Cooling device and liquid cooling system

Abstract

This application relates to the field of heat dissipation equipment technology, disclosing a cooling device and liquid cooling system. The cooling device includes a main body, a coil, multiple heat sinks, and a heat-conducting component. The main body is positioned above ground, and the coil is mounted on the main body for fluid flow. Multiple heat sinks are spaced apart on the main body and contact the coil, absorbing heat from the fluid within the coil. The heat-conducting component is buried underground and has a heat-conducting connection extending above ground. The heat-conducting connection is fixedly connected to the heat sinks, transferring heat from the heat sinks to the ground through the heat-conducting connection and the heat-conducting component. This method improves the heat dissipation capacity of the cooling device.

Description

Technical Field

[0001] This application relates to the field of heat dissipation equipment technology, specifically to a cooling device and liquid cooling system. Background Technology

[0002] Data centers are core facilities for the centralized storage, processing, and distribution of data, supporting critical businesses such as cloud computing, AI, finance, and the internet. Data centers typically deploy a large number of high-power devices, requiring efficient cooling solutions to dissipate heat promptly, ensuring stable equipment operation and extending equipment lifespan. Currently, data centers primarily rely on external cooling devices to transfer heat to the external environment, such as dry coolers and cooling towers.

[0003] Specifically, the cooling system is equipped with coils for fluid circulation. The fluid absorbs heat generated by the data center. As the heat-absorbing fluid flows through the coils, the ambient air can carry away the heat through heat exchange, or water evaporation can be used to remove the heat from the fluid within the coils via spraying or wet curtains. However, regardless of the method used, the overall heat dissipation capacity of the cooling system is limited, and this capacity directly affects the overall cooling effect of the data center. Therefore, improving the heat dissipation capacity of cooling systems of the same volume has been a continuous challenge for the industry. Utility Model Content

[0004] In view of the above problems, embodiments of this application provide a cooling device and a liquid cooling system for improving the heat dissipation capacity of the cooling device.

[0005] According to one aspect of the embodiments of this application, a cooling device is provided, comprising: a main body disposed above ground; a coil disposed on the main body for supplying fluid; a plurality of heat sinks disposed at intervals on the main body and in contact with the coil, the heat sinks for absorbing heat from the fluid in the coil; and a heat-conducting element buried below ground, the heat-conducting element having a heat-conducting connection extending above ground, the heat-conducting connection being connected to the heat sinks, and the heat from the heat sinks being conducted to the ground through the heat-conducting connection and the heat-conducting element.

[0006] In one alternative approach, the heat-conducting element is in the form of a plate and is laid flat and buried underground.

[0007] In one alternative embodiment, the heat sink is elongated, with multiple heat sinks arranged horizontally, and each heat sink extending vertically downwards or inclined downwards, with the end of the heat sink facing the ground connected to a heat-conducting connection.

[0008] In one alternative embodiment, the heat-conducting connector is plate-shaped and inserted vertically downwards into the ground. The bottom of the heat-conducting connector is fixedly connected to the heat-conducting component, and the top of the heat-conducting connector simultaneously supports and fixes multiple heat sinks.

[0009] In one alternative embodiment, each heat sink has multiple through holes spaced apart along its extension direction; the coil includes multiple heat exchange pipes extending in a horizontal direction, and the heat exchange pipes are inserted into the through holes on the multiple heat sinks, the multiple heat exchange pipes are arranged along the extension direction of the heat sinks, and the outer peripheral surface of the heat exchange pipes is in contact with the inner peripheral sidewall of the through holes.

[0010] In one alternative embodiment, the coil further includes an inlet pipe and an outlet pipe, which are disposed on the same side of the integral formed by the multiple heat sinks in the horizontal direction, and the extension direction of the inlet pipe and the outlet pipe is parallel to the extension direction of the heat sinks; the heat exchange pipe includes a first heat exchange pipe and a second heat exchange pipe, one end of the first heat exchange pipe is connected to the inlet pipe, the other end of the first heat exchange pipe is connected to one end of the second heat exchange pipe, and the other end of the second heat exchange pipe is connected to the outlet pipe.

