Power conversion device and power supply apparatus

Abstract

This application provides a power conversion device and a power supply device including the power conversion device, relating to the field of power supply technology. The power conversion device includes a cold plate, a circuit board, a connecting structure, multiple electronic components, and one or more frames; the cold plate has cooling channels for coolant flow; a gap exists between the circuit board and the cold plate; multiple electronic components are located between the circuit board and the cold plate and fixed to the circuit board; one or more frames are located between the circuit board and the cold plate, each frame having one or more receiving cavities, one receiving cavity for accommodating at least one of the multiple electronic components, and the inner wall of one receiving cavity for connecting at least one electronic component; the connecting structure connects the cold plate and one or more frames.

Description

Technical Field

[0001] This application relates to the field of power supply technology, and in particular to a power conversion device and power supply equipment. Background Technology

[0002] Power conversion devices in power supply equipment can convert input electrical energy into power and then output it. Power conversion devices generate a lot of heat. If the power conversion devices cannot dissipate heat efficiently, it will affect the normal operation of the power conversion devices and power supply equipment.

[0003] In related technologies, cold plates are used to cool the power conversion device and control its temperature. However, the power conversion device contains a large number of electronic components, and the heat from many of these components cannot be effectively transferred to the cold plate. This results in poor heat dissipation by the cold plate, which still affects the normal operation of the power conversion device and the power supply equipment. Utility Model Content

[0004] This application provides a power conversion device and a power supply device including the power conversion device, which can improve the heat dissipation effect of the power conversion device and reduce the risk of the power conversion device failing to operate normally.

[0005] To achieve the above objectives, this application adopts the following technical solution:

[0006] A first aspect of this application provides a power conversion device, which includes a cold plate, a circuit board, a connecting structure, a plurality of electronic components, and one or more frames; the cold plate has a cooling channel for coolant flow; there is a gap between the circuit board and the cold plate; the plurality of electronic components are located between the circuit board and the cold plate and are fixed to the circuit board; one or more frames are located between the circuit board and the cold plate, each frame having one or more receiving cavities, one receiving cavity for receiving at least one of the plurality of electronic components, and the inner wall of one receiving cavity for connecting at least one electronic component; the connecting structure connects the cold plate and the one or more frames.

[0007] The power conversion device of a power supply equipment can convert input electrical energy into power through power devices and then output it. For example, when the power supply equipment is a charging device, the power conversion device can output the converted electrical energy to a charging gun, which can then charge the device to be charged (e.g., an electric vehicle). During the operation of the power conversion device, multiple electronic components generate heat. These components extend into their respective housings and connect to a frame, allowing heat to be transferred from the components to the frame. Furthermore, the frame is connected to a cold plate, transferring heat from the frame to the cold plate. In other words, by designing the frame to connect both the cold plate and the multiple electronic components, the cold plate can better cool the components, improving the heat dissipation effect of the power conversion device and reducing the risk of malfunction.

[0008] Furthermore, since the frame and the cold plate are two independent structures, fixing them together via a connecting structure allows for independent machining of the frame and cold plate, eliminating the need to mold them as a single unit (or the power converter's housing). Understandably, if the frame and cold plate were molded as a single unit, a die-casting process would be required to manufacture the cold plate with the frame, resulting in thicker walls for both the cold plate and the frame. This would negatively impact heat dissipation in the power converter, increase its weight, make installation difficult, and raise production costs. Therefore, machining the frame and cold plate independently and then fixing them together via a connecting structure allows for thinner walls for both the frame and cold plate, reducing the weight of the power converter, facilitating heat dissipation for multiple electronic components, and lowering manufacturing costs.

[0009] In one embodiment, each cavity is filled with insulating adhesive, and the insulating adhesive in one cavity is used to immerse at least a portion of at least one electronic component; the area of ​​the cross-section of at least one of the cavities facing the circuit board is greater than the area of ​​the cross-section facing away from the circuit board, and each cross-section is perpendicular to the arrangement direction of the cold plate and the circuit board.

[0010] Insulating adhesive is used to connect the frame and multiple electronic components, preventing the components from contacting the frame. When the frame is made of metal, this reduces the risk of short circuits through the components. Furthermore, at least one cavity has a larger cross-sectional area facing the circuit board, ensuring that the portion of each electronic component not submerged in the insulating adhesive is further from the frame, meeting safety distance requirements. Conversely, the smaller cross-sectional area of ​​the cavity facing away from the circuit board reduces the distance between the frame and each component, thus reducing the thickness of the insulating adhesive and facilitating heat transfer from the components within the cavity to the frame. Moreover, with a relatively uniform frame thickness, the smaller cross-sectional area of ​​the cavity facing away from the circuit board also reduces the amount of material used in the frame, lowering its cost and consequently reducing the production and processing costs of the power conversion device.

[0011] In one embodiment, the cross-sectional area of ​​at least one receiving cavity gradually increases in the direction from the cold plate to the circuit board.

[0012] This design allows for a larger cross-sectional area at the end of each receiving cavity facing the circuit board and a smaller cross-sectional area at the end facing away from the circuit board. Furthermore, the cross-sectional area of ​​the receiving cavity gradually increases in the direction from the cold plate to the circuit board; that is, the cross-sectional area of ​​the receiving cavity changes gradually in this direction, which is beneficial for the processing and manufacturing of the receiving cavity (e.g., using die casting to process and manufacture the frame and form the receiving cavity).

[0013] In one embodiment, at least one of the one or more enclosures includes a frame and a base plate. The frame forms one or more receiving cavities. The frame is fixed to the base plate. The base plate is located between the frame and the cold plate. The base plate covers at least one of the one or more receiving cavities. A connecting structure is located between the base plate and the cold plate. The connecting structure connects the base plate and the cold plate.

[0014] By placing the connecting structure between the frame and the cold-rolled steel plate, the base plate of the frame increases the connection area between them, facilitating a stable connection between the frame and the cold-rolled steel plate and reducing the likelihood of separation. Furthermore, fixing the frame to the base plate provides support, reducing the possibility of bending or damage and thus improving the overall strength of the frame.

[0015] In one embodiment, the power conversion device further includes one or more positioning elements; a frame is fixed with at least one of the one or more positioning elements, and the cold plate has one or more positioning holes; or, one or more positioning elements are fixed to the cold plate, and a frame has one or more positioning holes; a positioning element is used to be inserted into a positioning hole.

