Heat dissipation device, heat dissipation system and electronic device

Abstract

A heat dissipation device, heat dissipation system, and electronic device are disclosed. The heat dissipation device includes a first support component, a second support component, and a third support component stacked sequentially, with the three support components enclosing a liquid channel for the flow of a cooling working fluid. The first support component includes a first base layer, a first barrier layer, and a second base layer stacked sequentially, with the stiffness of the first barrier layer being greater than that of the first and second base layers; and / or, the second support component includes a third base layer, a second barrier layer, and a fourth base layer stacked sequentially, with the stiffness of the second barrier layer being greater than that of the third and fourth base layers. In this embodiment, both the first and second support components can form a "rigid-flexible composite" interface through their respective base layers and barrier layers, thereby preventing breakage or delamination during bending, improving the thermal cycle life of the heat dissipation device, and meeting reliability requirements.

Description

Technical Field

[0001] This application relates to the field of heat dissipation technology, specifically to a heat dissipation device, heat dissipation system, and electronic device. Background Technology

[0002] As foldable electronic devices become increasingly thinner, their internal space is further compressed, limiting their heat dissipation capabilities. When the device is under high load for extended periods, heat accumulation can lead to a significant increase in the device's surface temperature, which can also reduce device performance and user experience.

[0003] In the existing technology, heat dissipation of electronic devices generally adopts heat dissipation structures such as graphite sheets and heat spreaders. However, for foldable electronic devices, heat dissipation structures such as graphite sheets and heat spreaders are very easy to break or delaminate during the bending process of foldable electronic devices, resulting in poor reliability. Utility Model Content

[0004] In view of this, this application provides a heat dissipation device, heat dissipation system and electronic device to solve the problem in the prior art that heat dissipation structures such as graphite sheets and heat spreaders are prone to breakage or delamination during the bending process of foldable electronic devices, resulting in poor reliability.

[0005] This application provides a heat dissipation device, comprising: a first support component, a second support component, and a third support component stacked sequentially, wherein the first support component, the second support component, and the third support component enclose a liquid channel for the flow of a cooling working fluid. The first support component includes a first base layer, a first barrier layer, and a second base layer stacked sequentially, wherein the stiffness of the first barrier layer is greater than the stiffness of the first base layer and the second base layer; and / or, the second support component includes a third base layer, a second barrier layer, and a fourth base layer stacked sequentially, wherein the stiffness of the second barrier layer is greater than the stiffness of the third base layer and the fourth base layer.

[0006] In this embodiment, the first and second base layers with lower stiffness form a "rigid-flexible composite" interface with the first barrier layer with higher stiffness. Similarly, the third and fourth base layers with lower stiffness also form a "rigid-flexible composite" interface with the second barrier layer with higher stiffness. This avoids breakage or delamination during bending and enables the heat dissipation device to achieve a thermal cycle life of over 10 years within a temperature range of -40℃ to 125℃. 4 This meets the reliability requirements.

[0007] In one possible implementation, the neutral layer of the heat dissipation device is located within the first barrier layer; and / or, the neutral layer of the heat dissipation device is located within the second barrier layer. Wherein, the neutral layer of the first support component is located within the first barrier layer, ensuring that the first barrier layer is not subjected to either tensile or compressive stress during bending with the heat dissipation device, thereby effectively preventing the relatively stiff first barrier layer from breaking due to tensile or compressive stress during bending. The neutral layer of the second support component is located within the second barrier layer, ensuring that the second barrier layer is not subjected to either tensile or compressive stress during bending with the heat dissipation device, thereby effectively preventing the relatively stiff second barrier layer from breaking due to tensile or compressive stress during bending.

[0008] In one possible implementation, the first support component includes a first base layer, a first barrier layer, and a second base layer stacked sequentially, and the second support component includes a third base layer, a second barrier layer, and a fourth base layer stacked sequentially. The first base layer, the first barrier layer, the second base layer, the third support component, the fourth base layer, the second barrier layer, and the third base layer are stacked sequentially, and the second base layer, the third support component, and the fourth base layer enclose each other to form the liquid channel. By providing a first support component and a second support component with a "sandwich" structure on both sides of the liquid channel, breakage or delamination during bending can be avoided, enhancing the reliability of the heat dissipation device. Simultaneously, the first and second barrier layers improve the sealing effect on the cooling medium in the liquid channel, preventing leakage.

[0009] In one possible implementation, the third support component includes a first support layer and a second support layer. The first support layer is connected to the first support component, and the second support layer is connected to the second support component. The side of the first support layer facing away from the first support component is bonded to the side of the second support layer facing away from the second support component. The first support layer can be integrally formed with the first support component, and the second support layer can be integrally formed with the second support component. This facilitates the fabrication of both the first and second support layers. Furthermore, bonding the first and second support layers together ensures the reliability of the connection between the first and second support components, facilitates assembly, and improves the sealing effect of the liquid channel in terms of width.

[0010] In one possible implementation, a first adhesive groove is provided on the side of the first support layer facing away from the first support component; and / or, a second adhesive groove is provided on the side of the second support layer facing away from the second support component. The first and second adhesive grooves can constrain the adhesive, preventing it from flowing freely.

[0011] In one possible implementation, the third support component is integrally formed, which can improve structural reliability, reduce leakage paths, and improve sealing performance.

[0012] In one possible implementation, the third support component is integrally formed by a wet etching process, which simplifies the fabrication process of the third support component, improves the structural reliability of the third support component, and enables the fabrication of complex flow channels.

[0013] In one possible implementation, the thickness of the first barrier layer and / or the second barrier layer is greater than or equal to 3 μm and less than or equal to 50 μm. Within this thickness range, each barrier layer can be guaranteed to have good waterproof properties, while ensuring that the neutral layer of the heat dissipation device is located within the corresponding barrier layer to avoid stress-induced fracture of the barrier layer.

[0014] In one possible implementation, the thickness of the first base layer and / or the third base layer is greater than or equal to 5 μm and less than or equal to 20 μm. Within this thickness range, the first base layer and / or the third base layer can ensure that the heat dissipation device as a whole has good bendability, while improving buffering capacity and ensuring structural reliability.

[0015] In one possible implementation, the thickness of the second base layer and / or the fourth base layer is greater than or equal to 5 μm and less than or equal to 10 μm. Within this thickness range, the second base layer and / or the fourth base layer can ensure that the heat dissipation device as a whole has good bendability, while ensuring the reliability of the liquid channel structure and preventing collapse.