[0011] In one alternative approach, the end of the inlet pipe facing the ground is provided with an inlet for fluid to enter the coil for heat dissipation; the end of the outlet pipe away from the ground is provided with an outlet for the cooled fluid to exit the coil.

[0012] In one alternative approach, both the heat-conducting component and the heat-conducting connection are made of metal.

[0013] In an alternative embodiment, the cooling device further includes a fan assembly disposed on the main body, which drives airflow through the gaps between the heat sinks to remove heat from the heat sinks and coils.

[0014] According to another aspect of the embodiments of this application, a liquid cooling system is provided. The liquid cooling system includes a cabinet, a cooling distribution unit, and a cooling device as described in any of the above. The cabinet and the cooling distribution unit are connected through a first pipe, and the cooling device and the cooling distribution unit are connected through a second pipe. The cabinet is used to house coolant and electronic equipment to absorb heat from the electronic equipment through the coolant. The cooling device is used to dissipate heat from the heat exchange fluid. The first pipe is used to allow coolant to flow between the cabinet and the cooling distribution unit. The second pipe is used to allow heat exchange fluid to flow between the cooling device and the cooling distribution unit. The cooling distribution unit is used to allow heat exchange between the heat exchange fluid and the coolant that has absorbed heat to reduce the temperature of the coolant.

[0015] In this embodiment, the heat sink is first brought into contact with the coil, allowing the heat from the fluid inside the coil to be conducted to the heat sink through the coil wall for heat dissipation. Then, the heat sink is connected to a heat-conducting component buried underground via a thermally conductive connection, allowing the heat from the heat sink to be conducted underground through the connection and the component. The soil, a natural cold source, is then used to dissipate heat from the heat sink, thus improving the cooling capacity of the cooling device.

[0016] The above description is only an overview of the technical solution of this application. In order to better understand the technical means of this application and to implement it in accordance with the contents of the specification, and to make the above and other objects, features and advantages of this application more obvious and understandable, specific embodiments of this application are given below. Attached Figure Description

[0017] Various other advantages and benefits will become apparent to those skilled in the art upon reading the following detailed description of preferred embodiments. The accompanying drawings are for illustrative purposes only and are not intended to limit the scope of this application. Furthermore, the same reference numerals denote the same parts throughout the drawings. In the drawings:

[0018] Figure 1 A perspective view of the cooling device provided in an embodiment of the present invention is shown;

[0019] Figure 2 This is a perspective view of the cooling device provided in an embodiment of the present invention.

[0020] Figure 3 This diagram shows the structure of the cooling device provided in this embodiment after installation.

[0021] Figure 4 A cross-sectional view of the cooling device provided in an embodiment of the present invention is shown.

[0022] The reference numerals in the detailed embodiments are as follows:

[0023] 1. Cooling device; 2. Ground;

[0024] 10. Main body; 20. Coil; 30. Heat sink; 40. Thermal conductive component; 50. Fan assembly;

[0025] 21. Heat exchange pipe; 211. First heat exchange pipe; 212. Second heat exchange pipe; 22. Liquid inlet pipe; 221. Liquid inlet; 23. Liquid outlet pipe; 231. Liquid outlet; 24. Bend pipe;

[0026] 31. Through hole;

[0027] 41. Thermally conductive connection part. Detailed Implementation

[0028] The embodiments of the technical solution of this application will now be described in detail with reference to the accompanying drawings. These embodiments are only used to more clearly illustrate the technical solution of this application and are therefore merely examples, and should not be used to limit the scope of protection of this application.

[0029] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains; the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the application; the terms “comprising” and “having”, and any variations thereof, in the specification, claims, and foregoing description of the drawings are intended to cover non-exclusive inclusion.

[0030] In the description of the embodiments of this application, technical terms such as "first" and "second" are used only to distinguish different objects and should not be construed as indicating or implying relative importance or implicitly specifying the number, specific order, or primary and secondary relationship of the indicated technical features. In the description of the embodiments of this application, "multiple" means two or more, unless otherwise explicitly defined.

