A heat dissipation component for a frequency converter and a frequency converter

Abstract

This invention provides a heat dissipation assembly for a frequency converter and the frequency converter itself. The heat dissipation assembly includes: a heat exchange element, a thermoelectric cooler, a radiator, and a condensation screen. The cold end of the thermoelectric cooler exchanges heat with the heat exchange element to absorb its heat, and the hot end of the thermoelectric cooler exchanges heat with the radiator to release heat onto it. Airflow passing over the radiator exchanges heat with the airflow. The condensation screen is located above the radiator, and airflow reaching the screen is intercepted and condensed. The condensed water falls onto the radiator to further cool it. This invention enables the recycling of condensed water, improving the radiator's cooling efficiency and recovering cold energy, thus improving the system energy efficiency of the heat dissipation assembly. It effectively solves the problem of low heat dissipation efficiency in existing frequency converters.

Description

Technical Field

[0001] This utility model relates to the field of frequency converter technology, specifically to a heat dissipation component and a frequency converter. Background Technology

[0002] With the rapid development of electronic technology, frequency converter technology has also developed faster and been widely used. While meeting basic functions, in pursuit of higher power and operating conditions, frequency converters are subjected to increasingly larger loads, and the high current and high voltage cause the modules to generate more heat. However, existing frequency converters suffer from low heat dissipation efficiency. If liquid cooling or other heat dissipation methods are used, a large amount of energy is required, resulting in low system energy efficiency.

[0003] Because existing frequency converters suffer from low heat dissipation efficiency and low system energy efficiency, this invention designs a heat dissipation component and a frequency converter. Utility Model Content

[0004] Therefore, the technical problem to be solved by this utility model is to overcome the defect of low heat dissipation efficiency of the frequency converter in the prior art, thereby providing a heat dissipation component and frequency converter for the frequency converter.

[0005] To address the above problems, this utility model provides a heat dissipation assembly for a frequency converter, comprising:

[0006] The system includes a heat exchange element, a thermoelectric cooler, a radiator, and a condensation net. The cold end of the thermoelectric cooler can exchange heat with the heat exchange element to absorb its heat, and the hot end of the thermoelectric cooler can exchange heat with the radiator to release heat onto it. Airflow can exchange heat with the radiator as it passes through it. The condensation net is located above the radiator, and airflow reaching the condensation net can be intercepted and condensed. The condensed water can fall onto the radiator to further cool it down.

[0007] In some implementations...

[0008] The condensation net is located at the downstream end of the radiator along the airflow direction. The airflow flows from bottom to top through the radiator for heat exchange, and then reaches the condensation net where it is intercepted and condensed.

[0009] In some implementations...

[0010] The radiator is a plate-shaped radiator, including fins. When airflow passes through the fins, it can exchange heat with the fins. The condensation net is located above the fins, and the water on the condensation net can fall onto the fins and exchange heat with the fins.

[0011] In some implementations...

[0012] It also includes a housing, in which the thermoelectric cooler and the radiator are both located. The lower end of the housing is an air inlet, and a fan is provided at the air inlet to draw airflow from outside the housing into the housing. The upper end of the housing is an air outlet, and a condensation net is provided at the air outlet so that the airflow after heat exchange by the radiator is intercepted and condensed by the condensation net and then blown upward.

[0013] In some implementations...

[0014] The thermoelectric cooler includes a heat-conducting sheet, a conductive sheet, a P-type semiconductor, and an N-type semiconductor. The heat dissipation assembly also includes a silicone pad. One end of the heat exchange element is connected to one side of the silicone pad, and the other side of the silicone pad is connected to the cold end of the thermoelectric cooler. The hot end of the thermoelectric cooler is connected to the heat sink.

[0015] In some implementations...

[0016] The heat exchange element is multiple, the thermoelectric cooler is multiple, and the silicone sheet is multiple. Each heat exchange element, thermoelectric cooler, and silicone sheet corresponds to another heat exchange element. The system also includes a heat insulation plate with receiving holes. Each thermoelectric cooler is disposed in a receiving hole, such that the hot end of the thermoelectric cooler is in contact with the silicone sheet and the cold end is in contact with the heat sink. There are also multiple receiving holes, each corresponding to a thermoelectric cooler.

