A water-cooled controller
By introducing a water-cooled radiator into the controller and optimizing the design of heat dissipation components, the problem of insufficient heat dissipation under high-temperature environments is solved, achieving efficient heat dissipation and ensuring the normal operation and safety of the motor controller.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- DONGGUAN XIAOQIANG ELECTRONIC TECH CO LTD
- Filing Date
- 2025-08-27
- Publication Date
- 2026-07-31
AI Technical Summary
Existing controllers are unable to meet the heat dissipation requirements under high power density in high-temperature environments, resulting in excessively high temperatures of electronic components, which affects the operating efficiency and reliability of motors.
A water-cooled controller is adopted, which uses a water-cooled radiator and coolant chamber inside the controller to quickly cool down the temperature using coolant. Combined with optimized heat dissipation component design, the heat dissipation efficiency is improved.
Rapid cooling is achieved, ensuring the normal operation of the electronic components inside the controller, meeting the heat dissipation requirements of the high power density of the high voltage DC motor controller, and improving heat dissipation efficiency and safety.
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Figure CN224583556U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of controllers, and more particularly to a water-cooled controller. Background Technology
[0002] Currently, controllers generally use air cooling. However, for some controllers, air cooling is insufficient to meet heat dissipation requirements when the ambient temperature is high. For example, in high-voltage DC motor applications (such as high-power industrial motor equipment, grooving machines, ring saws, and cutting machines), the motor controller, as a core component, generates a large amount of heat during power conversion. If this heat cannot be dissipated in time, it will cause the temperature of the internal electronic components (such as IGBT modules) to become too high, affecting the motor's operating efficiency and reliability, and even shortening the lifespan of components, leading to malfunctions. Traditional heat dissipation methods (such as simple air cooling) are limited by their heat dissipation efficiency and cannot meet the heat dissipation requirements of high-voltage DC motor controllers under high power density. Therefore, this application was developed. Utility Model Content
[0003] To enhance the heat dissipation performance of the controller and meet the heat dissipation requirements of high power density in high voltage DC motor controllers, this application provides a water-cooled controller.
[0004] The water-cooled controller provided in this application adopts the following technical solution: A water-cooled controller includes a housing and a water-cooled radiator disposed inside the housing. The water-cooled radiator has a coolant chamber inside, and pipe joints communicating with the coolant chamber are provided at opposite ends of the water-cooled radiator, with the pipe joints extending out of the housing.
[0005] By adopting the above technical solution, water cooling of the controller is achieved. Compared with conventional air-cooled controllers, the cooling speed is faster and the efficiency is higher. It can quickly reduce the internal temperature of the controller, ensure the normal operation of the internal electronic components, and meet the heat dissipation requirements of high power density of high voltage DC motor controllers.
[0006] Preferably, the box body is provided with a pair of spaced and parallel mounting plates, and the space between the pair of mounting plates is configured to accommodate the water-cooled radiator and fix the water-cooled radiator to the mounting plate.
[0007] By adopting the above technical solution, it is easy to install the water-cooled radiator inside the box.
[0008] Preferably, the water-cooled radiator includes: A pair of spaced and parallel positioning plates, which extend into the receiving space and are fixedly connected to the mounting base plate; A heat dissipation base plate is integrally connected to a pair of positioning plates extending out of the receiving space. The outer surface of the heat dissipation base plate is constructed with multiple heat dissipation components. At least some of the heat dissipation components are detachably and fixedly connected to the inner wall of the box. The coolant cavity is located inside the heat dissipation base plate and the heat dissipation components.
[0009] By adopting the above technical solution, it is easy to install the water-cooled radiator inside the box.
[0010] Preferably, the heat dissipation component is a heat sink, with multiple heat sinks distributed on opposite sides of the heat dissipation substrate, and the heat sinks are perpendicular to the sides of the heat dissipation substrate, with adjacent heat sinks spaced apart and arranged parallel to each other.
[0011] By adopting the above technical solution, the heat dissipation efficiency of the heat dissipation components can be accelerated to the maximum extent.
[0012] Preferably, the width of the heat sink gradually decreases from the middle of the side of the heat sink substrate towards both ends in the width direction.
[0013] By adopting the above technical solution, airflow circulation inside the controller housing is facilitated, thereby improving heat dissipation efficiency.
