Thermally conductive structures, liquid cooling devices, and electronic equipment

Abstract

This invention provides a heat-conducting structure, a liquid cooling device, and an electronic device, relating to the field of electronic device cooling technology. It includes an outer film layer and a heat-conducting component. In the unfolded state, the outer film layer is divided into a middle folded section, a first outer film segment, and a second outer film segment. In the folded state, the first and second outer film segments are folded inwards from the middle folded section. The heat-conducting structure includes multiple elastic heat-conducting units spaced apart. In the folded state, an insertion gap is formed between the elastic heat-conducting units on the first outer film segment and those on the second outer film segment. This invention's heat-conducting structure can conduct heat between the liquid cooling device and the component to be cooled, reducing the temperature of the component and enabling stable operation. It is particularly suitable for the thermal management needs of server DIMMs.

Description

Technical Field

[0001] This utility model relates to the field of electronic device cooling technology, and in particular to a heat-conducting structure, a liquid cooling device, and an electronic device. Background Technology

[0002] With the rapid growth of hyperscale data centers, the demand for AI servers and high-performance computing (HPC) equipment is exploding. To cope with the enormous heat generated by CPUs and other integrated circuits (ICs) during operation, cold-plate liquid cooling technology is gradually becoming the mainstream heat dissipation solution. Cold-plate liquid cooling technology can efficiently remove heat from key heat-generating components, including memory modules (DIMMs), through direct contact or indirect cooling, thereby maintaining stable system operation. Therefore, designing an efficient thermal interface solution between the memory module (DIMM) and the liquid cooling plate has become a crucial step in achieving reliable thermal management. Currently, the mainstream solution in the industry uses thermally conductive pads combined with polyimide (PI) or metal films as the thermal interface material. While this solution achieves heat conduction to some extent, it has significant shortcomings in practical applications. For example, the thermally conductive pads may have poor resilience or good resilience but high material hardness, making it difficult to maintain good contact pressure after repeated insertion and removal, leading to increased thermal resistance and affecting heat dissipation efficiency. Furthermore, the insufficient compressibility of the thermally conductive pads makes it difficult to flexibly adapt to the assembly tolerances between the memory module (DIMM) and the liquid cooling plate, thus reducing the heat conduction effect. Furthermore, when using silicone-based thermal pad materials, silicone oil may leach out. This silicone oil affects the adhesive's tackiness, and if a large amount of silicone oil leaches and contaminates the gold finger connection of the DIMM strip, it can lead to signal transmission failure. Additionally, existing thermal pads are generally assembled using a bonding process, requiring the pads to be adhered to the narrow gaps between cold plates. This process is cumbersome, increasing production costs and impacting subsequent maintenance efficiency. Utility Model Content

[0003] In order to overcome the above-mentioned defects of the prior art, the technical problem to be solved by the present invention is to provide a heat-conducting structure and a liquid cooling device to solve at least one of the above-mentioned technical problems.

[0004] The above-mentioned objective of this utility model can be achieved by the following technical solution: this utility model provides a heat-conducting structure, including:

[0005] An outer membrane layer has an unfolded state and a folded state. In the unfolded state, the outer membrane layer is divided into a middle folded section along the width direction, and a first outer membrane segment and a second outer membrane segment respectively disposed on both sides of the middle folded section. In the folded state, the first outer membrane segment and the second outer membrane segment are folded inward from the middle folded section.

[0006] A heat-conducting component, wherein the heat-conducting structure includes a plurality of elastic heat-conducting units, which are spaced apart on a first outer film segment and a second outer film segment. When the outer film layer is in a folded state, an insertion gap is formed between each elastic heat-conducting unit located on the first outer film segment and each elastic heat-conducting unit located on the second outer film segment.

[0007] In a preferred embodiment of this utility model, the material of the outer film layer is one of Pi, thermally conductive Pi, PET, thermally conductive cloth, or thermally conductive insulating cloth.

[0008] In a preferred embodiment of the present invention, the heat-conducting structure further includes a friction-reducing coating disposed on the outer film layer.

[0009] In a preferred embodiment of the present invention, the heat-conducting structure further includes a first adhesive layer disposed between the outer film layer and the elastic heat-conducting unit.

[0010] In a preferred embodiment of this utility model, the first adhesive layer is one of acrylic or acrylic-based adhesive.

[0011] In a preferred embodiment of the present invention, the outer membrane layer further includes a hollow structure disposed on the intermediate folded section, the hollow structure including at least one through hole penetrating the outer membrane layer.

[0012] In a preferred embodiment of this utility model, a plurality of through holes are provided, and the plurality of through holes are arranged at intervals along the extension direction of the middle folded section, with the outermost through hole serving a positioning function.

[0013] In a preferred embodiment of the present invention, the outer membrane layer further includes a crease structure disposed on the intermediate fold section, the crease structure including creases continuously disposed along the extension direction of the intermediate fold section or the crease structure including multiple creases spaced apart along the extension direction of the intermediate fold section.

[0014] In a preferred embodiment of the present invention, the heat-conducting structure further includes an inner film layer, and the inner film layer and the outer film layer are respectively disposed on both sides of the elastic heat-conducting unit.

[0015] In a preferred embodiment of the present invention, the inner film layer is divided into a first inner film segment and a second inner film segment spaced apart along the width direction. The first inner film segment and the first outer film segment are stacked and respectively placed on both sides of the corresponding elastic heat-conducting unit. The second inner film segment and the second outer film segment are stacked and respectively placed on both sides of the corresponding elastic heat-conducting unit. When the outer film layer is in a folded state, the insertion gap is formed between the first inner film segment and the second inner film segment.

[0016] In a preferred embodiment of this utility model, the material of the inner film layer is one of PET, release paper, and Mylar.

