Heat dissipation device and electronic device

Abstract

This disclosure relates to a heat dissipation device and electronic device, the heat dissipation device comprising: a first channel, a second channel, and a third channel. The first channel has an evaporation zone and a condensation zone arranged sequentially. The evaporation zone conducts heat to vaporize the heat exchange medium, and the condensation zone liquefies the vaporized heat exchange medium. The second channel is connected to the first channel and forms a fluid loop for the heat exchange medium, and a capillary layer is provided within the second channel. The third channel is connected to the first channel and forms a fluid loop for the heat exchange medium, and a booster pump is provided in the third channel to drive the flow of the heat exchange medium within the third channel. When the return of liquid heat exchange medium in the second channel is insufficient, the heat exchange medium can flow in the fluid loop formed by the third channel and the first channel. That is, the booster pump drives the liquid heat exchange medium to flow through the third channel to the evaporation zone to improve the gas-liquid circulation efficiency, thereby enhancing the heat dissipation capacity of the heat dissipation device.

Description

Technical Field

[0001] This disclosure relates to the field of electronic equipment technology, and in particular to a heat dissipation device and electronic equipment. Background Technology

[0002] In related technologies, vapor chambers, as phase change heat conduction components, are widely used in electronic devices for heat dissipation due to their excellent heat transfer and heat uniformity. The working principle of a vapor chamber is to achieve temperature uniformity through gas-liquid circulation. However, as electronic devices become thinner and lighter, the thickness of vapor chambers also decreases, leading to obstructed gas-liquid circulation and reduced heat dissipation performance. Utility Model Content

[0003] To overcome the problems existing in the related technologies, this disclosure provides a heat dissipation device and an electronic device.

[0004] According to some embodiments of this disclosure, a heat dissipation device is provided, comprising: a first channel having an evaporation zone and a condensation zone arranged sequentially, the evaporation zone being used to conduct heat to vaporize a heat exchange medium, and the condensation zone being used to liquefy the vaporized heat exchange medium; a second channel communicating with the first channel and forming a fluid loop for the heat exchange medium, the second channel having a capillary structure layer therein; and a third channel communicating with the first channel and forming a fluid loop for the heat exchange medium, the third channel having a booster pump for driving the flow of the heat exchange medium within the third channel.

[0005] In some embodiments, the heat dissipation device further includes a control unit; the control unit is electrically connected to the booster pump, and the control unit is used to control the booster pump to turn on or off. When the booster pump is on, the heat exchange medium flows into the evaporation zone through the second channel and the third channel. When the booster pump is off, the heat exchange medium flows into the evaporation zone through the second channel.

[0006] In some embodiments, the control unit includes a temperature sensor and a control circuit; the temperature sensor is disposed in the first channel and acquires a temperature measurement value, and the control circuit is electrically connected to the temperature sensor and the booster pump respectively, and the control circuit is used to control the booster pump to turn on or off based on the temperature measurement value.

[0007] In some embodiments, the control circuit is configured to control the booster pump to start in response to the temperature measurement value being greater than or equal to a preset temperature; and the control circuit is configured to control the booster pump to shut down in response to the temperature measurement value being less than the preset temperature.

[0008] In some embodiments, the temperature sensor is disposed in the evaporation zone.

[0009] In some embodiments, the two ends of the second channel are connected to the evaporation zone and the condensation zone, respectively.

[0010] In some embodiments, the two ends of the third channel are connected to the evaporation zone and the condensation zone, respectively.

[0011] In some embodiments, the booster pump includes a liquid inlet, a liquid outlet, a pump chamber, and a diaphragm; both the liquid inlet and the liquid outlet are connected to the third channel; the diaphragm covers the pump chamber and is used to change the volume of the pump chamber; both the liquid inlet and the liquid outlet are connected to the pump chamber; the liquid inlet is used to control the heat exchange medium to enter the pump chamber unidirectionally, and the liquid outlet is used to control the heat exchange medium to exit the pump chamber unidirectionally.

[0012] In some embodiments, the second channel is further provided with a channel; the channel is used to guide the heat exchange medium in the second channel.

[0013] In some embodiments, the channel is disposed on the inner sidewall of the second channel, and the capillary layer covers the opening side of the channel.

[0014] In some embodiments, the heat dissipation device further includes a first cover and a second cover; the first cover and / or the second cover are provided with cavities, and the first cover and the second cover are engaged to form the first channel, the second channel and the third channel.

[0015] In some embodiments, the heat dissipation device further includes a mounting portion; the edge of the first cover protrudes beyond the edge of the second cover, and the protruding portion of the edge of the first cover forms the mounting portion, which is used to fix the heat dissipation device to an electronic device.

[0016] According to some embodiments of this disclosure, an electronic device is provided, including: the heat dissipation device described in any of the above embodiments.

[0017] In some embodiments, the electronic device further includes a frame; the end of the heat dissipation device is connected to the inner sidewall of the frame.