[0016] In one possible implementation, the heat dissipation device further includes a first waterproof layer, which is stacked on the side of the first support component away from the second support component; and / or, the heat dissipation device further includes a second waterproof layer, which is stacked on the side of the second support component away from the first support component. The first and / or second waterproof layers can further prevent leakage of the liquid working fluid, improving the sealing effect.

[0017] In one possible implementation, the thickness of the first waterproof layer and / or the second waterproof layer is greater than or equal to 5 μm and less than or equal to 30 μm. By making the first waterproof layer and / or the second waterproof layer within this thickness range, the first waterproof layer and / or the second waterproof layer can have a good water-blocking effect, while ensuring that the heat dissipation device as a whole has good bending characteristics.

[0018] In one possible implementation, the depth of the liquid channel is greater than or equal to 10 μm and less than or equal to 100 μm; the width of the liquid channel is greater than or equal to 50 μm and less than or equal to 500 μm. By ensuring the depth and width of the liquid channel meet these dimensional ranges, the fluidity and heat exchange effect of the liquid working fluid can be enhanced. The width of the liquid channel refers to... Figure 2 The width dimension shown is in the X direction, which is also the width direction of the heat dissipation device.

[0019] In one possible implementation, the first and second barrier layers are inorganic layers, while the first, second, third, and fourth base layers are organic layers. The inorganic layers have greater stiffness than the organic layers. Therefore, the less stiff first and second base layers form a "rigid-flexible composite" interface with the more stiff first barrier layer, and similarly, the less stiff third and fourth base layers also form a "rigid-flexible composite" interface with the more stiff second barrier layer. This avoids breakage or delamination during bending and enables the heat dissipation device to achieve a thermal cycle life of over 10 years within a temperature range of -40℃ to 125℃. 4 This meets the reliability requirements.

[0020] In one possible implementation, the materials of the first barrier layer and / or the second barrier layer are silicon dioxide, silicon nitride, aluminum oxide, ferric oxide, lithium phosphate, or nickel ferrite. These inorganic materials have high rigidity and good waterproof properties, ensuring the structural strength of the heat dissipation device while preventing leakage of liquid working fluid in the liquid channel, achieving a sealing effect. The materials of the first base layer, the second base layer, the third base layer, and / or the fourth base layer are polyethylene terephthalate, polyimide, polymethyl methacrylate, or polydimethylsiloxane. These organic materials have a breaking elongation that meets bending requirements, ensuring that the heat dissipation device will not break during the folding process of the electronic device. Thus, the first support component formed by combining the first barrier layer made of inorganic materials and the first and second base layers made of organic materials can ensure good bending characteristics while also ensuring good waterproof properties and structural stability. Similarly, the second support component formed by combining the second barrier layer made of inorganic materials and the third and fourth base layers made of organic materials also has similar technical effects to the first support component, and will not be described in detail here.

[0021] In one possible implementation, the third support component is made of an organic polymer material, which can provide effective support for the first and second support components while ensuring that the heat dissipation device as a whole has good bendability, thus ensuring structural reliability.

[0022] In one possible implementation, the material of the third support component is photosensitive polyimide, polyethylene terephthalate, polyimide, polymethyl methacrylate, or polydimethylsiloxane. These materials can ensure that the heat dissipation device as a whole has good bendability, while also ensuring that the third support component can provide good mechanical support function and ensure structural reliability.

[0023] Secondly, this application also provides a heat dissipation system, which includes a controller, a drive device, a liquid flow module, and the heat dissipation device provided in the first aspect of this application; the controller is used to control the drive device to start or stop; the pipes in the liquid flow module are connected to the liquid channels of the heat dissipation device to form a closed loop; the drive device is used to drive the fluid to circulate in the liquid flow module and the heat dissipation device.

[0024] The heat dissipation path of the heat source in this heat dissipation system is as follows: the heat from the heat source is conducted to the heat dissipation device, where it can exchange heat with the liquid working fluid. The working fluid absorbs the heat conducted from the heat source to the heat dissipation device. The driving device drives the liquid working fluid to flow continuously. When the liquid working fluid that has absorbed heat flows to an external heat dissipation device (such as a finned tube or a cold plate), it can exchange heat with the heat dissipation device, allowing the heat to be released to the external environment through the heat dissipation device. This heat dissipation system can achieve multi-level response based on a preset temperature gradient, and can achieve multi-level control of the driving device speed, reducing system power consumption by 30%-50%. The heat dissipation device also provides the technical effects corresponding to the heat dissipation device provided in the first aspect of this application, which will not be elaborated further here.

[0025] Thirdly, this application also provides an electronic device, which includes the heat dissipation system provided in the second aspect of this application. This electronic device has similar technical effects to the heat dissipation system provided in the second aspect of this application, and will not be described in detail here.

[0026] In one possible implementation, the electronic device is a foldable electronic device.

[0027] It should be understood that the above general description and the following detailed description are merely exemplary and do not limit this application. Attached Figure Description

[0028] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0029] Figure 1An exploded view of the heat dissipation device provided in the embodiments of this application;

[0030] Figure 2 This is a cross-sectional view of a heat dissipation device provided in one embodiment of this application;

[0031] Figure 3 A cross-sectional view of a heat dissipation device provided in another embodiment of this application;

[0032] Figure 4 A schematic diagram of the heat dissipation device provided in one embodiment of this application before the first support component and the second support component are combined;

[0033] Figure 5 A cross-sectional view of a heat dissipation device provided in another embodiment of this application;

[0034] Figure 6 A cross-sectional view of a heat dissipation device provided in another embodiment of this application;

[0035] Figure 7 This is a schematic diagram of the heat dissipation device provided in one embodiment of this application during the fabrication of the first support component;

[0036] Figure 8 This is a schematic diagram of the heat dissipation device provided in one embodiment of the present application during the fabrication of the organic layer;

[0037] Figure 9 This is a schematic diagram of the heat dissipation device provided in one embodiment of this application during the fabrication of the second support component;

[0038] Figure 10 A schematic diagram of a heat dissipation device provided in one embodiment of this application after the sacrificial layer has been removed;

[0039] Figure 11 A cross-sectional view of a heat dissipation device provided in another embodiment of this application.

