Heat sink assembly and transfer switch device

Abstract

This application provides a heat dissipation enclosure assembly and a switching device. The heat dissipation enclosure assembly includes: an enclosure; a cooling fan; a mounting bracket disposed within the enclosure and dividing the space within the accommodating cavity into a first layer and a second layer along a second direction, the first layer being used to house a heat-generating element; and a radiator connected to the mounting bracket and located in the second layer, the radiator being used for thermally conductive connection with the heat-generating element. When the cooling fan operates, cold air from outside the enclosure can enter the interior through the main air inlet and be distributed to the first and second layers. The cold air can exchange heat with the heat-generating element in the first layer and with the radiator in the second layer. Hot air inside the enclosure can be discharged to the outside through the main exhaust outlet, achieving a heat dissipation effect. Thus, by optimizing the internal structural layout of the enclosure, the cooling fan can simultaneously provide air cooling for both the radiator and the heat-generating element, improving space utilization while ensuring heat dissipation performance.

Description

Technical Field

[0001] This application relates to the field of heat dissipation enclosure technology, and in particular to a heat dissipation enclosure assembly and a switching device. Background Technology

[0002] Static transfer switchgear (STS) is a crucial component in photovoltaic energy storage systems, enabling rapid switching between two independent power sources. If one power source exceeds its limits or experiences a power outage, the STS can quickly switch to the other, ensuring equipment operation and data security. Typically, depending on the application scenario and power output, one STS can be connected in parallel with multiple power storage converters (PCS).

[0003] Static transfer switchgear contains components that generate heat during operation, such as connecting copper busbars and thyristors. As the number of components connected in parallel increases, the current drawn by the static transfer switchgear also increases, leading to greater heat generation from these internal components. In related technologies, for applications with high heat generation, the number of heat sinks and fans is typically increased within the static transfer switchgear, resulting in increased internal space requirements and higher hardware costs. Utility Model Content

[0004] In view of the above, it is necessary to provide a heat dissipation enclosure assembly and a switching device to solve the above-mentioned defects.

[0005] This application provides a heat dissipation enclosure assembly, comprising: an enclosure having a receiving cavity, wherein a main air inlet and a main exhaust outlet are respectively provided on opposite sides of the enclosure in a first direction; a heat dissipation fan disposed within the enclosure; a mounting bracket disposed within the enclosure and dividing the space within the receiving cavity into a first layer and a second layer along a second direction, the first layer being used to house a heat-generating element, and the first direction and the second direction having an angle between them; and a radiator connected to the mounting bracket and located in the second layer, the radiator being used for thermally conductive connection with the heat-generating element; wherein the heat dissipation fan overlaps with the first layer and the second layer in the first direction; when the heat dissipation fan blows air from the main air inlet toward the main exhaust outlet along the first direction, the airflow passes through the first layer and the second layer respectively.

[0006] In some embodiments, the mounting bracket includes a main board portion, a bent portion, and an overlapping portion, wherein the main board portion is located between the first layer space and the second layer space, and the cooling fan is located on one side of the main board portion; the bent portion is bent from the side of the overlapping portion near the cooling fan toward the direction of approaching the first layer space, and the bent portion has an air inlet; the overlapping portion is located on the side of the bent portion away from the main board portion and overlaps with the cooling fan, and the cooling fan blows air toward the first layer space through the air inlet.

[0007] In some embodiments, an air outlet is provided on the side of the main board away from the bending portion, and the air inlet and air outlet are spaced apart along a first direction; when the heating element is housed in the first layer space, the heating element is located between the air inlet and the air outlet.

[0008] In some embodiments, the main exhaust port is located in the portion of the housing near the second-level space, and the air outlet and the main exhaust port are respectively connected to the second-level space.

[0009] In some embodiments, the motherboard has a communication port, the heat sink is fixed to the motherboard, and the side of the heat sink facing the first layer of space forms a mounting surface, which is used for heat conduction connection of the heat-generating element located in the first layer of space.

[0010] In some embodiments, the heat sink is provided with a plurality of fins spaced apart along a third direction, the plurality of fins being located in a second layer space, and the fins extending along a first direction, the first direction being perpendicular to the third direction.