[0014] Preferably, multiple heat dissipation strips are symmetrically arranged on both sides of the heat sink, and the multiple heat dissipation strips are spaced apart and arranged parallel to each other along the width direction of the heat sink.
[0015] By adopting the above technical solutions, heat dissipation efficiency can be improved.
[0016] Preferably, the heat dissipation component is a heat dissipation column, which is perpendicular to the side of the heat dissipation substrate away from the positioning plate. The height of the heat dissipation column gradually decreases from the middle of the side of the heat dissipation substrate towards both ends in the width direction, and adjacent heat dissipation columns are spaced apart and parallel to each other.
[0017] By adopting the above technical solution, compared with heat sinks, heat dissipation columns have less resistance, are more conducive to the flow of surrounding air, and improve heat dissipation efficiency.
[0018] Preferably, the mounting base plate is provided with fasteners, and the fasteners are detachably and fixedly connected to the positioning plate and the mounting base plate.
[0019] By adopting the above technical solution, it is convenient to disassemble and assemble the positioning plate and mounting base.
[0020] Preferably, the housing is equipped with a leakage current detection device for detecting whether the water-cooled radiator is energized.
[0021] By adopting the above technical solutions, the safe operation of the controller is ensured, and leakage can prevent the coolant in the coolant chamber from becoming electrified.
[0022] Preferably, a power device is disposed inside the housing, and the power device is fixedly connected to the mounting base plate.
[0023] By adopting the above technical solution, heat dissipation of power devices can be achieved more quickly.
[0024] In summary, this application includes at least one of the following beneficial technical effects: The water-cooled controller of this application can rapidly cool down the internal temperature of the controller by setting a water-cooled heat sink inside the controller, ensuring the normal operation of the electronic components inside the controller and meeting the heat dissipation requirements of the high power density of the high voltage DC motor controller. Attached Figure Description
[0025] Figure 1 This is a schematic diagram of the water-cooled controller in Embodiment 1 of this application.
[0026] Figure 2 yes Figure 1 A diagram showing the result after removing the water-cooling radiator.
[0027] Figure 3 This is a schematic diagram of the structure of the water-cooled radiator in Embodiment 1 of this application. Figure 1 .
[0028] Figure 4 This is a schematic diagram of the structure of the water-cooled radiator in Embodiment 1 of this application. Figure 2 .
[0029] Figure 5 This is a schematic diagram of the structure of the water-cooled radiator in Embodiment 1 of this application. Figure 3 .
[0030] Figure 6 This is a schematic diagram of the water-cooled controller in Embodiment 2 of this application.
[0031] Figure 7 This is a schematic diagram of the water-cooled controller in Embodiment 3 of this application.
[0032] Explanation of reference numerals in the attached drawings: 1. Box body; 2. Mounting plate; 3. Fasteners; 4. Accommodation space; 5. Water-cooled radiator; 51. Heat sink base plate; 52. Heat sink fins; 53. Positioning plate; 54. Mounting holes; 55. Heat sink grooves; 56. Coolant holes; 57. Heat sink columns; 58. Heat sink strips; 59. Coolant chambers; 6. Pipe fittings. Detailed Implementation
[0033] The following is in conjunction with the appendix Figure 1-7 This application will be described in further detail.
[0034] Example 1: This embodiment discloses a water-cooled controller. (Refer to...) Figures 1-5As shown, the water-cooled controller includes a housing 1 and a water-cooled radiator 5 disposed inside the housing 1. The water-cooled radiator 5 has a coolant chamber 59 internally. Pipe connectors 6, communicating with the coolant chamber 59, are located at opposite ends of the water-cooled radiator 5. The pipe connectors 6 extend out of the housing 1 to connect with an external water source, allowing coolant to enter the coolant chamber 59 of the water-cooled radiator 5 inside the housing 1 through one pipe connector 6 to cool the internal environment of the housing 1. Then, the coolant flows out of the housing 1 through the other pipe connector 6. This design allows for the recycling of cooling water. By adopting the above technical solution, water cooling of the controller is achieved. Compared with conventional air-cooled controllers, this method offers faster cooling speed and higher efficiency, rapidly reducing the internal temperature of the controller and ensuring the normal operation of the internal electronic components, thus meeting the heat dissipation requirements of high-voltage DC motor controllers under high power density.
[0035] In this embodiment, to facilitate the assembly and disassembly of the pipe connector 6 and the water-cooled radiator 5, such as Figure 5 As shown, the water-cooled radiator 5 has coolant holes 56 at both opposite ends, and the pipe joint 6 is sealed and plugged into or screwed into the coolant holes 56.