[0040] Figure label:

[0041] 1-First support component; 11-First base layer; 12-Second base layer; 13-First barrier layer;

[0042] 2-Second support component; 21-Third base layer; 22-Fourth base layer; 23-Second barrier layer;

[0043] 3-Third support component; 31-First support layer; 311-First adhesive groove; 32-Second support layer; 321-Second adhesive groove;

[0044] 4-First waterproof layer;

[0045] 5-Second waterproof layer;

[0046] 6-Liquid channel; 61-First channel; 62-Second channel;

[0047] 7-Glue;

[0048] 8-Organic layer; 81-Sacrificial layer;

[0049] 9 - Mask; 91 - Exposure area; 92 - Non-exposure area;

[0050] 10-Glass substrate. Detailed Implementation

[0051] To better understand the technical solution of this application, the embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0052] It should be understood that the described embodiments are merely some, not all, of the embodiments in this application. All other embodiments obtained by those skilled in the art based on the embodiments in this application without inventive effort are within the scope of protection of this application.

[0053] The terminology used in the embodiments of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of this application. The singular forms “a,” “the,” and “the” used in the embodiments of this application and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise.

[0054] It should be understood that the term "and / or" used in this article is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Additionally, the character " / " in this article generally indicates that the preceding and following related objects have an "or" relationship.

[0055] In the description of this application, unless otherwise expressly specified and limited, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance; unless otherwise specified or explained, the term "multiple" refers to two or more; the terms "connected," "fixed," etc., should be interpreted broadly. For example, "connected" can be a fixed connection, a detachable connection, an integral connection, or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0056] With the rapid development of mobile communication technology, foldable electronic devices such as foldable phones and foldable tablets are becoming increasingly popular. Foldable electronic devices achieve the foldable characteristic of the screen through flexible display technology, thus providing a larger display area while maintaining portability.

[0057] To meet users' pursuit of ultimate performance, the application scenarios for foldable electronic devices are constantly expanding, including high-performance scenarios such as high-definition video playback, high frame rate gaming, high-resolution photography, and multi-tasking parallel processing. The central processing unit (CPU) and graphics processing unit (GPU) of mobile phones typically need to run at high frequencies to provide smooth computing and graphics processing capabilities. However, high-performance computing inevitably comes with high power consumption, causing a significant amount of heat to be generated in the chips and peripheral components.

[0058] As smart electronic devices evolve towards foldable, ultra-thin, and high-brightness displays, their internal space is further compressed, limiting heat dissipation capabilities. When a device operates under high load for extended periods, heat accumulation leads to a significant increase in surface temperature, a phenomenon known as "overheating." This not only affects the user's grip experience but may also trigger the device's temperature-controlled throttling mechanism, resulting in performance degradation and even impacting battery life and the long-term reliability of electronic components. Therefore, achieving efficient heat dissipation under high-performance demands presents a new challenge for the design of foldable electronic devices.

[0059] Specifically, the shortcomings of foldable electronic devices in terms of heat dissipation are mainly reflected in the following aspects:

[0060] First, the folding mechanisms such as hinges and the stacked design of flexible screens in foldable electronic devices make the layout of the motherboard and heat dissipation components more compact, making it difficult to directly adopt traditional heat dissipation solutions that use large-area graphite sheets or heat spreaders.

[0061] Secondly, during repeated folding of foldable electronic devices, heat dissipation materials such as thermal grease and metal heat sinks are prone to delamination or deformation due to mechanical stress, affecting heat conduction efficiency.

[0062] Third, for liquid cooling solutions, foldable electronic devices typically employ multi-layer thin-film encapsulation and waterproof coatings to protect the flexible screen and internal components. However, these structures hinder heat dissipation, and the cooling fluid in the liquid cooling solution can easily escape through micro-cracks in the bending area, leading to a decline in long-term reliability.

[0063] Among the challenges of using liquid cooling solutions, there are difficulties in achieving ultra-thin liquid cooling device structures and ensuring reliable bending systems. For example, when the thickness of the cooling device is compressed to the 100-150μm range, it is difficult to meet the mechanical reliability requirements of foldable electronic devices under repeated opening and closing at a bending radius of 1.6mm. Specifically, when the barrier layer material of the liquid cooling device is dynamically bent in an ultra-thin state, its strain value is prone to exceeding the elongation at break threshold, leading to structural failure.

[0064] In addition, conventional liquid cooling devices face technical bottlenecks in evaporation control when in ultra-thin form. Existing packaging technology is difficult to achieve micro-water loss control of less than 0.1mg per day while maintaining bending performance, and has a short service life requirement.

[0065] Furthermore, when liquid cooling heat dissipation devices use multi-layer heterogeneous material stacking, the interface stress concentration caused by the difference in thermal expansion coefficients of each layer is prone to interlayer delamination failure under dynamic bending conditions, which restricts the reliable application of multi-layer structures in folding devices.

[0066] This application provides an electronic device, which can be a foldable device or a non-foldable device. The electronic device can include, but is not limited to, televisions, mobile phones, computers, tablets, etc. When the electronic device is a foldable device, it can be, but is not limited to, foldable mobile phones, foldable tablets, rollable screen smartwatches, wearable medical devices with bendable heat dissipation devices, flexible in-vehicle control screens, etc. This embodiment does not limit the type of electronic device.

[0067] Electronic devices have a heat dissipation system that can dissipate heat from heat sources inside the electronic device. The heat source may include a system on chip (SoC), which integrates high-heat-generating components such as CPU, GPU, and modem. The heat source may also include baseband processors, radio frequency chips, etc.

[0068] The heat dissipation system includes a controller, a drive unit, a liquid flow module, and a heat dissipation device. The controller can be a control chip, which can integrate an analog-to-digital converter (ADC) acquisition module, a proportional-integral-derivative (PID) control algorithm unit, and a pulse width modulation (PWM) output interface to realize real-time processing of temperature signals and generation of execution commands.

[0069] This heat dissipation system can include a temperature sensor to detect ambient or equipment temperature and send a temperature signal to the controller. The temperature sensor can be a high-precision thermocouple (such as an NTC or PTC) or a micro-electro-mechanical system (MEMS) temperature sensor, with a measurement range of -40°C to 150°C and a resolution of ±0.1°C. The temperature sensor can be embedded in areas with high heat density, such as the core area of ​​a chip or a battery stack layer, and connected to the controller via printed circuit board (PCB) traces or flexible circuitry. The temperature sensor can be preset to a trigger threshold of 35°C and supports software calibration of multiple start-up temperatures (such as 35°C / 40°C / 45°C stepped control).