[0017] In some implementations...

[0018] The housing includes a front cover and a rear cover, the rear cover having a receiving cavity to receive the radiator and the thermoelectric cooler therein, and the rear cover having an opening facing one side, the front cover covering the opening and being in contact with the periphery of the rear cover;

[0019] The front cover has a through hole, the silicone sheet is disposed at the through hole, the heat exchange element is disposed on the outside of the front cover away from the receiving cavity, and the heat exchange element is fixed on the front cover and connected to the silicone sheet.

[0020] In some implementations...

[0021] The heat exchange element includes a diode and an IGBT. The diode is disposed opposite to the through hole, and the IGBT is also disposed opposite to the through hole. There is at least one IGBT and at least one diode.

[0022] In some implementations...

[0023] The bottom of the back cover has a slope, and the surface where the air inlet is set is either a straight surface parallel to the horizontal plane or the slope. One end of the slope is connected to the straight surface, and the other end gradually decreases in height in a direction away from the straight surface. A drain outlet is provided on the slope.

[0024] This utility model discloses a frequency converter assembly, which includes the aforementioned heat dissipation assembly of the frequency converter.

[0025] The heat dissipation assembly and frequency converter provided by this utility model have the following beneficial effects:

[0026] 1. This utility model utilizes a thermoelectric cooler to absorb heat from the heat exchange element and transfer the heat to the radiator, thereby effectively cooling the heat exchange element. Heat is dissipated through the contact between the radiator and the airflow. A condensation net is installed above the radiator, causing the airflow to be intercepted and condensed upon reaching the net. The condensed water then falls onto the radiator, enhancing cooling. This effectively intercepts the airflow and utilizes the condensed water for recycling, improving the radiator's cooling efficiency and recovering cold energy, thus increasing the system energy efficiency of the heat dissipation components. This effectively solves the problem of low heat dissipation efficiency in existing frequency converters.

[0027] 2. This utility model further eliminates the traditional water-cooled heat dissipation pipe system by adopting a sheet metal layered structure, replacing it with a lighter and more compact fan, greatly reducing the weight and cost of the heat dissipation module. The inverter diodes and IGBT modules are attached to the silicone heat sink. Heat is converted and transferred from the cooler to the plate heat sink. The fast conversion and transfer speed enables rapid cooling. In addition, the temperature of the cooler is adjustable, which can ensure a stable operating temperature of the module, thereby ensuring that the module operates at the optimal temperature. Heat is transferred from the plate heat sink to the entire heat dissipation component, and the heat is isolated from the module by the heat insulation plate, realizing heat stratification and ensuring that heat does not return to the module. Furthermore, the fan under the component can perform conventional air cooling or carry low-temperature humid air for rapid heat dissipation. The entire component has good waterproof measures to ensure that water droplets will not affect the operation of the module or accumulate on the component. Thus, both dry and wet heat dissipation types are available, improving heat dissipation efficiency. Attached Figure Description

[0028] Figure 1 This is a three-dimensional structural diagram of the heat dissipation component of the frequency converter of this utility model;

[0029] Figure 2 This is a three-view structural diagram of the heat dissipation component of the frequency converter of this utility model;

[0030] Figure 3 This is a bottom view of the heat dissipation assembly of the frequency converter of this utility model;

[0031] Figure 4 This is an exploded view of the heat dissipation assembly of the frequency converter of this utility model;

[0032] Figure 5 These are a perspective view and a front view of the thermoelectric cooler of the heat dissipation component of the frequency converter of this utility model;

[0033] Figure 6 This is an overall cross-sectional view of the heat dissipation assembly of the frequency converter of this utility model;

[0034] Figure 7 This is a front structural diagram of the inverter assembly (including the inverter's heat dissipation assembly) of this utility model.