[0036] Preferred, such as Figure 1 and Figure 2 As shown, the housing 1 has a pair of spaced and parallel mounting plates 2 inside. The space between the mounting plates 2 is configured to accommodate the water-cooled radiator 5 and fix the water-cooled radiator 5 to the mounting plates 2. By adopting the above technical solution, it is convenient to install the water-cooled radiator 5 inside the housing 1, and it is also convenient to install the electronic components of the controller inside the housing 1 onto the mounting plates 2. Since the mounting plates 2 are in direct contact with the water-cooled radiator 5, the design of not directly contacting the electronic components with the mounting plates 2 results in higher cooling efficiency and faster heat dissipation.
[0037] Preferred, such as Figures 3-5 As shown, the water-cooled radiator 5 includes a heat dissipation base plate 51 and a pair of spaced and parallel positioning plates 53. The pair of positioning plates 53 extend into the receiving space 4 and are fixedly connected to the mounting base plate 2, thereby enabling direct contact between the mounting base plate 2 and the positioning plates 53, facilitating the installation of the water-cooled radiator 5 inside the housing 1. The pair of positioning plates 53 are spaced apart, thus forming a heat dissipation groove 55 between the pair of positioning plates 53. The heat dissipation groove 55 facilitates air circulation and improves heat dissipation efficiency.
[0038] In this embodiment, as Figures 3-5As shown, the heat dissipation base plate 51 and a pair of positioning plates 53 are integrally connected to the portion extending out of the receiving space 4. The outer surface of the heat dissipation base plate 51 is constructed with multiple heat dissipation components, at least some of which are detachably and fixedly connected to the inner wall of the housing 1. This design ensures that the water-cooled radiator 5 is stably installed inside the housing 1 and does not easily shake. Correspondingly, the mounting base plate 2 and the positioning plates 53 can adopt common quick and detachable connection methods between components, such as plug-in or snap-fit connections. Conversely, if the heat dissipation components do not contact the inner wall of the housing 1, the mounting base plate 2 and the positioning plates 53 must be reliably connected, such as by bolts, to ensure that the water-cooled radiator 5 is installed stably and reliably and does not shake. Figure 2 As shown, the mounting plate 2 is provided with fasteners 3, which are detachably and fixedly connected to the positioning plate 53 and the mounting plate 2. Common fasteners 3 are bolts. Correspondingly, the positioning plate 53 and the mounting plate 2 are provided with mounting holes 54 to accommodate the fasteners 3. Figure 4 As shown, fastener 3 facilitates the disassembly and assembly of positioning plate 53 and mounting base, and ensures the stable installation of water-cooled radiator 5.
[0039] In this embodiment, the coolant cavity 59 is located inside the heat dissipation substrate 51 and the heat dissipation component, so the water-cooled radiator 5 designed in this way has efficient and fast heat dissipation.
[0040] Specifically, such as Figures 1-5 As shown, the heat dissipation component is a heat sink 52, with multiple heat sinks 52 distributed on opposite sides of the heat dissipation substrate 51. The heat sinks 52 are perpendicular to the sides of the heat dissipation substrate 51, and adjacent heat sinks 52 are spaced apart and arranged parallel to each other. By adopting the above technical solution, the heat dissipation efficiency of the heat dissipation component is maximized.
[0041] In this embodiment, further, such as Figures 3-5 As shown, the width of the heat sink 52 gradually decreases from the middle of the side of the heat dissipation substrate 51 towards both ends in the width direction, and the coolant hole 56 is located in the middle of the side of the heat dissipation substrate 51. This design reduces the resistance of the heat sink 52 to the airflow inside the housing 1, facilitates the airflow circulation inside the controller housing 1, and improves heat dissipation efficiency.
[0042] In this embodiment, a leakage current detection device is further provided inside the housing 1 to detect whether the water-cooled radiator 5 is energized. A common leakage current detection device is a leakage current sensor. By adopting the above technical solution, the safe operation of the controller is ensured, and leakage current is prevented from causing the coolant in the coolant chamber 59 to become energized.
[0043] In this embodiment, the housing 1 is equipped with power devices, such as IGBT modules. The power devices are the source of heat generation in the controller. Therefore, fixing the power devices to the mounting plate 2 can dissipate heat from the power devices more quickly and improve heat dissipation efficiency.
