A multi-stage heat pipe heat dissipation substrate for 75-110ghz corner reflector antenna spread spectrum module processing
By using a three-layer heat-conducting cylinder and fin design, the problem of uneven heat dissipation of multi-stage heat pipe heat dissipation substrate is solved, realizing uniform heat conduction and rapid heat dissipation of heat pipes, and improving heat exchange efficiency.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- NANJING ANTAIXIN ELECTRONICS CO LTD
- Filing Date
- 2025-08-25
- Publication Date
- 2026-07-31
AI Technical Summary
Existing multi-stage heat pipe heat dissipation substrates suffer from uneven heat dissipation and inconsistent temperatures, resulting in reduced heat exchange efficiency.
The heat pipe features a three-layer structure, consisting of an outer layer, a middle layer, and an inner layer. The outer layer is made of a copper-aluminum composite metal, the middle layer is made of graphene, and the inner layer is made of thermal grease. Combined with fins, grooves, and extension strips, this design ensures complete coverage of the heat pipe surface and enhances airflow.
It achieves uniform heat conduction and rapid heat dissipation of the heat pipe, improves heat dissipation efficiency and heat exchange effect, and ensures air circulation and overall heat dissipation capacity.
Smart Images
Figure CN224583548U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of heat pipe heat dissipation substrate technology, specifically a multi-stage heat pipe heat dissipation substrate for processing 75-110GHz vector grid spread spectrum modules. Background Technology
[0002] Heat pipes fully utilize the principles of heat conduction and the rapid heat transfer properties of cooling media to quickly transfer heat from a heat-generating object to the outside of the heat source. Their thermal conductivity exceeds that of any known metal. However, the heat transfer and air exchange rate of heat pipes is relatively slow. Therefore, a heat dissipation substrate is placed on the surface of the heat pipe during heat conduction. The substrate can also absorb heat from the heat pipe and expand the contact area with the air, thereby improving heat dissipation efficiency.
[0003] Most existing multi-stage heat pipe heat dissipation substrates are segmented and directly fixed onto the surface of the heat pipes. This results in the gaps between the heat dissipation substrates not having a heat transfer medium in contact with the heat pipe. This means that the heat pipe in these gaps can only exchange heat through contact with the air. However, since there are multiple heat dissipation substrates, which divide the heat pipe into multiple segments, the heat exchange in the parts of the heat pipe without substrate contact is always slower than in the parts with substrate contact. This leads to uneven heat dissipation and inconsistent temperatures, affecting the heat exchange and heat dissipation effect.
[0004] Therefore, in view of this, we have studied and improved the existing structure to address its shortcomings, and proposed a multi-stage heat pipe heat dissipation substrate for processing 75-110GHz vector network spread spectrum modules. Utility Model Content
[0005] The purpose of this invention is to provide a multi-stage heat pipe heat dissipation substrate for processing 75-110GHz vector network spread spectrum modules, so as to solve the problems mentioned in the background art.
[0006] To achieve the above objectives, this utility model provides the following technical solution: a multi-stage heat pipe heat dissipation substrate for processing a -GHz vector network spread spectrum module, comprising an assembly plate, wherein heat-conducting cylinders are uniformly distributed on the surface of the assembly plate, the heat-conducting cylinders are composed of an outer layer, a middle layer and an inner layer, the outer layer serves as the support layer for the entire heat-conducting cylinder and is fixedly connected to the assembly plate, the outer layer comprises a cylindrical pipe formed by copper and aluminum composite metals, the inner circular surface of the outer layer is fixedly connected to the middle layer, the middle layer is configured as a cylindrical body made of graphene, the inner surface of the middle layer is fixedly connected to the inner layer, and the inner layer is configured as a filled thermal grease.
[0007] Preferably, fins are uniformly distributed and fixedly connected to the outer surface of the outer layer of the heat-conducting cylinder, and the fins are arranged in a circular shape.
[0008] Preferably, the surface of the fin has four grooves evenly distributed, and the grooves ensure airflow between the upper and lower fins.
[0009] Preferably, the inner surface of the groove is uniformly distributed and fixedly connected with extension strips, and the extension strips are copper strips with a thickness less than that of the fins.
[0010] Preferably, the length of the extension strip extends to the edge of the fin ring, and there is a gap between the extension strips.
[0011] Compared with the prior art, the beneficial effects of this utility model are:
[0012] 1. This utility model uses a heat-conducting cylinder, an outer layer, a middle layer, and an inner layer. The heat-conducting cylinder is set as a cylinder that matches the pipe, and the whole can completely cover the heat pipe for heat conduction. It is divided into three layers for heat conduction, and the inner layer can be filled to ensure that the entire heat-conducting cylinder can fit the heat pipe for heat conduction. The three-layer heat-conducting components can conduct heat to the heat pipe more quickly, which greatly improves the heat dissipation efficiency and heat dissipation capacity of the heat pipe.
[0013] 2. This utility model utilizes the arrangement of fins, grooves, and extension strips. The fins enable rapid heat exchange between the heat-conducting cylinder and the outside air, thereby improving the overall heat dissipation capacity. The extension strips further increase the contact area with the outside air, enhancing the heat exchange effect of the fins. The grooves allow for normal airflow between the fins, ensuring the heat exchange and heat dissipation performance of each set of fins and guaranteeing air circulation. Attached Figure Description
[0014] Figure 1 This is a schematic diagram of the overall three-dimensional structure of the present invention;
[0015] Figure 2 This is a schematic diagram of the fin structure of this utility model;
[0016] Figure 3 This is a schematic diagram of the heat-conducting cylinder part of this utility model.