[0018] The technical solutions provided by the embodiments of this disclosure may include the following beneficial effects: the heat exchange medium is located inside the first channel, the second channel, and the third channel. The evaporation zone of the first channel corresponds to the area in the electronic device that needs heat dissipation; that is, the outer wall of the evaporation zone of the first channel is used to attach to the area that needs heat dissipation for heat exchange. The heat exchange medium can flow in the fluid loop formed by the second channel and the first channel. The liquid heat exchange medium absorbs heat and vaporizes in the evaporation zone. The vaporized gaseous heat exchange medium flows to the condensation zone and re-condenses into a liquid heat exchange medium. The liquid heat exchange medium then flows through the second channel to the evaporation zone to absorb heat. The capillary structure layer in the second channel extends to the junction area of ​​the first and second channels. While preventing the backflow of the gaseous heat exchange medium, it can realize the spontaneous unidirectional flow of the liquid heat exchange medium in the second channel, and promptly and directionally transport the liquid heat exchange medium formed by the condensation of the gaseous heat exchange medium in the condensation zone to the evaporation zone. When the return of the liquid heat exchange medium in the second channel is insufficient, the heat exchange medium can flow in the fluid loop formed by the third channel and the first channel. That is, the liquid heat exchange medium is driven by the booster pump to flow to the evaporation zone through the third channel. The fluid loop formed by the third channel and the first channel improves the gas-liquid circulation efficiency, thereby improving the heat dissipation capacity of the heat dissipation device.

[0019] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this disclosure. Attached Figure Description

[0020] The accompanying drawings, which are incorporated in and form a part of this specification, illustrate embodiments consistent with this disclosure and, together with the description, serve to explain the principles of this disclosure.

[0021] Figure 1 This is a schematic diagram of a heat dissipation device according to some embodiments of the present disclosure.

[0022] Figure 2 This is a structural schematic diagram of a booster pump in an expanded state, according to some embodiments of the present disclosure.

[0023] Figure 3 This is a schematic diagram of the booster pump in its contracted state, according to some embodiments of the present disclosure.

[0024] Figure 4 This is a schematic diagram illustrating a heat dissipation device applied to an electronic device according to some embodiments of the present disclosure.

[0025] Figure 5 yes Figure 4 A schematic diagram of the partial structure of region A in the middle.

[0026] Figure 6 yes Figure 4 A partial sectional view of region A in the middle.

[0027] Figure 7 This is an exploded view of a heat dissipation device according to some embodiments of the present disclosure.

[0028] Figure 8 This is a schematic diagram illustrating the installation of a heat dissipation device applied to an electronic device according to some embodiments of the present disclosure.

[0029] Figure 9 This is a flowchart illustrating the fabrication process of a heat dissipation device according to some embodiments of the present disclosure.

[0030] Figure 10 This is a block diagram illustrating an electronic device according to some embodiments of the present disclosure. Detailed Implementation

[0031] Some embodiments of this disclosure will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description refers to the drawings, unless otherwise indicated, the same numbers in different drawings denote the same or similar elements. Various changes, modifications, and equivalents of the methods, apparatus, and / or systems described herein will become apparent upon understanding this disclosure. For example, the order of operations described herein is merely illustrative and is not limited to those orders set forth herein, but can be changed as will become apparent upon understanding this disclosure, except for operations that must be performed in a particular order. Furthermore, for clarity and brevity, descriptions of features known in the art may be omitted.

[0032] The embodiments described in the following examples of this disclosure are not representative of all embodiments consistent with this disclosure. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this disclosure as detailed in the appended claims.

[0033] The heat dissipation devices and electronic devices provided in some embodiments of this disclosure are applied to scenarios where electronic devices use heat dissipation devices for heat dissipation.

[0034] In related technologies, vapor chambers, as phase-change heat transfer components, are widely used in electronic devices for heat dissipation due to their excellent heat transfer and heat homogenization performance. The vapor chamber works by heating the working substance in the low-vacuum chamber, causing it to evaporate in the evaporation zone, diffuse to the condensation zone, condense, and then be returned to the evaporation zone by capillary structures, achieving temperature homogenization through gas-liquid circulation. However, with the trend towards thinner and lighter electronic devices, vapor chambers are becoming increasingly thinner and irregularly shaped. Reduced thickness enhances the vapor chamber's carryover effect, hindering gas-liquid circulation. Furthermore, the irregular shape makes it difficult for vapor to diffuse in some irregular areas, and water return is limited. Due to these limitations, the heat dissipation performance of ultra-thin, irregularly shaped vapor chambers is gradually failing to meet the heat dissipation requirements of electronic devices.

[0035] In view of this, some embodiments of this disclosure provide a heat dissipation device and electronic device 800. By providing a third channel 22 with a booster pump 33 in the liquid channel 2, when the gas-liquid circulation in the liquid channel 2 is obstructed, the booster pump 33 pressurizes the liquid in the third channel 22 to ensure smooth gas-liquid circulation, thereby improving the heat dissipation performance of the heat dissipation device.