[0070] The controller is used to start or stop the drive unit. The drive unit can be a micro-pump (flow rate range 5-500 mL / min) driven by a piezoelectric or DC brushless motor. The micro-pump, liquid flow module, and heat dissipation device can be connected by piping to form a closed loop, for example, a closed-loop "racetrack-shaped" loop. The drive unit drives the fluid to circulate within the liquid flow module and the heat dissipation device. The liquid flow module has flow channels that connect to the liquid channels in the heat dissipation device via piping. The width of the flow channels in the liquid flow module is between 10 and 500 μm, thereby enhancing the flow and heat dissipation of the liquid working fluid.

[0071] The cooling system can have multiple response levels. For example, the cooling system can have the following three response levels:

[0072] Level 1 response: When the temperature detected by the temperature sensor is ≥35℃, the controller can activate the basic speed of the drive unit to start the circulation of the liquid working fluid.

[0073] Secondary response: When the temperature continues to rise above 40°C, the controller can increase the flow rate of the drive unit.

[0074] Level 3 response (also known as safety protection response): When the temperature sensor detects a temperature ≥50℃, the controller triggers an emergency cooling mode to make the drive unit run at full power and trigger an alarm.

[0075] The heat dissipation path of the heat source in this heat dissipation system is as follows: the heat from the heat source is conducted to the heat dissipation device, where it can exchange heat with the liquid working fluid. The working fluid absorbs the heat conducted from the heat source to the heat dissipation device. The driving device drives the liquid working fluid to flow continuously. When the liquid working fluid that has absorbed heat flows to an external heat dissipation device (such as a finned tube or a cold plate), it can exchange heat with the heat dissipation device, allowing the heat to be released to the external environment through the heat dissipation device.

[0076] This heat dissipation system can achieve multi-level response based on a preset temperature gradient, and can achieve multi-level control of the drive device speed, which can reduce system power consumption by 30%-50%.

[0077] In some embodiments, the heat dissipation system may also integrate a flow monitoring device, such as a Hall sensor or a differential pressure sensor, to provide real-time feedback of the flow data of the liquid working fluid to the control chip.

[0078] In some embodiments, the drive unit may include two or more micropumps so that if one micropump fails, another micropump can be replaced in a timely manner to ensure the reliability of system operation.

[0079] In some embodiments, the drive device may include a liquid level detection device, such as a capacitive liquid level sensor, to detect leakage of the liquid working fluid.

[0080] in, Figure 1 This is an exploded view of the heat dissipation device provided in the embodiments of this application. Figure 2 This is a cross-sectional view of a heat dissipation device provided in one embodiment of this application, such as... Figure 1 and Figure 2 As shown, the heat dissipation device includes a first support component 1, a second support component 2, and a third support component 3 stacked sequentially. The first support component 1, the second support component 2, and the third support component 3 enclose a liquid channel 6, which is used for the flow of a cooling medium. The cooling medium can be a liquid, such as water, ethanol, or oil, which have good heat exchange properties. The cooling medium can exchange heat during its flow to achieve a heat dissipation effect.

[0081] like Figure 2 As shown, the first support component 1 includes a first base layer 11, a first barrier layer 13, and a second base layer 12 stacked sequentially, wherein the stiffness of the first barrier layer 13 is greater than that of the first base layer 11 and the second base layer 12; and / or, the second support component 2 includes a third base layer 21, a second barrier layer 23, and a fourth base layer 22 stacked sequentially, wherein the stiffness of the second barrier layer 23 is greater than that of the third base layer 21 and the fourth base layer 22.

[0082] The first base layer 11, the first barrier layer 13, and the second base layer 12 are stacked sequentially to form a "sandwich" structure. The first barrier layer 13 is located between the first base layer 11 and the second base layer 12, and its stiffness is greater than that of the first base layer 11 and the second base layer 12. That is, the first base layer 11 and the second base layer 12 have lower stiffness than the first barrier layer 13, making them relatively flexible and adaptable to the bending of foldable electronic devices. The first barrier layer 13 can also be called a water-blocking material layer, which prevents leakage of liquid working fluid and can achieve a daily water loss of ≤0.1mg / day. In this embodiment, the less stiff first base layer 11 and the second base layer 12 form a "rigid-flexible composite" interface with the more stiff first barrier layer 13, which can prevent breakage or delamination during bending and achieve a thermal cycle life of more than 10°C within a temperature range of -40°C to 125°C. 4 This meets the reliability requirements.

[0083] like Figure 2 As shown, the structure of the second support component 2 can be similar to that of the first support component 1. The second support component 2 includes a third base layer 21, a second barrier layer 23, and a fourth base layer 22 stacked sequentially. The sequential stacking of the third base layer 21, the second barrier layer 23, and the fourth base layer 22 can form a "sandwich" stacked structure. The stiffness of the second barrier layer 23 is greater than that of the third base layer 21 and the fourth base layer 22. The third base layer 21 has a similar function to the first base layer 11, the fourth base layer 22 has a similar function to the second base layer 12, and the second barrier layer 23 has a similar function to the first barrier layer 13, which will not be described in detail here. In this embodiment, the first base layer 11, the first barrier layer 13, the second base layer 12, the third support component 3, the fourth base layer 22, the second barrier layer 23, and the third base layer 21 are stacked sequentially, and the second base layer 12, the third support component 3, and the fourth base layer 22 enclose a liquid channel 6.

[0084] In one embodiment, the thickness of the first barrier layer 13 and / or the second barrier layer 23 can be greater than or equal to 3 μm and less than or equal to 50 μm. Within this thickness range, each barrier layer can be guaranteed to have good waterproof properties, while ensuring that the neutral layer of the heat dissipation device is located within the corresponding barrier layer to avoid stress fracture of the barrier layer. The thickness of the first barrier layer 13 and the second barrier layer 23 refers to their dimensions in the thickness direction of the heat dissipation device, such as... Figure 2 The Z-direction is shown in the diagram. All "thickness" dimensions mentioned below refer to the thickness dimension in the Z-direction.

[0085] In one embodiment, the thickness of the first base layer 11 and / or the third base layer 21 can be greater than or equal to 5 μm and less than or equal to 20 μm. Within this thickness range, the first base layer 11 and / or the third base layer 21 can ensure that the heat dissipation device as a whole has good bendability, while improving the buffering capacity and ensuring structural reliability.