[0031] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0032] In the description of the embodiments in this application, the term "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent three cases: A exists, A and B exist simultaneously, and B exists. In addition, the character " / " in this document generally indicates that the related objects before and after it have an "or" relationship.

[0033] In the description of the embodiments of this application, the term "multiple" refers to two or more (including two), similarly, "multiple groups" refers to two or more (including two groups), and "multiple pieces" refers to two or more (including two pieces).

[0034] In the description of the embodiments of this application, the technical terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of this application and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.

[0035] In the description of the embodiments of this application, unless otherwise expressly specified and limited, technical terms such as "installation," "connection," "joining," and "fixing" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. For those skilled in the art, the specific meaning of the above terms in the embodiments of this application can be understood according to the specific circumstances.

[0036] Data centers can dissipate heat using immersion liquid cooling systems. These systems include server racks, cooling distribution units, and cooling units. Both the racks and cooling units are connected to the cooling distribution unit via piping. Coolant circulates between the racks and the cooling distribution unit through piping, while heat exchange fluid circulates between the cooling units and the cooling distribution unit through piping. The data center equipment is immersed in the coolant within the racks, absorbing heat generated by the data center. The cooled coolant then exchanges heat with heat exchange fluids (such as water or air) in the cooling distribution unit to lower its temperature. After heat exchange, the heat exchange fluid dissipates heat through the cooling units and then returns to the cooling distribution unit through piping to exchange heat with the coolant again.

[0037] Taking a dry cooler as an example, the cooling device is equipped with coils and a fan. When the heat exchange fluid passes through the coils, the fan enhances the airflow near the cooling device, causing the air to flow over the surface of the coils and carry away the heat from the heat exchange fluid inside. However, air has a relatively small heat capacity; even a small amount of heat absorbed will cause the air temperature to rise. Furthermore, air has a poor thermal conductivity, meaning its heat transfer efficiency is low, and it easily forms localized high-temperature zones after absorbing heat. This results in the air near the cooling device remaining at a high temperature after absorbing heat from the heat exchange fluid. At this point, the temperature difference between the air and the heat exchange fluid is small, and the heat exchange effect between them is poor. The air cannot effectively carry away the heat from the heat exchange fluid, meaning the cooling device has a poor heat dissipation effect on the heat exchange fluid.

[0038] Since the heat exchange fluid needs to return to the cooling distribution unit to exchange heat with the coolant after dissipating heat in the cooling device, if the heat exchange fluid cannot dissipate heat effectively, it will directly affect the heat exchange efficiency between the coolant and the heat exchange fluid in the cooling distribution unit, resulting in poor cooling effect of the coolant, thus affecting the heat dissipation of the data center.

[0039] Based on this, in order to improve the heat dissipation capacity of the cooling device, this application provides a cooling device. The cooling device is provided with heat sinks that are in contact with the coil. The heat sinks are connected to a heat-conducting component that is pre-buried in the ground through a heat-conducting structure. When the heat exchange fluid passes through the coil, the heat of the heat exchange fluid can be conducted to the heat-conducting component through the heat sinks and the heat-conducting structure, and the heat-conducting component will conduct the heat to the ground to achieve heat dissipation of the heat exchange fluid.

[0040] Because soil has a relatively large heat capacity, it heats up less when absorbing the same amount of heat. This characteristic makes soil a natural "constant-temperature cold source," allowing it to exchange heat with the heat-conducting components in a more stable manner, thereby effectively improving the heat dissipation capacity of the cooling device.

[0041] Please see Figure 1 , Figure 2 and Figure 3 , Figure 1 and Figure 2 The three-dimensional structure of the cooling device is shown from two different perspectives. Figure 3 The structure of the cooling device after installation is shown. The cooling device 1 includes a main body 10, a coil 20, multiple heat sinks 30, and a heat-conducting element 40. The main body 10 is installed above the ground 2. The coil 20 is installed on the main body 10 and is used for fluid flow. Multiple heat sinks 30 are spaced apart on the main body 10 and in contact with the coil 20. The heat sinks 30 are used to absorb heat from the fluid inside the coil 20. The heat-conducting element 40 is buried below the ground 2 and has a heat-conducting connection 41 extending above the ground 2. The heat-conducting connection 41 is connected to the heat sinks 30, and the heat from the heat sinks 30 is conducted to the ground 2 through the heat-conducting connection 41 and the heat-conducting element 40.

