A liquid-cooled heat sink for an energy storage converter

By designing a liquid-cooled heat sink with multiple liquid flow channels and a multi-pass reciprocating serpentine channel, the problem of insufficient heat dissipation of IGBT modules and inductors in the energy storage converter was solved, achieving a highly efficient liquid cooling effect, extending the device life and ensuring the stability of the energy storage converter.

CN224583533UActive Publication Date: 2026-07-31DONGGUAN HENGYI NENGYI TECHNOLOGY CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
DONGGUAN HENGYI NENGYI TECHNOLOGY CO LTD
Filing Date
2025-07-28
Publication Date
2026-07-31

AI Technical Summary

Technical Problem

The heat dissipation components in existing energy storage converters cannot adequately dissipate heat from IGBT modules and inductors, affecting their lifespan and the normal operation of the energy storage converter.

Method used

Design a liquid-cooled heat sink for energy storage converters, which adopts a multi-channel liquid flow and a multi-pass reciprocating serpentine channel structure, combined with heat conduction modules and coolant circulation, to achieve efficient liquid cooling heat dissipation for IGBT modules and inductors.

Benefits of technology

This improves the heat dissipation efficiency of IGBT modules and inductors, extends their service life, and ensures the stable operation of the energy storage converter.

✦ Generated by Eureka AI based on patent content.

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Abstract

This utility model relates to the field of radiator technology, and more particularly to a liquid-cooled radiator for an energy storage converter. It includes a heat dissipation frame and a placement chamber formed at the bottom of the heat dissipation frame. The top plate of the heat dissipation frame has a second liquid guiding channel, a third liquid guiding channel, and a second connecting channel for connecting the end of the second liquid guiding channel to the beginning of the third liquid guiding channel. The surface of the top plate of the heat dissipation frame has an installation opening, at which a first heat-conducting module is installed, simultaneously covering the second and third liquid guiding channels. The coolant flowing in the second and third liquid guiding channels is in contact with the bottom surface of the first heat-conducting module. The top surface of the first heat-conducting module has a mounting portion for mounting several IGBT modules. After the IGBT modules generate heat during operation, the first heat-conducting module transfers the heat generated by the IGBT modules to the flowing coolant, which then carries away the heat, achieving liquid cooling.
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Description

Technical Field

[0001] This utility model relates to the field of radiator technology, and in particular to a liquid-cooled radiator for an energy storage converter. Background Technology

[0002] With the continuous development of new energy technologies, the application of energy storage devices is becoming increasingly widespread. Energy storage devices store electrical energy through battery modules formed by battery cells and output it to the outside world when needed. In addition to the battery modules, energy storage devices also include battery management devices, energy management devices, and energy storage converters that work in conjunction with the battery modules. The energy storage converter controls the charging and discharging process of the battery modules and is a key component for enabling bidirectional flow of electrical energy between the energy storage device and the power grid.

[0003] A PCS (Power Conversion System) controls the charging and discharging process of a battery, converting AC to DC power, and can directly supply AC loads in the absence of a power grid. A PCS consists of a DC / AC bidirectional converter, a control unit, etc., with the converter including multiple IGBT modules and inductors. With the rapid increase in heat flux density of the electronic components in the IGBT modules, the resulting heat dissipation also increases dramatically. Simultaneously, the demand for higher power ratings and miniaturization of IGBT modules has led to an increase in the power density of the PCS, making heat dissipation a more prominent issue. However, existing converters use heat dissipation components that transfer heat generated by the IGBT modules and inductors from the module casing to the heat sink via a thermal interface material (TIM), and then dissipate the heat through the heat sink. This heat dissipation method is insufficient for effectively cooling the IGBT modules and inductors. Prolonged use not only affects the lifespan of the IGBT modules and inductors but also the normal operation of the energy storage converter.

[0004] To improve converter cooling efficiency and ensure the stable and reliable operation of high-power converters, efficient heat dissipation of IGBT modules has become a major issue. Therefore, this paper presents a liquid-cooled heat sink for energy storage converters to solve the aforementioned technical problems. Utility Model Content

[0005] The purpose of this invention is to provide a liquid-cooled heat sink for energy storage converters to address the shortcomings of existing technologies, thereby solving the technical problem that the heat dissipation components in existing converters cannot adequately dissipate heat from the IGBT module.