[0017] In a preferred embodiment of the present invention, the thermally conductive structure further includes a second adhesive layer disposed between the inner film layer and the elastic thermally conductive unit.

[0018] In a preferred embodiment of this utility model, the second adhesive layer is one of acrylic or acrylic-based adhesive.

[0019] In a preferred embodiment of the present invention, the first inner membrane segment is folded into two layers, and the folding opening of the first inner membrane segment is disposed away from the middle folding segment; and / or, the second inner membrane segment is folded into two layers, and the folding opening of the second inner membrane segment is disposed away from the middle folding segment.

[0020] In a preferred embodiment of the present invention, the first inner membrane segment extends from one end away from the elastic heat-conducting unit to form a first pull-out segment, and the first pull-out segment is located outside the projection range of the outer membrane layer along the thickness direction of the outer membrane layer; and / or, the second inner membrane segment extends from one end away from the elastic heat-conducting unit to form a second pull-out segment, and the second pull-out segment is located outside the projection range of the outer membrane layer along the thickness direction of the outer membrane layer.

[0021] In a preferred embodiment of the present invention, the elastic thermally conductive unit includes an elastomer and a thermally conductive layer covering the elastomer.

[0022] In a preferred embodiment of the present invention, the elastic thermally conductive unit extends along the length direction of the outer membrane layer.

[0023] In a preferred embodiment of the present invention, the elastomer is formed from a non-metallic material.

[0024] In a preferred embodiment of this utility model, the material of the elastomer is one of silicone foam and polyurethane foam.

[0025] In a preferred embodiment of this utility model, the heat-conducting layer is formed from a metal material.

[0026] In a preferred embodiment of this utility model, the material of the heat-conducting layer is one of Cu or indium.

[0027] In a preferred embodiment of this utility model, the heat-conducting layer is formed from a non-metallic material.

[0028] In a preferred embodiment of this utility model, the material of the thermally conductive layer is one of graphene sheet, graphite sheet, and carbon fiber sheet.

[0029] In a preferred embodiment of the present invention, the compression ratio of the elastomer is 0 to 75%, and the rebound range of the elastomer is 50% to 100%.

[0030] In a preferred embodiment of the present invention, the compression ratio of the elastic thermal conductive unit is 0 to 75%, and the rebound range of the elastic thermal conductive unit is 50% to 100%.

[0031] In a preferred embodiment of the present invention, the compression ratio of the heat-conducting structure is 0 to 75%, and the rebound range of the heat-conducting structure is 50% to 100%.

[0032] In a preferred embodiment of this utility model, the thermal conductivity of the thermally conductive structure is 0.5W to 15W.

[0033] In a preferred embodiment of this utility model, the heat-conducting structure has a hollowed-out area.

[0034] This utility model also discloses a liquid cooling device, including the aforementioned heat-conducting structure.

[0035] In a preferred embodiment of the present invention, the liquid cooling device includes a liquid cooling plate, the outer film layer of the heat-conducting structure is in a folded state, and the heat-conducting structure can be snapped onto the liquid cooling plate through an insertion gap.

[0036] In a preferred embodiment of the present invention, a plurality of liquid cooling plates are provided, the plurality of liquid cooling plates are arranged at intervals, and slots for accommodating the parts to be cooled are formed between adjacent liquid cooling plates. Each liquid cooling plate is provided with at least one heat-conducting structure, which can be used to elastically abut against the parts to be cooled.

[0037] This utility model also discloses an electronic device, including the aforementioned liquid cooling device and a component to be cooled, wherein the component to be cooled is inserted into a slot of the liquid cooling device and abuts against the heat-conducting structure of the liquid cooling device.

[0038] In a preferred embodiment of this utility model, the component to be cooled is a memory module or a circuit board.

[0039] The technical solution of this utility model has the following significant beneficial effects:

[0040] The heat-conducting structure described in this invention can be placed between the liquid cooling device and the component to be cooled to conduct heat, thereby reducing the temperature of the component and enabling it to operate stably. This heat-conducting structure can meet the heat dissipation needs of electronic components and is particularly suitable for the thermal management requirements of server DIMMs.

[0041] When in use, the outer membrane layer is changed from an unfolded state to a folded state. At this time, the heat conduction structure forms an inverted U-shaped structure. Each elastic heat conduction unit on the first outer membrane segment and each elastic heat conduction unit on the second outer membrane segment can cooperate to form an insertion gap. The heat conduction structure can be directly snapped onto the liquid cooling plate of the liquid cooling device using the insertion gap, without the need for the existing bonding assembly, thus improving assembly efficiency.

[0042] Furthermore, when the component to be cooled is inserted between adjacent heat-conducting structures, the heat-conducting structures can undergo adaptive elastic deformation to better adapt to components of different sizes, avoiding the impact of assembly tolerances and improving adaptability and ease of assembly. Compared to existing heat-conducting pads, this heat-conducting structure has a better compressibility, allowing it to elastically deform and fully fill the space between the component to be cooled and the liquid cooling plate while maintaining good contact pressure. This allows for efficient heat transfer from the component to the liquid cooling plate, thus achieving excellent heat dissipation.

[0043] When the part to be cooled is removed from the slot, the elastic heat-conducting unit of the heat-conducting structure can automatically rebound. Even after multiple insertion and removal operations, the heat-conducting structure can maintain good contact pressure and play a stable heat-conducting role. Attached Figure Description

[0044] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0045] The accompanying drawings described herein are for illustrative purposes only and are not intended to limit the scope of this invention in any way. Furthermore, the shapes and proportions of the components in the drawings are merely illustrative to aid in understanding the invention and do not specifically limit the shapes and proportions of the components. Those skilled in the art, under the guidance of this invention, can select various possible shapes and proportions to implement this invention according to specific circumstances.