[0042] A coil 20 is a device used for heat exchange between fluids or gases inside and outside a pipe. It is typically formed by arranging metal tubes (such as copper, stainless steel, titanium, etc.). Specifically, the coil 20 can be arranged horizontally (i.e.,...). Figure 2 It can extend in a serpentine pattern (as shown by the X-axis), or it can extend in a vertical direction (i.e., along the X-axis). Figure 2(In the direction shown by the Y-axis) it extends in a serpentine shape. Of course, in order to improve the fluid handling capacity of the cooling device 1, the coil 20 can also be composed of multiple heat exchange pipes 21 that extend in the direction shown by the X-axis and are arranged in the direction shown by the Y-axis, or extend in the direction shown by the Y-axis and are arranged in the direction shown by the X-axis, so as to provide multiple heat dissipation paths to the fluid through multiple heat exchange pipes 21.

[0043] The heat sink 30 is used to increase the surface area of ​​the cooling device 1 in contact with the air, thereby improving the heat dissipation capacity of the cooling device, that is, improving the heat exchange efficiency between the fluid inside the coil 20 and the air in the external environment. Specifically, the heat sink 30 can be as follows: Figure 4 The coil 20 is inserted into the heat sink 30 through a through hole 31, as shown in the diagram. The inner circumferential surface of the through hole 31 is in contact with the outer circumferential surface of the coil 20. When fluid passes through the coil 20, heat can be transferred to the heat sink 30 through the coil wall. Figure 4 The cross-sectional structure of the cooling device is shown.

[0044] Of course, the heat sink 30 can also be configured such that its surface is in contact with the wall of the coil 20, for example, Figure 2 The coil 20 shown in the view is formed by extending in a serpentine manner along the Y-axis, or it is composed of multiple pipes arranged along the Y-axis. In this case, multiple heat sinks 30 can be arranged on the outside of the coil 20 along the X-axis or Y-axis, and the surface of the heat sink 30 is made to fit in contact with the wall of the coil 20, so that the fluid in the coil 20 conducts heat through the wall of the coil 20 to the heat sink 30, and dissipates heat through the heat sink 30.

[0045] Furthermore, since the heat-conducting component 40 is buried underground, the heat on the heat sink 30 needs to be conducted downwards through the heat-conducting connection 41 to reach the heat-conducting component 40. To prevent the heat sinks 30 from interfering with each other during heat transfer, such as... Figure 2 and Figure 4 As shown, the heat sink 30 can be elongated, and multiple heat sinks 30 are arranged in a horizontal direction (i.e., the direction shown by the X-axis in the figure). Each heat sink 30 extends vertically downward or inclined downward, and the end of the heat sink 30 facing the ground 2 is connected to the heat-conducting connection part 41.

[0046] During the operation of cooling device 1, such as Figure 2 As shown, firstly, the heat on each heat sink 30 will flow along... Figure 2 The heat is conducted downwards in the direction indicated by the dashed arrow to the bottom of the heat sink 30, and then through the connection point between the bottom of the heat sink 30 and the thermally conductive connection 41, the heat is conducted to the thermally conductive connection 41. The heat on the thermally conductive connection 41 then continues to travel downwards... Figure 2The heat continues downwards in the direction indicated by the dashed arrow to the heat-conducting component 40, and finally the heat is conducted to the ground through the heat-conducting component 40. In this structure, the heat from each heat sink 30 can be conducted to the heat-conducting component 40 through different paths, and the heat sinks 30 are less likely to interfere with each other during the heat transfer process, thus improving the efficiency of the heat sinks 30 in conducting heat to the heat-conducting component 40.

