Integrated shielding cover heat dissipation structure

Abstract

This utility model discloses an integrated shielding cover heat dissipation structure, including a main shell with mounting holes, and several heat dissipation blocks disposed on the outer surface of the shielding cover, avoiding the mounting holes. Adjacent heat dissipation blocks are interconnected. The fins on the heat dissipation blocks are conical, so that the thickness of the fins gradually decreases from the end in contact with the main shell to the top. This utility model forms multiple closed ring heat dissipation blocks by opening grooves in the metal plate, with the sides serving as fins. This arrangement of the heat dissipation blocks in a honeycomb pattern enhances the structural strength of the shielding cover. The fins are processed into conical surfaces, gradually thinning from the main shell to the top, maintaining the heat dissipation surface area while accelerating the heat exchange between heat and air, improving heat dissipation efficiency. The connecting holes between the heat dissipation blocks improve airflow and further optimize heat dissipation performance. Compared with the traditional honeycomb heat dissipation structure, the improved shielding cover structure is more robust, the fins are less prone to deformation, and the heat dissipation effect is significantly improved.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation technology for signal shielding covers, and in particular to an integrated heat dissipation structure for shielding covers. Background Technology

[0002] A "shielding cover" typically refers to a component used in electronic devices, primarily to prevent electromagnetic interference (EMI) or radio frequency interference (RFI). During the design and manufacturing of electronic devices, measures are often taken to reduce or eliminate these interferences to ensure normal operation and stable performance. The shielding cover effectively blocks external electromagnetic waves from entering the device or prevents electromagnetic waves generated inside the device from leaking out, thereby protecting sensitive components on the circuit board. Furthermore, the heat dissipation structure on the shielding cover primarily helps dissipate heat from critical components in the electronic device, ensuring that the device's operating temperature remains within a safe range.

[0003] The shielding cover and its heat dissipation structure are usually machined as a single piece. To meet structural strength requirements, most shielding covers sacrifice the thermal conductivity of the heat dissipation structure. For example, a honeycomb heat dissipation structure is formed on the shielding cover through machining. Although this structure provides the necessary strength, it results in poor heat dissipation due to poor air circulation. Therefore, to ensure the overall structural strength of the shielding cover, its thickness is usually thicker than that of traditional fins, further affecting heat dissipation performance. Utility Model Content

[0004] The purpose of this section is to outline some aspects of embodiments of the present invention and to briefly describe some preferred embodiments. Simplifications or omissions may be made in this section, as well as in the abstract and title of this application, to avoid obscuring the purpose of these documents; however, such simplifications or omissions should not be construed as limiting the scope of the present invention.

[0005] To address the aforementioned problems, this utility model provides the following technical solution: The integrated shielding cover heat dissipation structure includes a shielding cover, a main housing, and mounting holes; Several heat sinks are disposed on the outer surface of the shielding cover and are avoided from the mounting holes. Adjacent heat sinks are interconnected. The fins on the heat sinks are tapered so that the thickness of the fins gradually decreases from the end in contact with the main housing to the top.

[0006] Based on the above technical solution, the present invention can be further improved as follows.

[0007] As a preferred embodiment of the integrated shielding cover heat dissipation structure of this utility model, the fins are provided with heat dissipation holes, and the heat dissipation holes are close to the end of the fins that contacts the main housing.

[0008] As a preferred embodiment of the integrated shielding cover heat dissipation structure of this utility model, there is a heat dissipation area between adjacent fins, and the bottom width of the heat dissipation area is smaller than the top width of its heat dissipation area.

[0009] As a preferred embodiment of the integrated shielding cover heat dissipation structure of this utility model, the bottom surface is the outer surface of the main shell between adjacent fins.

[0010] As a preferred embodiment of the integrated shielding cover heat dissipation structure of this utility model, the mounting holes of the main housing are opened on the outer surface of the main housing outside the heat sink and / or on the outer surface of the main housing between adjacent fins.