[0046] Figure 1 This is a schematic diagram of an embodiment of the heat-conducting structure of this utility model in its unfolded state;

[0047] Figure 2 This is a cross-sectional view of one embodiment of the elastic heat-conducting unit described in this utility model;

[0048] Figure 3 This is a cross-sectional view of one embodiment of the heat-conducting structure of this utility model in its unfolded state;

[0049] Figure 4 A cross-sectional view of an embodiment of the heat-conducting structure described in this utility model, folded.

[0050] Figure 5 This is a schematic diagram of the structure of one embodiment of the first pull-out section of this utility model;

[0051] Figure 6 This is a side view of one embodiment of the heat-conducting structure of the present invention disposed on a liquid cooling plate;

[0052] Figure 7 This is a top view schematic diagram of one embodiment of the heat-conducting structure of the present invention disposed on a liquid cooling plate;

[0053] Figure 8 This is a top view of one embodiment of the liquid cooling device described in this utility model.

[0054] The reference numerals in the above figures are as follows:

[0055] 100. Outer membrane layer; 110. Middle folded section; 120. First outer membrane segment; 130. Second outer membrane segment; 140. Hollow structure; 141. Through hole;

[0056] 200. Thermal conductive component; 210. Elastic thermal conductive unit; 211. Elastomer; 212. Thermal conductive layer; 220. Hollowed-out area;

[0057] 300. First adhesive layer;

[0058] 400, Inner membrane layer; 410, First inner membrane segment; 411, First pull-out segment; 420, Second inner membrane segment; 421, Second pull-out segment;

[0059] 500, Second adhesive layer;

[0060] 600. Liquid cooling plate;

[0061] 700. Components awaiting cooling. Detailed Implementation

[0062] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0063] Implementation Method 1

[0064] Please refer to the following: Figures 1 to 8 As shown, an embodiment of this utility model provides a heat-conducting structure, which includes an outer film layer 100 and a heat-conducting component 200. The outer film layer 100 has an unfolded state and a folded state. In the unfolded state, the outer film layer 100 is divided along its width into a middle folded section 110 and a first outer film section 120 and a second outer film section 130 respectively disposed on both sides of the middle folded section 110. In the folded state, the first outer film section 120 and the second outer film section 130 are folded inward from the middle folded section 110. The heat-conducting structure includes a plurality of elastic heat-conducting units 210, which are spaced apart on the first outer film section 120 and the second outer film section 130. In the folded state, an insertion gap is formed between each elastic heat-conducting unit 210 on the first outer film section 120 and each elastic heat-conducting unit 210 on the second outer film section 130.

[0065] Overall, this heat-conducting structure can be placed between the liquid cooling device and the component to be cooled 700 to conduct heat, reducing the temperature of the component to be cooled 700 and enabling the component to be cooled 700 to operate stably. This heat-conducting structure can meet the heat dissipation needs of electronic components and is particularly suitable for the thermal management needs of server DIMMs.

[0066] Specifically, during use, the outer membrane layer 100 is changed from an unfolded state to a folded state. At this time, the heat-conducting structure forms an inverted U-shaped structure. The elastic heat-conducting units 210 on the first outer membrane segment 120 and the elastic heat-conducting units 210 on the second outer membrane segment 130 can cooperate to form an insertion gap. The heat-conducting structure can be directly snapped onto the liquid cooling plate 600 of the liquid cooling device using the insertion gap, without the need for the existing bonding assembly, thus improving assembly efficiency.

[0067] Furthermore, when the component to be cooled 700 is inserted between adjacent heat-conducting structures, the heat-conducting structures can undergo adaptive elastic deformation to better adapt to components 700 of different sizes, avoiding the influence of assembly tolerances and improving adaptability and ease of assembly. Compared with existing heat-conducting pads, this heat-conducting structure has a better compressibility, allowing it to elastically deform and fully fill the space between the component to be cooled 700 and the liquid cooling plate 600 while maintaining good contact pressure. The heat-conducting structure can efficiently transfer heat from the component to be cooled 700 to the liquid cooling plate 600, thus achieving good heat dissipation.

[0068] When the component to be cooled 700 is removed from the slot, the elastic heat-conducting unit 210 of the heat-conducting structure can automatically rebound. Even after multiple insertion and removal operations, the heat-conducting structure can maintain good contact pressure and play a stable heat-conducting role.

[0069] In embodiments of this utility model, the designer can adjust the specific number of elastic heat-conducting units 210 according to usage needs, and no specific limitation is made here. For example, two, three or more elastic heat-conducting units 210 can be provided on the first outer membrane segment 120. Two, three or more elastic heat-conducting units 210 can be provided on the second outer membrane segment 130.

[0070] In embodiments of this utility model, designers can adjust the specific material of the outer film layer 100 according to usage needs, and no specific limitations are imposed here. Preferably, the material of the outer film layer 100 is one of Pi, thermally conductive Pi, PET, thermally conductive cloth, or thermally conductive insulating cloth. Wherein, Pi is polyimide, thermally conductive Pi is a polyimide material with thermal conductivity formed by adding thermally conductive fillers, and PET is polyethylene terephthalate. The thermally conductive cloth or thermally conductive insulating cloth can be thermally conductive silicone cloth.

[0071] In embodiments of this invention, the heat-conducting structure further includes a friction-reducing coating disposed on the outer film layer 100. By disposing of the friction-reducing coating on the outer film layer 100, the friction-reducing coating can effectively reduce frictional damage and extend the service life of the heat-conducting structure.

[0072] In one specific embodiment, the outer film layer 100 is made of Pi, and an anti-friction coating is provided on the outer film layer 100. Designers can adjust the specific material of the anti-friction coating according to the application requirements, and no specific limitations are made here.