[0016] During the installation of the enclosure frame, if the positioning component is fixed to the enclosure frame and the positioning hole is located on the cold-rolled steel plate, then insert the positioning component on the enclosure frame into the positioning hole on the cold-rolled steel plate; if the positioning component is fixed to the cold-rolled steel plate and the positioning hole is located on the enclosure frame, then insert the positioning component on the cold-rolled steel plate into the positioning hole on the enclosure frame. Through the cooperation between the positioning component and the positioning hole, the position of the enclosure frame is determined, which facilitates the installation of the enclosure frame at the preset position on the cold-rolled steel plate and reduces the possibility of frame position deviation.

[0017] In one embodiment, the cooling channel includes a plurality of first flow channels and a plurality of second flow channels. The plurality of first flow channels are arranged along a first direction, and each first flow channel extends along a second direction. The first direction and the second direction are perpendicular to each other and both perpendicular to the arrangement direction of the cold plate and the circuit board. Two adjacent first flow channels are connected through a second flow channel. In the arrangement direction of the cold plate and the circuit board, a first flow channel faces at least one of the first or more receiving cavities.

[0018] Multiple first flow channels and multiple second flow channels form part of a cooling channel. In the arrangement direction of the cold plate and the circuit board, one first flow channel faces at least one receiving cavity. That is, in the arrangement direction of the cold plate and the circuit board, each first flow channel has at least one corresponding receiving cavity. Since coolant flows in the first flow channel, all electronic components in the receiving cavities corresponding to each first flow channel can be cooled by the coolant flowing through the first flow channel, which is beneficial for heat dissipation of multiple electronic components.

[0019] In one embodiment, each frame has multiple receiving cavities, and in the arrangement direction of the cold plate and the circuit board, at least two of the multiple receiving cavities face the same first flow channel, and at least two receiving cavities are arranged along a second direction.

[0020] In the arrangement direction of the cold plate and the circuit board, at least two receiving cavities are arranged facing the same first flow channel. That is, at least two receiving cavities are directly facing the same first flow channel. Since the coolant in the first flow channel will flow along the extension direction of the first flow channel, the multiple receiving cavities facing the same first flow channel are arranged along the extension direction of the first flow channel (that is, the second direction), which is beneficial for heat dissipation of multiple electronic components inside.

[0021] In one embodiment, the power conversion device further includes one or more heat sinks, with at least one of the plurality of first flow channels having a heat sink, and each heat sink including a plurality of slits for coolant flow.

[0022] After heat from some electronic components is transferred to the cold plate, the heat from the cold plate is transferred to the heat sink. As the coolant flows through multiple gaps in the heat sink, it can fully exchange heat with the heat sink, absorbing a significant amount of heat. Furthermore, the heat sink with multiple gaps increases the flow resistance of the coolant. When the coolant flows through the first flow channel equipped with the heat sink, the heat sink reduces the flow velocity of the coolant within that channel, allowing for more thorough heat exchange between the coolant and the heat sink, thus increasing the heat dissipation efficiency of the cold plate. The heat sink also supports the cooling channel, reducing the possibility of the cold plate collapsing (cooling channel deformation) due to pressure. In addition, when the first flow channel with the heat sink faces at least one receiving cavity, the heat sink within the first flow channel can further improve the heat dissipation efficiency of the electronic components inside that cavity.

[0023] In one embodiment, the plurality of electronic components include one or more power devices, the cold plate has a boss, the cooling channel includes the internal space of the boss, the boss protrudes toward one or more power devices, and the boss is used to connect one or more power devices; at least a portion of one or more frames is located to the side of the boss in a first direction or a second direction, the first direction and the second direction being perpendicular to each other and both perpendicular to the arrangement direction of the cold plate and the circuit board.

[0024] The cold plate has protrusions facing one or more power devices. These protrusions bring the cold plate close to and connect it to the power devices, allowing heat from the devices to be transferred to the protrusions. Since coolant flows through the protrusions, heat is transferred from the protrusions to the coolant. The flowing coolant continuously carries away the heat from the protrusions, thus achieving heat dissipation and cooling of the power devices. Specifically, the protrusions target one or more power devices for heat dissipation, while the frame dissipates heat for other electronic components. Through the cooperation of the frame and protrusions, rapid cooling of the power conversion device is achieved.

[0025] A second aspect of this application provides a power supply device, which includes an equipment cabinet, a cooling assembly, and multiple power conversion devices. The multiple power conversion devices are located inside the equipment cabinet, and the cooling assembly is located inside or outside the equipment cabinet. Each power conversion device has a cold plate with an inlet and an outlet communicating with a cooling channel. The cooling assembly is used to cool the coolant flowing out of the outlet and to transport the cooled coolant to the inlet.

[0026] The cooling assembly can cool the coolant flowing out of the outlet and drive the coolant to circulate within the cooling channel, thereby achieving continuous cooling of the power conversion device. Furthermore, the power supply equipment provided in this application includes the aforementioned power conversion device. Therefore, the power supply equipment provided in this application and the power conversion device of the above-mentioned technical solution can solve the same technical problem and have the same technical effect, which will not be elaborated further here. Attached Figure Description

[0027] Figure 1 This is a schematic diagram of the structure of a power supply device provided in an embodiment of this application;

[0028] Figure 2 This is a schematic diagram of another power supply device provided in an embodiment of this application;

[0029] Figure 3 This is a schematic diagram of the structure of a power conversion device provided in an embodiment of this application;

[0030] Figure 4 This is a schematic diagram of the structure of a connecting pipe provided in an embodiment of this application;

[0031] Figure 5 This is a schematic diagram of a cooling assembly provided in an embodiment of this application;

[0032] Figure 6 This is a schematic diagram of another cooling component provided in an embodiment of this application;

[0033] Figure 7 This is a schematic diagram of the structure of a device housing provided in an embodiment of this application;

[0034] Figure 8 This application provides a schematic diagram of the structure of a frame.