[0036] Figure 1 This is a schematic diagram of a heat dissipation device according to some embodiments of the present disclosure. Figure 4 This is a schematic diagram illustrating a heat dissipation device applied to an electronic device 800 according to some embodiments of this disclosure. Figure 1 and Figure 4 As shown, the heat dissipation device includes: a first channel 1, which has an evaporation zone 11 and a condensation zone 12 arranged sequentially. The evaporation zone 11 is used to conduct heat to vaporize the heat exchange medium, and the condensation zone 12 is used to liquefy the vaporized heat exchange medium. A second channel 21 is connected to the first channel 1 to form a fluid loop for the heat exchange medium, and a capillary structure layer 211 is provided in the second channel 21. A third channel 22 is connected to the first channel 1 to form a fluid loop for the heat exchange medium, and a booster pump 33 is provided in the third channel 22 to drive the flow of the heat exchange medium in the third channel 22.

[0037] The heat exchange medium is located inside the first channel 1, the second channel 21, and the third channel 22. The evaporation zone 11 of the first channel 1 corresponds to the area in the electronic device 800 that needs heat dissipation; that is, the outer wall of the evaporation zone 11 of the first channel 1 is used to attach to the area that needs heat dissipation for heat exchange. The heat exchange medium can flow in the fluid loop formed by the second channel 21 and the first channel 1. The liquid heat exchange medium absorbs heat and vaporizes in the evaporation zone 11. The vaporized gaseous heat exchange medium flows to the condensation zone 12 and re-condenses into a liquid heat exchange medium. The liquid heat exchange medium then flows through the second channel 21 back to the evaporation zone 11 to absorb heat. The capillary structure layer 211 in the second channel 21 extends to the junction area of ​​the first channel 1 and the second channel 21. While preventing the backflow of the gaseous heat exchange medium, it can realize the spontaneous unidirectional flow of the liquid heat exchange medium in the second channel 21, and promptly and directionally transport the liquid heat exchange medium formed by the condensation of the gaseous heat exchange medium in the condensation zone 12 to the evaporation zone 11. When the return of the liquid heat exchange medium in the second channel 21 is insufficient, the heat exchange medium can flow in the fluid loop formed by the third channel 22 and the first channel 1. That is, the liquid heat exchange medium is driven by the booster pump 33 to flow to the evaporation zone 11 through the third channel 22. The fluid loop formed by the third channel 22 and the first channel 1 improves the gas-liquid circulation efficiency, thereby improving the heat dissipation capacity of the heat dissipation device.

[0038] Among them, the first channel 1 serves as a steam channel, and the second channel 21 and the third channel 22 serve as liquid channels 2. The steam pipe and the liquid channel 2 are separated by a physical barrier structure to achieve gas-liquid separation and minimize the obstruction of gas-liquid circulation by the carry-over effect.

[0039] In some embodiments, the first channel 1 forms a cavity by etching or stamping a support column structure, and the gas heat exchange medium can diffuse freely inside the cavity.

[0040] In some embodiments, the physical barrier structure between the first channel 1, the second channel 21 and the third channel 22 can be achieved directly through openings or by welding.

[0041] In some embodiments, the heat dissipation device further includes a control unit. The control unit is electrically connected to the booster pump 33 and is used to control the booster pump 33 to turn on or off. When the booster pump 33 is on, the heat exchange medium flows into the evaporation zone 11 through the second channel 21 and the third channel 22. When the booster pump 33 is off, the heat exchange medium flows into the evaporation zone 11 through the second channel 21.

[0042] For example, when there is no risk of the evaporation zone 11 burning out, the booster pump 33 is turned off, and the heat dissipation device returns the liquid through the capillary structure layer 211. When there is a risk of the evaporation zone 11 burning out, the booster pump 33 is turned on, and the heat dissipation device returns the liquid through the capillary structure layer 211 and the booster pump 33, thereby achieving more efficient and intelligent heat dissipation.

[0043] In some embodiments, the control unit includes a temperature sensor 31 and a control circuit 32. The temperature sensor 31 is disposed in the first channel 1 and acquires temperature measurements. The control circuit 32 is electrically connected to both the temperature sensor 31 and the booster pump 33. The control circuit 32 is used to control the booster pump 33 to turn on or off based on the temperature measurements. Determining whether there is a risk of the evaporation zone 11 drying out is more accurate by using the temperature measurements acquired by the temperature sensor 31.