[0006] To achieve the above objectives, the technical solution of this utility model is as follows:

[0007] A liquid-cooled heat sink for an energy storage converter includes a heat sink frame and a placement chamber formed at the bottom of the heat sink frame. The top plate of the heat sink frame has a second liquid flow channel, a third liquid flow channel, and a second connecting channel for connecting the end of the second liquid flow channel with the beginning of the third liquid flow channel.

[0008] The surface of the top plate of the heat sink frame is formed with an installation opening. A first heat-conducting module is installed at the installation opening, which simultaneously covers the second and third liquid guide channels. The coolant flowing in the second and third liquid guide channels is in contact with the bottom surface of the first heat-conducting module. The top surface of the first heat-conducting module is provided with a mounting part for mounting several IGBT modules.

[0009] Furthermore, the two side plates along the length of the heat dissipation frame are respectively formed with a first liquid guiding channel and a fourth liquid guiding channel inside; the side plate with the first liquid guiding channel is also formed with a first connecting channel, which is used to connect the end of the first liquid guiding channel with the beginning of the second liquid guiding channel; the side plate with the fourth liquid guiding channel is also formed with a third connecting channel, which is used to connect the end of the third liquid guiding channel with the beginning of the fourth liquid guiding channel.

[0010] Furthermore, multiple inductors are installed in the placement chamber; the inner wall of the placement chamber is equipped with a pair of second heat-conducting modules, both of which are used to contact the inductors. The coolant flowing in the first liquid channel contacts the side of one of the second heat-conducting modules away from the inductor, and the coolant flowing in the fourth liquid channel contacts the side of the other second heat-conducting module away from the inductor.

[0011] Furthermore, a liquid inlet channel and a liquid outlet channel are formed on the side plate in the width direction of the heat dissipation frame. The liquid inlet channel and the liquid outlet channel are formed on the same side plate, and the liquid inlet channel is connected to the beginning end of the first liquid guide channel, and the liquid outlet channel is connected to the end end of the fourth liquid guide channel.

[0012] Furthermore, the outside of the heat dissipation frame is provided with an inlet connection pipe that communicates with the inlet channel and an outlet connection pipe that communicates with the outlet channel.

[0013] Furthermore, the second liquid guiding channel includes a first slow-flow channel and a first reciprocating heat exchange channel connected to the first slow-flow channel; the initial end of the first slow-flow channel is connected to the first connecting channel, and the end of the first slow-flow channel is connected to the initial end of the first reciprocating heat exchange channel; the third liquid guiding channel includes a second slow-flow channel and a second reciprocating heat exchange channel connected to the second slow-flow channel; the initial end of the second reciprocating heat exchange channel is connected to the end of the first reciprocating heat exchange channel through a second connecting channel, the initial end of the second slow-flow channel is connected to the end of the second reciprocating heat exchange channel, and the end of the second slow-flow channel is connected to the third connecting channel.

[0014] Furthermore, both the first and second reciprocating heat exchange channels are multi-pass reciprocating serpentine channels.

[0015] Furthermore, the first heat-conducting module includes a heat-conducting plate and a square ring-shaped mounting frame. A first mounting groove is formed on the outer side of the mounting frame, and a second mounting groove is formed on the inner side of the mounting frame. The edge of the mounting opening is embedded in the first mounting groove so that the mounting frame is mounted on the mounting opening. The edge of the heat-conducting plate is embedded in the second mounting groove so that the heat-conducting plate is mounted on the mounting frame.

[0016] Furthermore, sealing rings are provided on the upper and lower walls of the first mounting groove and the upper and lower walls of the second mounting groove.

[0017] Furthermore, several IGBT modules are mounted on the top surface of the heat-conducting plate via mounting parts, and a heat-conducting layer is provided between each IGBT module and the top surface of the heat-conducting plate.

