A circuit board structure for a supercapacitor with heat dissipation function

Abstract

This utility model relates to the field of circuit board technology and discloses a circuit board structure for a supercapacitor with heat dissipation function. The structure includes a circuit board for the supercapacitor, with heat dissipation holes and positioning holes on its surface. The heat dissipation holes on the circuit board allow for heat dissipation of large and small electronic components fixed to the top of the circuit board, while simultaneously placing the large electronic components in a central position and distributing the small components evenly. This effectively prevents heat accumulation from the large and small electronic components from affecting the lifespan of the circuit board. The heat generated by the large electronic components is absorbed and dispersed by the heat sink on top, increasing the heat dissipation area. The heat sink is then connected to a connecting rod fixed at the bottom, with a reducing bolt and a washer connecting to the inside of the connecting rod and the bottom of the circuit board, preventing the bottom of the heat sink from detaching from the top of the large electronic components.

Description

Technical Field

[0001] This utility model relates to the field of circuit board technology, and in particular to a circuit board structure for a supercapacitor with heat dissipation function. Background Technology

[0002] The circuit board of a supercapacitor is typically a CMS (SuperCapacitor Management System) circuit board, designed to ensure stable operation during use and prevent overheating that could damage components or degrade performance. The heat dissipation design is particularly important for high-power, long-term operation, and high-temperature ambient applications.

[0003] Most circuit boards in the current technology do not have their own heat dissipation devices. Instead, they rely on external fans and fixed heat sinks to dissipate heat from the electronic components fixed on the surface of the circuit board. This limits the flexibility and practicality of the circuit board due to the limitations of the fans and heat sinks. Circuit boards with supercapacitors installed on them generate a lot of heat. For circuit boards without heat dissipation functions, long-term use can easily affect the lifespan of the circuit board, or even cause it to be damaged. Utility Model Content

[0004] To solve the above-mentioned technical problems, this utility model provides a circuit board structure for a supercapacitor with heat dissipation function.

[0005] This utility model is achieved using the following technical solution: a circuit board structure for a supercapacitor with heat dissipation function, comprising a circuit board for the supercapacitor, heat dissipation holes and positioning holes on the surface of the circuit board, a large electronic component fixedly connected to the top of the circuit board, a small electronic component fixedly connected to the top of the circuit board, a heat sink being disposed in contact with the top of the large electronic component, a connecting rod being fixedly connected to the bottom of the heat sink, the outer wall of the connecting rod being slidably connected to the inner wall of the positioning hole, a reducing bolt being threadedly connected to the inner wall of the connecting rod, and a washer being disposed in contact with the surface of the reducing bolt.

[0006] As a further improvement to the above solution, several heat dissipation holes are provided, four positioning holes are provided, the four positioning holes are symmetrically arranged around the large electronic component, and four variable diameter bolts are provided.

[0007] Through the above technical solution, the heat dissipation holes opened on the circuit board of the supercapacitor can dissipate heat to a certain extent for the large and small electronic components fixed on the top of the circuit board. At the same time, the large electronic components are placed in the center and the small electronic components are evenly distributed, which effectively prevents the heat generated by the large and small electronic components from accumulating and affecting the service life of the circuit board of the supercapacitor.

[0008] As a further improvement to the above solution, the control cabinet is fixedly connected to a limit slide rail on the front, the connecting rod is slidably connected to a heat sink 2 on its outer wall, the outer wall of the reducing bolt is threadedly connected to the inner wall of the heat sink 2, and the gasket surface is contacted and disposed on the surface of the heat sink 2.

[0009] As a further improvement to the above solution, the supercapacitor is fixedly connected to a base at the bottom of the circuit board, and a threaded rod is rotatably connected to the inner wall of the base. The right side of the threaded rod passes through the inner wall of the base and extends thereto, and a sliding groove is provided at the bottom of the base.