[0017] In the diagram: 1. Assembly plate; 2. Heat-conducting cylinder; 201. Outer layer; 202. Middle layer; 203. Inner layer; 3. Fins; 4. Groove; 5. Extension strip. Detailed Implementation
[0018] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0019] like Figures 1-3 As shown, a multi-stage heat pipe heat dissipation substrate for processing 75-110GHz vector network spread spectrum modules includes an assembly plate 1. Heat-conducting cylinders 2 are uniformly distributed on the surface of the assembly plate 1. The heat-conducting cylinders 2 are composed of an outer layer 201, a middle layer 202, and an inner layer 203. The outer layer 201 serves as the support layer for the entire heat-conducting cylinder 2 and is fixedly connected to the assembly plate 1. The outer layer 201 contains a cylindrical pipe formed by copper and aluminum composite metals. The middle layer 202 is fixedly connected to the inner circular surface of the outer layer 201. The middle layer 202 is a cylindrical body made of graphene. The inner surface of the middle layer 202 is fixedly connected to the inner layer 203, which is filled with thermal grease.
[0020] By adopting the above technical solution, the heat-conducting cylinder 2 is set as a cylinder that matches the pipe, and the whole can completely cover the heat pipe for heat conduction.
[0021] It has a three-layer structure for heat conduction. The inner layer 203 can be filled to ensure that the entire heat conduction cylinder 2 can fit the heat pipe for heat conduction. The three-layer heat conduction components can conduct heat to the heat pipe more quickly.
[0022] Furthermore, fins 3 are uniformly distributed and fixedly connected to the outer surface of the outer layer 201 in the heat-conducting cylinder 2, and the fins 3 are set in a circular shape.
[0023] By adopting the above technical solution, the fins 3 can absorb the heat from the heat-conducting cylinder 2 and expand the contact surface with the air, thereby accelerating the heat exchange efficiency between the heat-conducting cylinder 2 and the air.
[0024] Furthermore, four grooves 4 are evenly distributed on the surface of the fin 3, and the grooves 4 ensure airflow between the upper and lower fins 3.
[0025] By adopting the above technical solution, the groove 4 allows the air between the fins 3 to flow normally up and down, thereby ensuring the heat exchange and heat dissipation performance of each set of fins 3, and also ensuring the airflow.
[0026] Furthermore, the inner surface of the groove 4 is uniformly distributed and fixedly connected with extension strips 5, and the extension strips 5 are set as copper strips with a thickness less than that of the fins 3;
[0027] The length of the extension strip 5 extends to the edge of the annular fin 3, and there are gaps between the extension strips 5.
[0028] By adopting the above technical solution, the extension strip 5 further increases the contact area with the outside air, thereby enhancing the heat exchange effect of the fin 3.
[0029] Working Principle: When using this 75-110GHz vector network spread spectrum module to process a multi-stage heat pipe heat dissipation substrate, firstly, the heat pipes are inserted into the heat-conducting cylinder 2, and the inner layer 203 is attached to the heat pipes. The heat-conducting cylinder 2 is set as a cylinder to match the pipes, and the whole can completely cover the heat pipes for heat conduction. It is divided into three layers for heat conduction. The inner layer 203 can fill the cylinder, ensuring that the entire heat-conducting cylinder 2 can fit the heat pipes for heat conduction. The three layers of heat-conducting components can conduct heat to the heat pipes more quickly. The fins 3 can quickly exchange heat between the heat-conducting cylinder 2 and the outside air, improving the overall heat dissipation capacity. The extension strip 5 further increases the contact area with the outside air, enhancing the heat exchange effect of the fins 3. The grooves 4 allow the air between the fins 3 to flow normally up and down, thereby ensuring the heat exchange and heat dissipation performance of each set of fins 3 and ensuring air circulation. This is the working principle of the multi-stage heat pipe heat dissipation substrate used for processing the 75-110GHz vector network spread spectrum module.
Claims
1. A multi-stage heat pipe heat sink substrate for 75-110 GHz corner reflector spread spectrum module processing, comprising an assembly plate (1), characterized in that, The surface of the assembly plate (1) is uniformly provided with heat-conducting cylinders (2). The heat-conducting cylinders (2) are composed of an outer layer (201), a middle layer (202) and an inner layer (203). The outer layer (201) serves as the support layer for the entire heat-conducting cylinder (2) and is fixedly connected to the assembly plate (1). The outer layer (201) contains a cylindrical pipe formed by copper and aluminum composite metals. The inner circular surface of the outer layer (201) is fixedly connected to the middle layer (202). The middle layer (202) is set as a cylindrical body made of graphene. The inner surface of the middle layer (202) is fixedly connected to the inner layer (203). The inner layer (203) is set as a filled thermal grease.
2. The multi-stage heat pipe heat sink substrate for 75-110 GHz corner-cube antenna spread spectrum module processing according to claim 1, characterized in that, The outer surface of the outer layer (201) of the heat-conducting cylinder (2) is uniformly distributed and fixedly connected with fins (3), and the fins (3) are set in a circular shape.
3. The multi-stage heat pipe heat sink substrate for 75-110 GHz corner-cube antenna spread spectrum module processing of claim 2, wherein, The surface of the fin (3) is provided with four grooves (4) evenly distributed, and the grooves (4) ensure air circulation between the upper and lower fins (3).
4. The multi-stage heat pipe heat dissipation substrate for processing a 75-110GHz vector grid spread spectrum module according to claim 3, characterized in that, The inner surface of the groove (4) is uniformly distributed and fixedly connected with extension strips (5), and the extension strips (5) are copper strips with a thickness less than that of the fins (3).
5. The multi-stage heat pipe heat dissipation substrate for processing a 75-110GHz vector grid spread spectrum module according to claim 4, characterized in that, The length of the extension strip (5) extends to the edge of the annular fin (3) and there is a gap between the extension strips (5).