[0044] In some embodiments, the control circuit 32 is configured to control the booster pump 33 to start in response to a temperature measurement value being greater than or equal to a preset temperature. The control circuit 32 is also configured to control the booster pump 33 to shut down in response to a temperature measurement value being less than a preset temperature. One or more temperature sensors 31 are welded to the inner or outer wall of the first channel 1. When the temperature of the first channel 1 is low, the booster pump 33 does not operate, and the heat dissipation device relies on the capillary layer 211 inside the second channel 21 to complete the liquid return. When the temperature of the first channel 1 is high, the control circuit 32 supplies power to the booster pump 33, directionally pumping the liquid heat exchange medium that cannot return through the capillary layer 211 in the second channel 21 back to the evaporation zone 11, achieving intelligent and efficient gas-liquid circulation.

[0045] It should be noted that this disclosure does not limit the specific temperature value of the preset temperature.

[0046] In some embodiments, a temperature sensor 31 is disposed in the evaporation zone 11 to acquire the temperature measurement value of the evaporation zone 11. Based on the temperature measurement value of the evaporation zone 11, it is determined whether to turn on the booster pump 33 to avoid the evaporation zone 11 from overheating and burning dry.

[0047] In some embodiments, the two ends of the second channel 21 are connected to the evaporation zone 11 and the condensation zone 12, respectively. The heat exchange medium condensed into liquid in the condensation zone 12 flows directly into the second channel 21 and then flows back to the evaporation zone 11 through the second channel 21 for heat exchange. The fluid loop structure formed by the second channel 21 and the first channel 1 is relatively simple, which reduces the risk of insufficient liquid return of the heat exchange medium.

[0048] In some embodiments, the two ends of the third channel 22 are connected to the evaporation zone 11 and the condensation zone 12, respectively. When the return of the liquid heat exchange medium in the second channel 21 is insufficient, the heat exchange medium condensed into liquid in the condensation zone 12 flows directly into the third channel 22 and, driven by the booster pump 33, flows back to the evaporation zone 11 through the third channel 22 for heat exchange. The fluid loop structure formed by the third channel 22 and the first channel 1 is relatively simple, thereby reducing the risk of insufficient return of the heat exchange medium.

[0049] Figure 2 This is a structural schematic diagram of the booster pump 33 in an expanded state, according to some embodiments of the present disclosure. Figure 3 This is a schematic diagram of the booster pump 33 in its contracted state, as shown in some embodiments of this disclosure. Figure 4 This is a schematic diagram illustrating a heat dissipation device applied to an electronic device 800 according to some embodiments of the present disclosure. Figure 5 yes Figure 4 A schematic diagram of a partial structure of region A. In some embodiments, such as... Figures 2 to 5 As shown, the booster pump 33 includes a liquid inlet 331, a liquid outlet 332, a pump chamber 333, and a diaphragm 334. Both the liquid inlet 331 and the liquid outlet 332 are connected to the third channel 22. The diaphragm 334 covers the pump chamber 333 and is used to change the volume of the pump chamber 333. The liquid inlet 331 controls the unidirectional entry of the heat exchange medium into the pump chamber 333, and the liquid outlet 332 controls the unidirectional discharge of the heat exchange medium from the pump chamber 333. This achieves unidirectional flow of the liquid heat exchange medium within the third channel 22, preventing backflow of the liquid heat exchange medium when the booster pump 33 is turned off, which would affect the gas-liquid circulation of the heat dissipation device.

[0050] In some embodiments, one-way valves are provided for the liquid inlet 331 and the liquid outlet 332, so as to enable the liquid heat exchange medium to enter the pump chamber 333 in one direction through the liquid inlet 331 and to exit the pump chamber 333 in one direction through the liquid outlet 332.

[0051] In some embodiments, a partition is provided in the third channel 22 to prevent backflow of the liquid heat exchange medium in the third channel 22. The booster pump 33 is disposed relative to the partition, and the liquid inlet 331 and the liquid outlet 332 are located on opposite sides of the partition, so as to realize unidirectional flow of the liquid heat exchange medium in the third channel 22.

[0052] In some embodiments, the booster pump 33 can be a micropump, i.e., the diaphragm 334 is a piezoelectric ceramic diaphragm. A micropump is a millimeter-scale pump that drives the vibration of a piezoelectric ceramic diaphragm to drive the liquid heat exchange medium through a voltage signal. By adjusting various parameters of the third channel 22, liquid return can be supplemented when the return liquid in the capillary layer 211 of the second channel 21 is insufficient, thereby increasing the gas-liquid circulation efficiency and effectively increasing the heat dissipation capacity of the heat dissipation device.

[0053] In some embodiments, a third channel 22 is added in parallel to the liquid channel 2 by means of an etching or stamping process in a conventional ultrathin loop heat pipe. The third channel 22 may be a channel driven by a micropump.

[0054] Figure 4 This is a schematic diagram illustrating a heat dissipation device applied to an electronic device 800 according to some embodiments of the present disclosure. Figure 6 yes Figure 4 A partial cross-sectional view of region A. In some embodiments, such as Figure 4 and Figure 6 As shown, a channel 212 is also provided in the second channel 21. The channel 212 is used to guide the flow of the heat exchange medium in the second channel 21. By setting the channel 212, the flow resistance of the liquid heat exchange medium in the second channel 21 is effectively reduced, and the overall thermal cycle efficiency of the heat dissipation device is improved.