[0011] In a preferred embodiment of the integrated shielding cover heat dissipation structure of this utility model, the top of the heat dissipation block is a slope.

[0012] The beneficial effects of this utility model are as follows: By opening grooves in the metal plate to form multiple closed ring-shaped heat dissipation blocks, with their sides serving as fins similar to traditional heat dissipation fins, the heat dissipation blocks are arranged in a honeycomb pattern, enhancing the structural strength of the shielding cover. The fins are processed into conical surfaces, gradually thinning from the main shell to the top, maintaining the heat dissipation surface area while accelerating the heat exchange between heat and air, improving heat dissipation efficiency. The connecting holes between the heat dissipation blocks improve airflow, further optimizing heat dissipation performance. Compared with the traditional honeycomb heat dissipation structure, the improved shielding cover structure is more robust, the fins are less prone to deformation, and the heat dissipation effect is significantly improved. Attached Figure Description

[0013] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. Among them: Figure 1 This is a perspective view of the entire embodiment.

[0014] Figure 2 This is an example. Figure 1 A partial schematic diagram.

[0015] Figure 3 This is an example. Figure 1 Top view.

[0016] Figure 4 This is an example. Figure 1 Partial cross-sectional view.

[0017] Figure 5 This is an example. Figure 1 Partial cross-sectional view.

[0018] Figure 6 This is an example. Figure 5 Partial 3D view.

[0019] Figure 7 This is an example. Figure 6 Shape diagram of the heat dissipation area.

[0020] In the figure; shielding cover 100, main housing 101, mounting hole 101a, heat sink 102, heat dissipation hole 102a, inclined surface 102b; Fin 102-1, conical surface 102-1a, heat dissipation area 102-2, bottom surface 102-2a, top surface 102-2b. Detailed Implementation

[0021] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings.

[0022] Many specific details are set forth in the following description in order to provide a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Those skilled in the art can make similar extensions without departing from the spirit of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0023] Secondly, the term "an embodiment" or "embodiment" as used herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The phrase "in one embodiment" appearing in different places in this specification does not necessarily refer to the same embodiment, nor is it a single or selective embodiment that excludes other embodiments.