[0086] In one embodiment, the thickness of the second base layer 12 and / or the fourth base layer 22 can be greater than or equal to 5 μm and less than or equal to 10 μm. Within this thickness range, the second base layer 12 and / or the fourth base layer 22 can ensure that the heat dissipation device as a whole has good bendability, while ensuring the structural reliability of the liquid channel 6 and preventing collapse.

[0087] In one embodiment, the depth of the liquid channel 6 can be greater than or equal to 10 μm and less than or equal to 100 μm; the width of the liquid channel 6 can be greater than or equal to 50 μm and less than or equal to 500 μm. By ensuring that the depth and width of the liquid channel 6 meet the above-mentioned size ranges, the fluidity and heat exchange effect of the liquid working fluid can be enhanced. The width dimension of the liquid channel 6 refers to... Figure 2 The width dimension shown is in the X direction, which is also the width direction of the heat dissipation device.

[0088] In one embodiment, the first support component 1 includes a first base layer 11, a first barrier layer 13, and a second base layer 12 stacked sequentially. The second support layer 32 can be other membrane layers or combinations of membrane layers, for example, the second support layer 32 includes one or more organic layers. In other embodiments, the second support component 2 includes a third base layer 21, a second barrier layer 23, and a fourth base layer 22 stacked sequentially, while the first support component 1 can be other membrane layers or combinations of membrane layers, for example, the first support layer 31 includes one or more organic layers.

[0089] In this embodiment, the first barrier layer 13 and the second barrier layer 23 are inorganic layers, while the first base layer 11, the second base layer 12, the third base layer 21, and the fourth base layer 22 are organic layers. The inorganic layers have a higher stiffness than the organic layers. Therefore, the less stiff first base layer 11 and the second base layer 12 form a "rigid-flexible composite" interface with the more stiff first barrier layer 13, and similarly, the less stiff third base layer 21 and the fourth base layer 22 can also form a "rigid-flexible composite" interface with the more stiff second barrier layer 23. This avoids breakage or delamination during bending and enables the heat dissipation device to achieve a thermal cycle life of more than 10 cycles within a temperature range of -40℃ to 125℃. 4 This meets the reliability requirements.

[0090] In one embodiment, the material of the first barrier layer 13 and / or the second barrier layer 23 can be one of silicon dioxide, silicon nitride, aluminum oxide, ferric oxide, lithium phosphate, or nickel ferrite. These inorganic materials have high rigidity and good waterproof properties, which can ensure the structural strength of the heat dissipation device and prevent the liquid working fluid in the liquid channel 6 from leaking outward, achieving a sealing effect. The materials of the first base layer 11, the second base layer 12, the third base layer 21, and the fourth base layer 22 are all one of polyethylene terephthalate, polyimide, polymethyl methacrylate, or polydimethylsiloxane. These organic materials have a breaking elongation that meets the bending requirements, which can ensure that the heat dissipation device will not break during the folding process of the electronic device. Thus, the first support component 1 formed by the combination of the first barrier layer 13 made of inorganic materials and the first base layer 11 and the second base layer 12 made of organic materials can ensure good bending characteristics while also ensuring good waterproof properties and structural stability. Similarly, the second support component 2, which is formed by combining the second barrier layer 23 made of inorganic materials and the third base layer 21 and the fourth base layer 22 made of organic materials, also has similar technical effects to the first support component 1, and will not be described in detail here.

[0091] In this embodiment, a hollow liquid channel 6 exists between the first support component 1 and the second support component 2. During bending, the heat dissipation device can undergo significant deformation at the liquid channel 6. For ease of explanation, the bending of the heat dissipation device on the side containing the first support component 1 is taken as an example. During bending, the second base layer 12 of the first support component 1, closer to the liquid channel 6, is stretched, while the first base layer 11, farther from the liquid channel 6, is compressed. A neutral layer exists between the first base layer 11 and the second base layer 12. A neutral layer refers to a theoretical layer where the material experiences neither tensile nor compressive stress during bending deformation. Figure 2 As shown, since there is a first barrier layer 13 between the first base layer 11 and the second base layer 12, the neutral layer C1 of the first support component 1 of the heat dissipation device is located in the first barrier layer 13, so that the first barrier layer 13 does not bear tensile or compressive stress during the bending process of the heat dissipation device, thereby effectively preventing the first barrier layer 13 with large stiffness from breaking due to tensile or compressive stress during the bending process.

[0092] Since the first support assembly 1 and the second support assembly 2 are located on both sides of the liquid channel 6, during the bending process of the heat dissipation device, the third base layer 21 of the second support assembly 2, which is away from the liquid channel 6, will be stretched, while the fourth base layer 22 of the second support assembly 2, which is close to the liquid channel 6, will be compressed. A neutral layer will also exist between the third base layer 21 and the fourth base layer 22, meaning there are two neutral layers in the heat dissipation device. Because there is a second barrier layer 23 between the third base layer 21 and the fourth base layer 22, the neutral layer C2 of the second support assembly 2 can be located within the second barrier layer 23. This ensures that the second barrier layer 23 does not bear either tensile or compressive stress during the bending process of the heat dissipation device, effectively preventing the relatively stiff second barrier layer 23 from breaking due to tensile or compressive stress during bending.

[0093] The third support component 3 is located between the first support component 1 and the second support component 2, and can support the first support component 1 and the second support component 2 to ensure the structural stability of the liquid channel 6.

[0094] In one embodiment, the material of the third support component 3 can be an organic polymer material, which can provide effective support for the first support component 1 and the second support component 2 while ensuring that the heat dissipation device as a whole has good bendability, thus ensuring structural reliability.

[0095] In one embodiment, the material of the third support component 3 can be photosensitive polyimide, polyethylene terephthalate, polyimide, polymethyl methacrylate, or polydimethylsiloxane. These materials can ensure that the heat dissipation device as a whole has good bendability, while ensuring that the third support component 3 can provide good mechanical support function and ensure structural reliability.