[0010] As a further improvement to the above solution, the outer wall of the threaded rod is threadedly connected to a threaded slider, the inner wall of the threaded slider is rotatably connected to a rotating rod, and the outer wall of the rotating rod is rotatably connected to a connecting rod.

[0011] As a further improvement to the above solution, a second rotating rod is rotatably connected to the inner wall of the end of the connecting rod away from the rotating rod, a fixed block is rotatably connected to the outer wall of the second rotating rod, a lifting slider is fixedly connected to the bottom of the fixed block, the outer wall of the lifting slider is slidably connected to the inner wall of the slide groove, and an adjustment groove is provided on the right side of the threaded rod.

[0012] As a further improvement to the above solution, four threaded rods are provided, and the four threaded rods are symmetrically arranged around the large electronic component. Four lifting sliders are also provided, and the four lifting sliders are symmetrically arranged around the large electronic component.

[0013] With the above technical solution, when the large electronic component is a device with a large heat dissipation, the second heat sink can be pressed into the bottom of the positioning hole, and then the reducing bolt can be threaded onto the inner wall of the second heat sink and the connecting rod respectively. This allows the heat received by the heat sink to be transferred to the second heat sink through the connecting rod, and then the heat sink releases heat to the bottom through the second heat sink to improve the heat exchange efficiency of the large electronic component.

[0014] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0015] This invention utilizes heat dissipation holes in the circuit board of a supercapacitor to provide a certain degree of heat dissipation for both large and small electronic components fixed on the top of the circuit board. Simultaneously, it positions the large electronic components centrally while distributing the small components evenly, effectively preventing heat buildup from affecting the lifespan of the supercapacitor circuit board. Furthermore, the heat generated by the large electronic components is absorbed and dispersed by the top heat sink, increasing the heat dissipation area. The heat sink is then connected to the bottom via a connecting rod, with a reducing bolt and washer connecting to the inside of the connecting rod and the bottom of the supercapacitor circuit board, preventing the bottom of the heat sink from detaching from the top of the large electronic components.

[0016] This invention allows for the insertion of a second heat sink into a positioning hole when a large electronic component requires significant heat dissipation. A reducing bolt is then threaded onto the inner walls of the second heat sink and the connecting rod, respectively. This allows the heat received by the heat sink to be transferred to the second heat sink via the connecting rod, and then the heat sink releases heat to the bottom, improving the heat exchange efficiency of the large electronic component. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0018] Figure 2 This is a schematic diagram of the structure of the small electronic component of this utility model;

[0019] Figure 3 This is a schematic diagram of the bottom structure of the circuit board for the supercapacitor of this utility model;

[0020] Figure 4 This is a schematic diagram of the cross-sectional structure of the positioning hole of this utility model;

[0021] Figure 5 This utility model Figure 4 Enlarged structural diagram of section A in the middle;

[0022] Figure 6 This is a schematic diagram of the cross-sectional structure of the base of this utility model;

[0023] Figure 7 This utility model Figure 6 Enlarged structural diagram of section B.

[0024] Explanation of key symbols:

[0025] 1. Circuit board for supercapacitor; 2. Heat dissipation holes; 3. Positioning holes; 4. Large electronic components; 5. Small electronic components; 6. Heat sink; 7. Connecting rod; 8. Variable diameter bolt; 9. Gasket; 10. Second heat sink; 11. Base; 12. Threaded rod; 13. Slide groove; 14. Threaded slider; 15. Rotating rod; 16. Connecting rod; 17. Second rotating rod; 18. Fixing block; 19. Adjusting groove; 20. Lifting slider. Detailed Implementation

[0026] The present invention will be further described below with reference to the accompanying drawings and specific embodiments. It should be noted that, without conflict, the various embodiments or technical features described below can be arbitrarily combined to form new embodiments.