[0011] In some embodiments, the main air inlet, the cooling fan, the fins, and the main exhaust outlet overlap in a first direction.

[0012] In some embodiments, there are multiple cooling fans, which are spaced apart along a third direction, with the first direction being perpendicular to the third direction.

[0013] In some embodiments, the heat dissipation enclosure assembly further includes a baffle plate disposed on the enclosure and shielding the first layer of space; the side of the mounting bracket is provided with a vertical plate portion, the vertical plate portion extending along a second direction, and the baffle plate overlapping the vertical plate portion.

[0014] The second aspect of this application provides a changeover switch device, including a heating element and a heat sink assembly as provided in the first aspect, wherein the heating element is disposed within the heat sink assembly.

[0015] With the heat dissipation enclosure assembly and switching device provided in this application, when the cooling fan is working, cold air from outside the enclosure can enter the interior through the main air inlet and be distributed to the first and second layer spaces. The cold air can exchange heat with the heating elements in the first layer space and with the radiator in the second layer space. Hot air inside the enclosure can be discharged to the outside through the main exhaust port, achieving a heat dissipation effect. Thus, by optimizing the internal structural layout of the enclosure, the cooling fan can simultaneously provide air cooling for both the radiator and the heating elements, improving space utilization while ensuring heat dissipation performance. Attached Figure Description

[0016] Figure 1 This is a structural schematic diagram of the heat dissipation enclosure assembly provided in this application.

[0017] Figure 2A schematic diagram of the internal structure of the heat dissipation enclosure assembly provided in this application from a first-view perspective.

[0018] Figure 3 A schematic diagram of the internal structure of the heat dissipation box assembly provided in this application from a second perspective.

[0019] Figure 4 A schematic diagram illustrating the principle of airflow diversion during operation of the heat dissipation enclosure assembly provided in this application.

[0020] Figure 5 A schematic diagram of the mounting bracket provided in this application.

[0021] Figure 6 This is a structural diagram of the mounting bracket and heat sink provided in this application.

[0022] Explanation of main component symbols

[0023] 10. Enclosure; 11. Receiving cavity; 111. First layer space; 112. Second layer space; 12. Main air inlet; 13. Main exhaust outlet; 14. Base plate; 15. First side plate; 16. Second side plate; 17. Front panel; 18. Back plate; 19. Mounting plate; 20. Mounting bracket; 21. Main board section; 211. Connecting port; 212. Air outlet; 22. Bending section; 221. Air inlet; 23. Overlap section; 24. Vertical plate section; 25. Folded edge section; 30. Radiator; 31. Fins; 32. Mounting surface; 40. Cooling fan; 50. Baffle; 100. Connector; 200. Thyristor; 300. Adapter copper busbar. Detailed Implementation

[0024] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments.

[0025] In the description of the embodiments in this application, the words "exemplary" or "for example" are used to indicate that they are examples, illustrations, or descriptions. Any embodiment or design that is described as "exemplary" or "for example" in the embodiments of this application should not be construed as being more preferred or advantageous than other embodiments or design options. Specifically, the use of the words "exemplary" or "for example" is intended to present the relevant concepts in a specific manner.

[0026] In current static transfer switch designs, heat dissipation solutions for high-current applications typically involve increasing the cross-sectional area of ​​the copper busbar to reduce current density and heat generation, but this increases costs. Another approach involves adding a separate fan to the copper busbar for cooling; however, the device usually contains heat-generating components such as thyristors, which require forced cooling. Adding an extra fan to the copper busbar would not only increase costs but also require additional space.

[0027] Therefore, this application provides a heat dissipation enclosure assembly and a switching device that can ensure heat dissipation while improving space utilization.

[0028] like Figures 1 to 3 As shown, this application first provides a heat dissipation enclosure assembly. The heat dissipation enclosure assembly can be applied to energy storage systems, specifically to switching devices within those systems. For example, the switching device includes a heat dissipation enclosure assembly and various electronic components, with the electronic components housed within the heat dissipation enclosure assembly. These electronic components can be circuit boards (not shown), connectors 100, thyristors 200, and transition copper busbars 300, etc. For ease of understanding, the thyristors 200, transition copper busbars 300, and other electronic components that generate significant heat are defined below as heat-generating elements.

