A fan cooling device

Abstract

This utility model relates to the technical field of heat dissipation devices, and provides a fan heat dissipation device, including a centrifugal fan. The air outlet of the centrifugal fan is connected to a first heat dissipation mechanism. The first heat dissipation mechanism includes a first heat dissipation box, in which heat sinks are provided, and cooling pipes are provided inside the heat sinks. The first heat dissipation mechanism is connected to a second heat dissipation mechanism, which includes a second heat dissipation box. A support frame is provided inside the second heat dissipation box, and at least one heat dissipation channel is installed on the support frame. This utility model can effectively reduce the temperature of equipment or chips through the first heat dissipation mechanism, preventing equipment or chips from malfunctioning due to overheating, and ensuring the stability and reliability of equipment or chips. The second heat dissipation device can further dissipate heat from the air blown into it, avoiding impact on other equipment or components.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation device technology, specifically a fan heat dissipation device. Background Technology

[0002] Chips are a general term for semiconductor components used in various fields. Chips generate heat during operation, and the higher the chip's processing speed, the higher its power consumption. High-power chips generate significant amounts of heat during operation. To prevent this heat from affecting the chip's operational stability, heat sinks are installed on the chip. However, current heat sinks are not ideal for high-power chips. Prolonged operation at high temperatures can easily lead to overheating, reduced processing speed, and even chip burnout.

[0003] Utility model patent CN221041108U discloses a chip heat dissipation device, including a heat-conducting plate. Each connecting mechanism includes a connecting groove, a connecting block, a fixing block, a threaded groove, a through groove, a bolt, and a through hole. Moving the bolt through the through hole disengages the threaded connection with the through groove and the threaded groove itself. Pulling the fixing block then disengages the connecting block from the connecting groove, preventing the fixing block from interfering with the connection between the heat-conducting plate and the chip. When the heat-conducting plate needs to connect to the chip through the through hole on the fixing block, the connecting block is inserted into the connecting groove. Rotating the bolt through the through groove connects the threaded connection with the threaded groove, fixing the connecting block inside the connecting groove. The user can then use the bolt to fix the chip through the through hole on the fixing block, facilitating adjustments to the heat dissipation device's connection method according to the chip's needs and avoiding the waste of existing heat dissipation devices that require replacement. However, for high-power chips, the heat dissipation effect of this device is still not ideal. Utility Model Content

[0004] This invention proposes a fan cooling device with a simple structure and good heat dissipation effect.

[0005] A fan cooling device includes a centrifugal fan, the air outlet of the centrifugal fan is connected to a first cooling mechanism through a first ventilation pipe, and the first cooling mechanism is connected to a second cooling mechanism through a second ventilation pipe. The first heat dissipation mechanism includes a first heat dissipation box fixedly connected to the first ventilation pipe. The first heat dissipation box is provided with heat dissipation fins. The heat dissipation fins are provided with a cooling pipe for conveying cooling medium. One end of the cooling pipe is provided with a cooling medium inlet that penetrates the first heat dissipation box, and the other end is provided with a cooling medium outlet that penetrates the first heat dissipation box. The second heat dissipation mechanism includes a second heat dissipation box fixedly connected to the second ventilation pipe. The second heat dissipation box is provided with a support frame, and at least one heat dissipation channel is installed on the support frame.

[0006] With the above structure, the first heat dissipation mechanism can effectively reduce the temperature of the device or chip, preventing malfunctions due to overheating and ensuring the stability and reliability of the device or chip. The heat sink conducts heat from the device or chip to the entire heat sink itself, and a flowing cooling medium is installed within the cooling pipes of the heat sink, carrying away heat from the heat sink during its flow. The second heat dissipation device further dissipates heat from the air blown into it, preventing it from affecting other devices or components.

[0007] In order to further dissipate heat from the air passing through the first heat dissipation mechanism, the heat dissipation channel includes a channel inlet and a channel outlet, both of which are equipped with heat dissipation plates.

[0008] To increase the heat dissipation area of ​​the heat sink, the heat sink is provided with multiple wavy, raised heat dissipation fins.

[0009] To make better use of the cooling medium, the cooling medium inlet is located near the second heat dissipation mechanism, and the cooling medium outlet is located near the centrifugal fan.

[0010] To facilitate connection between the cooling pipe and the external cooling medium delivery pipe, both the cooling medium outlet and the cooling medium inlet are funnel-shaped. The inner diameter of the cooling medium outlet near the cooling pipe end is smaller than the inner diameter of the other end, and the inner diameter of the cooling medium inlet near the cooling pipe end is smaller than the inner diameter of the other end.

[0011] Preferably, the cooling pipe is a T2 copper pipe.

[0012] Preferably, the heat sink includes a heat-conducting mounting portion for contacting the device, the heat-conducting mounting portion being connected to a plurality of heat-conducting fins, and the cooling pipe passing through the heat-conducting fins.

