Heat dissipation structure of a cassette device and cassette device
By introducing a combination of top-plate heat dissipation fins and centrifugal fans into the soft router device, the problem of poor heat dissipation was solved, achieving effective exhaust of hot gas and accelerated airflow through the fins, thus improving the device's heat dissipation performance and stability.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN JIADAR TECH CO LTD
- Filing Date
- 2025-08-25
- Publication Date
- 2026-07-31
AI Technical Summary
Existing software routers have poor heat dissipation, and internal hot air cannot be effectively expelled, causing the temperature of the heat sink fins to rise, affecting device stability and user experience.
The device employs a heat dissipation structure with heat sink fins and a centrifugal fan on the top plate. The air inlet of the centrifugal fan faces the inside of the device, and the air outlet faces the exhaust port. The combination of the air inlet and exhaust port design enables the extraction of hot gas and the acceleration of airflow through the fins.
The heat dissipation of the box-type equipment has been improved, ensuring stable operation of the equipment for a long time and improving the user experience.
Smart Images

Figure CN224583550U_ABST
Abstract
Description
Technical Field
[0001] This application relates to a box-type device, and more specifically to a heat dissipation structure for a box-type device and the box-type device itself. Background Technology
[0002] Software routers are a common type of box-type device. According to the inventor, some software routers use a metal casing with heat dissipation fins on the outer wall or top plate. Others incorporate cooling fans within the heat dissipation fins to reduce their temperature and achieve cooling. However, the heated gases accumulated inside this structure are not effectively expelled, and the cooling performance needs improvement. Utility Model Content
[0003] The purpose of this application is to provide a heat dissipation structure and a box-type device to improve heat dissipation performance.
[0004] To achieve the above objectives, this application provides a heat dissipation structure for a box-type device, which includes a top plate with heat dissipation fins on its top surface and at least one centrifugal fan. The inner side of the top plate is provided with a receiving groove, and the centrifugal fan is disposed in the receiving groove. An exhaust port is provided on the side wall of the receiving groove. At least one groove between the heat dissipation fins is connected to the exhaust port. The air inlet of the centrifugal fan faces the interior of the box-type device, and the air outlet of the centrifugal fan faces the exhaust port. At least one air inlet communicating with the interior of the box-type device is provided on the side wall of the box-type device.
[0005] This application also provides a box-type device, which includes the heat dissipation structure of the box-type device described above.
[0006] In the technical solution of this application, the centrifugal fan extracts the heated gas inside the equipment and accelerates the airflow of the heat dissipation fins, thereby improving the heat dissipation effect. This is beneficial for the long-term stable use of the box-type equipment and also improves the user experience of the box-type equipment. Attached Figure Description
[0007] Figure 1 An assembly perspective view of a box-type device according to at least one embodiment.
[0008] Figure 2 and Figure 3 All are exploded views of a box-type device according to at least one embodiment.
[0009] Figure 4 A top view of a box-type device according to at least one embodiment.
[0010] Figure 5 for Figure 4 Sectional view of section AA.
[0011] It should be noted that the products shown in the above views have been appropriately scaled down / enlarged to fit the drawing size and ensure clarity of the views, and there is no limitation on the size of the products shown in the views. Detailed Implementation
[0012] To make the objectives, technical solutions, and advantages of this application clearer, the application will be further described in detail below with reference to the accompanying drawings and specific embodiments.
[0013] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are all within the scope of protection of this application.
[0014] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.
[0015] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.
[0016] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.
[0017] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. The illustrative expressions of the above terms in this specification should not be construed as necessarily referring to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. In addition, those skilled in the art can combine and integrate the different embodiments or examples described in this specification.
[0018] At least one embodiment of this application is a heat dissipation structure for a box-type device 100, the specific structure of which is as follows: Figures 1-5 As shown, box-type device 100 is a software router; in other embodiments, the box-type device can also be a switch, firewall, or other box-shaped router or other box-shaped device. Combined with... Figures 1 to 3 As shown, the heat dissipation structure includes a top plate 11 with heat dissipation fins 111 on its top surface and at least one centrifugal fan 20. A receiving groove 113 is provided on the inner side of the top plate 11, and the centrifugal fan 20 is fixedly installed in the receiving groove 113 by means of adhesive bonding or screw connection. An exhaust port 114 is provided on the side wall of the receiving groove 113, and at least one groove 112 between the heat dissipation fins 111 connects to the exhaust port 114. The air inlet 21 of the centrifugal fan 20 (… Figure 3 The air outlet 22 of the centrifugal fan 20 is oriented towards the interior of the box-type device 100. Figure 2 Facing the exhaust port 114, the side wall of the box-type device 100 is provided with at least one air inlet 513 communicating with the interior of the box-type device 100. Therefore, outside air enters the box-type device 100 through the air inlet 513 on the side wall, and is then blown by the centrifugal fan 20 onto the heat dissipation fins 111 of the top plate 11. Thus, the centrifugal fan 20 extracts the heated gas from inside the box-type device 100 and accelerates the airflow to the heat dissipation fins 111, improving the heat dissipation effect. This is beneficial for the long-term stable use of the box-type device 100 and also improves the user experience.