[0055] In some embodiments, the channel 212 is disposed on the inner sidewall of the second channel 21, and the capillary layer 211 covers the opening side of the channel 212. The channel 212 and the capillary layer 211 together form a multi-layer water-controlling unidirectional structure, which can prevent the backflow of gaseous heat exchange medium while realizing the spontaneous unidirectional flow of liquid heat exchange medium in the second channel 21.

[0056] In some embodiments, the capillary layer 211 may be one or more of sintered copper mesh, stainless steel mesh, etched metal mesh, powder sintered metal mesh, foamed metal, and stamped metal mesh.

[0057] Figure 7This is an exploded view of a heat dissipation device according to some embodiments of the present disclosure. Figure 7 As shown, in some embodiments, the heat dissipation device further includes a first cover 41 and a second cover 42. The first cover 41 and / or the second cover 42 are provided with cavities, and the first cover 41 and the second cover 42 are interlocked to form a first channel 1, a second channel 21, and a third channel 22. After the first cover 41 and the second cover 42 are integrally formed, the interlocking arrangement to form the first channel 1, the second channel 21, and the third channel 22 is relatively simple to manufacture and can effectively improve production efficiency.

[0058] In some embodiments, the first cover 41 and the second cover 42 are connected by welding. The welding method of the first cover 41 and the second cover 42 can be one of laser welding, brazing, or diffusion welding. Micropump welding requires high sealing, so vacuum reflow welding is generally used to weld the surface of the second cover 42. During welding, solders that do not easily generate bubbles, such as tin-bismuth alloy solder paste or indium alloy solder sheets, are generally used. The materials of the first cover 41 and the second cover 42 can be one or more of stainless steel, titanium alloy, aluminum alloy, pure copper, and alloy copper.

[0059] In some embodiments, the heat dissipation device further includes a mounting portion 411. The edge of the first cover 41 protrudes beyond the edge of the second cover 42, and the protruding portion of the edge of the first cover 41 forms the mounting portion 411. The mounting portion 411 is used to fix the heat dissipation device to the electronic device 800, so that the heat dissipation device can be installed inside the electronic device 800 to improve the heat dissipation effect of the electronic device 800.

[0060] Figure 8 This is a schematic diagram illustrating the installation of a heat dissipation device applied to an electronic device 800 according to some embodiments of this disclosure. Figure 8 As shown, in some embodiments, the heat dissipation device is mounted within the frame 840 of the electronic device 800 via the mounting part 411.

[0061] Figure 9 This is a flowchart illustrating the fabrication process of a heat dissipation device according to some embodiments of this disclosure. Figure 9As shown, the fabrication of the heat dissipation device may include the following steps: molding the first cover 41 and the second cover 42; cutting the raw materials to shape the first cover 41 and the second cover 42; etching the first channel 1, the second channel 21, the third channel 22, and the channel 212; stamping the top nozzle and the bottom nozzle; cutting the mesh to create the capillary layer 211; applying / sintering the mesh to the second cover 42; applying diffusion welding to the top cover; applying adhesive to the first cover 41 and the second cover 42; bonding the first cover 41 and the second cover 42; and brazing the cover plate and the pump body. Filling pipe. High-frequency welding: Welding the first cover 41 and the second cover 42. Redox: Reducing corrosion at the welding site. Liquid injection: Adding liquid heat exchange medium. First exhaust: Vacuuming the heat dissipation device cavity. Second exhaust: Argon arc welding for fixed-length sealing. Leveling: Leveling the heat dissipation device. Aging / Helium Leakage: Aging and hydrogen testing of the heat dissipation device. Ink jet coding: Inkjet coding of the heat dissipation device. Performance testing: Testing the performance of the heat dissipation device. Go / no go inspection: Measuring and evaluating the dimensions and shape of the heat dissipation device. Inspection and outgoing quality control (OQC). Packing: Packing the inspected and qualified heat dissipation devices for shipment.

[0062] According to some embodiments of this disclosure, an electronic device 800 is provided, including: the heat dissipation device described in any of the above embodiments. Figure 10 This is a block diagram illustrating an electronic device 800 according to some embodiments of the present disclosure. For example, the electronic device 800 may be a mobile phone, computer, digital broadcasting terminal, messaging device, game console, tablet device, medical device, fitness equipment, personal digital assistant, etc.

[0063] In some embodiments, the electronic device 800 further includes a frame 840. For example... Figure 8 As shown, the end of the heat dissipation device is connected to the inner sidewall of the frame 840.

[0064] For example, the heat dissipation device is connected to the inner sidewall of the frame 840 via the mounting part 411, and the heat dissipation device can be installed inside the electronic device 800.