[0035] Figure 9 A schematic diagram of the disassembled structure of a frame and a cold plate provided for an embodiment of this application;

[0036] Figure 10 A schematic diagram of the structure of a frame and a base plate provided in an embodiment of this application;

[0037] Figure 11 Schematic diagrams of the structures of various positioning elements provided in the embodiments of this application;

[0038] Figure 12 A schematic diagram of the position of a frame provided in an embodiment of this application;

[0039] Figure 13 This is a schematic diagram of a cooling channel provided in an embodiment of this application;

[0040] Figure 14 This is a schematic diagram of another power conversion device provided in an embodiment of this application;

[0041] Figure 15 This is a schematic diagram of the structure of a first flow channel provided in an embodiment of this application;

[0042] Figure 16 This is a schematic diagram of a heat sink provided in an embodiment of this application;

[0043] Figure 17 This is a schematic diagram of the structure of a receiving cavity provided in an embodiment of this application;

[0044] Figure 18 A schematic diagram of a cross-section provided in an embodiment of this application;

[0045] Figure 19 This is a schematic diagram of another accommodating cavity provided in an embodiment of this application.

[0046] Figure label:

[0047] 100 - Power supply equipment; 10 - Equipment cabinet; 20 - AC power distribution device; 30 - DC power distribution device; 40 - Charging gun; 50 - First cable; 60 - Second cable; 70 - Terminal cabinet; 80 - Cooling assembly; 801 - Drive unit; 802 - Heat exchanger; 8021 - First heat exchange channel; 8022 - Second heat exchange channel; 803 - Fan; 804 - Liquid storage tank; 90 - Connecting pipe; 1 - Power conversion device; 11 - Cold plate; 111 - Cooling Channel; 1111-First flow channel; 1112-Second flow channel; 112-Inlet; 113-Outlet; 114-Boss; 12-Equipment housing; 13-Circuit board; 14-Electronic components; 141-Power devices; 15-Frame; 151-Receiving cavity; 152-Frame; 153-Base plate; 16-Insulating adhesive; 17-Connecting structure; 181-Positioning component; 182-Positioning hole; 19-Heat dissipation component; 191-Gap; 200-Cold source. Detailed Implementation

[0048] The technical solutions of the embodiments of this application will be described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments.

[0049] In this application, the terms "first," "second," etc., are used for descriptive purposes only to distinguish one element from another, and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature.

[0050] In this application, unless otherwise expressly stated and limited, "multiple" means two or more.

[0051] Furthermore, in this application, the terms "exemplary" or "for example" are used to indicate that something is an example, illustration, or illustration. Any embodiment or design described as "exemplary" or "for example" in this application should not be construed as being more preferred or advantageous than other embodiments or designs. Specifically, the use of terms such as "exemplary" or "for example" is intended to present the relevant concepts in a specific manner.

[0052] The X-axis, Y-axis, and Z-axis are three mutually perpendicular axes in a spatial rectangular coordinate system.

[0053] In the accompanying drawings of the embodiments of this application, solid structures such as components and assemblies are represented by guide lines; structures composed of multiple components are represented by guide lines with parentheses or solid arrows; and hollow structures such as openings, holes, spaces, and cavities are represented by guide lines with hollow arrows.

[0054] This application provides a power supply device. Figure 1 An exemplary structure of a power supply device is shown, with reference to Figure 1 The power supply equipment is an integrated charging pile, which includes an equipment cabinet, an AC power distribution unit, a DC power distribution unit, and multiple power conversion devices. The AC power distribution unit, DC power distribution unit, and multiple power conversion devices are all installed inside the equipment cabinet.

[0055] The input terminal of the AC power distribution unit is used to connect to a power source, which can be the power grid. The output terminal of the AC power distribution unit connects to the input terminals of multiple power conversion devices, and the AC power distribution unit controls the on / off state of the circuit between the power source and the multiple power conversion devices. Each power conversion device performs power conversion; for example, some power conversion devices convert AC to DC, and others perform voltage boosting or bucking; or, for another example, each power conversion device converts AC to DC. The output terminals of multiple power conversion devices are connected to the input terminal of the DC power distribution unit.

[0056] In addition, refer to Figure 1 The power supply device 100 also includes at least one (or more) charging guns 40 and at least one (or more) first cables 50, in Figure 1 In the illustrated embodiment, two charging guns 40 and two first cables 50 are provided. The charging guns 40 are located outside the equipment cabinet 10 and are used to connect to the device to be charged (e.g., an electric vehicle). The charging guns 40 are connected to the DC power distribution device 30 via corresponding first cables 50. The DC power distribution device 30 controls the on / off state of the circuit between the multiple power conversion devices 1 and the first cables 50. When the DC power distribution device 30 conducts the circuit between the first cables 50 and the multiple power conversion devices 1, the charging guns 40 can output the current after power conversion by the multiple power conversion devices 1.

[0057] In another embodiment, when the power supply device 100 is an integrated charging pile, the power supply device 100 has one or more charging guns 40 and first cables 50.

[0058] Figure 2 An exemplary diagram shows the structure of another power supply device 100, with reference to Figure 2 The power supply equipment 100 is a split-type charging pile, comprising a main unit and multiple terminal units. The main unit of the power supply equipment 100 includes an equipment cabinet 10, an AC power distribution device 20, a DC power distribution device 30 (also referred to as a power allocation device), and multiple power conversion devices 1. The AC power distribution device 20, DC power distribution device 30, and multiple power conversion devices 1 are all installed within the equipment cabinet 10. The input terminal of the AC power distribution device 20 is used to connect to a power source (e.g., the power grid). Each power conversion device 1 is used to perform power conversion. The DC power distribution device 30 is connected to multiple terminal units of the power supply equipment 100 via multiple second cables 60 to distribute the DC power output from the multiple power conversion devices 1 to one or more of the terminal units.

[0059] Reference Figure 2 Each terminal section of the power supply equipment 100 includes a terminal cabinet 70, a charging gun 40, and a first cable 50, wherein a portion of a second cable 60 extends into the terminal cabinet 70. Figure 2 In the illustrated embodiment, each terminal section has two charging guns 40 and two first cables 50. Each charging gun 40 is connected to the terminal cabinet 70 via a corresponding first cable 50. When the circuit between the first cable 50 and the second cable 60 is connected, the charging gun 40 can output the current after power conversion by multiple power conversion devices 1.

[0060] In another embodiment, in each terminal section of the power supply device 100, one or more charging guns 40 and first cables 50 are provided.