[0024] Example Reference Figures 1 to 7 This is an embodiment of the present utility model, which provides an integrated shielding cover heat dissipation structure, including a shielding cover 100, a main housing 101, and a mounting hole 101a; Several heat sinks 102 are disposed on the outer surface of the shielding cover 100 and are avoided from the mounting holes 101a. Adjacent heat sinks 102 are interconnected. The fins 102-1 on the heat sink 102 are tapered surfaces 102-1a, so that the thickness of the fin 102-1 at the end in contact with the main housing 101 gradually decreases to its top. Specifically, to meet the overall structural strength requirements of the shielding cover, a metal plate is used to create multiple closed-loop heat sink 102 structures by creating corresponding grooves in the metal plate. The sides of the heat sink 102, i.e., the fins 102-1, serve the same heat dissipation function as traditional heat sink fins. This process connects the heat sinks 102 together in a honeycomb structure as shown in the figure, which strengthens the overall structural strength of the shielding cover 100. At the same time, the fins 102-1 of the heat sink 102 are processed into conical surfaces 102-1a, making the fins 102-1 thinner from the main shell 101 to its top. This maintains the heat dissipation surface area of ​​the heat sink 102, while the thinner thickness facilitates rapid heat exchange with the air, improving heat dissipation efficiency. In addition, the interconnection between the heat sinks 102 improves airflow, which is also beneficial for heat dissipation. Compared with the traditional shield cover heat dissipation structure, the improved shield cover and heat dissipation structure are more robust, and the fins are less likely to bend or deform during processing, transportation and installation. At the same time, by connecting the heat dissipation blocks 102 with openings to improve air flow and by processing the fins 102-1 of the heat dissipation block 102 into a conical surface 102-1a, the heat dissipation effect of the improved shield cover heat dissipation structure is improved. In summary, the improved shielding cover heat dissipation structure forms multiple closed-ring heat dissipation blocks 102 by cutting a single metal plate, and connects these heat dissipation blocks 102 in series to form a honeycomb structure. The side of each heat dissipation block 102 is designed with conical fins 102-1, which gradually thin from the main shell 101 to the top to increase the heat dissipation surface area and promote heat exchange. At the same time, the heat dissipation blocks 102 are interconnected through openings 102-2 to enhance air circulation, thereby significantly improving the overall structural strength and heat dissipation efficiency. For example, such as Figure 1 , Figure 2 As shown, in order to achieve interconnection between adjacent heat sinks 102, the fins 102-1 are provided with heat dissipation holes 102a, and the heat dissipation holes 102a are close to the end of the fins 102-1 that contacts the main housing 101. Since the thickness is thicker closer to the end of the main housing 101, the heat dissipation holes 102a are opened here to connect the heat sinks 102, improve the heat dissipation effect by allowing air circulation, and do not affect the stability of the fins 102-1. After all, opening the heat dissipation holes 102a on the top of the thinner fins 102-1 can easily cause them to bend and deform. It is worth mentioning that opening the heat dissipation holes 102a closer to the end of the main housing 101 can also support a larger aperture of the heat dissipation holes 102a, which can be opened as waist-shaped holes to improve air flow. In summary, the design location of the heat dissipation hole 102a is crucial. If the hole is placed on top of the thinner fin 102-1, it can easily cause the fin to bend or deform, affecting overall heat dissipation performance and structural integrity. Placing the heat dissipation hole 102a in a thicker area not only avoids these problems but also allows for larger aperture designs, such as oblong holes. This increases airflow path and volume, further improving heat dissipation efficiency. For example, such as Figures 5-7 As shown, the bottom surface 102-2a is the outer surface of the main shell 101 between adjacent fins 102-1. There is a heat dissipation area 102-2 between adjacent fins 102-1. The width of the bottom surface 102-2a of the heat dissipation area 102-2 is smaller than the width of its top surface 102-2b. Since the thickness of the fins 102-1 gradually decreases from the top of the main shell 101, the bottom width of the heat dissipation area 102-2 between adjacent fins 102-1 will be smaller than the top surface 102-2b. During heat exchange, the air in the heat dissipation area 102-2 can conduct heat more quickly due to the wider opening, allowing cooler air to enter the heat dissipation area 102-2 and exchange heat with the fins 102-1 and the outer surface of the main shell 101 between adjacent fins 102-1, thereby improving the heat dissipation efficiency of the fins 102-1 and the outer surface of the main shell 101 between adjacent fins 102-1. In summary, the wider top surface 102-2b and the narrower bottom surface 102-2a form a flared structure, which can more effectively guide air into the heat dissipation area 102-2. When hot air is quickly expelled, cold air can quickly replenish it and exchange heat with the outer surfaces of the fins 102-1 and the main housing 101, thereby improving the overall heat dissipation effect. For example, such as Figure 1 , Figure 2 As shown, in order to avoid the heat sink 102 from the mounting hole 101a, the mounting hole 101a of the main housing 101 is opened on the outer surface of the main housing 101 outside the heat sink 102 and / or on the outer surface of the main housing 101 between adjacent fins 102-1. This processing flow can be achieved by first processing and engraving the heat sink 102 on the metal plate, and then opening the mounting hole 101a at the corresponding position on the metal plate. In this embodiment, as Figure 1 , Figure 4 As shown, the top of the heat sink 102 is a slope 102b. The heat sinks 102 with slopes 102b are distributed on the outer ring of the entire heat sink 102 assembly, and the slopes are inclined towards the middle of the heat sink 102 assembly, so that the entire heat sink 102 assembly gradually increases in height from the outside to the inside. This is conducive to natural wind covering the entire heat sink 102 assembly, and its purpose is to improve the heat dissipation effect of the heat sink 102 and the uniform heat dissipation effect. In summary, the design of the sloping surface 102b makes the outer ring of the heat sink 102 assembly higher than the inner ring, forming a natural slope. This slope helps guide airflow from the bottom to the top, increasing the airflow speed and volume. The enhanced natural convection can more effectively remove heat from the heat sink 102, thereby improving the overall heat dissipation efficiency. The sloping surface design allows air to cover the entire heat sink 102 assembly more evenly, avoiding the problem of localized overheating.