[0018] The beneficial effects of this utility model are as follows: After the coolant is delivered into the interior of the second liquid guiding channel from the initial end, it is first guided through the second liquid guiding channel. Under the connection of the second connecting channel, the coolant in the second liquid guiding channel enters the third liquid guiding channel and is guided through the third liquid guiding channel. The coolant flows through the second liquid guiding channel, the second connecting channel and the third liquid guiding channel in sequence, so that the coolant circulates in the top plate of the heat dissipation frame and contacts the bottom surface of the first heat conducting module.

[0019] After the IGBT module generates heat during operation, the first heat conduction module transfers the heat generated by the IGBT module to the flowing coolant, which then carries away the heat, achieving liquid cooling heat dissipation. Compared with existing heat sinks, this liquid cooling heat sink has higher heat dissipation efficiency. Attached Figure Description

[0020] Figure 1 This is a three-dimensional structural diagram of the present invention.

[0021] Figure 2 This is a three-dimensional structural schematic diagram of the present invention from another perspective.

[0022] Figure 3 This is a partial structural schematic diagram of the present invention.

[0023] Figure 4 This is a cross-sectional view of the present invention.

[0024] Figure 5 This is a cross-sectional view of the present invention from another perspective.

[0025] Figure 6 This is a schematic diagram of the structure of the second and third liquid guiding channels of this utility model.

[0026] Figure 7 This is a schematic diagram of the structure of the first heat-conducting module of this utility model.

[0027] The reference numerals in the figures include:

[0028] 1. Heat sink frame; 2. Placement chamber; 3. Inductor; 4. First liquid guide channel; 5. Second liquid guide channel; 51. First slow flow channel; 52. First reciprocating heat exchange channel; 6. Third liquid guide channel; 61. Second slow flow channel; 62. Second reciprocating heat exchange channel; 7. Fourth liquid guide channel; 8. First connecting channel; 9. Second connecting channel; 10. Third connecting channel; 11. Liquid inlet channel; 12. Liquid inlet connecting pipe; 13. Liquid outlet channel; 14. Liquid outlet connecting pipe; 15. Mounting opening; 16. First thermally conductive module; 161. Mounting frame; 162. First mounting groove; 163. Second mounting groove; 164. Heat-conducting plate; 165. Sealing ring; 17. IGBT module; 18. Second thermally conductive module; 19. Thermally conductive layer. Detailed Implementation

[0029] The following is a detailed description of a liquid-cooled radiator for an energy storage converter according to the present invention, with reference to the accompanying drawings.

[0030] like Figure 1-5 As shown, an embodiment of the liquid-cooled heat sink for an energy storage converter of the present invention includes a heat sink frame 1 and a placement chamber 2 formed at the bottom of the heat sink frame 1. By setting the placement chamber 2, the heat sink frame 1 is a structure composed of a top plate, two side plates in the length direction and two side plates in the width direction. Multiple inductors 3 (inductors 3 are existing technology and are components that can convert electrical energy into magnetic energy and store it) are installed in the placement chamber 2.

[0031] The heat dissipation frame 1 has a first liquid channel 4 and a fourth liquid channel 7 formed inside the two side plates along its length, and a second liquid channel 5 and a third liquid channel 6 formed inside the top plate of the heat dissipation frame 1. A first connecting channel 8 is also formed inside the side plate with the first liquid channel 4, which connects the end of the first liquid channel 4 to the beginning of the second liquid channel 5. A third connecting channel 10 is also formed inside the side plate with the fourth liquid channel 7, which connects the end of the third liquid channel 6 to the beginning of the fourth liquid channel 7. A second connecting channel 9 is also formed inside the top plate of the heat dissipation frame 1, which connects the end of the second liquid channel 5 to the beginning of the third liquid channel 6. After the coolant is introduced into the first guide channel 4, it is first guided through the first guide channel 4. Under the connection of the first connecting channel 8, the coolant in the first guide channel 4 enters the second guide channel 5 and is guided through the second guide channel 5. Under the connection of the second connecting channel 9, the coolant in the second guide channel 5 enters the third guide channel 6 and is guided through the third guide channel 6. Under the connection of the third connecting channel 10, the coolant in the third guide channel 6 enters the fourth guide channel 7 and is guided through the fourth guide channel 7. Finally, the coolant is discharged from the end of the fourth guide channel 7. In summary, the flow trajectory of the coolant is, in sequence, the first guide channel 4, the first connecting channel 8, the second guide channel 5, the second connecting channel 9, the third guide channel 6, the third connecting channel 10, and the fourth guide channel 7, so that the coolant circulates within the top plate and the two side plates along the length of the heat sink frame 1.