[0047] The heat-conducting component 40 is used to conduct heat from the heat sink 30 to the ground 2, and dissipates heat from the heat sink 30 through heat exchange with the soil or rock below the ground 2. The heat-conducting component 40 can be used as follows: Figure 1 As shown, it is plate-shaped, and as Figure 3 As shown, the heat-conducting component 40 is laid flat and buried under the ground 2. This not only ensures that the heat-conducting component 40 is in full contact with the soil or rock under the ground 2, but also ensures that all positions on the buried heat-conducting component 40 are at the same depth under the ground 2. The appropriate burial depth can be selected according to the characteristics of the soil or rock under the ground 2 (for example, the position where the soil or rock temperature is the lowest under the ground 2, or the position where the soil or rock under the ground 2 has good heat dissipation capacity and low construction difficulty, etc.). This allows all positions on the buried heat-conducting component 40 to have good heat dissipation capacity, thereby improving the heat dissipation effect of the cooling device 1.

[0048] Furthermore, the flatly arranged heat-conducting components 40 can also serve as the foundation of the cooling device 1, providing a certain degree of support and improving its stability. Specifically, for example... Figure 2 and Figure 3 As shown, the heat-conducting connection part 41 is plate-shaped and vertically inserted into the ground 2. The bottom of the heat-conducting connection part 41 is fixedly connected to the heat-conducting component 40, and the top of the heat-conducting connection part 41 simultaneously supports and fixes multiple heat sinks 30. The bottom of the heat-conducting connection part 41 can be fixed to the heat-conducting component 40 by welding, threaded connection, or other methods. When the heat-conducting connection part 41 is connected to the heat-conducting component 40, the heat-conducting component 40 will provide an upward supporting force to the heat-conducting connection part 41, enabling the heat-conducting connection part 41 to stably support the heat sinks 30, thereby improving the stability of the cooling device 1.

[0049] As another implementation method, the heat-conducting component 40 can also be buried in the ground 2 vertically or inclined downwards. This allows it to be directly driven into the ground 2, thereby reducing the construction area and the amount of construction work. In addition, to ensure the heat conduction capacity of the heat-conducting component 40 and the heat-conducting connection part 41, the heat-conducting component 40 and the heat-conducting connection part 41 can be made of metal materials, such as copper, aluminum, and other metals with high thermal conductivity.

[0050] In the above embodiment, the heat sink 30 is first brought into contact with the coil 20, allowing the heat of the fluid inside the coil 20 to be conducted to the heat sink 30 through the wall of the coil 20 for heat dissipation. Then, the heat sink 30 is connected to the heat-conducting component 40 buried under the ground 2 through the heat-conducting connection 41, allowing the heat on the heat sink 30 to be conducted to the ground 2 through the heat-conducting connection 41 and the heat-conducting component 40, and utilizing the natural cold source of the soil in the earth to dissipate heat from the heat sink 30, thereby improving the heat dissipation capacity of the cooling device 1.

[0051] Furthermore, in order to improve the heat dissipation capacity of the cooling device 1, in some embodiments, such as Figure 2 and Figure 4 As shown, each heat sink 30 has multiple through holes 31 spaced apart along its extension direction, and the coil 20 includes multiple horizontal (i.e., Figure 2 A heat exchange pipe 21 extends in the direction shown by the X-axis, and the heat exchange pipe 21 is inserted into the through hole 31 on multiple heat sinks 30. Multiple heat exchange pipes 21 are arranged along the extension direction of the heat sinks 30, and the outer peripheral surface of the heat exchange pipe 21 is in contact with the inner peripheral sidewall of the through hole 31.

[0052] by Figure 2 The heat exchange pipe 21 shown in the view (i.e. Figure 4 Taking the heat exchange pipe 21 located on the left side in the shown view as an example, the heat sinks 30 are arranged along the X-axis, and each heat sink 30 has multiple through holes 31 arranged along the Y-axis. The through holes 31 on the multiple heat sinks 30 are aligned with each other along the X-axis. The heat exchange pipe 21 is as follows: Figure 2 As shown, through holes 31 pass through multiple heat sinks 30 along the X-axis direction, and different heat exchange pipes 21 are as follows: Figure 4 The devices are inserted into different through holes 31 on the same heat sink 30.