[0019] In some embodiments, the top plate 11 may be made of aluminum alloy or copper, which have good thermal conductivity.
[0020] In some embodiments, combined with Figure 2 , Figure 3 and Figure 5As shown, the air inlet 513 is located at one end of the box-type device 100 along the length X direction, and the centrifugal fan 20 is located at the other end of the box-type device 100 along the length X direction. The structure of the air inlet 513 and the centrifugal fan 20 being located at opposite ends of the box-type device 100 facilitates the flow of air entering from the air inlet 513 through more of the internal space, ensuring airflow throughout most of the internal space and reducing heat accumulation. In some embodiments, combined with... Figure 2 , Figure 3 and Figure 5 As shown, the heat dissipation structure also includes an intake fan 30, which is located inside the air inlet 513. There are two intake fans 30 arranged side-by-side; however, in other embodiments, the number of intake fans can be adjusted as needed. The two intake fans 30 can accelerate airflow, allowing air to enter the cassette device 100 more quickly. Combined with the centrifugal fan 20, this allows the air inside the cassette device 100 to exit more quickly, preventing the air temperature inside the cassette device 100 from becoming too high. This also ensures that the airflow from the centrifugal fan 20 blowing onto the heat dissipation fins 111 is not too hot, thus guaranteeing sufficient heat dissipation.
[0021] In some embodiments, combined with Figure 2 and Figure 3 As shown, there are 10 exhaust ports 114 arranged side by side on the side wall of the receiving groove 113, and each exhaust port 114 corresponds one-to-one with the groove 112. Figure 2 The 10 grooves 112 are connected one-to-one with each other. Figure 3 The system has 10 exhaust ports 114. In other embodiments, when the centrifugal fan is larger, the receiving slot needs to accommodate a correspondingly larger centrifugal fan, and its sidewalls can have more exhaust ports and more grooves corresponding to the exhaust ports. The centrifugal fan can blow air onto more heat dissipation fins, which helps to improve the heat dissipation effect. In other embodiments, more than one centrifugal fan can be provided, and the number of receiving slots can correspond one-to-one with the number of centrifugal fans, or the width of the receiving slots can be increased to accommodate the required number of centrifugal fans.
[0022] In some embodiments, combined with Figure 4 and Figure 5 As shown, a clearance groove 1121 is provided at the position where the groove 112 connects to the exhaust port 114. The bottom height of the clearance groove 1121 is less than the bottom height of the groove 112. Therefore, the clearance groove 1121 increases the area of the exhaust port 114, reduces the exhaust resistance of the exhaust port 114, and also increases the exhaust volume.
[0023] At least one embodiment of this application is a box-type device, which includes the heat dissipation structure of the box-type device 100 of the above embodiments, and its specific structure is as follows: Figure 2 , Figure 3 and Figure 5As shown in the diagram, the box-type device 100 contains a main control circuit board 40. A heat transfer block 42 is positioned between the main control circuit board 40 and the top plate 11. The top surface of the heat transfer block 42 is attached to the top plate 11, and the bottom surface of the heat transfer block 42 is attached to the heating element 41 on the main control circuit board 40. This allows the heat from the main control circuit board 40 to be transferred to the top plate 11 and the heat dissipation fins 111 through the heat transfer block 42, improving heat dissipation and reducing heat accumulation. The heat transfer block 42 can be made of aluminum alloy or copper, which have good heat transfer properties, facilitating rapid heat transfer to the top plate 11 and the heat dissipation fins 111. The heating element 41 on the main control circuit board 40 can be one or more, and the number of heat transfer blocks 42 can be adjusted as needed. In specific implementation, the heat-generating element 41 on the main control circuit board 40 may be a processor, such as a CPU, GPU, ISP, MCU, DSP, etc.; or the heat-generating element 41 may be a power semiconductor device, such as a MOSFET, IGBT, diode, transistor, etc.; or the heat-generating element 41 may be a power-related component, such as a power management chip, voltage regulator, etc.; or the heat-generating element 41 may be other components, such as a resistor, sensor, etc.
[0024] In some embodiments, combined with Figure 2 , Figure 3 and Figure 5 As shown, the box-type device 100 is also equipped with a network interface module 43. A heat transfer base plate 44 with heat sink 45 is fixed inside the network interface module 43. An airflow gap 405 is left between the heat sink 45 of the heat transfer base plate 44 and the main control circuit board 40 so that air can flow between the two and avoid heat accumulation.