[0065] In some embodiments, such as Figure 4 As shown, the electronic device 800 has a camera area 830 corresponding to the camera. The evaporation area 11 of the heat dissipation device can be set to correspond to the camera area 830, which generates a large amount of heat, or to the chip area in the electronic device 800, so as to improve the heat dissipation effect of the heat dissipation device.

[0066] Reference Figure 10 The electronic device 800 may include one or more of the following components: processing component 802, memory 804, power supply component 806, multimedia component 808, audio component 810, input / output (I / O) interface 812, sensor component 814, and communication component 816.

[0067] Processing component 802 typically controls the overall operation of electronic device 800, such as operations associated with display, telephone calls, data communication, camera operation, and recording operations. Processing component 802 may include one or more processors 820 to execute instructions to complete all or part of the steps of the methods described above. Furthermore, processing component 802 may include one or more modules to facilitate interaction between processing component 802 and other components. For example, processing component 802 may include a multimedia module to facilitate interaction between multimedia component 808 and processing component 802.

[0068] Memory 804 is configured to store various types of data to support the operation of electronic device 800. Examples of this data include instructions for any application or method operating on electronic device 800, contact data, phonebook data, messages, pictures, videos, etc. Memory 804 can be implemented by any type of volatile or non-volatile storage device or a combination thereof, such as static random access memory (SRAM), electrically erasable programmable read-only memory (EEPROM), erasable programmable read-only memory (EPROM), programmable read-only memory (PROM), read-only memory (ROM), magnetic storage, flash memory, magnetic disk, or optical disk.

[0069] Power supply component 806 provides power to various components of electronic device 800. Power supply component 806 may include a power management system, one or more power supplies, and other components associated with generating, managing, and distributing power to electronic device 800.

[0070] Multimedia component 808 includes a screen that provides an output interface between the electronic device 800 and the user. In some embodiments, the screen may include a liquid crystal display (LCD) and a touch panel (TP). If the screen includes a touch panel, the screen may be implemented as a touchscreen to receive input signals from the user. The touch panel includes one or more touch sensors to sense touches, swipes, and gestures on the touch panel. The touch sensors may sense not only the boundaries of the touch or swipe action but also the duration and pressure associated with the touch or swipe operation. In some embodiments, multimedia component 808 includes a front-facing camera and / or a rear-facing camera. When the electronic device 800 is in an operating mode, such as a shooting mode or a video mode, the front-facing camera and / or the rear-facing camera may receive external multimedia data. Each front-facing camera and rear-facing camera may be a fixed optical lens system or have focal length and optical zoom capabilities.

[0071] Audio component 810 is configured to output and / or input audio signals. For example, audio component 810 includes a microphone (MIC) configured to receive external audio signals when electronic device 800 is in an operating mode, such as call mode, recording mode, and voice recognition mode. The received audio signals may be further stored in memory 804 or transmitted via communication component 816. In some embodiments, audio component 810 also includes a speaker for outputting audio signals.

[0072] I / O interface 812 provides an interface between processing component 802 and peripheral interface modules, such as keyboards, click wheels, buttons, etc. These buttons may include, but are not limited to, home buttons, volume buttons, power buttons, and lock buttons.

[0073] Sensor assembly 814 includes one or more sensors for providing state assessments of various aspects of electronic device 800. For example, sensor assembly 814 can detect the on / off state of electronic device 800, the relative positioning of components such as the display and keypad of electronic device 800, changes in position of electronic device 800 or a component of electronic device 800, the presence or absence of user contact with electronic device 800, orientation or acceleration / deceleration of electronic device 800, and temperature changes of electronic device 800. Sensor assembly 814 may include a proximity sensor configured to detect the presence of nearby objects without any physical contact. Sensor assembly 814 may also include a light sensor, such as a CMOS or CCD image sensor, for use in imaging applications. In some embodiments, sensor assembly 814 may also include an accelerometer, gyroscope, magnetometer, pressure sensor, or temperature sensor.

[0074] Communication component 816 is configured to facilitate wired or wireless communication between electronic device 800 and other devices. Electronic device 800 can access wireless networks based on communication standards, such as WiFi, 3G, 4G, 5G, other communication standards, or combinations thereof. In some embodiments of this disclosure, communication component 816 receives broadcast signals or broadcast-related information from an external broadcast management system via a broadcast channel. In some embodiments of this disclosure, communication component 816 further includes a near-field communication (NFC) module to facilitate short-range communication. For example, the NFC module may be implemented based on radio frequency identification (RFID) technology, Infrared Data Association (IrDA) technology, ultra-wideband (UWB) technology, Bluetooth (BT) technology, and other technologies.

[0075] In some embodiments of this disclosure, the electronic device 800 may be implemented by one or more application-specific integrated circuits (ASICs), digital signal processors (DSPs), digital signal processing devices (DSPDs), programmable logic devices (PLDs), field-programmable gate arrays (FPGAs), controllers, microcontrollers, microprocessors, or other electronic components to perform the methods described above.