[0061] In another embodiment, the power supply device 100 is a power cabinet, for example, a cabinet-type uninterruptible power supply (UPS).

[0062] Among them, multiple power conversion devices 1 generate significant heat during operation, therefore cooling of the power conversion devices 1 is necessary, referring to... Figure 1 and Figure 2The power supply equipment 100 also includes a cooling assembly 80, which is disposed at any suitable location within the equipment cabinet 10. In another embodiment, the cooling assembly 80 is disposed outside the equipment cabinet 10. The cooling assembly 80 is used to cool the plurality of power conversion devices 1.

[0063] Figure 3 An exemplary structure of a power conversion device 1 is shown, with reference to... Figure 3 The power conversion device 1 includes a cold plate 11, and the cold plate 11 has a cooling channel 111 for the flow of coolant. Figure 3 The cooling channel 111 is shielded by the outer casing of the cold plate 11, which has an inlet 112 and an outlet 113 communicating with the cooling channel 111. The cooling assembly 80 can be connected to the inlet 112 and outlet 113 of each cold plate 11 in any suitable manner; for example, the power supply device 100 also includes a connecting pipe 90. Figure 4 An exemplary embodiment shows the structure of a connecting pipe 90, through which the cooling assembly 80 is connected to the liquid inlet 112 and liquid outlet 113 of each cold plate 11. Figure 4 In the illustrated embodiment, the connecting pipe 90 includes a main pipe and multiple branch pipes, enabling the cold plates 11 of multiple power conversion devices 1 to be connected in parallel or in series.

[0064] Figure 5 An exemplary structure of a cooling assembly 80 is shown, with reference to Figure 5 The cooling component 80 can cool the coolant and drive the coolant to flow between the inlet 112 and the outlet 113. That is, the cooling component 80 can cool the coolant flowing out of the outlet 113 and deliver the cooled coolant to the inlet 112 to drive the coolant to circulate within the cooling channel 111, thereby continuously cooling the power conversion device 1. In this context... Figure 5 In the illustrated embodiment, the cooling assembly 80 includes a drive 801 (e.g., a liquid pump) and a heat exchanger 802 (e.g., a plate heat exchanger 802). The internal channels of the heat exchanger 802 include a first heat exchange channel 8021 and a second heat exchange channel 8022. The liquid inlet 112 and the liquid outlet 113 of each cold plate 11 are connected to the first heat exchange channel 8021 of the heat exchanger 802, and the second heat exchange channel 8022 of the heat exchanger 802 is connected to the cold source 200.

[0065] Reference Figure 5The driving component 801 drives the coolant to flow. The coolant enters the cooling channel 111 of the cold plate 11 from the inlet 112 and absorbs the heat inside the power conversion device 1. After absorbing the heat, the coolant flows out from the outlet 113 and enters the heat exchanger 802 to exchange heat with the cold source 200. After the heat exchange, the temperature of the coolant decreases and it returns to the cooling channel 111 to continue cooling the power conversion device 1. This cycle repeats to achieve cyclic cooling of the power conversion device 1.

[0066] In one embodiment, the cold source 200 is disposed inside the equipment cabinet 10. In another embodiment, the cold source 200 is disposed outside the equipment cabinet 10.

[0067] In one embodiment, the cold source 200 includes a compressor, a condenser (or a cooling tower), a throttling valve, etc. These components are connected sequentially by pipes to form a closed system in which the refrigerant circulates. The liquid refrigerant absorbs heat from the coolant in the heat exchanger 802, vaporizing into a low-temperature, low-pressure gaseous refrigerant. This gaseous refrigerant is then drawn into the compressor, compressed into a high-pressure, high-temperature gaseous refrigerant, and discharged into the condenser. In the condenser, the gaseous refrigerant releases heat, condensing into a high-pressure liquid refrigerant. This liquid is then throttled by the throttling valve to become a low-pressure, low-temperature refrigerant, which re-enters the heat exchanger 802 to absorb heat and vaporize, achieving the purpose of cyclic refrigeration. In another embodiment, the cold source 200 can also be other suitable structures to exchange heat with the coolant in the heat exchanger 802.

[0068] Figure 6 An exemplary diagram shows the structure of another cooling assembly 80, with reference to Figure 6 The cooling assembly 80 includes a drive unit 801 (e.g., a liquid pump) and a heat exchanger 802 (e.g., a plate heat exchanger 802). The inlet 112 and outlet 113 of each cold plate 11 communicate with the internal channels of the heat exchanger 802. In this embodiment, the heat exchanger 802 exchanges heat with air. For example, the cooling assembly 80 also includes a fan 803 for blowing air towards the heat exchanger 802, or the fan 803 draws air from outside the equipment cabinet 10 into the equipment cabinet 10 and directs the air through the heat exchanger 802. The drive unit 801 drives the coolant to flow. The coolant enters the cooling channel 111 of the cold plate 11 from the inlet 112 and absorbs the heat inside the power conversion device 1. After absorbing the heat, the coolant flows out from the outlet 113 and enters the heat exchanger 802 to exchange heat with the air. After the heat exchange, the temperature of the coolant decreases and returns to the cooling channel 111 of the cold plate 11 to continue cooling the power conversion device 1, and the cycle repeats.

[0069] In order to further improve heat exchange efficiency, refer to Figure 6Multiple heat exchangers 802 can be provided, and the internal channels of each heat exchanger 802 are connected to all liquid inlets 112 and all liquid outlets 113, so that multiple heat exchangers 802 are arranged in parallel.

[0070] exist Figure 4 and Figure 5 In the illustrated embodiment, multiple drive elements 801 are provided, and these drive elements 801 are arranged in parallel, each capable of driving the flow of coolant. This design ensures that even if one drive element 801 fails, other drive elements 801 will continue to operate, reducing the likelihood of the cooling assembly 80 stopping operation due to the failure of an individual drive element 801. In another embodiment, the cooling assembly 80 may also have only one drive element 801.

[0071] In addition, Figure 4 and Figure 5 In the illustrated embodiment, the cooling assembly 80 further includes a reservoir 804 for storing coolant, the reservoir 804 being connected to the drive 801 and the heat exchanger 802.