[0044] Example 2: The difference between this embodiment and Embodiment 1 is as follows: Figure 6 As shown, multiple heat dissipation strips 58 are symmetrically arranged on both sides of the heat sink 52. The multiple heat dissipation strips 58 are spaced apart and arranged parallel to each other along the width direction of the heat sink 52. This design further increases the heat dissipation area and improves heat dissipation efficiency.
[0045] Example 3: The difference between this embodiment and Embodiment 1 is as follows: Figure 7 As shown, the heat dissipation component is a heat dissipation column 57. The heat dissipation column 57 is perpendicular to the side of the heat dissipation substrate 51 away from the positioning plate 53. The height of the heat dissipation column 57 gradually decreases from the middle of the side of the heat dissipation substrate 51 towards both ends in the width direction. Adjacent heat dissipation columns 57 are spaced apart and parallel to each other. With this design, compared with the heat dissipation fin 52, the heat dissipation column 57 has less resistance, which is more conducive to the flow of surrounding air and improves heat dissipation efficiency.
[0046] Unless otherwise defined, the technical or scientific terms used in this application shall have the ordinary meaning understood by one of ordinary skill in the art to which this application pertains. The terms "first," "second," "third," and similar terms used in this application specification and claims do not indicate any order, quantity, or importance, but are merely used to distinguish different components. The terms "an" or "a" and similar terms do not indicate a quantity limitation, but rather indicate the presence of at least one. The terms "comprising" or "including" and similar terms mean that the elements or objects preceding "comprising" or "including" encompass the elements or objects listed following "comprising" or "including" and their equivalents, and do not exclude other elements or objects. "Above," "below," "left," "right," etc., are used only to indicate relative positional relationships; when the absolute position of the described object changes, the relative positional relationship may also change accordingly.
[0047] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.
Claims
1. A water-cooled controller characterized by: The device includes a housing and a water-cooled radiator disposed inside the housing. The water-cooled radiator has a coolant chamber inside, and pipe joints communicating with the coolant chamber are provided at opposite ends of the water-cooled radiator. The pipe joints extend out of the housing.
2. The water-cooled controller of claim 1, wherein: The box body is provided with a pair of spaced and parallel mounting plates. The space between the pair of mounting plates is configured to accommodate the water-cooled radiator and fix the water-cooled radiator to the mounting plate.
3. The water-cooled controller of claim 2, wherein: The water-cooled radiator includes: A pair of spaced and parallel positioning plates, which extend into the receiving space and are fixedly connected to the mounting base plate; A heat dissipation base plate is integrally connected to a pair of positioning plates extending out of the receiving space. The outer surface of the heat dissipation base plate is constructed with multiple heat dissipation components. At least some of the heat dissipation components are detachably and fixedly connected to the inner wall of the box. The coolant cavity is located inside the heat dissipation base plate and the heat dissipation components.
4. The water-cooled controller of claim 3, wherein: The heat dissipation component is a heat sink, with multiple heat sinks distributed on opposite sides of the heat dissipation substrate. The heat sinks are perpendicular to the sides of the heat dissipation substrate, and adjacent heat sinks are spaced apart and arranged parallel to each other.
5. The water-cooled controller of claim 4, wherein: The width of the heat sink gradually decreases from the middle of the side of the heat sink substrate towards both ends in the width direction.
6. The water-cooled controller of claim 4, wherein: Multiple heat dissipation strips are symmetrically arranged on both sides of the heat sink, and the multiple heat dissipation strips are spaced apart and arranged parallel to each other along the width direction of the heat sink.
7. The water-cooled controller of claim 3, wherein: The heat dissipation component is a heat dissipation column, which is perpendicular to the side of the heat dissipation substrate away from the positioning plate. The height of the heat dissipation column gradually decreases from the middle of the side of the heat dissipation substrate towards both ends in the width direction. Adjacent heat dissipation columns are spaced apart and parallel to each other.
8. The water-cooled controller of claim 3, wherein: The mounting base plate is equipped with fasteners, which are detachably and fixedly connected to the positioning plate and the mounting base plate.
9. The water-cooled controller of claim 1, wherein: The box is equipped with a leakage current detection device to detect whether the water-cooled radiator is energized.
10. The water-cooled controller of claim 1, wherein: The box contains a power device, which is fixedly connected to the mounting base plate.