[0029] In this embodiment, the heat dissipation enclosure assembly includes a housing 10, a mounting bracket 20, a radiator 30, a cooling fan 40, and a baffle 50. The housing 10 has a receiving cavity 11, and a main air inlet 12 and a main exhaust outlet 13 are respectively opened on opposite sides in a first direction, both of which are connected to the receiving cavity 11. The first direction is the X direction shown in the figure. The cooling fan 40 is disposed inside the housing 10 and blows air along the first direction.

[0030] Please refer to the following: Figure 4 A mounting bracket 20 is disposed within the housing 10 and divides the space within the accommodating cavity 11 into a first space 111 and a second space 112 along a second direction. An angle exists between the first and second directions, with the second direction being the Z direction as shown in the figure. The first space 111 is used to house the heating element. A heat sink 30 is connected to the mounting bracket 20 and located in the second space 112, serving as a thermally conductive connection with the heating element. A cooling fan 40 overlaps with both the first and second spaces 111 and 112 along a first direction. When the cooling fan 40 blows air from the main air inlet 12 towards the main exhaust outlet 13 along the first direction, the airflow passes through both the first and second spaces 111 and 112 respectively. A baffle 50 is disposed within the housing 10, obstructing the view above the first space 111.

[0031] It is understandable that when the cooling fan 40 is working, cold air from outside the enclosure 10 can enter the interior through the main air inlet 12 and be distributed to the first layer space 111 and the second layer space 112. The cold air can exchange heat with the heating elements in the first layer space 111 and with the radiator 30 in the second layer space 112. The hot air inside the enclosure 10 can be discharged to the outside through the main exhaust port 13, achieving a heat dissipation effect. In this way, by optimizing the internal structural layout of the enclosure 10, the cooling fan 40 can simultaneously provide air cooling for both the radiator 30 and the heating elements, improving space utilization while ensuring heat dissipation performance.

[0032] In the example of this application, the heating element includes a connecting copper busbar 300 and a thyristor 200. Both the thyristor 200 and the connecting copper busbar 300 are located in the first layer space 111. The thyristor 200 is thermally connected to the heating element, and the connecting copper busbar 300 is electrically connected to the thyristor 200.

[0033] It is understandable that during equipment operation, due to the significant losses in the thyristor 200, a large amount of heat from the thyristor 200 may be conducted to the heat dissipation system. By diverting the airflow to the first layer space 111 and the second layer space 112, the cold air can, on the one hand, exchange heat with the heat sink 30 for indirect heat dissipation of the thyristor 200, and on the other hand, it can directly cool the thyristor 200 and the transition copper busbar 300 in the first layer space 111. In this way, without affecting the heat dissipation of the thyristor 200, a portion of the airflow can be diverted to the transition copper busbar 300 for heat dissipation, thus meeting the overall heat dissipation performance requirements. At the same time, it is not necessary to increase the cross-sectional area of ​​the transition copper busbar 300 or configure an additional fan to blow air onto the transition copper busbar 300, saving space and reducing hardware costs.

[0034] In some embodiments, the housing 10 includes a bottom plate 14, a first side plate 15, a second side plate 16, a front panel 17, a back plate 18, and a top plate (not shown). The first side plate 15 and the second side plate 16 are fixed to the bottom plate 14 on both sides in a third direction, which is the Y direction shown in the figure. The front panel 17 and the back plate 18 are fixed to the bottom plate 14 on both sides in a first direction. The front panel 17, the back plate 18, the first side plate 15, and the second side plate 16 together form a receiving cavity 11. The bottom plate 14 is located at the bottom of the receiving cavity 11, and the top plate covers the top of the receiving cavity 11.

[0035] Specifically, panel 17 is located on the front of housing 10. A main exhaust port 13 is opened on the side of panel 17 near the bottom plate 14. The main exhaust port 13 penetrates both sides of panel 17 and has multiple ports arranged in a grid pattern. Connector 100 is embedded in panel 17. Part of connector 100 is located within the first layer space 111 and connected to the adapter copper busbar 300. The other part of connector 100 is located on the outside of panel 17 for connection to other energy storage devices. Back panel 18 is located on the back of housing 10. A main air inlet 12 is opened on the side of back panel 18 near the bottom plate 14. The main air inlet 12 penetrates both sides of back panel 18 and has multiple ports arranged in a grid pattern.