[0072] In one embodiment, the cold plate 11 is part of the housing of the power conversion device 1. For example, the power conversion device 1 includes a device housing 12 (the housing of the power conversion device 1). Figure 7 An exemplary structure of a device housing 12 is shown, with reference to Figure 7 The cold plate 11 is part of the device housing 12. In another embodiment, the power conversion device 1 includes a device housing 12 (the outer shell of the power conversion device 1), the cold plate 11 and the device housing 12 are two independent structures, and the cold plate 11 is located inside the device housing 12.

[0073] The housing 12 is used to house the internal components and structures of the power conversion device 1, as shown in the reference. Figure 7 The power conversion device 1 also includes a circuit board 13 and multiple electronic components 14. A gap exists between the circuit board 13 and the cold plate 11. The multiple electronic components 14 are located between the circuit board 13 and the cold plate 11 and are fixed to the circuit board 13. Both the circuit board 13 and the multiple electronic components 14 are located within the device housing 12. Since the power conversion device 1 contains a large number of electronic components 14, if only the cold plate 11 is used for cooling the power conversion device 1, the heat from a large number of electronic components 14 cannot be effectively transferred to the cold plate 11. This results in poor heat dissipation by the cold plate 11 for the power conversion device 1, which will affect the normal operation of the power conversion device 1 and the power supply equipment 100.

[0074] Therefore, the power conversion device 1 of this application further includes one or more enclosures 15. Figure 8 An exemplary structure of the frame 15 is shown. Figure 9 An example is shown Figure 8The split structure of the frame 15 and the cold plate 11 in the middle, Figure 8 and Figure 9 The illustration shows a power conversion device 1 comprising a single frame 15. In other embodiments, the power conversion device 1 comprises multiple frames 15. It should be noted that the frame 15 and the cold plate 11 are two independent structures, and the frame 15 and the device housing 12 are also two independent structures. That is, the frame 15 needs to be manufactured separately (for example, the material of the frame 15 may be aluminum, and the frame 15 may be manufactured by die casting).

[0075] Return to reference Figure 7 The frame 15 is located between the circuit board 13 and the cold plate 11, and the frame 15 has one or more receiving cavities 151. Each receiving cavity 151 is used to receive at least one electronic component 14 from a plurality of electronic components 14. That is, each receiving cavity 151 can receive at least one electronic component 14, and the electronic components 14 received by different receiving cavities 151 are different. It can be understood that the electronic components 14 received by the receiving cavity 151 extend into the receiving cavity 151, or in other words, all or part of the electronic components 14 received by the receiving cavity 151 are located within the receiving cavity 151.

[0076] In order to transfer the heat of the electronic components 14 to the cold plate 11 through the frame 15, the inner wall of each receiving cavity 151 is connected to all the electronic components 14 contained therein. In one embodiment, referring to... Figure 7 Each receiving cavity 151 is filled with insulating adhesive 16 (the dotted shaded areas represent the insulating adhesive 16). The insulating adhesive 16 in each receiving cavity 151 is used to immerse at least a portion of each electronic component 14 contained therein. That is, all electronic components 14 in each receiving cavity 151 are partially or completely immersed in the insulating adhesive 16 of the receiving cavity 151. For example, receiving cavity 151(a) contains one electronic component 14, and the electronic component 14 is partially immersed in the insulating adhesive 16 inside the receiving cavity 151(a), or the electronic component 14 is completely immersed in the insulating adhesive 16 inside the receiving cavity 151(a). As another example, a receiving cavity 151 contains three electronic components 14, and each of the three electronic components 14 is partially immersed in the insulating adhesive 16 inside the receiving cavity 151, or the three electronic components 14 are completely immersed in the insulating adhesive 16 inside the receiving cavity 151.

[0077] When the cavity 151 is filled with insulating adhesive 16, the insulating adhesive 16 can fill the entire cavity 151 or only a portion of the cavity 151. The insulating adhesive 16 is used to connect the frame 15 and the multiple electronic components 14, preventing the multiple electronic components 14 from contacting the frame 15. When the frame 15 is made of metal, this reduces the risk of short circuits of the multiple electronic components 14 through the frame 15.

[0078] In another embodiment, the inner wall of each receiving cavity 151 is bonded to all the electronic components 14 contained therein.

[0079] In addition, the frame 15 also needs to be connected to the cold plate 11, wherein, referring to Figure 7 The power conversion device 1 further includes a connecting structure 17, which connects the cold plate 11 and the frame 15. Specifically, the frame 15 is connected to the cold plate 11 via the connecting structure 17. In one embodiment, the connecting structure 17 is a screw, which fixes the frame 15 to the cold plate 11. In another embodiment, the connecting structure 17 is solder, meaning the frame 15 and the cold plate 11 are welded together via the connecting structure 17 (solder).

[0080] During the operation of the power conversion device 1, multiple electronic components 14 generate heat. These components extend into different receiving cavities 151 and connect to the frame 15, allowing the heat from the components to be transferred to the frame 15. Furthermore, the frame 15 is connected to the cold plate 11, transferring heat from the frame 15 to the cold plate 11. In other words, by configuring the frame 15 to connect both the cold plate 11 and the multiple electronic components 14, the cold plate 11 can better cool the components, improving the heat dissipation effect of the power conversion device 1 and reducing the risk of malfunction.

[0081] Furthermore, since the frame 15 and the cold plate 11 are two independent structures, they can be fixed together by the connecting structure 17, allowing for independent processing of the frame 15 and the cold plate 11. It is unnecessary to integrally mold the frame 15 and the cold plate 11 (or other parts of the device housing 12). Understandably, if the frame 15 and the cold plate 11 were integrally molded, a die-casting process would be required to manufacture the cold plate 11 with the frame 15, resulting in thicker walls for both the cold plate 11 and the frame 15. This would affect the heat dissipation of the power conversion device 1, increase the weight of the power conversion device 1, make installation difficult, and increase production costs. Therefore, by independently processing the frame 15 and the cold plate 11 and then fixing them together by the connecting structure 17, the wall thickness of each component can be reduced, lowering the weight of the power conversion device 1. This also facilitates heat dissipation for the multiple electronic components 14 and reduces processing costs.