[0035] The reference numerals in the attached figures are as follows:

[0036] 100. Heat exchange element to be exchanged; 1. Diode; 2. IGBT; 3. Silicone sheet; 4. Front cover; 5. Thermoelectric cooler; 50. Heat-conducting sheet; 51. Conductive sheet; 52. P-type semiconductor; 53. N-type semiconductor; 6. Heat insulation plate; 7. Heat sink; 8. Fan; 9. Rear cover; 10. Condensation screen; 11. Drain outlet; 12. Housing; 13. Air inlet; 14. Air outlet; 15. Accommodation hole; 16. Through hole; 17. Angled surface; 200. Inverter assembly. Detailed Implementation

[0037] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. The following description of at least one exemplary embodiment is merely illustrative and is in no way intended to limit the present utility model or its application or use. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the scope of protection of the present utility model.

[0038] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0039] Unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps described in these embodiments do not limit the scope of this invention. It should also be understood that, for ease of description, the dimensions of the various parts shown in the drawings are not drawn to actual scale. Techniques, methods, and devices known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and devices should be considered part of the specification. In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters in the following drawings denote similar items; therefore, once an item is defined in one drawing, it need not be further discussed in subsequent drawings.

[0040] In the description of this utility model, it should be understood that the directional terms such as "front, back, up, down, left, right", "horizontal, vertical, horizontal" and "top, bottom" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description. Unless otherwise stated, these directional terms do not indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the scope of protection of this utility model. The directional terms "inner" and "outer" refer to the inner and outer contours of each component itself.

[0041] For ease of description, spatial relative terms such as "above," "on top of," "on the upper surface of," "above," etc., are used herein to describe the spatial positional relationship of a device or feature as shown in the figures to other devices or features. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation beyond the orientation of the device as described in the figures. For example, if the device in the figures were inverted, a device described as "above" or "on top of" other devices or structures would subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein will be interpreted accordingly.

[0042] Furthermore, it should be noted that the use of terms such as "first" and "second" to define components is merely for the purpose of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore cannot be construed as limiting the scope of protection of this utility model.

[0043] like Figure 1-7 As shown, this utility model provides a heat dissipation component for a frequency converter, which includes:

[0044] The system includes a heat exchange element 100, a thermoelectric cooler 5, a radiator 7, and a condensation net 10. The cold end of the thermoelectric cooler 5 can exchange heat with the heat exchange element 100 to absorb the heat from the heat exchange element 100. The hot end of the thermoelectric cooler 5 can exchange heat with the radiator 7 to release heat onto the radiator 7. Airflow can exchange heat with the radiator 7 as it passes through it. The condensation net 10 is located above the radiator 7. When the airflow reaches the condensation net 10, it can form interception and condensation. The water formed by the condensation can fall onto the radiator 7 to further dissipate heat and cool the radiator 7.

[0045] This invention, through the aforementioned structure, utilizes a thermoelectric cooler to absorb heat from the heat exchange element and transfer the heat to the radiator, thereby effectively cooling the heat exchange element. Heat is dissipated through the contact between the radiator and the airflow. A condensation net is installed above the radiator, causing the airflow to be intercepted and condensed upon reaching the net. The condensed water then falls onto the radiator, enhancing cooling. This effectively intercepts the airflow and utilizes the condensed water for recycling, improving the radiator's cooling efficiency and recovering cold energy, thus increasing the system energy efficiency of the heat dissipation components. It effectively solves the problem of low heat dissipation efficiency in existing frequency converters.

[0046] To address the heat dissipation problem of high-power, high-heat modules, this invention proposes a variable frequency heat dissipation component based on thermoelectric cooling, which can achieve rapid cooling and precise temperature control. The heat dissipation component is small in size and compact in structure, eliminating concerns about complex piping issues. It solves the problem that traditional liquid-cooled frequency converters rely on piping to connect to the refrigerant channel of the unit, requiring additional manual labor and being complex and time-consuming to install.

[0047] This invention, through the aforementioned structure, designs a layered and categorized inverter heat dissipation component structure, achieving lightweight and portable installation of the inverter. It enables rapid cooling and precise temperature control, maintaining the operating temperature of the inverter module and improving system stability. Layered and categorized heat dissipation enhances heat dissipation efficiency.