[0073] In the embodiments of this utility model, such as Figure 3 and Figure 4 In the embodiment shown, the thermally conductive structure further includes a first adhesive layer 300 disposed between the outer film layer 100 and the elastic thermally conductive unit 210.

[0074] The first adhesive layer 300 ensures that the elastic thermal conductive unit 210 is firmly attached to the outer film layer 100, preventing displacement or detachment during assembly or use.

[0075] Designers may adjust the specific material of the first adhesive layer 300 according to the usage requirements, and no specific restrictions are imposed here. Preferably, the first adhesive layer 300 is one of acrylic or acrylic-based adhesive.

[0076] Specifically, a portion of the first adhesive layer 300 is disposed on the intermediate folding section 110. The first adhesive layer 300 located on the intermediate folding section 110 can be preferentially attached to the liquid cooling device, thereby fixing the position and maintaining left and right symmetry.

[0077] With the outer membrane layer 100 in a folded state, the first outer membrane segment 120 and the second outer membrane segment 130 are folded inward from the middle folded segment 110, so that the overall structure of the heat-conducting structure is an inverted U-shape.

[0078] When the outer membrane layer 100 is thick, the folding stress generated during folding is also large, which increases the difficulty of folding and easily leads to the problem of the outer membrane layer 100 cracking.

[0079] To overcome the above-mentioned technical problems, in one feasible embodiment of this utility model, such as Figure 1 and Figure 7 In the embodiment shown, the outer membrane layer 100 further includes a perforated structure 140 disposed on the intermediate folded section 110, the perforated structure 140 including at least one through hole 141 penetrating the outer membrane layer 100.

[0080] By setting a hollow structure 140 on the middle folding section 110, the hollow structure 140 can reduce the overall structural strength of the middle folding section 110, reduce or eliminate the folding stress acting on the middle folding section 110, and reduce the risk of the middle folding section 110 breaking.

[0081] When the heat-conducting structure is directly snapped onto the liquid cooling plate 600 through the insertion gap, the through hole 141 can also effectively discharge the gas inside the heat-conducting structure during the insertion process, reduce gas resistance, and improve installation efficiency and assembly smoothness.

[0082] Designers can adjust the arrangement of the through holes 141 according to usage needs, and no specific restrictions are imposed here. Preferably, multiple through holes 141 are provided, and the multiple through holes 141 are arranged at intervals along the extension direction of the middle folded section 110, with the outermost through hole 141 serving a positioning function.

[0083] By arranging multiple through holes 141 at intervals, folding stress is effectively reduced, allowing the heat-conducting structure to be folded more precisely. Furthermore, the outermost through hole 141 serves a positioning function during installation, preventing misalignment and ensuring the assembly accuracy of the heat-conducting structure, thus improving heat dissipation efficiency and reliability.

[0084] In another feasible embodiment of this utility model, the outer membrane layer 100 further includes a crease structure provided on the intermediate folding section 110. By providing a crease structure on the intermediate folding section 110, the crease structure makes the intermediate folding section 110 easier to fold and ensures the centering accuracy after folding.

[0085] Designers can adjust the specific construction of the crease structure according to usage needs, and no specific limitations are imposed here. In one feasible embodiment, the crease structure includes creases continuously arranged along the extension direction of the intermediate fold segment 110. In another feasible embodiment, the crease structure includes multiple creases spaced apart along the extension direction of the intermediate fold segment 110.

[0086] In the embodiments of this utility model, such as Figure 3 and Figure 4 In the embodiment shown, the heat-conducting structure further includes an inner film layer 400, which is disposed on both sides of the elastic heat-conducting unit 210, along with the outer film layer 100.

[0087] Specifically, the inner membrane layer 400 is divided into a first inner membrane segment 410 and a second inner membrane segment 420 spaced apart along the width direction. The first inner membrane segment 410 and the first outer membrane segment 120 are stacked and placed on both sides of the corresponding elastic heat-conducting unit 210, respectively. The second inner membrane segment 420 and the second outer membrane segment 130 are stacked and placed on both sides of the corresponding elastic heat-conducting unit 210. When the outer membrane layer 100 is in a folded state, an insertion gap is formed between the first inner membrane segment 410 and the second inner membrane segment 420.

[0088] By setting the inner film layer 400 and the outer film layer 100 on both sides of the elastic heat-conducting unit 210 respectively, a clamping and protective structure for the elastic heat-conducting unit 210 is formed, further enhancing the overall stability of the heat-conducting structure.

[0089] Furthermore, an insertion gap can be formed between the first inner membrane segment 410 and the second inner membrane segment 420, which facilitates the quick and accurate snapping of the heat-conducting structure onto the liquid cooling plate 600, improves the assembly efficiency of the heat-conducting structure, and avoids friction damage caused by the elastic heat-conducting unit 210 directly contacting the liquid cooling plate 600 during the insertion process, thus ensuring the reliability and service life of the heat-conducting structure.

[0090] Designers can adjust the specific material of the inner film layer 400 according to the usage requirements, and no specific restrictions are imposed here. Preferably, the material of the inner film layer 400 is one of PET, release paper, or Mylar.

[0091] In the embodiments of this utility model, such as Figure 3 , Figure 4 and Figure 5 In the embodiment shown, the thermally conductive structure further includes a second adhesive layer 500 disposed between the inner film layer 400 and the elastic thermally conductive unit 210.

[0092] By providing a second adhesive layer 500 between the inner film layer 400 and the elastic heat-conducting unit 210, the inner film layer 400 and the elastic heat-conducting unit 210 can be stably connected, thus avoiding the problem of the inner film layer 400 accidentally detaching.