[0053] When the fluid flows through the heat exchange pipe 21 along the direction shown by the X-axis, the fluid can not only exchange heat with multiple heat sinks 30 through the pipe wall of the heat exchange pipe 21, thus fully dissipating heat, but also the heat exchange pipe 21 can contact the heat sinks 30 by adhering to the inner circumferential surface of the through hole 31. When the fluid passes through the heat sink 30, the fluid can exchange heat with the heat sink 30 through the pipe wall at any position on the heat exchange pipe 21, so that the fluid in the heat exchange pipe 21 can dissipate heat evenly.

[0054] Furthermore, in order to enable the fluid within the heat exchange pipe 21 to dissipate heat more effectively, in some embodiments, such as Figure 2 and Figure 3As shown, the coil 20 also includes an inlet pipe 22 and an outlet pipe 23. The inlet pipe 22 and the outlet pipe 23 are arranged on the same side of the overall structure formed by the multiple heat sinks 30 in the horizontal direction, and the extending directions of the inlet pipe 22 and the outlet pipe 23 are parallel to the extending directions of the heat sinks 30. The heat exchange pipe 21 includes a first heat exchange pipe 211 and a second heat exchange pipe 212. One end of the first heat exchange pipe 211 is connected to the inlet pipe 22, and the other end of the first heat exchange pipe 211 is connected to one end of the second heat exchange pipe 212. The other end of the second heat exchange pipe 212 is connected to the outlet pipe 23.

[0055] Specifically, the inlet pipe 22 is provided with an inlet 221, which is used to allow fluid to enter the coil 20 for heat dissipation, and the outlet pipe 23 is provided with an outlet 231, which is used to allow the cooled fluid to exit the coil 20. Figure 2 Taking the structure shown as an example, the inlet pipe 22 and the outlet pipe 23 are located on the right side of the whole formed by multiple heat sinks 30. After the fluid enters the inlet pipe 22 from the inlet port 221, it needs to flow back and forth at least once in the direction shown by the X-axis before it can reach the outlet pipe 23 and be discharged from the outlet port 231 on the outlet pipe 23. In this way, the fluid can fully exchange heat with the heat sinks 30 during the back and forth flow, ensuring the heat dissipation effect of the fluid and thus improving the heat dissipation capacity of the cooling device 1.

[0056] As an example, such as Figure 2 As shown, the coil 20 is arranged with multiple layers of heat exchange pipes 21 from bottom to top. Assuming that the odd-numbered heat exchange pipes 21 are the first heat exchange pipes 211 and the even-numbered heat exchange pipes 21 are the second heat exchange pipes 212, the fluid enters the inlet pipe 22 from the inlet port 221, first enters the first heat exchange pipe 211 and flows in the negative X-axis direction. During the flow, the fluid exchanges heat with the heat sink 30 through the pipe wall of the first heat exchange pipe 211. Then, it enters the second heat exchange pipe 212 from the curved pipe 24 on the left side of the cooling device 1 and flows to the outlet pipe 23 in the positive X-axis direction. During the flow, the fluid will further exchange heat with the heat sink 30 through the pipe wall of the second heat exchange pipe 212. Finally, it is discharged from the outlet port 231 of the outlet pipe 23. This ensures that the fluid dissipates heat fully through the pipe walls of the first heat exchange pipe 211 and the second heat exchange pipe 212 during the flow. Of course, the heat exchange pipes 21 with even-numbered layers can be used as the first heat exchange pipes 211, and the heat exchange pipes 21 with odd-numbered layers can be used as the second heat exchange pipes 212.