[0076] In the above detailed description, reference has been made to the accompanying drawings, which illustrate specific aspects of this disclosure by way of illustration. In this regard, terms indicating direction or positional relationship, such as “center,” “longitudinal,” “lateral,” “length,” “width,” “thickness,” “upper,” “lower,” “front,” “rear,” “left,” “right,” “vertical,” “horizontal,” “top,” “bottom,” “inner,” “outer,” “clockwise,” “counterclockwise,” “axial,” “radial,” and “circumferential,” are used with reference to the orientation of the described figures. Since components of the described device can be positioned in multiple different orientations, directional terms are used for illustrative purposes and not for limitation. It should be understood that other aspects can be utilized and structural or logical changes can be made without departing from the concept of this disclosure. Therefore, the following detailed description should not be considered limiting.

[0077] It should be understood that, unless otherwise specifically indicated, features of various embodiments of this disclosure described herein can be combined with each other. As used herein, the term "and / or" includes any of the associated listed items and any combination of any two or more; it should be understood that, unless otherwise expressly specified and limited, the terms "joining," "attaching," "mounting," "connecting," "linking," "fixing," etc., used in the embodiments of this disclosure should be interpreted broadly, for example, as a fixed connection, a detachable connection, or an integral part; as a mechanical connection, an electrical connection, or a communicative connection; as a direct connection or an indirect connection through an intermediate medium; as a connection within two elements or an interaction between two elements, unless otherwise expressly limited. Those skilled in the art will understand the specific meaning of the above terms herein according to the specific circumstances.

[0078] Furthermore, the term "above" as used herein with respect to components, elements, or material layers formed or located "above" a surface may be used to indicate that the component, element, or material layer is "indirectly" positioned (e.g., placed, formed, deposited, etc.) on the surface such that one or more additional components, elements, or layers are arranged between the surface and the component, element, or material layer. However, the term "above" as used with respect to components, elements, or material layers formed or located "above" a surface may also optionally have a specific meaning: that the component, element, or material layer is "directly" positioned (e.g., placed, formed, deposited, etc.) on the surface, for example, in direct contact with the surface.

[0079] It should be understood that spatial relative terms, such as “above,” “upper,” “below,” and “lower,” are used herein to describe the relationship between one element and another shown in the figures. In addition to the orientation depicted in the figures, these spatial relative terms are also intended to encompass different orientations of the device in use or operation. For example, if the device in the figures is flipped, an element described as “above” or “upper” relative to another element would be “below” or “lower” relative to that other element. Thus, depending on the spatial orientation of the device, the term “above” encompasses both above and below orientations. Devices may have other orientations (e.g., rotated 90 degrees or in other orientations), and the spatial relative terms used herein should be interpreted accordingly.

[0080] Although terms such as “first,” “second,” and “third” may be used herein to describe various components, parts, regions, layers, or sections, these components, parts, regions, layers, or sections are not limited to these terms. Rather, these terms are used only to distinguish one component, part, region, layer, or section from another. Therefore, without departing from the teachings of the examples described herein, a first component, part, region, layer, or section mentioned in the examples may also be referred to as a second component, part, region, layer, or section. Furthermore, the terms “first” and “second” are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as “first” or “second” may explicitly or implicitly include at least one of that feature.

[0081] It is further understood that the terms "first," "second," etc., are used to describe various types of information, but this information should not be limited to these terms. These terms are only used to distinguish information of the same type from one another, and do not indicate a specific order or degree of importance. In fact, the expressions "first," "second," etc., are completely interchangeable. For example, without departing from the scope of this disclosure, first information can also be referred to as second information, and similarly, second information can also be referred to as first information.

[0082] In this description, "multiple" means at least two, referring to two or more, such as two, three, etc., unless otherwise explicitly specified. Other quantifiers are similar. The singular forms "a," "the," and "the" are also intended to include the plural forms unless the context clearly indicates otherwise. Furthermore, unless otherwise specified or clearly indicated from the context, the articles "a" and "an" as used in this application and the appended claims are generally understood to mean "one or more."

[0083] It should be understood that, unless otherwise specifically indicated, features of various embodiments of this disclosure described herein can be combined with each other. As used herein, the term "and / or" includes any one of the related listed items and any combination of two or more; "and / or" describes the association relationship between related objects, indicating that three relationships may exist, for example, A and / or B can represent: A alone, A and B simultaneously, and B alone. The character " / " generally indicates that the preceding and following related objects are in an "or" relationship. Similarly, "at least one of..." includes any one of the related listed items and any combination of two or more.

[0084] Furthermore, the term "exemplary" is used herein to indicate that it serves as an example, instance, or illustration. Any aspect or design described herein as "exemplary" is not necessarily to be construed as advantageous compared to other aspects or designs. Rather, the use of the term "exemplary" is intended to present concepts in a concrete manner. As used herein, the term "or" is intended to indicate an inclusive "or" rather than an exclusive "or." That is, unless otherwise specified or clear from the context, "X applies A or B" is intended to indicate any of the natural inclusive permutations. That is, if X applies A; X applies B; or X applies both A and B, then applying A or B satisfies the condition under any of the foregoing instances.