[0027] Example:

[0028] Please combine Figure 1-7 This embodiment discloses a circuit board structure for a supercapacitor with heat dissipation function, including a supercapacitor circuit board 1. The surface of the supercapacitor circuit board 1 has heat dissipation holes 2 and positioning holes 3. A large electronic component 4 and a small electronic component 5 are fixedly connected to the top of the supercapacitor circuit board 1. A heat sink 6 is disposed in contact with the top of the large electronic component 4. A connecting rod 7 is fixedly connected to the bottom of the heat sink 6. The outer wall of the connecting rod 7 is slidably connected to the inner wall of the positioning hole 3. A reducing bolt 8 is threadedly connected to the inner wall of the connecting rod 7. A washer 9 is disposed in contact with the surface of the reducing bolt 8.

[0029] Several heat dissipation holes 2 are provided, and four positioning holes 3 are provided. The four positioning holes 3 are symmetrically arranged around the large electronic component 4. Four reducing bolts 8 are provided.

[0030] The outer wall of the connecting rod 7 is slidably connected to the heat sink 10, the outer wall of the reducing bolt 8 is threadedly connected to the inner wall of the heat sink 10, and the surface of the gasket 9 is in contact with the surface of the heat sink 10.

[0031] The circuit board 1 for the supercapacitor is fixedly connected to a base 11 at the bottom. A threaded rod 12 is rotatably connected to the inner wall of the base 11. The right side of the threaded rod 12 passes through the inner wall of the base 11 and extends therein. A groove 13 is provided at the bottom of the base 11.

[0032] The threaded rod 12 has a threaded slider 14 connected to its outer wall, and a rotating rod 15 is rotatably connected to the inner wall of the threaded slider 14. The rotating rod 15 is rotatably connected to the outer wall of the rotating rod 15.

[0033] A second rotating rod 17 is rotatably connected to the inner wall of the end of the connecting rod 16 away from the rotating rod 15. A fixed block 18 is rotatably connected to the outer wall of the second rotating rod 17. A lifting slider 20 is fixedly connected to the bottom of the fixed block 18. The outer wall of the lifting slider 20 is slidably connected to the inner wall of the slide groove 13. An adjustment groove 19 is provided on the right side of the threaded rod 12.

[0034] There are four threaded rods 12, which are symmetrically arranged around the large electronic component 4. There are also four lifting sliders 20, which are symmetrically arranged around the large electronic component 4.

[0035] The implementation principle of the circuit board structure of a supercapacitor with heat dissipation function in this application embodiment is as follows: The heat dissipation holes 2 opened on the circuit board 1 of the supercapacitor can dissipate heat to a certain extent from the large electronic components 4 and small electronic components 5 fixed on the top of the circuit board 1. Simultaneously, the large electronic components 4 are positioned centrally, and the small electronic components 5 are evenly distributed, effectively preventing the heat generated by the large electronic components 4 and small electronic components 5 from accumulating and affecting the service life of the circuit board 1. Meanwhile, the heat generated by the large electronic components 4 is absorbed and dispersed by the heat sink 6 on top, increasing the heat dissipation area of ​​the large electronic components 4. Then, the heat sink 6 is connected to the bottom of the circuit board 1 via a connecting rod 7, which connects the reducing bolt 8 and the washer 9 to the inside of the connecting rod 7, preventing the bottom of the heat sink 6 from detaching from the top of the large electronic components 4. In the absence of the heat sink 10, multiple washers 9 can be installed on the surface of the reducing bolt 8 to compensate for the heat generated by the reducing bolt 8 and the supercapacitor. The gap between the circuit boards 1 allows for the insertion of heat sink 10 from the bottom of the positioning hole 3 when the large electronic component 4 has a large heat dissipation capacity. Then, the reducing bolt 8 is threaded onto the inner wall of the heat sink 10 and the connecting rod 7, respectively. This allows the heat received by the heat sink 6 to be transferred to the heat sink 10 through the connecting rod 7. At the same time, the top of the heat sink 10 absorbs the heat generated at the bottom of the supercapacitor circuit board 1 and then releases the heat to the bottom, increasing the heat exchange efficiency of the large electronic component 4. The adjusting groove 19 on the right side of the rotating threaded rod 12 can be used to move the threaded slider 14 to the left along the threaded rod 12. Simultaneously, the threaded slider 14 drives the rotating rod 15, which in turn pushes the connecting rod 16. The connecting rod 16 pushes the rotating rod 17, which in turn pushes the fixing block 18. The fixing block 18 pushes the adjusting groove 19 to slide down along the sliding groove 13 on the base 11, thereby increasing the space at the bottom of the supercapacitor circuit board 1, accelerating air circulation, and improving the heat dissipation efficiency of the heat sink 10.