[0082] When the power conversion device 1 includes a frame 15, the volume of the frame 15 can be increased, and the frame 15 can have more accommodating cavities 151 to accommodate more (or all) electronic components 14. Compared to the case where the power conversion device 1 includes multiple frames 15 (which can be understood as splitting the aforementioned one frame 15 into multiple independent frames 15), the number of frames 15 can be reduced, making it easier to install the frames 15.

[0083] The frame 15 can be any suitable structure; for example, the frame 15 includes a side panel 152 and a base plate 153. Figure 10 An exemplary structure of a frame 152 and a base plate 153 is shown, with reference to Figure 10 The frame 152 forms one or more receiving cavities 151. The frame 152 is fixed to the base plate 153 (for example, the frame 152 and the base plate 153 are integrally connected). The base plate 153 is located between the frame 152 and the cold plate 11 (auxiliary reference). Figure 9 and Figure 10 Furthermore, the base plate 153 covers at least one of the one or more receiving cavities 151. That is, the base plate 153 is located between at least one receiving cavity 151 in the frame 15 and the cold plate 11.

[0084] by Figure 10 Taking the frame 15 shown as an example, the border 152 of the frame 15 encloses a plurality of receiving cavities 151. Some of the receiving cavities 151 are not covered by the base plate 153, such as receiving cavities 151(b) and receiving cavities 151(c); while other receiving cavities 151 are covered by the base plate 153, such as receiving cavities 151(d), receiving cavities 151(e), and receiving cavities 151(f). In another embodiment, each receiving cavity 151 on the frame 15 is covered by the base plate 153. Here, "the base plate 153 covers a certain receiving cavity 151" means that the end of the receiving cavity 151 facing the cold plate 11 is completely or partially covered by the base plate 153.

[0085] In the case where the power conversion device 1 includes multiple frames 15, in one embodiment, each frame 15 includes a side frame 152 and a base plate 153, and in another embodiment, one or a portion of the frames 15 include a side frame 152 and a base plate 153, while the remaining frames 15 may have other structures.

[0086] Fixing the frame 152 to the base plate 153 provides support for the frame 152, reducing the possibility of bending or damage to the frame 152 and thus improving the overall strength of the frame 15.

[0087] In addition, in one embodiment, the connecting structure 17 is located between the base plate 153 and the cold plate 11. The connecting structure 17 connects the base plate 153 and the cold plate 11. The base plate 153 of the frame 15 can increase the connection area between the frame 15 and the cold plate 11, which makes it easier for the connecting structure 17 to stably connect the frame 15 to the cold plate 11 and reduces the possibility of the frame 15 and the cold plate 11 separating from each other.

[0088] To position the enclosure 15, the power conversion device 1 also includes one or more positioning elements 181. Figure 11 Exemplary examples illustrate the structures of various positioning elements 181. In one embodiment, reference is made to... Figure 11 In (a) of the figure, the frame 15 is fixed with at least one positioning element 181. For example, the frame 15 in the figure is fixed with two positioning elements 181 (the structure of the positioning element 181 can be a short column). The cold plate 11 has one or more positioning holes 182. It can be understood that the number of positioning holes 182 is the same as the number of positioning elements 181. For example, there are also two positioning holes 182. One positioning element 181 is used to be inserted into one positioning hole 182. That is, multiple positioning elements 181 and multiple positioning holes 182 correspond one-to-one, and each positioning element 181 is inserted into the corresponding positioning hole 182.

[0089] In another embodiment, refer to Figure 11 In (b), all (e.g., two) positioning elements 181 are fixed to the cold plate 11, and the frame 15 has one or more positioning holes 182, the number of positioning holes 182 being the same as the number of positioning elements 181. For example, two positioning holes 182 are also provided, and each positioning element 181 is inserted into the corresponding positioning hole 182.

[0090] During the installation of the enclosure frame 15, if the positioning member 181 is fixed to the enclosure frame 15 and the positioning hole 182 is located on the cold plate 11, then the positioning member 181 on the enclosure frame 15 is inserted into the positioning hole 182 on the cold plate 11; if the positioning member 181 is fixed to the cold plate 11 and the positioning hole 182 is located on the enclosure frame 15, then the positioning member 181 on the cold plate 11 is inserted into the positioning hole 182 on the enclosure frame 15. Through the cooperation between the positioning member 181 and the positioning hole 182, the position of the enclosure frame 15 is positioned, which is more conducive to installing the enclosure frame 15 at the preset position on the cold plate 11 and reduces the possibility of positional deviation of the enclosure frame 15.

[0091] After the frame 15 is installed on the cold plate 11, the position of the frame 15 can be designed according to requirements, for example, Figure 12 An example is shown showing the position of the frame 15, return to reference. Figure 7The system includes multiple electronic components 14, including one or more power devices 141. A cold plate 11 has a boss 114 located outside all receiving cavities 151. A cooling channel 111 includes the internal space of the boss 114 (the space indicated by arrow S1), meaning coolant flows through the boss 114. The boss 114 protrudes towards one or more power devices 141 and is used to connect one or more power devices 141. In other words, the cold plate 11 is brought close to and connected to the power devices 141 via the boss 114. Because coolant flows through the boss 114, heat from the boss 114 is transferred to the coolant. The flowing coolant continuously carries away the heat from the boss 114, thus achieving heat dissipation and cooling of the power devices 141. The boss 114 is specifically designed to dissipate heat from the power device 141, while the frame 15 dissipates heat from other electronic components 14 (other electronic components 14 besides the power device 141, such as inductors, capacitors, etc.). Through the cooperation of the frame 15 and the boss 114, the power conversion device 1 can be cooled down quickly.

[0092] Reference Figure 12 A portion of the enclosure 15 (e.g., the portion within the dashed frame K1) is located to the side of the boss 114 in the first direction (parallel to the X-axis), and another portion of the enclosure 15 (e.g., the portion within the dashed frame K2) is located to the side of the boss 114 in the second direction (parallel to the Y-axis). The first and second directions are perpendicular to each other and both perpendicular to the arrangement direction of the cold plate 11 and the circuit board 13 (parallel to the Z-axis). In another embodiment, the entire enclosure 15 is located to the side of the boss 114 in the first direction, or the entire enclosure 15 is located to the side of the boss 114 in the second direction.

