vertically connected to the right edge of the electronic device mounting plate 101 by welding; 2.3 The front frame 102 is welded to the front edge of the electronic device mounting plate 101; 2.4 The rear upright plate 105 is welded to the rear edge of the electronic device mounting plate 101; As a priority, the shell 1 can be manufactured using an integrated molding technology.
[0041] Welded connections ensure structural rigidity and provide a supporting foundation for the heat dissipation fins.
[0042] 3. Heat dissipation enhancement structure 3.1 Mounting plate heat dissipation design: The front of the electronic device mounting plate 101 has a cylindrical heat-conducting protrusion structure (5mm high), the protrusion position corresponds to the mounting point of the main control module 903 chip, and directly conducts the chip heat; the back is equipped with an array-type heat dissipation fin structure (15mm high, 5mm spacing), increasing the heat dissipation area by 300%. The rear upright plate 105 has a rectangular heat dissipation air duct outlet (60×30mm).
[0043] 3.2 Heat transfer path of the heat exchanger: Three copper heat pipes 501 (8mm in diameter) are welded to the surface of the heat spreader 5. A copper thermal pad 502 is bonded to the front side using thermal grease. One end of the thermal pad 502 is pressed against the surface of the copper heat pipes 501, and the other end is pressed against the surface of the main control module 903 chip, realizing the rapid conduction of heat from the chip → thermal pad 502 → copper heat pipes 501 → heat spreader 5. The back of the heat spreader 5 has an integrated comb-shaped heat dissipation fin structure (15mm high).
[0044] 4. Front panel shielding and sealing structure The front panel 2 is equipped with an electrical connector 205 (MIL-DTL-38999 standard interface) and an LCD display 201. 4.1 Electromagnetic shielding glass 203 (3mm thick) is bonded to the surface of LCD display 201; 4.2 The first conductive pad 202 (nickel-plated copper wire mesh pad) is pressed into the U-shaped groove inside the front panel 2; 4.3 The second conductive pad 204 (pad of the same specification) is pressed onto the right side of the electromagnetic shielding glass 203; 4.4 The metal pressure plate 206 presses the electromagnetic shielding glass 203 between the first conductive pad 202 and the second conductive pad 204 using screws. Double conductive pads fill the gap between the electromagnetic shielding glass 203 and the front panel 2 to ensure 360° conductive continuity and shielding effectiveness ≥70dB.
[0045] 5. Dynamic temperature control system Electronic device mounting cavity settings: Power control module 901 (TI TPS54620 chip); Temperature detector 902 (MAX31855 thermocouple) is attached to main control module chip 903; Main control module 903 (NVIDIA Jetson TX2 core board); RF module 904 (ADI AD9361 transceiver); Timing module 905 (u-blox NEO-M8T).
[0046] Temperature sensor 902 is connected to power control module 901 via I2C bus; power control module 901 is connected to cooling fan 6 via PWM signal line. When temperature sensor 902 detects chip temperature >80℃, power control module 901 outputs 12V voltage to drive cooling fan 6 to run at full speed; when temperature <60℃, it outputs 5V voltage to run at low speed, achieving a balance between energy consumption and heat dissipation.
[0047] 6. Protection and Materials 6.1 Dustproof structure: The air inlet dustproof net 12 (made of 304 stainless steel, with a mesh size of 100) is clipped and installed at the air inlet of the air duct; the air outlet dustproof net 10 (made of the same material) is clipped and installed at the air outlet of the rear upright plate 105 to intercept particles ≥50μm.
[0048] 6.2 RF Module 904 Installation: The right side of the electronic device mounting plate 101 has a milled recessed cavity (10mm deep), and the radio frequency module 904 is fixed in the cavity with screws; the inner side of the right upright plate 104 is machined with an aluminum alloy heat-conducting platform, and the outer side is integrally machined with heat dissipation fins to directly dissipate the heat of the radio frequency module 904.
[0049] 6.3 Material Selection: The heat spreader 5 is made of copper (thermal conductivity 401W / m·K) to optimize the heat transfer efficiency of high-power chips; the housing 1, upper cover 3, lower cover 4, and front panel 2 are made of 6061 aluminum alloy (thermal conductivity 167W / m·K) to balance lightweight and structural strength.
[0050] Other embodiments of this application will readily occur to those skilled in the art upon consideration of the specification and practice of the utility models disclosed herein. This application is intended to cover any variations, uses, or adaptations of this application that follow the general principles of this application and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this application are indicated by the following claims.
[0051] It should be understood that this application is not limited to the precise structure described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this application is limited only by the appended claims.