[0096] Figure 3 A cross-sectional view of a heat dissipation device provided in another embodiment of this application, such as... Figure 3As shown, the third support component 3 may include a first support layer 31 and a second support layer 32. The first support layer 31 is connected to the first support component 1, and the second support layer 32 is connected to the second support component 2. The side of the first support layer 31 facing away from the first support component 1 and the side of the second support layer 32 facing away from the second support component 2 are bonded together by adhesive 7. The first support component 1 and the second support component 2 can be manufactured separately. The first support layer 31 can be formed during the manufacturing process of the first support component 1, and the second support layer 32 can be formed during the manufacturing process of the second support component 2. Adhesive 7 can then be filled between the first support layer 31 and the second support layer 32 to achieve the connection between the first support component 1 and the second support component 2 through bonding. A first channel 61 can be formed between the first support layer 31 and the first support component 1, and a second channel 62 can be formed between the second support layer 32 and the second support component 2. When the first support layer 31 and the second support layer 32 are bonded together, the first channel 61 and the second channel 62 are aligned with each other to form the aforementioned liquid channel 6 between the first channel 61 and the second channel 62.

[0097] The adhesive 7 between the first support layer 31 and the second support layer 32 can be a thermosetting adhesive. Thermosetting adhesive has the characteristics of high strength, high temperature resistance and good chemical stability, which can ensure the reliability of the connection between the first support layer 31 and the second support layer 32, and at the same time ensure good sealing performance.

[0098] Figure 4 This is a schematic diagram of the heat dissipation device provided in one embodiment of this application before the first support component 1 and the second support component 2 are combined. Figure 5 A cross-sectional view of a heat dissipation device provided in another embodiment of this application, such as... Figure 4 and Figure 5 As shown, a first adhesive groove 311 is provided on the side of the first support layer 31 facing away from the first support component 1; and / or, a second adhesive groove 321 is provided on the side of the second support layer 32 facing away from the second support component 2. Exemplarily, the first support layer 31 is provided with the first adhesive groove 311, and the second support layer 32 is provided with the second adhesive groove 321. When the first support component 1 and the second support component 2 are assembled together, the first adhesive groove 311 and the second adhesive groove 321 are aligned and connected. Adhesive 7 can be filled into both the first adhesive groove 311 and the second adhesive groove 321, such as... Figure 5As shown, when the first support component 1 and the second support component 2 are assembled together, the adhesive 7 in the first adhesive groove 311 and the adhesive 7 in the second adhesive groove 321 can be bonded together, thereby ensuring the reliability of the bonding between the first support layer 31 and the second support layer 32. Specifically, before bonding the first support layer 31 and the second support layer 32, the adhesive 7 can be pre-filled into the first adhesive groove 311 and the second adhesive groove 321, which can constrain the adhesive 7 and prevent it from flowing freely.

[0099] In one embodiment, such as Figure 5 As shown, the first support component 1 in the heat dissipation device includes a first base layer 11, a first barrier layer 13, and a second base layer 12 stacked sequentially. The second support component 2 includes a third base layer 21, a second barrier layer 23, and a fourth base layer 22 stacked sequentially. During the fabrication of this heat dissipation device, the first support component 1 and the second support component 2 can be fabricated separately. During the fabrication of the first support component 1 and the second support component 2, the corresponding first support layer 31 and second support layer 32 in the third support component 3 can be fabricated separately. Then, the first support layer 31 and the second support layer 32 can be bonded together to form the heat dissipation device. The fabrication processes of the first support component 1 and the second support component 2 are similar; the fabrication process of the first support component 1 will be used as an example for detailed explanation below.

[0100] The first support component 1 and the first support layer 31 can be manufactured by the following process:

[0101] Step S1: Spin-coating or slot-coating a flexible organic material, such as polyethylene terephthalate, polyimide, polymethyl methacrylate, or polydimethylsiloxane, onto the first glass substrate to form a first base layer 11. This first base layer 11 can serve as a buffer layer to alleviate thermal and bending stresses between the first glass substrate and the subsequent first barrier layer 13.

[0102] Step S2: Deposit a first barrier layer 13 made of inorganic material on the first base layer 11 by atomic layer deposition (ALD) or chemical vapor deposition (CVD). The inorganic material can be selected from materials such as silicon dioxide, silicon nitride, aluminum oxide, ferric oxide, lithium phosphate or nickel ferrite, etc., to prevent liquid working fluid from penetrating and enhance mechanical strength.

[0103] Step S3: Coat the side of the first barrier layer 13 away from the first base layer 11 with an organic material to form a second base layer 12. The material of the second base layer 12 may be the same as or different from the material of the first base layer 11. The material of the second base layer 12 may also be an organic material such as polyethylene terephthalate, polyimide, polymethyl methacrylate or polydimethylsiloxane. The second base layer 12 may serve as the inner wall of the liquid channel 6.

[0104] Step S4: A high-resolution mask is placed on the second substrate 12, and a portion of the liquid channel 6 (first channel 61) and the first adhesive tank 311 are formed by a patterning process. In this patterning process, ultraviolet light with a wavelength of 365nm can be used to irradiate the second substrate 12 covered by the mask, and the dose (the light energy received per unit area during the exposure of the second substrate 12) is 100-300mJ / cm². 2 After irradiation for a certain period of time, a development operation is performed, for example, using an alkaline solution such as tetramethylammonium hydroxide (TMAH) to remove the unexposed areas on the second substrate 12, thereby forming the first channel 61 and the first adhesive groove 311 structure. The portions of the second substrate 12 that were not removed on both sides of the first channel 61 form the first support layer 31, and the removed portions of the first support layer 31 form the first adhesive groove 311. Then, a drying operation can be performed, for example, curing the first support layer 31 at 50℃~150℃ to ensure structural stability.

[0105] Step S5: Precisely apply adhesive to the first adhesive groove 311 of the first support layer 31. The adhesive can be an epoxy thermosetting adhesive with a viscosity of 50 to 2000 cP. The amount of adhesive is controlled to be 90% to 110% of the volume of the first adhesive groove 311 to avoid overflow.

[0106] The preparation method of the second support component 2 and the second support layer 32 is the same as the preparation method of the first support component 1 and the first support layer 31. That is, a third base layer 21 can be prepared on the second glass substrate, a second barrier layer 23 made of inorganic material can be deposited on the third base layer 21, an organic material can be coated on the side of the second barrier layer 23 facing away from the third base layer 21 to form a fourth base layer 22, another part of the liquid channel 6 (second channel 62) and the second support layer 32 can be formed on the fourth base layer 22 by a patterning process, and a second glue groove 321 can be formed on the second support layer 32. Then, glue is dispensed in the second glue groove 321.