[0093] The shape of the cooling channel 111 can be designed as needed. In one embodiment, the cooling channel 111 further includes a plurality of first flow channels 1111 and a plurality of second flow channels 1112. Figure 13 An exemplary structure of a cooling channel 111 is shown, with reference to Figure 13Multiple first flow channels 1111 are arranged along a first direction (parallel to the Y-axis), and each first flow channel 1111 extends along a second direction (parallel to the X-axis). Each second flow channel 1112 connects two adjacent first flow channels 1111. Two second flow channels 1112 connected to the same first flow channel 1111 are located at different ends of the first flow channel 1111 in the second direction. That is, the multiple first flow channels 1111 and the multiple second flow channels 1112 form a serpentine channel, which is part of the cooling channel 111. The serpentine shape of a portion of the cooling channel 111 allows the coolant to flow through more areas of the cold plate 11, cooling more electronic components 14 within the power conversion device 1 and improving the heat dissipation effect of the power conversion device 1.

[0094] Specifically, the portion of cooling channel 111 between dashed lines L1 and L2 is a first flow channel 1111 extending along a second direction; the portion of cooling channel 111 between dashed lines L3 and L4 is also a first flow channel 1111 extending along a third direction; and the portion of cooling channel 111 between dashed lines L5 and L6 is also a first flow channel 1111 extending along a third direction. The portion of cooling channel 111 between dashed lines L2 and L3 (and used to connect two adjacent first flow channels 1111) is a second flow channel 1112. The other first flow channels 1111 and second flow channels 1112 of cooling channel 111 are also determined in this way, and will not be elaborated further here.

[0095] In the case where the cold plate 11 also includes a boss 114 Figure 14 An exemplary structure of another power conversion device 1 is shown, with reference to... Figure 14 The first flow channel 1111, which is closest to the boss 114, is connected to the internal space of the boss 114.

[0096] Furthermore, in the arrangement direction of the cold plate 11 and the circuit board 13 (parallel to the Z-axis), a first flow channel 1111 faces at least one receiving cavity 151. That is, in the arrangement direction of the cold plate 11 and the circuit board 13, each first flow channel 1111 has at least one corresponding receiving cavity 151. Since coolant flows in the first flow channel 1111, multiple electronic components 14 in all the receiving cavities 151 corresponding to each first flow channel 1111 can be cooled by the coolant flowing through the first flow channel 1111, which is beneficial for heat dissipation of multiple electronic components 14. It should be noted that in some embodiments, a certain receiving cavity 151 may also have two first flow channels 1111 facing that receiving cavity 151.

[0097] In one embodiment, the frame 15 has a plurality of receiving cavities 151. In the arrangement direction of the cold plate 11 and the circuit board 13 (parallel to the Z-axis), at least two of the receiving cavities 151 face the same first flow channel 1111, that is, at least two receiving cavities 151 are directly opposite the same first flow channel 1111. For example, Figure 15 An exemplary structure of a first flow channel 1111 is shown, which can be understood as... Figure 13 One of the multiple first flow channels 1111 is oriented toward three receiving cavities 151, and the three receiving cavities 151 oriented toward the same first flow channel 1111 are arranged along a second direction (parallel to the X-axis).

[0098] Since the coolant in the first flow channel 1111 flows along the extension direction of the first flow channel 1111, that is, along the second direction, the multiple receiving cavities 151 facing the same first flow channel 1111 are arranged along the extension direction of the first flow channel 1111 (that is, the second direction), which is beneficial for the heat dissipation of the multiple electronic components 14 inside them.

[0099] In one embodiment, the power conversion device 1 further includes one or more heat sinks 19. Figure 16 An exemplary structure of a heat sink 19 is shown, for example, a heat sink 19 is provided in each of the first flow channels 1111, or, for example, only one or a portion (a few of them) of the first flow channels 1111 are provided with a heat sink 19. (Refer to...) Figure 16 At least one of the plurality of first flow channels 1111 has a heat sink 19, each heat sink 19 including a plurality of slits 191 for coolant flow, the heat sink 19 having a plurality of slits 191 can fully exchange heat with the coolant in the first flow channel 1111 and reduce the flow rate of the coolant in the first flow channel 1111.

[0100] After the heat from some electronic components 14 is transferred to the cold plate 11, the heat from the cold plate 11 is transferred to the heat sink 19. After the coolant flows through the multiple gaps 191 on the heat sink 19, it can fully exchange heat with the heat sink 19 and absorb more heat from the heat sink 19. Moreover, the heat sink 19 with multiple gaps 191 can increase the flow resistance of the coolant. When the coolant flows through the first flow channel 1111 where the heat sink 19 is provided, the heat sink 19 reduces the flow rate of the coolant in the first flow channel 1111, so that the coolant can fully exchange heat with the heat sink 19 in the first flow channel 1111, thereby increasing the heat dissipation efficiency of the cold plate 11.

[0101] Furthermore, in some embodiments, the inner wall of the cold plate 11 can be fixedly connected to the heat sink 19, and the heat sink 19 plays the role of supporting the cooling channel 111, reducing the possibility of the cold plate 11 collapsing (cooling channel 111 deforming) due to pressure.

[0102] Furthermore, when the first flow channel 1111, which is provided with heat sink 19, faces at least one receiving cavity 151, the heat sink 19 in the first flow channel 1111 can further improve the heat dissipation efficiency of the electronic components 14 inside the receiving cavity 151 to which the first flow channel 1111 faces.

[0103] Reference Figure 16 The heat sink 19 can be a complete structure, for example, Figure 16 The heat sink 19(a) can also be a structure composed of multiple parts, for example, Figure 16 The heat sink 19(b) and heat sink 19(c) in the middle each include two parts.

[0104] When the cavity 151 is filled with insulating adhesive 16, the area of ​​the cross section of at least one cavity 151 facing the circuit board 13 is greater than the area of ​​the cross section facing away from the circuit board 13, and each cross section is perpendicular to the arrangement direction of the cold plate 11 and the circuit board 13 (that is, perpendicular to the Z-axis direction). Figure 17 An exemplary structure for a receiving cavity 151 is shown, for... Figure 17 Taking the cavity 151 shown as an example, the area of ​​the cross-section of the cavity 151 facing the circuit board 13 (D1) is larger than the area of ​​the cross-section facing away from the circuit board 13 (D2), and each cross-section is perpendicular to the arrangement direction of the cold plate 11 and the circuit board 13. Figure 18 An exemplary cross-sectional structure is shown, with reference to Figure 18 Section M1 is Figure 17 The cross-section M2 of the cavity 151 facing the end (D1) of the circuit board 13 is as follows: Figure 17 The cavity 151 in the middle is a cross section away from the end (D2) of the circuit board 13. Both cross sections M1 and M2 are perpendicular to the Z-axis direction, and the area of ​​cross section M1 is larger than the area of ​​cross section M2.