[0057] Furthermore, in order to enable the fluid to dissipate heat evenly, in some embodiments, such as Figure 2 and Figure 3As shown, the inlet 221 can be located at the end of the inlet pipe 22 facing the ground 2, and the outlet 231 can be located at the end of the outlet pipe 23 away from the ground 2. After the fluid enters the inlet pipe 22 through the inlet 221, if the fluid enters the heat exchange pipe 21 located below for heat dissipation, the heat sink 30 can transfer a large amount of heat to the heat-conducting connection 41 and the heat-conducting component 40, and dissipate heat through the soil or rock below the ground 2; if the fluid enters the heat exchange pipe 21 located above for heat dissipation, the fluid needs to be cooled by... Figure 3 The fluid flows in the direction indicated by the dashed arrow in the liquid inlet pipe 22. During this process, the fluid can first conduct some of the heat to the air in the external environment through the side wall of the liquid inlet pipe 22, and then enter the heat exchange pipe 21 to exchange heat with the heat sink 30.

[0058] In the above structure, Figure 2 The heat exchange pipe 21 located at the bottom can dissipate a large amount of heat through the heat sink 30 and the heat-conducting connection part 41, while Figure 2 The heat exchange pipe 21 located at the top can first dissipate some heat through the liquid inlet pipe 22, and then dissipate the remaining heat through the heat sink 30 and the heat-conducting connection part 41. This ensures that the fluid in the coil 20 can dissipate heat evenly, so that when the fluid reaches the cooling distribution unit and exchanges heat with the coolant, it can evenly carry away the heat of the coolant, thus ensuring uniform heat dissipation of the coolant. In addition, the liquid outlet 231 is located at the end of the liquid outlet pipe 23 away from the ground 2, so that the fluid needs to flow to the end of the liquid outlet pipe 23 away from the ground 2 before it can be discharged from the liquid outlet 231. Compared with the structure where the liquid outlet 231 is located at the end facing the ground 2, it can avoid the fluid being discharged only by gravity. Figure 2 The flow inside the heat exchange pipe 21 located below helps to improve the utilization rate of the cooling device 1.

[0059] Furthermore, in order to improve the heat dissipation capacity of the cooling device 1, in some embodiments, such as Figure 3 As shown, the cooling device 1 also includes a fan assembly 50, which is disposed on the main body 10. The fan assembly 50 is used to drive airflow into the gap between the heat sinks 30 so as to remove heat from the heat sinks 30 and the coils 20 by airflow.

[0060] As an example, such as Figure 3As shown, coils 20 and heat sinks 30 are provided on both the left and right sides of the main body 10, while the fan assembly 50 is located on the top of the main body 10. The fan assembly 50 drives air upwards; that is, during the operation of the fan assembly 50, the air inside the main body 10 is driven upwards by the fan assembly 50 and discharged to the outside of the main body 10. At this time, the air on the left and right sides will pass through the gaps between the heat sinks 30 and enter the interior of the main body 10 to replenish the air inside the main body 10. When the air passes through the heat sinks 30, it will come into contact with the surfaces of the heat sinks 30 and the coils 20, thereby carrying away some of the heat from the heat sinks 30 and the coils 20. Of course, the fan assembly 50 can also be provided in other positions on the main body 10, for example, on the left and right sides of the main body 10, to enhance the horizontal airflow.

[0061] In the above embodiments, by setting the fan assembly 50, the airflow is enhanced, allowing air to pass through the gaps between the heat sinks 30 and carry away some of the heat from the heat sinks 30 and the coil 20, effectively improving the cooling device 1's heat dissipation capacity for the fluid.

[0062] According to another aspect of the embodiments of this application, a liquid cooling system is provided, comprising a cabinet, a cooling distribution unit, and a cooling device as described in any of the above embodiments. The cabinet is connected to the cooling distribution unit via a first pipe, and the cooling device is connected to the cooling distribution unit via a second pipe. The cabinet is used to house the coolant and electronic equipment to absorb heat from the electronic equipment through the coolant. The cooling device is used to dissipate heat from the heat exchange fluid.

[0063] The first pipe is used for the flow of coolant between the cabinet and the cooling distribution unit, and the second pipe is used for the flow of heat exchange fluid between the cooling unit and the cooling distribution unit. The cooling distribution unit is used for heat exchange between the heat exchange fluid and the coolant that has absorbed heat, in order to reduce the temperature of the coolant.