[0036] In some embodiments, a cooling fan 40 is fixed to the base plate 14 near the back plate 18. The cooling fan 40 has an air inlet and an air outlet. The air inlet of the cooling fan 40 is located adjacent to the main air inlet 12, and the air outlet of the cooling fan 40 is located towards the first layer space 111 and the second layer space 112. Multiple cooling fans 40 are distributed at intervals along a third direction, and the multiple cooling fans 40 blow air simultaneously from multiple locations to improve heat dissipation efficiency. For example, the number of cooling fans 40 is 3, and the number of thyristors 200 is 3. Each cooling fan 40 corresponds to each thyristor 200, and each cooling fan 40 can blow air towards its corresponding thyristor 200. The housing 10 is also equipped with a mounting plate 19, and the cooling fan 40 is bolted to the mounting plate 19. The mounting plate 19 has an opening corresponding to the cooling fan 40 (not shown in the figure). The cooling fan 40 blows air towards the first layer space 111 and the second layer space 112 through the opening.

[0037] Please refer to the following: Figure 5 and Figure 6 In some embodiments, the mounting bracket 20 includes a main board portion 21, a bent portion 22, an overlapping portion 23, and a vertical plate portion 24, wherein the main board portion 21 is located between a first layer space 111 and a second layer space 112. The main board portion 21 is perpendicular to the second direction, the first layer space 111 is formed on the side of the main board portion 21 away from the base plate 14, and the second layer space 112 is formed on the side of the main board portion 21 facing the base plate 14. A cooling fan 40 is located on one side of the main board portion 21, and the cooling fan 40 is located between the main board portion 21 and the back plate 18.

[0038] The bent portion 22 is bent from the side of the overlapping portion 23 near the cooling fan 40 toward the direction near the first layer space 111, so that the bent portion 22 as a whole has an angle with the second direction. The bent portion 22 has an air inlet 221, which runs through both sides of the bent portion 22, and there are multiple air inlets 221, which are spaced apart along the third direction. The overlapping portion 23 is located on the side of the bent portion 22 away from the main board portion 21, and the overlapping portion 23 is parallel to the main board portion 21. The bent portion 22 connects the overlapping portion 23 and the main board portion 21.

[0039] Specifically, the distance between the main board 21 and the base plate 14 in the second direction is less than the height of the cooling fan 40 in the second direction. Viewed along the first direction, the main board 21 is located in the middle of the cooling fan 40, the lower part of the cooling fan 40 faces the second layer space 112, and the upper part of the cooling fan 40 faces the bending part 22.

[0040] Under the action of the bending portion 22, a height difference is formed between the overlapping portion 23 and the main board portion 21, so that the distance between the overlapping portion 23 and the base plate 14 is greater than the distance between the main board portion 21 and the base plate 14 in the second direction, providing sufficient accommodation space for the cooling fan 40. The overlapping portion 23 overlaps with the cooling fan 40. When the cooling fan 40 is working, the cooling fan 40 blows air directly into the second layer space 112, and at the same time, the cooling fan 40 blows air towards the first layer space 111 through the air inlet 221.

[0041] In some embodiments, an air outlet 212 is provided on the side of the main board portion 21 away from the bending portion 22, and the air inlet 221 and the air outlet 212 are spaced apart along a first direction. A main exhaust port 13 is provided in the portion of the housing 10 near the second layer space 112. Specifically, the main exhaust port 13 is provided on the side of the panel 17 near the second layer space 112, and the air outlet 212 and the main exhaust port 13 are respectively connected to the second layer space 112. When the heating element is housed within the first layer space 111, the heating element is located between the air inlet 221 and the air outlet 212.