[0032] To facilitate the delivery and discharge of coolant, an inlet channel 11 and an outlet channel 13 are formed on the side plate along the width direction of the heat sink frame 1. The inlet channel 11 and the outlet channel 13 are formed on the same side plate, with the inlet channel 11 connected to the initial end of the first liquid guide channel 4 and the outlet channel 13 connected to the end of the fourth liquid guide channel 7. An inlet connecting pipe 12 connected to the inlet channel 11 and an outlet connecting pipe 14 connected to the outlet channel 13 are provided on the outside of the heat sink frame 1. The inlet connecting pipe 12 and the outlet connecting pipe 14 are respectively connected to different delivery pipes. The delivery pipe connected to the inlet connecting pipe 12 delivers coolant through the inlet channel 11 into the first liquid guide channel 4. After the coolant flows into the end of the fourth liquid guide channel 7, it is discharged from the outlet connecting pipe 14 through the outlet channel 13.

[0033] In this embodiment, the surface of the top plate of the heat sink frame 1 is formed with an installation opening 15. A first heat-conducting module 16 is installed at the installation opening 15, which simultaneously covers the second liquid guide channel 5 and the third liquid guide channel 6. The coolant flowing in the second liquid guide channel 5 and the third liquid guide channel 6 is in contact with the bottom surface of the first heat-conducting module 16. The top surface of the first heat-conducting module 16 is provided with a mounting part for mounting a plurality of IGBT modules 17. After the IGBT module 17 generates heat during operation, the first heat-conducting module 16 transfers the heat generated by the IGBT module 17 to the flowing coolant, and the heat is carried away by the flowing coolant, thereby achieving liquid cooling heat dissipation.

[0034] A pair of second heat-conducting modules 18, both for contacting the inductor 3, are installed on the inner wall of the placement chamber 2. The coolant flowing in the first liquid channel 4 contacts the side of one of the second heat-conducting modules 18 away from the inductor 3, and the coolant flowing in the fourth liquid channel 7 contacts the side of the other second heat-conducting module 18 away from the inductor 3. After the inductor 3 generates heat during operation, the heat is transferred through the second heat-conducting modules 18 on both sides to the coolant flowing in the first liquid channel 4 and the coolant flowing in the fourth liquid channel 7, achieving simultaneous liquid cooling of the IGBT module 17 and the inductor 3, thus improving heat dissipation efficiency.

[0035] like Figure 6 As shown, the second liquid guiding channel 5 includes a first slow flow channel 51 and a first reciprocating heat exchange channel 52 connected to the first slow flow channel 51; the initial end of the first slow flow channel 51 is connected to the first connecting channel 8, and the end of the first slow flow channel 51 is connected to the initial end of the first reciprocating heat exchange channel 52.

[0036] The third liquid guiding channel 6 includes a second slow flow channel 61 and a second reciprocating heat exchange channel 62 connected to the second slow flow channel 61; the initial end of the second reciprocating heat exchange channel 62 is connected to the end of the first reciprocating heat exchange channel 52 through a second connecting channel 9, the initial end of the second slow flow channel 61 is connected to the end of the second reciprocating heat exchange channel 62, and the end of the second slow flow channel 61 is connected to the third connecting channel 10.

[0037] Both the first slow-flow channel 51 and the second slow-flow channel 61 are used to slow down the flow of coolant, increase the contact time between the coolant and the first heat-conducting module 16, and enable heat to be fully transferred to the coolant.