[0025] In some embodiments, such as Figure 3 As shown, the box-type device 100 also includes a U-shaped plate 51, a front baffle 52, and a bottom plate 53. All three plates can be made of metal, such as aluminum alloy or stainless steel. The U-shaped plate 51 and the front baffle 52 are fixedly connected by several screws to form a square frame. A top plate 11 is located above the U-shaped plate 51 and the front baffle 52, and is fixedly connected to both the U-shaped plate 51 and the front baffle 52 by several screws. The bottom plate 53 is located below the U-shaped plate 51 and the front baffle 52, and is also fixedly connected to both the U-shaped plate 51 and the front baffle 52 by several screws. The top plate 11, the U-shaped plate 51, the front baffle 52, and the bottom plate 53 enclose the internal space of the box-type device 100. The air inlet 513 is located on a side plate 511 of the C-shaped plate 51, while the middle plate 512 of the C-shaped plate 51 has a first clearance hole 514 corresponding to the functional interface of the main control circuit board 40. The front baffle 52 is located on the opposite side of the middle plate 512 of the C-shaped plate 51, and the front baffle 52 has several second clearance holes 521 corresponding to the functional interface of the main control circuit board 40.
[0026] In some embodiments, such as Figure 5 As shown, several internally threaded posts 531 are provided on the base plate 53 to provide support. The main control circuit board 40 is secured within the box-type device 100 by screws that pass through and are screwed into the internally threaded posts 531. Similarly, a similar structure can be used to fix the heat transfer base plate 44 and the network interface module 43 to the base plate 53 to prevent excessive weight from causing deformation at the connection between the network interface module 43 and the front baffle 52.
[0027] For a schematic diagram of the heat dissipation airflow of the housing device 100, please refer to the diagram. Figure 5 As shown, outside air enters the box device 100 quickly through the intake fan 30. The airflow passes above and below the main control circuit board 40 and below the heat transfer base plate 44. Then the airflow enters the centrifugal fan 20. Driven by the centrifugal fan 20, the airflow enters the groove 112 between the heat dissipation fins 111 from the exhaust port 114. Finally, the airflow returns to the outside.
[0028] The terms "first" and "second" used in this application are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.
[0029] The above examples are merely illustrative of the technical content of this application to facilitate reader understanding, but do not imply that the implementation methods of this application are limited to these. Any technical extensions or re-creations made based on this application are protected by this application. The scope of protection of this application is determined by the claims.
Claims
1. A heat dissipation structure for a box-type device, characterized in that, It includes a top plate with heat dissipation fins on its top surface and at least one centrifugal fan. The inner side of the top plate is provided with a receiving groove, and the centrifugal fan is disposed in the receiving groove. The side wall of the receiving groove is provided with an exhaust port. At least one groove between the heat dissipation fins is connected to the exhaust port. The air inlet of the centrifugal fan faces the interior of the box-shaped device, and the air outlet of the centrifugal fan faces the exhaust port. The side wall of the box-shaped device is provided with at least one air inlet that connects to the interior of the box-shaped device.
2. The heat dissipation structure of the box-type device as described in claim 1, characterized in that, The air inlet is located at one end of the length of the box-shaped device, and the centrifugal fan is located at the other end of the length of the box-shaped device.
3. The heat dissipation structure of the box-type device as described in claim 1, characterized in that, A clearance groove for increasing exhaust volume is provided at the location where the groove connects to the exhaust port, and the bottom height of the clearance groove is less than the bottom height of the groove.
4. The heat dissipation structure of the box-type device as described in claim 1, characterized in that, It also includes an intake fan, which is located inside the air intake.
5. The heat dissipation structure of the box-type device as described in claim 1, characterized in that, The top plate is made of aluminum alloy or copper.
6. A box-type device, characterized in that, It includes the heat dissipation structure of the box-type device as described in any one of claims 1-5.
7. The box-type device as described in claim 6, characterized in that, The box-type device has a main control circuit board inside, and a heat transfer block is provided between the main control circuit board and the top plate. The top surface of the heat transfer block is attached to the top plate, and the bottom surface of the heat transfer block is attached to the heating element on the main control circuit board.
8. The box-type device as described in claim 7, characterized in that, The heat transfer block is made of aluminum alloy or copper.
9. The box-type device as described in claim 7, characterized in that, The box-type device is also equipped with a network interface module. The network interface module is fixed with a heat transfer base plate with heat sinks. An airflow gap is left between the heat sinks of the heat transfer base plate and the main control circuit board.
10. The box-type device as described in claim 6, characterized in that, The box-type device is a software router.