[0042] During the heat dissipation process, the air in the first layer space 111, after heat exchange with the heating element, flows to the second layer space 112 through the air outlet 212. The space in the second layer space 112, after heat exchange with the heat sink 30 and the space flowing in from the air outlet 212, can be discharged to the outside of the enclosure 10 through the main exhaust port 13. In this way, by utilizing the positional relationship between the air outlet 212 and the main exhaust port 13, the hot air that has undergone heat exchange in the first layer space 111 and the second layer space 112 is guided together to be discharged from the main exhaust port 13 at the bottom of the enclosure 10, preventing the hot air from flowing upward inside the enclosure 10 and affecting the operation of the upper electronic components.

[0043] In some embodiments, the main board portion 21 has a communication port 211 located between the air inlet 221 and the air outlet 212. A heat sink 30 is fixed to the main board portion 21, and a mounting surface 32 is formed on the side of the heat sink 30 facing the first layer space 111. The mounting surface 32 is used for thermally conductive connection of the heat-generating element located within the first layer space 111. The heat sink 30 is provided with a plurality of fins 31 spaced apart along a third direction. The plurality of fins 31 are located within the second layer space 112, and the fins 31 extend along a first direction. The main air inlet 12, the cooling fan 40, the fins 31, and the main exhaust port 13 overlap in the first direction.

[0044] For example, the heat sink 30 is bolted to the motherboard 21, and the bottom of the thyristor 200 is coated with thermal grease and then fixed to the mounting surface 32 of the heat sink 30 with screws. The thermal grease applied to the thyristor 200 can fill the local gap between the bottom of the thyristor 200 and the heat sink 30, thereby improving the heat transfer efficiency between the thyristor 200 and the heat sink 30.

[0045] Thus, when the equipment is working, the heat generated by the thyristor 200 can be quickly conducted to the fins 31 of the heat sink 30, and the cold air blown out by the cooling fan 40 can pass through the gaps between multiple fins 31 for heat exchange, and then be discharged from the main exhaust port 13 to the outside of the housing 10.

[0046] In some embodiments, the upright plate portion 24 is disposed on the side of the main board portion 21, and the upright plate portion 24 extends along a second direction, with the baffle 50 overlapping the upright plate portion 24. For example, the main board portion 21 has upright plate portions 24 on both sides in a third direction, the upright plate portions 24 being formed by bending the side of the main board portion 21, and the two upright plate portions 24 are respectively attached and bolted to the first side plate 15 and the second side plate 16. The baffle 50 overlaps the side of the upright plate portion 24 away from the main board portion 21, and the baffle 50 is bolted to the upright plate portion 24. The top of the baffle 50 can be used to mount electronic devices such as circuit boards. It is understood that the baffle 50 can shield the first layer space 111, preventing hot air in the first layer space 111 from continuing to flow upwards and affecting the operation of the upper-layer electronic devices.

[0047] In some embodiments, a folded edge portion 25 is provided on the side of the main board portion 21 away from the bending portion 22. The folded edge portion 25 extends along a second direction and is fixed to the housing 10. Exemplarily, the folded edge portion 25 is formed by bending the side of the main board portion 21, and is fitted against the inner side of the panel 17 and bolted to it. Both the folded edge portion 25 and the upright plate portion 24 can fit against the inner side of the housing 10 and achieve positioning effects from different positions and directions. This facilitates the positioning of the mounting bracket 20 during the assembly process, improving assembly efficiency.

[0048] The assembly process of the heat sink assembly is described below.

[0049] First, the heat sink 30 is bolted and fixed to the main board portion 21 of the mounting bracket 20 so that the mounting surface 32 of the heat sink 30 is exposed to the communication port 211, and the fixed heat sink 30 and mounting bracket 20 are easier to transfer and assemble.

[0050] Then, position and fix the mounting bracket 20 inside the housing 10. Apply thermal grease to the bottom of the thyristor 200 and fix it to the heat sink 30 with screws. Fix the mounting plate 19 to the housing 10, fix the cooling fan 40 to the mounting plate 19, and fix the overlapping part 23 of the mounting bracket 20 to the cooling fan 40.

[0051] Then, the connector 100 is installed on the panel 17, the adapter copper busbar 300 is connected between the thyristor 200 and the connector 100, and the baffle 50 is installed on the upright plate 24 of the mounting bracket 20.