[0085] Similarly, although this disclosure has been shown and described with respect to one or more implementations, equivalent variations and modifications will occur to those skilled in the art upon reading and understanding the specification and drawings. This disclosure includes all such modifications and variations and is limited only by the scope of the claims. In particular, with respect to the various functions performed by the components described above (e.g., elements, resources, etc.), unless otherwise indicated, the terminology used to describe such components is intended to correspond to any component (functionally equivalent) that performs the specific function of the described component, even if it is not structurally equivalent to the disclosed structure. Furthermore, although specific features of this disclosure may have been disclosed with respect to only one of several implementations, such features may be combined with one or more other features of other implementations, as may be desired and advantageous to any given or particular application. Moreover, with regard to the terms “comprising,” “owning,” “having,” “having,” or variations thereof as used in this disclosure, such terms are intended to be inclusive in a manner similar to the term “including.”

[0086] Other embodiments of this disclosure will readily occur to those skilled in the art upon consideration of the specification and practice of the utility model disclosed herein. This application is intended to cover any variations, uses, or adaptations of this disclosure that follow the general principles of this disclosure and include common knowledge or customary techniques in the art not disclosed herein.

[0087] It should be understood that this disclosure is not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this disclosure is limited only by the appended claims.

Claims

1. A heat dissipating device, characterized by, include: A first channel has an evaporation zone and a condensation zone arranged in sequence. The evaporation zone is used to conduct heat to vaporize the heat exchange medium, and the condensation zone is used to liquefy the vaporized heat exchange medium. The second channel is connected to the first channel and forms a fluid loop for the heat exchange medium. The second channel is provided with a capillary structure layer. The third channel is connected to the first channel and forms a fluid loop for the heat exchange medium. The third channel is equipped with a booster pump, which is used to drive the flow of the heat exchange medium in the third channel.

2. The heat dissipating device according to claim 1, wherein The heat dissipation device also includes a control unit; The control unit is electrically connected to the booster pump. The control unit is used to control the booster pump to turn on or off. When the booster pump is on, the heat exchange medium flows into the evaporation zone through the second channel and the third channel. When the booster pump is off, the heat exchange medium flows into the evaporation zone through the second channel.

3. The heat dissipating device of claim 2, wherein The control unit includes a temperature sensor and a control circuit. The temperature sensor is located in the first channel and acquires the temperature measurement value. The control circuit is electrically connected to the temperature sensor and the booster pump respectively. The control circuit is used to control the booster pump to turn on or off based on the temperature measurement value.

4. The heat dissipating device according to claim 3, wherein The control circuit is used to control the booster pump to start in response to the measured temperature value being greater than or equal to a preset temperature; and The control circuit is used to control the booster pump to shut down in response to the temperature measurement value being less than the preset temperature.

5. The heat dissipating device of claim 3, wherein The temperature sensor is located in the evaporation zone.

6. The heat dissipating device of claim 1, wherein The two ends of the second channel are connected to the evaporation zone and the condensation zone, respectively.

7. The heat dissipating device according to claim 6, wherein The two ends of the third channel are connected to the evaporation zone and the condensation zone, respectively.

8. The heat dissipating device of claim 1, wherein, The booster pump includes a liquid inlet, a liquid outlet, a pump chamber, and a diaphragm; Both the liquid inlet and the liquid outlet are connected to the third channel; The diaphragm covers the pump chamber and is used to change the volume of the pump chamber. The liquid inlet and the liquid outlet are both connected to the pump chamber. The liquid inlet is used to control the heat exchange medium to enter the pump chamber in one direction, and the liquid outlet is used to control the heat exchange medium to exit the pump chamber in one direction.

9. The heat dissipating device of claim 1, wherein, The second channel is also equipped with a trough; The channel is used to guide the heat exchange medium in the second channel.

10. The heat dissipating device of claim 9, wherein, The channel is disposed on the inner side wall of the second channel, and the capillary layer covers the opening side of the channel.

11. The heat dissipating device according to any one of claims 1 to 10, wherein The heat dissipation device also includes a first cover and a second cover; The first cover and / or the second cover are provided with cavities, and the first cover and the second cover are interlocked to form the first channel, the second channel and the third channel.

12. The heat dissipating device of claim 11, wherein, The heat dissipation device also includes a mounting section; The edge of the first cover protrudes beyond the edge of the second cover, and the protruding portion of the edge of the first cover forms the mounting portion, which is used to fix the heat dissipation device to the electronic device.

13. An electronic device, comprising: include: The heat dissipation device according to any one of claims 1 to 12.

14. The electronic device of claim 13, wherein, The electronic device also includes a frame; The end of the heat dissipation device is connected to the inner sidewall of the frame.

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