[0093] Designers may adjust the specific material of the second adhesive layer 500 according to usage requirements, and no specific restrictions are imposed here. Preferably, the second adhesive layer 500 is one of acrylic or acrylic-based adhesive.

[0094] When the heat-conducting structure is installed as a whole on the liquid cooling device, the second adhesive layer 500 on the inner film layer 400 is prone to detaching from the liquid cooling device, creating a gap. If the material of the outer film layer 100 is Pi and a crease structure is provided on the middle fold section 110, when the heat-conducting structure is inserted into the part to be cooled 700, if the edge of the part to be cooled 700 scrapes against these crease structures, Pi tearing is likely to occur, resulting in the outer film layer 100 breaking. Therefore, when the material of the outer film layer 100 is Pi, a hollow structure 140 is preferred.

[0095] In the embodiments of this utility model, such as Figure 3 and Figure 4 In the embodiment shown, the first inner membrane segment 410 is folded into two layers, and the folding opening of the first inner membrane segment 410 is disposed opposite to the middle folding segment 110; and / or, the second inner membrane segment 420 is folded into two layers, and the folding opening of the second inner membrane segment 420 is disposed opposite to the middle folding segment 110.

[0096] Preferably, the first inner membrane segment 410 is folded into two layers, and the folding opening of the first inner membrane segment 410 is disposed away from the middle folding segment 110; and the second inner membrane segment 420 is folded into two layers, and the folding opening of the second inner membrane segment 420 is disposed away from the middle folding segment 110.

[0097] During the process of inserting the heat-conducting structure into the liquid cooling plate 600, the two first inner membrane segments 410 can slide relative to each other, and the two second inner membrane segments 420 can slide relative to each other, which effectively reduces the frictional force and significantly improves the smoothness of insertion and operational efficiency.

[0098] In the embodiments of this utility model, such as Figure 3 and Figure 4 In the illustrated embodiment, the first inner membrane segment 410 extends away from the elastic heat-conducting unit 210 to form a first pull-out segment 411, which is located outside the projection range of the outer membrane layer 100 along the thickness direction of the outer membrane layer 100; and / or, the second inner membrane segment 420 extends away from the elastic heat-conducting unit 210 to form a second pull-out segment 421, which is located outside the projection range of the outer membrane layer 100 along the thickness direction of the outer membrane layer 100.

[0099] Preferably, the first inner membrane segment 410 extends away from the elastic heat-conducting unit 210 to form a first pull-out segment 411, and the first pull-out segment 411 is located outside the projection range of the outer membrane layer 100 along the thickness direction of the outer membrane layer 100; and the second inner membrane segment 420 extends away from the elastic heat-conducting unit 210 to form a second pull-out segment 421, and the second pull-out segment 421 is located outside the projection range of the outer membrane layer 100 along the thickness direction of the outer membrane layer 100.

[0100] By providing a first pull-out section 411 on the first inner membrane segment 410 and extending the first pull-out section 411 beyond the projection range of the outer membrane layer 100, when the heat-conducting structure is inserted and engaged with the liquid cooling plate 600, the first pull-out section 411 can be exposed on the outer side of the outer membrane layer 100, such as... Figure 5 In the illustrated embodiment, the first pull-out section 411 can be pulled out to remove the first inner film layer 400, allowing the elastic heat-conducting unit 210 to be directly bonded to the surface of the liquid cooling plate 600 via the second adhesive layer 500. This improves heat conduction efficiency and avoids poor contact caused by film layer interference, thereby enhancing the stability and heat dissipation performance of the heat-conducting structure. Similarly, the second pull-out section 421 can be pulled out to remove the second inner film layer 400.

[0101] In the embodiments of this utility model, such as Figure 1 and Figure 2 In the illustrated embodiment, the elastic thermally conductive unit 210 includes an elastomer 211 and a thermally conductive layer 212 covering the elastomer 211. By covering the surface of the elastomer 211 with the thermally conductive layer 212, not only is the thermal conductivity of the thermally conductive unit enhanced, but it also protects the elastomer 211 and improves its wear resistance and chemical stability.

[0102] Specifically, the elastic heat-conducting unit 210 extends along the length of the outer film layer 100. By extending the elastic heat-conducting unit 210 along the length of the outer film layer 100, the elastic heat-conducting unit 210 can be more evenly distributed on the outer film layer 100, further improving the continuity of the heat conduction path and the heat conduction efficiency.

[0103] Furthermore, in actual use, due to differences in shape or height among some electronic components on the component to be cooled 700, some of the elastic heat-conducting units 210 are affected by these height differences, thus failing to fit properly and reducing the bonding effect. To solve the above technical problem, in the embodiment of this utility model, the heat-conducting structure is provided with a hollow area 220.

[0104] By setting a hollow area 220 on the heat-conducting structure, the hollow area 220 can be used to accommodate the protrusion on the part to be cooled 700, so that the outer film layer 100 is not easily affected by the protrusion on the part to be cooled 700 during the extrusion deformation process, effectively solving the problem of failure to fit properly caused by local height differences on the part to be cooled 700.

[0105] Specifically, to improve the bonding effect between the heat-conducting structure and the component 700 to be cooled, the middle part of the outer film layer 100 and the elastic heat-conducting unit 210 can be cut to form a hollow area 220. The hollow area 220 can accommodate or avoid electronic components on the component 700 to be cooled, thereby improving the overall bonding effect of the heat-conducting structure and improving the heat conduction efficiency. Designers can flexibly adjust the shape and structure of the hollow area 220 according to the needs of use, and no specific restrictions are imposed here.

[0106] Furthermore, some of the elastic heat-conducting units 210 can also be extended into the hollow area 220, so that the elastic heat-conducting units 210 can better fit onto the part 700 to be cooled located in the hollow area 220, thereby achieving a better heat conduction effect.