[0064] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and not to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. These modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application, and they should all be covered within the scope of the claims and specification of this application. In particular, as long as there is no structural conflict, the various technical features mentioned in the embodiments can be combined in any way. This application is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. Cooling device, characterized in that The cooling device includes: The main body is set on the ground; A coil is provided on the main body, and the coil is used to supply fluid; Multiple heat sinks are spaced apart on the main body and in contact with the coil, the heat sinks being used to absorb the heat of the fluid inside the coil; A heat-conducting component is buried under the ground. The heat-conducting component is provided with a heat-conducting connection portion extending above the ground. The heat-conducting connection portion is connected to the heat sink. The heat of the heat sink is conducted to the ground through the heat-conducting connection portion and the heat-conducting component.

2. The cooling device according to claim 1, characterized in that, The heat-conducting component is plate-shaped and laid flat and buried under the ground.

3. The cooling device according to claim 2, characterized in that, The heat sink is elongated and arranged horizontally, with each heat sink extending vertically downwards or inclined downwards. The end of the heat sink facing the ground is connected to the heat-conducting connection part.

4. The cooling device according to claim 3, characterized in that, The heat-conducting connection part is plate-shaped and is inserted vertically downward into the ground. The bottom of the heat-conducting connection part is fixedly connected to the heat-conducting component, and the top of the heat-conducting connection part simultaneously supports and fixes multiple heat sinks.

5. The cooling device according to claim 3, characterized in that, Each heat sink is provided with a plurality of through holes spaced apart along its extending direction; The coil includes multiple heat exchange pipes extending along the horizontal direction, and the heat exchange pipes are inserted into the through holes on multiple heat sinks. The multiple heat exchange pipes are arranged along the extension direction of the heat sinks, and the outer peripheral surface of the heat exchange pipes is in contact with the inner peripheral sidewall of the through hole.

6. The cooling device according to claim 5, characterized in that, The coil also includes an inlet pipe and an outlet pipe, which are arranged on the same side of the integral formed by the plurality of heat sinks in the horizontal direction, and the extending directions of the inlet pipe and the outlet pipe are parallel to the extending direction of the heat sinks. The heat exchange pipeline includes a first heat exchange pipeline and a second heat exchange pipeline. One end of the first heat exchange pipeline is connected to the liquid inlet pipeline, and the other end of the first heat exchange pipeline is connected to one end of the second heat exchange pipeline. The other end of the second heat exchange pipeline is connected to the liquid outlet pipeline.

7. The cooling device according to claim 6, characterized in that, The liquid inlet pipe is provided with a liquid inlet at one end facing the ground, and the liquid inlet is used to allow fluid to enter the coil for heat dissipation. The liquid outlet pipe is provided with a liquid outlet at the end away from the ground, and the liquid outlet is used to discharge the cooled fluid from the coil.

8. The cooling device according to claim 1, characterized in that, Both the heat-conducting component and the heat-conducting connection are made of metal.

9. The cooling device according to claim 1, characterized in that, The cooling device further includes a fan assembly disposed on the main body. The fan assembly is used to drive airflow through the gaps between the heat sinks to remove heat from the heat sinks and the coils.

10. A liquid cooling system, characterized in that, The liquid cooling system includes a cabinet, a cooling capacity distribution unit, and a cooling device as described in any one of claims 1 to 9. The cabinet is connected to the cooling capacity distribution unit via a first pipe, and the cooling device is connected to the cooling capacity distribution unit via a second pipe. The cabinet is used to house the coolant and electronic equipment, so as to absorb the heat of the electronic equipment through the coolant; The cooling device is used to dissipate heat from the heat exchange fluid; The first pipe is used to supply the coolant to flow between the cabinet and the cooling distribution unit; The second pipe is used to allow the heat exchange fluid to flow between the cooling device and the cold energy distribution unit; The cooling capacity distribution unit is used to allow the heat exchange fluid and the coolant that has absorbed heat to exchange heat, thereby reducing the temperature of the coolant.

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