[0048] This utility model solves the following technical problem:

[0049] 1. Layered and classified heat dissipation (the radiator first exchanges heat with the airflow, and then the radiator exchanges heat with the condensate water after throttling and condensation), which improves heat dissipation efficiency.

[0050] 2. Reduce the weight of the main heat dissipation module of the frequency converter to improve the portability of the module.

[0051] 3. Rapid cooling and temperature reduction, quickly removing heat from the module.

[0052] 4. Precise temperature control ensures stable module operation.

[0053] In some implementations...

[0054] The condensation net 10 is located at the downstream end of the radiator 7 along the airflow direction. The airflow flows from bottom to top through the radiator 7 for heat exchange, and then reaches the condensation net 10 where it is intercepted and condensed.

[0055] This is the preferred setting position and form of the condensation screen of this utility model. It is set downstream of the airflow direction of the radiator, so that the airflow can first exchange heat through the radiator and then be intercepted and condensed at the condensation screen. This allows the airflow to be heated first, realizing the first utilization of the airflow's cold energy. When the heated airflow reaches the condensation screen, the condensation screen, due to its relatively low temperature and small holes, will intercept the airflow and form condensation, thereby separating the water in the airflow and letting it fall onto the radiator. This is a second recovery of the airflow's cold energy, and it also recovers the cold energy at the condensation screen, further improving the heat dissipation efficiency of the heat exchange element.

[0056] In some implementations...

[0057] The radiator 7 is a plate-shaped radiator, including fins. When airflow passes through the fins, it can exchange heat with the fins. The condensation net 10 is located above the fins. Water on the condensation net 10 can fall onto the fins and exchange heat with the fins.

[0058] This is the preferred structural form of the radiator of this utility model, namely, a finned radiator. By utilizing the structure of multiple fins, the heat dissipation area between the radiator and the airflow can be increased. Furthermore, the water falling onto the fins from the condensation net and exchanging heat with the fins can further increase the heat exchange area between the condensation water and the radiator, thereby further improving the heat dissipation efficiency of the radiator.

[0059] In some implementations...

[0060] It also includes a housing 12, in which the thermoelectric cooler 5 and the radiator 7 are both located. The lower end of the housing 12 is an air inlet 13, and a fan 8 is provided at the air inlet 13 so that the airflow outside the housing 12 can be drawn into the housing 12 by the fan 8. The upper end of the housing 12 is an air outlet 14, and a condensation net 10 is provided at the air outlet 14 so that the airflow after heat exchange by the radiator 7 is intercepted and condensed by the condensation net 10 and then blown upward.

[0061] The present invention preferably incorporates the thermoelectric cooler and the radiator within the housing using the aforementioned structure. This allows the heat from the heat exchange element to be absorbed into the housing and introduced into the housing via airflow from the lower air inlet, facilitating efficient heat exchange with the radiator. The heat is then expelled from the upper air outlet, enhancing the airflow's fluidity. Furthermore, condensation forms at the upper condensation mesh, dripping downwards onto the radiator, further enhancing the radiator's heat dissipation efficiency.

[0062] In some implementations...

[0063] The thermoelectric cooler 5 includes a heat-conducting sheet 50, a conductive sheet 51, a P-type semiconductor 52, and an N-type semiconductor 53. The heat dissipation assembly also includes a silicone sheet 3. One end of the heat exchange element 100 is connected to one side of the silicone sheet 3, and the other side of the silicone sheet 3 is connected to the cold end of the thermoelectric cooler 5. The hot end of the thermoelectric cooler 5 is connected to the radiator 7.

[0064] This is the preferred structural form of the thermoelectric cooler of this utility model. The silicone sheet can be connected to the heat exchange element to be exchanged, realizing the connection between the heat exchange element and the thermoelectric cooler. At the same time, it achieves the effect of transferring the heat of the heat exchange element to the thermoelectric cooler. The thermoelectric cooler of this utility model forms the function and effect of absorbing heat at the cold end and releasing heat at the hot end when energized, realizing the effect of transferring the heat of the heat exchange element to the radiator and dissipating heat towards the airflow.