[0105] The cross-sectional area (e.g., cross-section M1) of at least one receiving cavity 151 facing the end of the circuit board 13 is larger, and the portion of each electronic component 14 not immersed in the insulating adhesive 16 is farther from the frame 15, that is, Figure 17The dimensions of C1 meet the safety distance requirements between the electronic components 14 and the frame 15. The smaller cross-sectional area (e.g., cross-section M2) of each receiving cavity 151 away from the circuit board 13 reduces the distance between the frame 15 and each electronic component 14, thus reducing the thickness of the insulating adhesive 16. This facilitates heat transfer from the electronic components 14 within the receiving cavity 151 to the frame 15. Furthermore, with a relatively uniform thickness of the frame 15, the smaller cross-sectional area of ​​the receiving cavity 151 away from the circuit board 13 also reduces the material used in the frame 15, lowering its cost and consequently reducing the production and processing costs of the power conversion device 1.

[0106] In another embodiment, Figure 19 An exemplary structure of a receiving cavity 151 is shown, wherein at least one receiving cavity 151 (in the Z1 direction) is provided in the direction from the cold plate 11 to the circuit board 13. Figure 19 Taking the receiving cavity 151 as an example, the cross-sectional area gradually increases. Through this design, the cross-sectional area of ​​the end of each receiving cavity 151 facing the circuit board 13 can be larger, while the cross-sectional area of ​​the end of each receiving cavity 151 away from the circuit board 13 can be smaller.

[0107] Furthermore, in the direction from the cold plate 11 to the circuit board 13 (in the Z1 direction), the cross-sectional area of ​​the cavity 151 gradually increases. That is, in the direction from the cold plate 11 to the circuit board 13, the cross-sectional area of ​​the cavity 151 gradually changes, which is beneficial to the processing and manufacturing of the cavity 151 (for example, the frame 15 is processed and manufactured by die casting to form the cavity 151).

[0108] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A power conversion device, characterized by, include: A cold plate, wherein the cold plate has cooling channels for the flow of coolant; A circuit board, wherein a gap exists between the circuit board and the cold plate; Multiple electronic components are located between the circuit board and the cold plate and are fixed to the circuit board; One or more frames are located between the circuit board and the cold plate, each frame having one or more receiving cavities, one receiving cavity for receiving at least one electronic component among the plurality of electronic components, and the inner wall of the receiving cavity for connecting the at least one electronic component; A connecting structure that connects the cold plate and the one or more surrounding frames.

2. The power conversion device of claim 1, wherein, Each of the accommodating cavities is filled with insulating adhesive, and the insulating adhesive in one of the accommodating cavities is used to immerse at least a portion of the at least one electronic component; The area of ​​the cross-section of at least one of the one or more receiving cavities facing the end of the circuit board is greater than the area of ​​the cross-section facing away from the circuit board, and each of the cross-sections is perpendicular to the arrangement direction of the cold plate and the circuit board.

3. The power conversion device of claim 2, wherein, In the direction from the cold plate to the circuit board, the area of ​​the cross section of the at least one receiving cavity gradually increases.

4. The power conversion device according to any one of claims 1 to 3, characterized by, At least one of the one or more enclosures includes a frame and a base plate. The frame forms one or more receiving cavities. The frame is fixed to the base plate. The base plate is located between the frame and the cold plate. The base plate covers at least one of the one or more receiving cavities. The connecting structure is located between the base plate and the cold plate. The connecting structure connects the base plate and the cold plate.

5. The power conversion device according to any one of claims 1 to 4, characterized by, The power conversion device further includes one or more positioning elements; One of the enclosure frames is fixed with at least one of the one or more positioning elements, and the cold plate has one or more positioning holes; or, the one or more positioning elements are fixed to the cold plate, and one of the enclosure frames has one or more positioning holes. One of the positioning elements is used to be inserted into one of the positioning holes.

6. The power conversion device of any one of claims 1-5, wherein, The cooling channel includes a plurality of first flow channels and a plurality of second flow channels. The plurality of first flow channels are arranged along a first direction, and each first flow channel extends along a second direction. The first direction and the second direction are perpendicular to each other and both perpendicular to the arrangement direction of the cold plate and the circuit board. Two adjacent first flow channels are connected through a second flow channel. In the arrangement direction of the cold plate and the circuit board, one of the first flow channels faces at least one of the first or more receiving cavities.

7. The power conversion device of claim 6, wherein, Each of the frames has a plurality of receiving cavities, and in the arrangement direction of the cold plate and the circuit board, at least two of the plurality of receiving cavities face the same first flow channel, and the at least two receiving cavities are arranged along the second direction.

8. A power conversion device according to claim 6 or 7, characterised in that, The power conversion device further includes one or more heat sinks, and at least one of the plurality of first flow channels has one heat sink, each of the heat sinks including a plurality of slits for coolant flow.

9. The power conversion device of any one of claims 1-8, wherein, The plurality of electronic components include one or more power devices, the cold plate has a boss, the cooling channel includes the internal space of the boss, the boss protrudes toward the one or more power devices, and the boss is used to connect the one or more power devices; At least a portion of the one or more frames is located to the side of the boss in a first direction or a second direction, the first direction and the second direction being perpendicular to each other and both perpendicular to the arrangement direction of the cold plate and the circuit board.

10. A power supply device, characterized by comprising: It includes an equipment cabinet, a cooling assembly, and a plurality of power conversion devices according to any one of claims 1-9, wherein the plurality of power conversion devices are located within the equipment cabinet; The cooling assembly is located inside or outside the equipment cabinet. Each power conversion device has a cold plate with an inlet and an outlet that communicate with the cooling channel. The cooling assembly is used to cool the coolant flowing out of the outlet and to transport the cooled coolant to the inlet.

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