Claims
1. A shielded and sealed heat dissipation enclosure for electronic equipment, characterized in that: The heat dissipation chassis includes a shell (1), a front panel (2), an upper cover (3), a lower cover (4), a heat spreader (5), and a cooling fan (6); The housing (1) includes an electronic device mounting plate (101), which is horizontally disposed inside the housing (1) and divides the interior of the housing (1) into an upper electronic device mounting cavity and a lower isolated heat dissipation duct. The upper cover plate (3) is connected to the opening at the top of the housing (1), the front panel (2) is connected to the opening at the front of the housing (1), and the heat spreader (5) is covered by the opening on the electronic device mounting plate (101). The upper cover plate (3), the front panel (2), the heat spreader (5) and the upper part of the housing (1) are combined to form a sealed electronic device mounting cavity. The lower cover plate (4) covers the opening at the bottom of the housing (1), and the lower cover plate (4) and the lower half of the housing (1) are combined to form an independent heat dissipation duct; The cooling fan (6) is located at the air inlet of the cooling duct.
2. The shielded and sealed electronic device heat dissipation enclosure according to claim 1, characterized in that: The housing (1) also includes a front frame (102), a left upright plate (103), a right upright plate (104), and a rear upright plate (105); The electronic device mounting plate (101) is arranged horizontally inside the housing (1). The left upright plate (103) and the right upright plate (104) are respectively located on the left and right sides of the electronic device mounting plate (101). The front frame (102) is located on the front side of the electronic device mounting plate (101), and the rear upright plate (105) is located on the rear side of the electronic device mounting plate (101).
3. The shielded and sealed electronic device heat dissipation enclosure according to claim 2, characterized in that, The front of the electronic device mounting plate (101) is provided with a heat-conducting protrusion structure, which corresponds to the position of the heat-generating element in the electronic device mounting cavity; the back of the electronic device mounting plate (101) is provided with a heat dissipation fin structure; and the rear upright plate (105) is provided with a heat dissipation air duct outlet.
4. The shielded and sealed electronic device heat dissipation enclosure according to claim 2, characterized in that: The front panel (2) includes a liquid crystal display (201), a first conductive pad (202), an electromagnetic shielding glass (203), a second conductive pad (204), an electrical connector (205), and a metal pressure plate (206); The front panel (2) is equipped with the electrical connector (205) and the liquid crystal display screen (201); The LCD screen (201) is provided with an electromagnetic shielding glass (203) on the side near the front panel (2), and a first conductive pad (202) and a second conductive pad (204) are provided on the left and right sides of the electromagnetic shielding glass (203) respectively. The first conductive pad (202) is attached to the groove on the inner side of the front panel (2), and the electromagnetic shielding glass (203) is placed between the first conductive pad (202) and the second conductive pad (204), and is pressed against the inner side of the front panel (2) by the metal pressure plate (206).
5. The shielded and sealed electronic device heat dissipation enclosure according to claim 1, characterized in that: Copper heat pipes (501) are arranged on the heat spreader (5); The back of the heat dissipation plate (5) is provided with a heat dissipation fin structure; The heat spreader (5) is connected to a heat-conducting pad (502) on the front. One end of the heat-conducting pad (502) is attached to the copper heat pipe (501), and the other end is attached to the high-power chip in the electronic device mounting cavity.
6. The shielded and sealed electronic device heat dissipation enclosure according to claim 1, characterized in that: A shielding and sealing gasket (7) is embedded at the joint surface of the upper cover plate (3), the front panel (2), the heat equalization plate (5) and the shell (1); A silicone rubber sealing ring (8) is embedded at the joint surface between the lower cover plate (4) and the housing (1).
7. The shielded and sealed electronic device heat dissipation enclosure according to claim 1, characterized in that: The heat dissipation chassis also includes electronic equipment (9), which includes a power control module (901), a temperature detector (902), a main control module (903), a radio frequency module (904), and a timing module (905); The power control module (901), temperature detector (902), main control module (903), radio frequency module (904), and timing module (905) are disposed inside the mounting cavity of the electronic device; The temperature detector (902) is electrically connected to the power control module (901), and the power control module (901) is electrically connected to the cooling fan (6).
8. The shielded and sealed electronic device heat dissipation enclosure according to claim 1, characterized in that: The air inlet of the heat dissipation duct is provided with an air inlet dustproof net (12); the air outlet of the heat dissipation duct is provided with an air outlet dustproof net (10).
9. The shielded and sealed electronic device heat dissipation enclosure according to claim 7, characterized in that: The electronic device mounting plate (101) is provided with a recessed receiving cavity on the side near the right upright plate (104), and the radio frequency module (904) is disposed in the recessed receiving cavity; A heat-conducting platform is provided on the inner side of the right vertical plate (104), and a heat dissipation fin structure is provided on the outer side.
10. The shielded and sealed electronic device heat dissipation enclosure according to claim 1, characterized in that: The material of the heat spreader (5) is copper. The shell (1), upper cover (3), lower cover (4), and front panel (2) are made of aluminum alloy.