[0065] See Figure 4-5 In this invention, diode 1 and IGBT 2 are bonded to silicone sheet 3, which rapidly transfers heat during operation to thermoelectric cooler 5. The temperature of thermoelectric cooler 5 is then transferred to P-type semiconductor 52 and N-type semiconductor 53. When current is applied, current flows through P-type semiconductor 52 and N-type semiconductor 53. Due to the characteristics of semiconductors, a temperature difference is generated at the two ends of the semiconductor. This characteristic is used to absorb the heat generated by diode 1 and IGBT 2 and release the heat through the rear end to the sheet-like heat sink 7. Since the heat insulation plate 6 can insulate the temperature, there is no need to worry that the heat that has been absorbed and transferred will affect the temperature of the entire component again.

[0066] In some implementations...

[0067] There are multiple heat exchange elements 100, multiple thermoelectric coolers 5, and multiple silicone sheets 3. Each heat exchange element 100, thermoelectric cooler 5, and silicone sheet 3 corresponds to another element. The system also includes a heat insulation plate 6 with receiving holes 15. Each thermoelectric cooler 5 is disposed in a receiving hole 15, such that the hot end of the thermoelectric cooler 5 is connected to the silicone sheet 3, and the cold end is connected to the heat sink 7. There are also multiple receiving holes 15, each corresponding to a thermoelectric cooler 5.

[0068] This invention achieves one-to-one heat exchange through multiple heat exchange elements, multiple thermoelectric coolers, and multiple silicone sheets, thereby improving the heat exchange efficiency of the heat exchange elements. This invention also preferably uses a heat insulation plate to fix the thermoelectric cooler while preventing heat from dissipating outwards, ensuring that heat is effectively transferred to the radiator, and then blown out by the radiator through heat exchange with the airflow, thereby improving the heat dissipation efficiency.

[0069] This invention further eliminates the traditional water-cooled heat dissipation pipe system by adopting a sheet metal layered structure, replacing it with a lighter and more compact fan, significantly reducing the weight and cost of the heat dissipation module. The inverter diodes and IGBT modules are attached to silicone heat sinks. Heat is converted and transferred from the cooler to the heat sink via a fast conversion and transfer speed, enabling rapid cooling. Furthermore, the cooler's temperature is adjustable, ensuring a stable operating temperature for the module and guaranteeing optimal operation. Heat is transferred from the heat sink to the entire heat dissipation assembly, and is isolated from the module by a heat insulation plate, achieving heat stratification and preventing heat from returning to the module. Additionally, the fan below the assembly can perform conventional air cooling or carry low-temperature, humid air for rapid heat dissipation. The entire assembly has excellent waterproofing measures, ensuring that water droplets do not affect module operation or accumulate on the assembly. Thus, both dry and wet heat dissipation types are available, improving heat dissipation efficiency.

[0070] In some implementations...

[0071] The housing 12 includes a front cover 4 and a rear cover 9. The rear cover 9 has a receiving cavity to receive the radiator 7 and the thermoelectric cooler 5 therein, and the rear cover 9 has an opening facing one side. The front cover 4 is disposed over the opening and is in contact with the periphery of the rear cover 9.

[0072] The front cover 4 has a through hole 16, the silicone sheet 3 is disposed at the through hole 16, the heat exchange element 100 is disposed on the outside of the front cover 4 away from the accommodating cavity, and the heat exchange element 100 is fixed on the front cover 4 and connected to the silicone sheet 3.

[0073] The aforementioned housing of this utility model preferably includes a front cover and a rear cover. The accommodating cavity inside the rear cover can accommodate the radiator and the thermoelectric cooler. The rear cover and the front cover are connected as a whole to form a relatively closed heat exchange space. The through hole on the front cover can be used to set the silicone sheet and connect and fix it to the heat exchange element on the outside, ensuring that heat is effectively transferred from the heat exchange element to the radiator through the silicone sheet and the thermoelectric cooler, and is dissipated with the heat exchange flow of the airflow, thereby improving the heat dissipation efficiency of the heat exchange element.