[0036] The above embodiments are merely preferred embodiments of this utility model and should not be construed as limiting the scope of protection of this utility model. Any non-substantial changes and substitutions made by those skilled in the art based on this utility model shall fall within the scope of protection claimed by this utility model.

Claims

1. A circuit board structure of a super capacitor with a heat dissipation function, characterized by, The device includes a supercapacitor circuit board (1), which has heat dissipation holes (2) and positioning holes (3) on its surface. A large electronic component (4) is fixedly connected to the top of the supercapacitor circuit board (1), and a small electronic component (5) is fixedly connected to the top of the supercapacitor circuit board (1). A heat sink (6) is disposed on the top of the large electronic component (4), and a connecting rod (7) is fixedly connected to the bottom of the heat sink (6). The outer wall of the connecting rod (7) is slidably connected to the inner wall of the positioning hole (3), and a reducing bolt (8) is threadedly connected to the inner wall of the connecting rod (7). A gasket (9) is disposed on the surface of the reducing bolt (8).

2. The circuit board structure of the super capacitor with heat dissipation function according to claim 1, characterized in that: The heat dissipation holes (2) are provided in several places, the positioning holes (3) are provided in four places, the four positioning holes (3) are symmetrically arranged around the large electronic component (4), and the variable diameter bolts (8) are provided in four places.

3. The circuit board structure of a supercapacitor with heat dissipation function as described in claim 1, characterized in that: The outer wall of the connecting rod (7) is slidably connected to the heat sink 2 (10), the outer wall of the variable diameter bolt (8) is threadedly connected to the inner wall of the heat sink 2 (10), and the surface of the gasket (9) is in contact with the surface of the heat sink 2 (10).

4. The circuit board structure of a supercapacitor with heat dissipation function as described in claim 3, characterized in that: The circuit board (1) for the supercapacitor is fixedly connected to a base (11) at the bottom. A threaded rod (12) is rotatably connected to the inner wall of the base (11). The right side of the threaded rod (12) passes through the inner wall of the base (11) and extends therein. A groove (13) is provided at the bottom of the base (11).

5. The circuit board structure of a supercapacitor with heat dissipation function as described in claim 4, characterized in that: The threaded rod (12) is threadedly connected to a threaded slider (14) on its outer wall. The inner wall of the threaded slider (14) is rotatably connected to a rotating rod (15). The outer wall of the rotating rod (15) is rotatably connected to a connecting rod (16).

6. The circuit board structure of a supercapacitor with heat dissipation function as described in claim 5, characterized in that: The inner wall of the connecting rod (16) away from the rotating rod (15) is rotatably connected to a rotating rod two (17). The outer wall of the rotating rod two (17) is rotatably connected to a fixed block (18). The bottom of the fixed block (18) is fixedly connected to a lifting slider (20). The outer wall of the lifting slider (20) is slidably connected to the inner wall of the slide groove (13). An adjustment groove (19) is provided on the right side of the threaded rod (12).

7. The circuit board structure of a supercapacitor with heat dissipation function as described in claim 6, characterized in that: Four threaded rods (12) are provided, and the four threaded rods (12) are symmetrically arranged around the large electronic component (4). Four lifting sliders (20) are provided, and the four lifting sliders (20) are symmetrically arranged around the large electronic component (4).

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