[0107] In this embodiment of the invention, the elastomer 211 is formed from a non-metallic material. Designers can adjust the specific material of the elastomer 211 according to the needs of use, and no specific limitations are made here.

[0108] In one feasible embodiment, the elastomer 211 is made of polyurethane foam. Polyurethane foam possesses good elasticity and abrasion resistance, effectively buffering assembly pressure and maintaining long-term stability.

[0109] In another feasible embodiment, the elastomer 211 is made of silicone foam. Preferably, the elastomer 211 is made of silicone foam. Silicone foam has excellent temperature resistance and resilience, as well as low thermal resistance, which helps to improve thermal conductivity.

[0110] In one feasible embodiment of this utility model, the heat-conducting layer 212 is formed of a metal material. Designers can adjust the specific material of the elastomer 211 according to the needs of use, and no specific limitations are made here.

[0111] In one feasible embodiment, the material of the heat-conducting layer 212 is Cu. Cu has excellent thermal conductivity and good processability, which can significantly improve the heat transfer efficiency of the heat-conducting unit.

[0112] In another feasible embodiment, the thermally conductive layer 212 is made of indium foil. Indium foil has excellent thermal conductivity, as well as good ductility and adhesion.

[0113] In another feasible embodiment of this utility model, the heat-conducting layer 212 is formed of a non-metallic material. Designers can adjust the specific material of the elastomer 211 according to the needs of use, and no specific limitations are made here.

[0114] In one feasible embodiment, the thermally conductive layer 212 is made of graphene sheet. Graphene sheet has extremely high thermal conductivity and excellent flexibility, which can effectively improve thermal conductivity and adapt to fitting requirements.

[0115] In another feasible embodiment, the thermally conductive layer 212 is made of graphite sheets. Graphite sheets have good thermal conductivity and low cost, making them suitable for large-area heat dissipation scenarios.

[0116] In another feasible embodiment, the thermal layer is made of carbon fiber sheets. Carbon fiber sheets have good thermal conductivity, as well as high strength and lightweight properties, making them suitable for applications requiring both structural strength and weight.

[0117] In one feasible embodiment of the present invention, the compression ratio of the elastomer 211 is 0 to 75%, and the rebound range of the elastomer 211 is 50% to 100%.

[0118] By controlling the compression ratio and rebound range of the elastomer 211, the elastomer 211 has good compression and rebound, which not only ensures that the heat-conducting structure fits fully during initial assembly and improves the heat conduction efficiency of the contact interface, but also effectively resists fatigue deformation and maintains stable thermal conductivity during long-term use. This makes the heat-conducting structure more adaptable and able to cope with complex environmental factors such as vibration and temperature fluctuations, thereby improving the reliability and service life of the heat-conducting structure.

[0119] Designers can adjust the compression ratio and resilience range of elastomer 211 according to usage requirements, without specific limitations. In one feasible embodiment, when the compression ratio of elastomer 211 is in the range of 0 to 25%, the resilience of elastomer 211 is in the range of 90% to 100%. When the compression ratio of elastomer 211 is in the range of 25% to 50%, the resilience of elastomer 211 is in the range of 70% to 90%. When the compression ratio of elastomer 211 is in the range of 50% to 75%, the resilience of elastomer 211 is in the range of 50% to 70%.

[0120] In another feasible embodiment of the present invention, the compression rate of the elastic heat-conducting unit 210 is 0 to 75%, and the rebound range of the elastic heat-conducting unit 210 is 50% to 100%.

[0121] By controlling the compression ratio and rebound range of the elastic heat-conducting unit 210, the elastic heat-conducting unit 210 has good compression and rebound, which not only ensures that the heat-conducting structure is fully fitted during initial assembly and improves the heat conduction efficiency of the contact interface, but also effectively resists fatigue deformation and maintains stable heat conduction performance during long-term use. This makes the heat-conducting structure more adaptable and able to cope with complex environmental factors such as vibration and temperature fluctuations, thereby improving the reliability and service life of the heat-conducting structure.

[0122] Designers can adjust the compression ratio and rebound rate range of the elastic heat-conducting unit 210 according to usage requirements, without specific limitations. In one feasible embodiment, when the compression ratio of the elastic heat-conducting unit 210 is in the range of 0 to 25%, the rebound rate of the elastic heat-conducting unit 210 is in the range of 90% to 100%. When the compression ratio of the elastic heat-conducting unit 210 is in the range of 25% to 50%, the rebound rate of the elastic heat-conducting unit 210 is in the range of 70% to 90%. When the compression ratio of the elastic heat-conducting unit 210 is in the range of 50% to 75%, the rebound rate of the elastic heat-conducting unit 210 is in the range of 50% to 70%.

[0123] In another feasible embodiment of the present invention, the compression ratio of the heat-conducting structure is 0 to 75%, and the springback range of the heat-conducting structure is 50% to 100%.

[0124] By controlling the compressibility and springback range of the heat-conducting structure, it achieves excellent compressibility and springback. This not only ensures a perfect fit during initial assembly, improving heat transfer efficiency at the contact interface, but also effectively resists fatigue deformation and maintains stable thermal conductivity during long-term use. This results in greater adaptability, enabling the heat-conducting structure to cope with complex environmental factors such as vibration and temperature fluctuations, thereby improving its reliability and service life. In one feasible embodiment, the compressibility and springback range of the heat-conducting structure is its thickness direction.

[0125] Designers can adjust the compressibility and resilience range of the thermally conductive structure according to usage requirements, without specific limitations. In one feasible embodiment, when the compressibility of the thermally conductive structure is in the range of 0 to 25%, the resilience is in the range of 90% to 100%. When the compressibility of the thermally conductive structure is in the range of 25% to 50%, the resilience is in the range of 70% to 90%. When the compressibility of the thermally conductive structure is in the range of 50% to 75%, the resilience is in the range of 50% to 70%.