[0074] This utility model provides a variable frequency heat dissipation component based on thermoelectric cooling, including a silicone sheet 3, a front cover 4, a thermoelectric cooler 5, a heat insulation plate 6, a sheet-like heat sink 7, a fan 8, a rear cover 9, and a condensation mesh 10. The lower layer of the inverter's diodes 1 and IGBTs 2 is located on top of the silicone sheet 3, secured with bolts without the need for silicone grease. The thermoelectric cooler 5 is placed on the lower layer of the silicone sheet 3, and the heat insulation sheet metal (heat insulation plate 6) and the front cover 4 are welded to fix the thermoelectric cooler 5 inside. The lower layer of the heat sink 7 is placed on top of the heat insulation plate 6 and is in contact with the thermoelectric cooler 5. The fan 8 matches the mounting holes below the rear cover 9, and the dustproof condensation mesh 10 is placed above the rear cover 9 of the inverter assembly. After the above assembly is completed, the front and rear covers of the component are bolted together to complete the entire heat dissipation component.

[0075] In some implementations...

[0076] The heat exchange element 100 includes a diode 1 and an IGBT 2. The diode 1 is disposed opposite to the through hole 16, and the IGBT 2 is also disposed opposite to the through hole 16. There is at least one IGBT 2 and at least one diode 1.

[0077] The heat exchange components of this invention preferably include diodes and IGBTs, which can effectively exchange and cool both.

[0078] In some implementations...

[0079] The bottom of the rear cover 9 has a slope 17. The surface of the air inlet 13 is a straight surface parallel to the horizontal plane or the slope 17. One end of the slope 17 is connected to the straight surface, and the other end gradually decreases in height in the direction away from the straight surface. A drain outlet 11 is provided on the slope 17.

[0080] This invention uses the sloping surface at the bottom of the rear cover to guide the condensate falling from above and discharge it to the outside of the inverter heat dissipation component through the drain outlet, thereby achieving the discharge of condensate, ensuring the safety of the internal structure, and further improving heat dissipation efficiency.

[0081] See Figure 1-3Viewed from the right side, the module is a closed structure with ventilation at the top and bottom. In the left view, the top and bottom of the module's rear cover are both sloped (17). This is primarily to allow small water droplets condensing from the cold, humid air blown into the module to collect on one side within the dust-proof condensation net (10) and flow downwards to be discharged through the drain outlet (11). The condensation net (10) is inclined towards the module's heat sink (7), where the condensed water droplets carry away heat from the finned heat sink, turning into water vapor, which is then discharged from the module. This process not only cools and dissipates heat but also cleans the module.

[0082] See Figure 4-6 The fan 8 of this invention can also preferably be installed on the inclined surface 17 of the lower half of the rear cover 9, which changes the air intake angle of the fan 8. After the air is intaked, it collides with the fins of the plate-shaped heat sink 7, generating a laminar flow along the fins and a turbulent flow due to the collision with the fin surface. The laminar flow dissipates heat upwards along the heat sink, while the turbulent flow continuously collides and carries away the heat of the gas in the cavity. When the blown-in gas is low-temperature wet steam, the laminar flow cools the heat sink from bottom to top, while the turbulent flow carries the wet steam in the cavity and collides with various corners inside the cavity, thereby dissipating heat inside the cavity. The inclined fan 8 can also prevent water droplets from flowing in. The dustproof condensation net 10 retains the water droplets and causes them to flow down the inner wall of the cavity again. The water droplets absorb heat and turn into steam, which dissipates heat for the entire cavity of the component.

[0083] This utility model also provides a frequency converter assembly, which includes the aforementioned heat dissipation assembly of the frequency converter.

[0084] The above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the protection scope of this utility model. The above description is only a preferred embodiment of this utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the technical principles of this utility model, and these improvements and modifications should also be considered within the protection scope of this utility model.

Claims

1. A heat dissipating assembly of a frequency converter, characterized by: include: The heat exchange element (100), thermoelectric cooler (5), radiator (7) and condensation net (10) are provided. The cold end of the thermoelectric cooler (5) can exchange heat with the heat exchange element (100) to absorb the heat of the heat exchange element (100). The hot end of the thermoelectric cooler (5) can exchange heat with the radiator (7) to release heat onto the radiator (7). When the airflow passes through the radiator (7), it can exchange heat with it. The condensation net (10) is located above the radiator (7). When the airflow reaches the condensation net (10), it can form interception and condensation. The water formed by condensation can fall onto the radiator (7) to further dissipate heat and cool the radiator (7).