[0052] In this way, the overall assembly of the heat dissipation box assembly can be achieved. During this process, the mounting bracket 20 can be used as a support structure for the heat sink 30 and the heat-generating element for handling and assembly. Moreover, the mounting bracket 20 can be positioned by its own contour to fit the inside of the box 10, which facilitates assembly and improves assembly efficiency and production efficiency.

[0053] This application also provides a transfer switchgear. The transfer switchgear can be applied in energy storage systems and connected to other energy storage devices such as energy storage converters.

[0054] Specifically, the switching equipment includes a heat sink assembly and various electronic components, with the electronic components housed within the heat sink assembly. These electronic components may include circuit boards, connectors 100, thyristors 200, and transition copper busbars 300, etc. For ease of understanding, the thyristors 200, transition copper busbars 300, and other electronic components that generate significant heat will be defined as heat-generating elements, which are housed within the heat sink assembly.

[0055] The working principle and beneficial effects of the switching device provided in this application can be found in the relevant descriptions in the foregoing embodiments, and will not be repeated here.

[0056] It will be apparent to those skilled in the art that this application is not limited to the details of the exemplary embodiments described above, and that this application can be implemented in other specific forms without departing from the spirit or essential characteristics of this application. Therefore, the embodiments described above should be considered exemplary and non-limiting in all respects, and the scope of this application is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within this application.

Claims

1. A heat sink enclosure assembly, comprising: include: The housing has a accommodating cavity, and the housing has a main air inlet and a main exhaust outlet on two opposite sides in a first direction, respectively; A cooling fan is installed inside the enclosure; The mounting bracket is disposed inside the housing and divides the space inside the accommodating cavity into a first layer of space and a second layer of space along the second direction. The first layer of space is used to accommodate the heating element, and there is an angle between the first direction and the second direction. A heat sink is connected to the mounting bracket and located in the second layer space. The heat sink is used for thermally conductive connection with the heat-generating element. The cooling fan overlaps with the first layer space and the second layer space in the first direction; when the cooling fan blows air from the main air inlet to the main exhaust outlet along the first direction, the airflow passes through the first layer space and the second layer space respectively.

2. The heat sink enclosure assembly of claim 1, wherein, The mounting bracket includes a main board section, a bending section, and an overlapping section. The main board section is located between the first layer space and the second layer space, and the cooling fan is located on one side of the main board section. The bending section is bent from the side of the overlapping section near the cooling fan towards the first layer space, and the bending section has an air inlet. The overlapping section is located on the side of the bending section away from the main board section and overlaps with the cooling fan. The cooling fan blows air towards the first layer space through the air inlet.

3. The heat sink enclosure assembly of claim 2, wherein, An air outlet is provided on the side of the main board away from the bending portion, and the air inlet and the air outlet are spaced apart along the first direction; when the heating element is housed in the first layer space, the heating element is located between the air inlet and the air outlet.

4. The heat sink enclosure assembly of claim 3, wherein, The main exhaust port is located in the part of the housing near the second layer space, and the air outlet and the main exhaust port are respectively connected to the second layer space.

5. The heat sink enclosure assembly of claim 2, wherein, The motherboard has a communication port, the heat sink is fixed to the motherboard, and the side of the heat sink facing the first layer space forms a mounting surface, which is used for thermally conductive connection of the heating element located in the first layer space.

6. The heat sink enclosure assembly of claim 1, wherein, The radiator is provided with a plurality of fins spaced apart along a third direction. The plurality of fins are located in the second layer space and extend along the first direction, which is perpendicular to the third direction.

7. The heat sink enclosure assembly of claim 6, wherein, The main air inlet, the cooling fan, the fins, and the main exhaust outlet overlap in a first direction.

8. The heat sink enclosure assembly of claim 1, wherein, The cooling fan is a plurality of such fans, which are spaced apart along a third direction, the first direction being perpendicular to the third direction.

9. The heat sink enclosure assembly of claim 1, wherein, The heat dissipation box assembly also includes a baffle plate, which is disposed on the box and blocks the first layer space; the side of the mounting bracket is provided with a vertical plate portion, which extends along the second direction, and the baffle plate overlaps the vertical plate portion.

10. A transfer switch device, characterized by It includes a heating element and a heat dissipation housing assembly as described in any one of claims 1 to 9, wherein the heating element is disposed within the heat dissipation housing assembly.

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