[0126] In the embodiments of this utility model, the designer can adjust the specific thermal conductivity of the heat-conducting structure according to the usage requirements, and no specific limitation is made here. Preferably, the thermal conductivity of the heat-conducting structure is 0.5W to 15W.

[0127] By setting the thermal conductivity of the thermally conductive structure within the range of 0.5W to 15W, a stable thermal conductivity capability can be maintained under different operating conditions, effectively reducing thermal resistance and improving heat dissipation efficiency. Furthermore, this thermal conductivity range also offers good compatibility, adapting to the application requirements of electronic devices with different power densities, thereby enhancing the reliability and safety of equipment operation.

[0128] Designers can adjust the thermal conductivity of the heat-conducting structure according to usage requirements, and no specific limitations are imposed here. In one feasible embodiment, the thermal conductivity of the heat-conducting structure is approximately 0.5 W. In another feasible embodiment, the thermal conductivity of the heat-conducting structure is approximately 3.5 W. In yet another feasible embodiment, the thermal conductivity of the heat-conducting structure is approximately 15 W.

[0129] Implementation Method 2

[0130] Please refer to the following: Figures 1 to 8 As shown, this utility model also provides a liquid cooling device, which includes the heat-conducting structure described in Embodiment 1. The structure and effect of this heat-conducting structure are the same as those described in Embodiment 1, and will not be repeated here.

[0131] In the embodiments of this utility model, such as Figure 6 , Figure 7 and Figure 8 In the embodiment shown, the liquid cooling device includes a liquid cooling plate 600, with the outer film layer 100 of the heat-conducting structure in a folded state, and the heat-conducting structure can be snapped onto the liquid cooling plate 600 through an insertion gap.

[0132] The heat-conducting structure can be folded to form a plug-in gap and snapped onto the liquid cooling plate 600, which improves the ease of assembly and the stability of the structure. The heat-conducting structure can work with the liquid cooling plate 600 to achieve efficient heat conduction and stable heat dissipation.

[0133] Specifically, multiple liquid cooling plates 600 are provided, and the multiple liquid cooling plates 600 are arranged at intervals. A slot for accommodating the component 700 to be cooled is formed between adjacent liquid cooling plates 600. Each liquid cooling plate 600 is provided with at least one heat-conducting structure, which can be used to elastically abut against the component 700 to be cooled.

[0134] The heat-conducting structure can elastically abut against the part 700 to be cooled, ensuring automatic contact with the surface of the part 700 during assembly. This achieves efficient and uniform heat conduction, reduces thermal resistance, and thus improves heat conduction efficiency. Furthermore, during operation, the heat-conducting structure can effectively absorb stress caused by vibration and thermal expansion, improving system stability and service life. Designers can adjust the specific number and structure of the liquid cooling plates 600 according to usage requirements; no specific limitations are imposed here.

[0135] Implementation Method 3

[0136] An embodiment of this utility model discloses an electronic device, which includes the liquid cooling device described in Embodiment 2 and a component 700 to be cooled. The component 700 to be cooled is inserted into the slot of the liquid cooling device and abuts against the heat-conducting structure of the liquid cooling device.

[0137] The thermally conductive structure ensures good contact with the component 700 to be cooled during assembly and operation. The liquid cooling device and the thermally conductive structure work together to dissipate heat from the component 700, improving the overall heat dissipation efficiency of the electronic device and ensuring the operational stability and reliability of the electronic device. It is especially suitable for high power density and high heat flux density scenarios, and has significant technical advantages and application value.

[0138] Designers may adjust the specific type of electronic device according to usage requirements, and no specific restrictions are imposed here. Preferably, the electronic device is a computer, server, or controller, etc. More preferably, the component to be cooled 700 is a DIMM strip, memory module, or circuit board.

[0139] All articles and references disclosed herein, including patent applications and publications, are incorporated herein by reference for various purposes. The term “substantially constitutes…” used to describe a combination should include the identified element, component, part, or step, as well as other elements, components, parts, or steps that do not substantially affect the essential novelty of the combination. The use of the terms “comprising” or “including” to describe combinations of elements, components, parts, or steps herein also contemplates embodiments substantially constituted by such elements, components, parts, or steps. The use of the term “may” herein is intended to indicate that any described attribute “may” include is optional. Multiple elements, components, parts, or steps can be provided by a single integrated element, component, part, or step. Alternatively, a single integrated element, component, part, or step can be divided into multiple separate elements, components, parts, or steps. The disclosure of “a” or “an” used to describe an element, component, part, or step does not imply exclusion of other elements, components, parts, or steps.

[0140] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on its differences from other embodiments. Similar or identical parts between embodiments can be referred to interchangeably. The above embodiments are only for illustrating the technical concept and features of this utility model, and are intended to enable those skilled in the art to understand the content of this utility model and implement it accordingly. They should not be construed as limiting the scope of protection of this utility model. All equivalent changes or modifications made in accordance with the spirit and essence of this utility model should be included within the scope of protection of this utility model.

Claims

1. A thermally conductive structure, characterized by, include: An outer membrane layer has an unfolded state and a folded state. In the unfolded state, the outer membrane layer is divided into a middle folded section along the width direction, and a first outer membrane segment and a second outer membrane segment respectively disposed on both sides of the middle folded section. In the folded state, the first outer membrane segment and the second outer membrane segment are folded inward from the middle folded section. A heat-conducting component, wherein the heat-conducting structure includes a plurality of elastic heat-conducting units, which are spaced apart on a first outer film segment and a second outer film segment. When the outer film layer is in a folded state, an insertion gap is formed between each elastic heat-conducting unit located on the first outer film segment and each elastic heat-conducting unit located on the second outer film segment.