[0038] Both the first reciprocating heat exchange channel 52 and the second reciprocating heat exchange channel 62 are multi-pass reciprocating serpentine channels; the pipeline passes through multiple reciprocating turns (such as...). Figure 6As indicated by the arrow, a "serpentine" layout is formed, creating a multi-flow path that allows the coolant to flow back and forth within the pipes. This extends the fluid path, enhances heat exchange efficiency, and ensures that the heat generated by the IGBT module 17 is fully transferred to the coolant and carried away. The combination of the multi-pass reciprocating serpentine channel and the slow-flow channel increases the contact time between the first heat-conducting module 16 and the coolant, further improving the efficiency of liquid cooling.

[0039] like Figure 7 As shown, the first heat-conducting module 16 includes a heat-conducting plate 164 and a square ring-shaped mounting frame 161. The outer side of the mounting frame 161 is formed with a first mounting groove 162, and the inner side of the mounting frame 161 is formed with a second mounting groove 163. The edge of the mounting opening 15 is embedded in the first mounting groove 162, so that the mounting frame 161 can be stably installed at the mounting opening 15. The edge of the heat-conducting plate 164 is embedded in the second mounting groove 163, so that the heat-conducting plate 164 can be stably installed on the mounting frame 161. Furthermore, under the installation action of the mounting frame 161, the heat-conducting plate 164 can be stably installed at the mounting opening 15 at the top of the heat dissipation frame 1. Sealing rings 165 are provided on the upper and lower walls of the first mounting groove 162 and the upper and lower walls of the second mounting groove 163. The sealing rings 165 are silicone sealing rings, which fill the gap between the edge of the mounting opening 15 and the inner wall of the first mounting groove 162, as well as the gap between the edge of the heat conduction plate 164 and the inner wall of the second mounting groove 163. By setting the sealing rings 165, the coolant in the second liquid guide channel 5 and the third liquid guide channel 6 is prevented from leaking out from the gap in the first mounting groove 162 or the second mounting groove 163, thereby improving the sealing performance of the mounting frame 161 after installation.

[0040] In addition, several IGBT modules 17 are mounted on the top surface of the heat-conducting plate 164 via mounting parts, and a heat-conducting layer 19 is provided between each IGBT module 17 and the top surface of the heat-conducting plate 164. The heat-conducting plate 164 is a graphene plate, and the heat-conducting layer 19 is a thermal grease layer. After applying thermal grease to the surface of the heat-conducting plate 164, the IGBT module 17 can be installed at the thermal grease layer. The heat generated by the IGBT module 17 after operation is transferred to the graphene plate through the thermal grease layer, and then transferred to the coolant in the second liquid channel 5 and the third liquid channel 6 through the graphene plate, where it is carried away by the coolant, thereby maintaining a constant temperature for the IGBT module 17.

[0041] In summary, this utility model possesses the aforementioned excellent characteristics, enabling it to achieve unprecedented efficiency in use and thus become a highly practical product.

[0042] The above description is only a preferred embodiment of this utility model. For those skilled in the art, there will be changes in the specific implementation method and application scope based on the idea of ​​this utility model. The content of this specification should not be construed as a limitation of this utility model.

Claims

1. A liquid-cooled heat sink for an energy storage converter, characterized by: It includes a heat dissipation frame (1) and a placement chamber (2) formed at the bottom of the heat dissipation frame (1). The top plate of the heat dissipation frame (1) is formed with a second liquid channel (5), a third liquid channel (6) and a second connecting channel (9) for connecting the end of the second liquid channel (5) with the beginning of the third liquid channel (6). The surface of the top plate of the heat dissipation frame (1) is formed with an installation opening (15). A first heat-conducting module (16) is installed at the installation opening (15) and simultaneously covers the second liquid flow channel (5) and the third liquid flow channel (6). The coolant flowing in the second liquid flow channel (5) and the third liquid flow channel (6) is in contact with the bottom surface of the first heat-conducting module (16). The top surface of the first heat-conducting module (16) is provided with a mounting part for mounting several IGBT modules (17).