[0107] The first support component 1 and the second support component 2 can be prepared simultaneously.

[0108] Step S6: Align the first glass substrate and the second glass substrate. For example, an infrared device can be used to ensure the alignment accuracy of the first glass substrate and the second glass substrate, thereby ensuring high alignment accuracy of the first support component 1 on the first glass substrate and the second support component 2 on the second glass substrate. The tolerance of this alignment accuracy can be controlled within ±1.5μm, so that the first channel 61 and the second channel 62 have high alignment accuracy to form the liquid channel 6. The first adhesive tank 311 and the second adhesive tank 321 also have high alignment accuracy. During the alignment process of the first support component 1 and the second support component 2, the adhesive in the first adhesive tank 311 and the adhesive in the second adhesive tank 321 can bond with each other. Through a curing process, the adhesives in the first adhesive tank 311 and the second adhesive tank 321 can be bonded and cured into one piece. Among them, a stepped hot-press curing method can be used to bond and cure the adhesives in the first adhesive tank 311 and the second adhesive tank 321 into one piece, thereby ensuring that there are no gaps between the cured adhesive and the inner wall of the first adhesive tank 311 and the second adhesive tank 321, achieving complete cross-linking, shear strength ≥10Mpa, and ensuring reliable bonding.

[0109] In this embodiment, the use of a patterned molding process enables dimensional tolerance (also known as dimensional accuracy) control of the liquid channel 6 to ≤10μm. With the assistance of a mask, the corresponding channel can be integrally molded, supporting complex flow channel designs and enhancing service life. Simultaneously, the first barrier layer 13 and the second barrier layer 23 on both sides of the depth direction of the liquid channel 6 provide reliable sealing for the liquid working fluid. The adhesive on both sides of the width direction of the liquid channel 6 also provides reliable sealing at the interface between the first support layer 31 and the second support layer 32. Therefore, reliable sealing can be achieved around the liquid channel 6, preventing liquid working fluid leakage with a leakage rate ≤0.1mg / day.

[0110] Figure 6 A cross-sectional view of a heat dissipation device provided in another embodiment of this application, such as... Figure 6 As shown, the heat dissipation device may further include a first waterproof layer 4 and / or a second waterproof layer 5. The first waterproof layer 4 is stacked on the side of the first support component 1 away from the second support component 2, and the second waterproof layer 5 is stacked on the side of the second support component 2 away from the first support component 1. The first waterproof layer 4 and / or the second waterproof layer 5 can further prevent leakage of liquid working fluid and improve the sealing effect.

[0111] After step S6, the first glass substrate can be peeled off, and the first waterproof layer 4 can be attached to the side of the first base layer 11 opposite to the second base layer 12. Then, the second glass substrate can be peeled off, and the second waterproof layer 5 can be attached to the side of the third base layer 21 opposite to the fourth base layer 22. Finally, the heat dissipation device can be cut to the required size by a cutting process.

[0112] In one embodiment, the material of the first waterproof layer 4 and / or the second waterproof layer 5 may be, but is not limited to, materials such as parylene, polyvinylidene fluoride, or polyimide, which have good water-blocking properties.

[0113] In one embodiment, the thickness of the first waterproof layer 4 and / or the second waterproof layer 5 can be greater than or equal to 5 μm and less than or equal to 30 μm. By making the first waterproof layer 4 and / or the second waterproof layer 5 within this thickness range, the first waterproof layer 4 and / or the second waterproof layer 5 can have a good water-blocking effect, while ensuring that the heat dissipation device as a whole has good bending characteristics.

[0114] In one embodiment, the third support component 3 can be integrally formed, that is, the third support component 3 can be directly formed into a film layer with a certain thickness, without the need for bonding through the aforementioned first support layer 31 and second support layer 32, thereby simplifying the process.

[0115] In one embodiment, the third support component 3 can be integrally formed using a wet etching process. Exemplarily, the heat dissipation device can be fabricated using the following process:

[0116] Figure 7 This is a schematic diagram of the heat dissipation device provided in one embodiment of this application during the fabrication of the first support component 1. Steps S10 to S30 are referred to... Figure 7 .

[0117] Step S10: Spin-coating or slot-coating a flexible organic material, such as polyethylene terephthalate, polyimide, polymethyl methacrylate, or polydimethylsiloxane, onto the glass substrate to form a first base layer 11. This first base layer 11 can serve as a buffer layer to alleviate thermal and bending stresses between the first glass substrate and the subsequent first barrier layer 13.

[0118] Step S20: Deposit a first barrier layer 13 made of inorganic material on the first base layer 11 by atomic layer deposition (ALD) or chemical vapor deposition (CVD). The inorganic material can be selected from materials such as silicon dioxide, silicon nitride, aluminum oxide, ferric oxide, lithium phosphate or nickel ferrite, etc., to prevent liquid working fluid from penetrating and enhance mechanical strength.

[0119] Step S30: Coat the side of the first barrier layer 13 away from the first base layer 11 with an organic material to form a second base layer 12. The material of the second base layer 12 may be the same as or different from the material of the first base layer 11. The material of the second base layer 12 may also be an organic material such as polyethylene terephthalate, polyimide, polymethyl methacrylate or polydimethylsiloxane. The second base layer 12 may serve as the inner wall of the liquid channel 6.

[0120] Figure 8 This is a schematic diagram of the heat dissipation device provided in one embodiment of this application during the fabrication of the organic layer 8. The following step S40 is referred to Figure 8 .

[0121] In step S40, an organic layer 8 is spin-coated onto the second base layer 12. Then, the organic layer can be selectively removed and retained by sequentially applying a mask, exposure, and development. For example, based on the material properties of the organic layer 8, the exposed area 91 and unexposed area 92 on the mask 9 can expose only a portion of the organic layer 8. The exposed area on the organic layer 8 can serve as a sacrificial layer 81, which can be subsequently removed by the developing solution to form the liquid channel 6.

[0122] Figure 9 This is a schematic diagram of the heat dissipation device provided in one embodiment of this application during the fabrication of the second support component 2. Steps S50 to S70 are referred to... Figure 9 .

[0123] Step S50: Remove the mask and coat the fourth base layer 22 on the organic layer 8.

[0124] Step S60: Deposit inorganic material on the fourth base layer 22 to form a second barrier layer 23.

[0125] Step S70: Apply an organic material to the second barrier layer 23 to form a third base layer 21.