2. The thermally conductive structure of claim 1, wherein, The outer membrane layer also includes a perforated structure disposed on the intermediate folded section, the perforated structure including at least one through hole penetrating the outer membrane layer.

3. The thermally conductive structure of claim 2, wherein, The through holes are provided in multiple ways, and the multiple through holes are arranged at intervals along the extension direction of the middle folded section. The through hole located on the outermost side is used for positioning.

4. The thermally conductive structure of claim 1, wherein, The outer membrane layer also includes a crease structure disposed on the intermediate fold section, the crease structure including creases continuously disposed along the extension direction of the intermediate fold section or the crease structure including multiple creases spaced apart along the extension direction of the intermediate fold section.

5. The thermally conductive structure of claim 1, wherein, The material of the outer membrane layer is one of Pi, thermally conductive Pi, PET, thermally conductive cloth, or thermally conductive insulating cloth.

6. The thermally conductive structure of claim 1, wherein, The thermally conductive structure also includes a friction-reducing coating disposed on the outer film layer.

7. The thermally conductive structure of claim 1, wherein, The thermally conductive structure further includes a first adhesive layer disposed between the outer film layer and the elastic thermally conductive unit.

8. The thermally conductive structure of claim 1, wherein, The heat-conducting structure also includes an inner film layer, which is disposed on both sides of the elastic heat-conducting unit, along with the outer film layer.

9. The thermally conductive structure of claim 8, wherein, The inner membrane layer is divided into a first inner membrane segment and a second inner membrane segment spaced apart along its width. The first inner membrane segment and the first outer membrane segment are stacked and respectively placed on both sides of the corresponding elastic heat-conducting unit. The second inner membrane segment and the second outer membrane segment are stacked and respectively placed on both sides of the corresponding elastic heat-conducting unit. When the outer membrane layer is in a folded state, the insertion gap is formed between the first inner membrane segment and the second inner membrane segment.

10. The thermally conductive structure of claim 8, wherein, The thermally conductive structure further includes a second adhesive layer disposed between the inner film layer and the elastic thermally conductive unit.

11. The thermally conductive structure of claim 9, wherein, The first inner membrane segment is folded into two layers, and the folding opening of the first inner membrane segment is disposed opposite to the middle folding segment; and / or, the second inner membrane segment is folded into two layers, and the folding opening of the second inner membrane segment is disposed opposite to the middle folding segment.

12. The thermally conductive structure of claim 11, wherein, The first inner membrane segment extends from one end away from the elastic heat-conducting unit to form a first pull-out segment, and the first pull-out segment is located outside the projection range of the outer membrane layer along the thickness direction of the outer membrane layer; and / or, the second inner membrane segment extends from one end away from the elastic heat-conducting unit to form a second pull-out segment, and the second pull-out segment is located outside the projection range of the outer membrane layer along the thickness direction of the outer membrane layer.

13. The thermally conductive structure of claim 12, wherein, The elastic thermally conductive unit includes an elastomer and a thermally conductive layer covering the elastomer; and / or, the elastic thermally conductive unit extends along the length direction of the outer film layer.

14. The thermally conductive structure of claim 13, wherein, The elastomer is formed from a non-metallic material.

15. The thermally conductive structure of claim 14, wherein, The elastomer is made of either silicone foam or polyurethane foam.

16. The thermally conductive structure of claim 13, wherein, The thermally conductive layer is formed from a metallic material.

17. The thermally conductive structure of claim 16, wherein, The material of the heat-conducting layer is one of Al, Cu, or indium.

18. The thermally conductive structure of claim 13, wherein, The thermally conductive layer is formed from a non-metallic material.

19. The thermally conductive structure of claim 18, wherein, The thermally conductive layer is made of one of the following materials: graphene sheet, graphite sheet, or carbon fiber sheet.

20. The thermally conductive structure of claim 13, wherein, The compressibility of the elastomer is 0 to 75%, and the rebound range of the elastomer is 50% to 100%.

21. The thermally conductive structure of claim 13, wherein, The compression ratio of the elastic thermal conductive unit is 0 to 75%, and the rebound range of the elastic thermal conductive unit is 50% to 100%.

22. The thermally conductive structure of claim 1, wherein, The thermally conductive structure has a compression ratio of 0 to 75% and a springback range of 50% to 100%.

23. The thermally conductive structure of claim 1, wherein, The thermal conductivity of the thermally conductive structure is 0.5W to 15W.

24. The thermally conductive structure of claim 1, wherein, The heat-conducting structure has a hollowed-out area.

25. A liquid cooling device, characterized by, Includes the thermally conductive structure as described in any one of claims 1 to 24.

26. The liquid cooling device of claim 25, wherein, The liquid cooling device includes a liquid cooling plate, with the outer film layer of the heat-conducting structure in a folded state, and the heat-conducting structure can be snapped onto the liquid cooling plate through an insertion gap.

27. The liquid cooling device of claim 26, wherein, The liquid cooling plates are provided in multiple ways, and the multiple liquid cooling plates are arranged at intervals. A slot for accommodating the part to be cooled is formed between adjacent liquid cooling plates. Each liquid cooling plate is provided with at least one heat-conducting structure, which can be used to elastically abut against the part to be cooled.

28. An electronic device, comprising: It includes a liquid cooling device as described in any one of claims 25 to 27, and a component to be cooled, the component to be cooled being inserted into a slot of the liquid cooling device and abutting against the thermally conductive structure of the liquid cooling device.

29. The electronic device of claim 28, wherein, The component to be cooled is a memory module or a circuit board.

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