2. The liquid cooling radiator for energy storage converter according to claim 1, characterized in that: The two side plates of the heat dissipation frame (1) along the length direction are respectively formed with a first liquid guiding channel (4) and a fourth liquid guiding channel (7); the side plate with the first liquid guiding channel (4) is also formed with a first connecting channel (8), which is used to connect the end of the first liquid guiding channel (4) with the beginning of the second liquid guiding channel (5); the side plate with the fourth liquid guiding channel (7) is also formed with a third connecting channel (10), which is used to connect the end of the third liquid guiding channel (6) with the beginning of the fourth liquid guiding channel (7).

3. The liquid-cooled heat sink for an energy storage inverter of claim 2, wherein: Multiple inductors (3) are installed in the placement chamber (2); the inner wall of the placement chamber (2) is equipped with a pair of second heat-conducting modules (18) that are both used to contact the inductors (3). The coolant flowing in the first liquid channel (4) contacts the side of one of the second heat-conducting modules (18) away from the inductor (3), and the coolant flowing in the fourth liquid channel (7) contacts the side of the other second heat-conducting module (18) away from the inductor (3).

4. A liquid-cooled radiator for an energy storage converter according to claim 3, characterized in that: The side plate of the heat dissipation frame (1) in the width direction is formed with an inlet channel (11) and an outlet channel (13). The inlet channel (11) and the outlet channel (13) are formed on the same side plate. The inlet channel (11) is connected to the beginning end of the first liquid guide channel (4), and the outlet channel (13) is connected to the end end of the fourth liquid guide channel (7).

5. A liquid-cooled radiator for an energy storage converter according to claim 4, characterized in that: The heat dissipation frame (1) is provided with an inlet connection pipe (12) that communicates with the inlet channel (11) and an outlet connection pipe (14) that communicates with the outlet channel (13).

6. The liquid-cooled heat sink for an energy storage inverter of claim 1, wherein: The second liquid guiding channel (5) includes a first slow-flow channel (51) and a first reciprocating heat exchange channel (52) connected to the first slow-flow channel (51); the initial end of the first slow-flow channel (51) is connected to the first connecting channel (8), and the end of the first slow-flow channel (51) is connected to the initial end of the first reciprocating heat exchange channel (52); the third liquid guiding channel (6) includes a second slow-flow channel (61) and a second reciprocating heat exchange channel (62) connected to the second slow-flow channel (61); the initial end of the second reciprocating heat exchange channel (62) is connected to the end of the first reciprocating heat exchange channel (52) through the second connecting channel (9), the initial end of the second slow-flow channel (61) is connected to the end of the second reciprocating heat exchange channel (62), and the end of the second slow-flow channel (61) is connected to the third connecting channel (10).

7. The liquid-cooled heat sink for an energy storage inverter of claim 6, wherein: Both the first reciprocating heat exchange channel (52) and the second reciprocating heat exchange channel (62) are multi-pass reciprocating serpentine channels.

8. The liquid-cooled heat sink for an energy storage inverter of claim 1, wherein: The first heat-conducting module (16) includes a heat-conducting plate (164) and a square ring-shaped mounting frame (161). The outer side of the mounting frame (161) is formed with a first mounting groove (162), and the inner side of the mounting frame (161) is formed with a second mounting groove (163). The edge of the mounting opening (15) is embedded in the first mounting groove (162) so that the mounting frame (161) is mounted in the mounting opening (15). The edge of the heat-conducting plate (164) is embedded in the second mounting groove (163) so that the heat-conducting plate (164) is mounted in the mounting frame (161).

9. The liquid-cooled heat sink for an energy storage inverter of claim 8, wherein: Sealing rings (165) are provided on the upper and lower walls of the first mounting groove (162) and the upper and lower walls of the second mounting groove (163).

10. The liquid-cooled heat sink for an energy storage inverter of claim 8, wherein: Several IGBT modules (17) are mounted on the top surface of the heat-conducting plate (164) via mounting parts, and a heat-conducting layer (19) is provided between each IGBT module (17) and the top surface of the heat-conducting plate (164).