[0126] Figure 10 This is a schematic diagram of a heat dissipation device provided in an embodiment of this application after the sacrificial layer 81 has been removed. The following step S80 is referred to Figure 10 .

[0127] Step S80: The aforementioned sacrificial layer is dissolved by wet etching to form a closed liquid channel 6. The undissolved portions on both sides of the sacrificial layer form a third support component 3.

[0128] In this embodiment, the liquid channel 6 is directly formed by dissolving the sacrificial layer 81. The heat dissipation device can be formed via single-sided spin coating, simplifying the process and achieving a high yield rate (greater than 95%). This patterned forming process allows for dimensional tolerance (also known as dimensional accuracy) control of the liquid channel 6 to ≤10μm. It enables direct formation of the liquid channel 6 with the aid of a mask, supporting complex flow channel designs and enhancing service life. Furthermore, the first barrier layer 13 and the second barrier layer 23 on both sides of the depth direction of the liquid channel 6 provide reliable sealing for the liquid working fluid. The integrated third support component 3 on both sides of the width direction of the liquid channel 6 also provides reliable sealing, thus achieving reliable sealing around the liquid channel 6 and preventing liquid working fluid leakage with a leakage rate ≤0.1mg / day.

[0129] Figure 11 A cross-sectional view of a heat dissipation device provided in another embodiment of this application, such as... Figure 11 As shown, in this embodiment, the heat dissipation device may further include a first waterproof layer 4 and / or a second waterproof layer 5. The first waterproof layer 4 is stacked on the side of the first support component 1 away from the second support component 2, and the second waterproof layer 5 is stacked on the side of the second support component 2 away from the first support component 1. The first waterproof layer 4 and / or the second waterproof layer 5 can further prevent leakage of liquid working fluid and improve the sealing effect.

[0130] The above are merely preferred embodiments of this application and are not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A heat dissipating device, characterized by, include: A first support component, a second support component, and a third support component are stacked sequentially, and a liquid channel is formed between the first support component, the second support component, and the third support component. The liquid channel is used for the flow of cooling working fluid. The first support component includes a first base layer, a first barrier layer, and a second base layer stacked sequentially, wherein the stiffness of the first barrier layer is greater than the stiffness of the first base layer and the second base layer; and / or, The second support component includes a third base layer, a second barrier layer and a fourth base layer stacked in sequence, wherein the stiffness of the second barrier layer is greater than the stiffness of the third base layer and the fourth base layer.

2. The heat dissipating device according to claim 1, wherein The neutral layer of the heat dissipation device is located within the first barrier layer; and / or, The neutral layer of the heat dissipation device is located within the second barrier layer.

3. The heat dissipating device of claim 1, wherein The first support component includes a first base layer, a first barrier layer and a second base layer stacked in sequence; the second support component includes a third base layer, a second barrier layer and a fourth base layer stacked in sequence. The first base layer, the first barrier layer, the second base layer, the third support component, the fourth base layer, the second barrier layer, and the third base layer are stacked in sequence, and the liquid channel is formed by the enclosing of the second base layer, the third support component, and the fourth base layer.

4. The heat dissipating device according to any one of claims 1 to 3, characterized in that, The third support component includes a first support layer and a second support layer. The first support layer is connected to the first support component, and the second support layer is connected to the second support component. The side of the first support layer facing away from the first support component is bonded to the side of the second support layer facing away from the second support component.

5. The heat dissipating device of claim 4, wherein A first adhesive groove is provided on the side of the first support layer facing away from the first support assembly; and / or, A second adhesive groove is provided on the side of the second support layer that is opposite to the second support component.

6. The heat dissipating device according to any one of claims 1 to 3, wherein The third support component is integrally molded.

7. The heat dissipating device according to claim 6, wherein The third support component is integrally formed using a wet etching process.

8. The heat dissipating device of claim 1, wherein, The thickness of the first barrier layer and / or the second barrier layer is greater than or equal to 3 μm and less than or equal to 50 μm.

9. The heat dissipating device of claim 1, wherein, The thickness of the first base layer and / or the third base layer is greater than or equal to 5 μm and less than or equal to 20 μm.

10. The heat dissipating device of claim 1, wherein The thickness of the second base layer and / or the fourth base layer is greater than or equal to 5 μm and less than or equal to 10 μm.

11. The heat dissipating device of claim 1, wherein It also includes a first waterproof layer, which is stacked on the side of the first support assembly away from the second support assembly; and / or, The heat dissipation device further includes a second waterproof layer, which is stacked on the side of the second support component away from the first support component.

12. The heat dissipating device of claim 11, wherein, The thickness of the first waterproof layer and / or the second waterproof layer is greater than or equal to 5 μm and less than or equal to 30 μm.

13. The heat dissipating device of claim 1, wherein, The depth of the liquid channel is greater than or equal to 10 μm and less than or equal to 100 μm; the width of the liquid channel is greater than or equal to 50 μm and less than or equal to 500 μm.

14. The heat dissipating device of claim 1, wherein, The first barrier layer and the second barrier layer are inorganic layers, while the first base layer, the second base layer, the third base layer and the fourth base layer are organic layers.

15. The heat dissipating device of claim 14, wherein, The material of the first barrier layer and / or the second barrier layer is silicon dioxide, silicon nitride, aluminum oxide, ferric oxide, lithium phosphate, or nickel ferrite; The materials of the first base layer, the second base layer, the third base layer and / or the fourth base layer are polyethylene terephthalate, polyimide, polymethyl methacrylate or polydimethylsiloxane.

16. The heat dissipating device of claim 1, wherein The material of the third support component is an organic polymer material.

17. The heat dissipating device of claim 16, wherein, The material of the third support component is photosensitive polyimide, polyethylene terephthalate, polyimide, polymethyl methacrylate, or polydimethylsiloxane.

18. A heat dissipation system, characterized by, Includes a controller, a drive unit, a liquid flow module, and a heat dissipation device as described in any one of claims 1-17 of this application; The controller is used to control the start or stop of the drive device; The pipes within the liquid flow module are connected to the liquid channels of the heat dissipation device to form a closed loop. The driving device is used to drive the fluid to circulate in the liquid flow module and the heat dissipation device.

19. An electronic device, comprising: Includes the heat dissipation system as described in claim 18.

20. The electronic device of claim 19, wherein, The electronic device is a foldable electronic device.

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