2. The heat dissipation assembly of the frequency converter according to claim 1, characterized in that: The condensation net (10) is located downstream of the radiator (7) along the airflow direction. The airflow flows from bottom to top through the radiator (7) for heat exchange, and then reaches the condensation net (10) where it is intercepted and condensed.

3. The heat dissipation assembly of the frequency converter according to claim 2, characterized in that: The radiator (7) is a plate-shaped radiator, including fins. When the airflow passes through the fins, it can exchange heat with the fins. The condensation net (10) is located above the fins. Water on the condensation net (10) can fall onto the fins and exchange heat with the fins.

4. The heat dissipation assembly of the frequency converter according to claim 1, characterized in that: It also includes a housing (12), in which the thermoelectric cooler (5) and the radiator (7) are both located. The lower end of the housing (12) is an air inlet (13), and a fan (8) is provided at the air inlet (13) so that the airflow outside the housing (12) can be drawn into the housing (12) by the fan (8). The upper end of the housing (12) is an air outlet (14), and a condensation net (10) is provided at the air outlet (14) so ​​that the airflow after heat exchange by the radiator (7) is intercepted and condensed by the condensation net (10) and then blown upward.

5. The heat dissipation assembly of the frequency converter according to claim 4, characterized in that: The thermoelectric cooler (5) includes a heat-conducting sheet (50), a conductive sheet (51), a P-type semiconductor (52), and an N-type semiconductor (53). The heat dissipation assembly also includes a silicone sheet (3). One end of the heat exchange element (100) is connected to one side of the silicone sheet (3), and the other side of the silicone sheet (3) is connected to the cold end of the thermoelectric cooler (5). The hot end of the thermoelectric cooler (5) is connected to the radiator (7).

6. The heat dissipation assembly of the frequency converter according to claim 5, characterized in that: There are multiple heat exchange elements (100), multiple thermoelectric coolers (5), and multiple silicone sheets (3). The heat exchange elements (100), thermoelectric coolers (5), and silicone sheets (3) are all one-to-one. The system also includes a heat insulation plate (6). The heat insulation plate (6) is provided with receiving holes (15). The thermoelectric coolers (5) are disposed in the receiving holes (15), so that the hot end of the thermoelectric cooler (5) is connected to the silicone sheet (3) and the cold end is connected to the radiator (7). There are also multiple receiving holes (15), and each receiving hole (15) corresponds to a thermoelectric cooler (5).

7. The heat dissipation assembly of the frequency converter according to claim 5, characterized in that: The housing (12) includes a front cover (4) and a rear cover (9), the rear cover (9) having a receiving cavity to receive the radiator (7) and the thermoelectric cooler (5) therein, and the rear cover (9) having an opening facing one side, the front cover (4) covering the opening and connecting with the periphery of the rear cover (9); The front cover (4) has a through hole (16), the silicone sheet (3) is disposed at the through hole (16), the heat exchange element (100) is disposed on the outside of the front cover (4) away from the cavity, and the heat exchange element (100) is fixed on the front cover (4) and connected to the silicone sheet (3).

8. The heat dissipation assembly of the frequency converter according to claim 7, characterized in that: The heat exchange element (100) includes a diode (1) and an IGBT (2). The diode (1) is disposed opposite to the through hole (16), and the IGBT (2) is also disposed opposite to the through hole (16). There is at least one IGBT (2) and at least one diode (1).

9. The heat dissipation assembly of the frequency converter according to claim 7, characterized in that: The bottom of the back cover (9) has a slope (17). The surface of the air inlet (13) is a straight surface parallel to the horizontal plane or the slope (17). One end of the slope (17) is connected to the straight surface, and the other end gradually decreases in height in the direction away from the straight surface. A drain outlet (11) is provided on the slope (17).

10. A frequency converter assembly characterized by: The heat dissipation component of the frequency converter as described in any one of claims 1-9.

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