[0025] It is important to note that the constructions and arrangements of this application shown in several different exemplary embodiments are merely illustrative. Although only a few embodiments are described in detail in this disclosure, those who consult this disclosure will readily understand that many modifications are possible (e.g., changes in the size, dimensions, structure, shape and proportion of various elements, as well as parameter values ​​(e.g., temperature, pressure, etc.), mounting arrangements, use of materials, color, orientation, etc.) without substantially departing from the novel teachings and advantages of the subject matter described in this application). For example, an element shown as integrally formed may be composed of multiple parts or elements, the position of elements may be inverted or otherwise altered, and the nature or number or position of discrete elements may be changed or altered. Therefore, all such modifications are intended to be included within the scope of this utility model. The order or sequence of any process or method steps may be changed or reordered according to alternative embodiments. In the claims, any "device plus function" clause is intended to cover the structure described herein that performs the function, and not only structural equivalents but also equivalent structures. Without departing from the scope of this invention, other substitutions, modifications, alterations, and omissions may be made in the design, operation, and arrangement of the exemplary embodiments. Therefore, this invention is not limited to the specific embodiments, but extends to various modifications that still fall within the scope of the appended claims.

[0026] Furthermore, in order to provide a concise description of exemplary embodiments, not all features of actual embodiments (i.e., those features that are not relevant to the best mode of carrying out the present invention as currently considered, or those features that are not relevant to implementing the present invention) may be omitted.

[0027] It should be noted that the above embodiments are only used to illustrate the technical solution of this utility model and are not intended to limit it. Although this utility model has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solution of this utility model without departing from the spirit and scope of the technical solution of this utility model, and all such modifications or substitutions should be covered within the scope of the claims of this utility model.

Claims

1. An integrated shielded lid heat dissipation structure, characterized by: Includes a shielding cover (100), a main housing (101), the main housing (101) being provided with mounting holes (101a) and; Several heat sinks (102) are disposed on the outer surface of the shielding cover (100) and avoid the mounting holes (101a). Adjacent heat sinks (102) are interconnected. The fins (102-1) on the heat sinks (102) are tapered surfaces (102-1a) so that the thickness of the fins (102-1) at the end in contact with the main housing (101) gradually decreases to its top.

2. The one-piece shielded lid heat dissipation structure of claim 1, wherein: The fin (102-1) is provided with heat dissipation holes (102a), and the heat dissipation holes (102a) are close to the end of the fin (102-1) that contacts the main shell (101).

3. The one-piece shielded lid heat dissipation structure of claim 1, wherein: There is a heat dissipation area (102-2) between adjacent fins (102-1), and the width of the bottom surface (102-2a) of the heat dissipation area (102-2) is smaller than the width of its top surface (102-2b).

4. The one-piece shield cover heat sink structure of claim 3, wherein: The bottom surface (102-2a) is the outer surface of the main shell (101) between adjacent fins (102-1).

5. The one-piece shielded lid heat dissipation structure of claim 4, wherein: The mounting holes (101a) of the main housing (101) are opened on the outer surface of the main housing (101) outside the heat sink (102) and / or between the adjacent fins (102-1) on the outer surface of the main housing (101).

6. The integrated shielding cover heat dissipation structure as described in claim 1, characterized in that: The top of the heat sink (102) is a slope (102b).

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