[0013] After adopting the above technical solution, the beneficial effects of this utility model are: 1. The fan cooling device provided by this utility model includes a first cooling mechanism, which comprises a heat sink and cooling pipes. The heat sink conducts heat from the device or chip to the entire heat sink itself. A flowing cooling medium is contained within the cooling pipes of the heat sink, carrying away heat from the heat sink during its flow. The first cooling mechanism can effectively reduce the temperature of the device or chip, preventing malfunctions due to overheating and ensuring the stability and reliability of the device or chip.

[0014] 2. The fan cooling device provided by this utility model is equipped with a second cooling mechanism, which can further dissipate heat from the air blown into it, so as to avoid affecting other equipment or components. Attached Figure Description

[0015] Figure 1 This is a three-dimensional structural schematic diagram of the present invention; Figure 2 This is a three-dimensional structural diagram of the internal structure of the first heat sink; Figure 3 This is a side view of the internal structure of the first heat sink. Figure 4 This is a three-dimensional structural diagram of the internal structure of the second heat sink; Figure 5 This is a three-dimensional structural diagram of the internal structure of the second heat sink from another angle.

[0016] Wherein: 1-Centrifugal fan; 2-First heat dissipation mechanism; 21-First heat dissipation box; 22-Heat-conducting installation part; 23-Heat-conducting fins; 24-Cooling medium inlet; 25-Cooling pipe; 26-Cooling medium outlet; 3-Second heat dissipation mechanism; 31-Second heat dissipation box; 32-Support frame; 33-Heat dissipation channel; 34-Channel inlet; 35-Channel outlet. Detailed Implementation

[0017] The present invention will be further described below with reference to the accompanying drawings.

[0018] The orientations mentioned in this specification are based on the orientation of this utility model during normal operation, and do not limit its orientation during storage and transportation. They only represent relative positional relationships and do not represent absolute positional relationships.

[0019] like Figure 1-5 As shown, a fan cooling device includes a centrifugal fan 1. The air outlet of the centrifugal fan 1 is connected to a first cooling mechanism 2 through a first ventilation pipe. The first cooling mechanism 2 is connected to a second cooling mechanism 3 through a second ventilation pipe. The first cooling mechanism 2 can effectively reduce the temperature of the equipment or chip, prevent the equipment or chip from malfunctioning due to overheating, and ensure the stability and reliability of the equipment or chip. The second cooling device can further dissipate heat from the air blown into it, avoiding affecting other equipment or components.

[0020] The first heat dissipation mechanism 2 includes a first heat dissipation box 21 fixedly connected to a first ventilation duct. The first heat dissipation box 21 contains heat sinks, and the heat sinks contain cooling pipes 25 for conveying cooling medium. One end of the cooling pipe 25 has a cooling medium inlet 24 penetrating the first heat dissipation box 21, and the other end has a cooling medium outlet 26 penetrating the first heat dissipation box 21. The heat sinks conduct heat from the device or chip to the entire heat sink itself. The cooling medium flows within the cooling pipes 25 of the heat sink, carrying away heat from the heat sink during its flow.

[0021] The heat sink includes a thermally conductive mounting part 22 for contacting the device or chip. The thermally conductive mounting part 22 is connected to multiple thermally conductive fins 23. A cooling pipe 25 passes through the thermally conductive fins 23. The cooling pipe 25 is a T2 copper pipe, which has a better heat dissipation effect.

[0022] The second heat dissipation mechanism 3 includes a second heat dissipation box 31 fixedly connected to the second ventilation duct. A support frame 32 is provided inside the second heat dissipation box 31, and at least one heat dissipation channel 33 is installed on the support frame 32. The second heat dissipation mechanism 3 continues to further dissipate heat from the air passing through the first heat dissipation mechanism 2.

[0023] The heat dissipation channel 33 includes a channel inlet 34 and a channel outlet 35. Both the channel inlet 34 and the channel outlet 35 are equipped with heat dissipation plates. The heat dissipation plates are equipped with multiple wavy, raised heat dissipation fins, which increases the heat dissipation area of ​​the heat dissipation plates.

[0024] The cooling medium inlet 24 is located near the second heat dissipation mechanism 3, and the cooling medium outlet 26 is located near the centrifugal fan 1, so that the cooling medium can be better utilized.

[0025] Both the cooling medium outlet 26 and the cooling medium inlet 24 are funnel-shaped. The inner diameter of the cooling medium outlet 26 near the cooling pipe 25 is smaller than the inner diameter of the other end. The inner diameter of the cooling medium inlet 24 near the cooling pipe 25 is smaller than the inner diameter of the other end. This is to facilitate the connection of the cooling pipe 25 to the external cooling medium delivery pipe and to enable the cooling medium to flow faster in the cooling pipe 25.

[0026] Of course, the above description is not intended to limit the present utility model, and the present utility model is not limited to the examples given above. Any changes, modifications, additions or substitutions made by those skilled in the art within the scope of the present utility model should also fall within the protection scope of the present utility model.

Claims

1. A fan heat sink device comprising a centrifugal fan (1), characterized in that, The air outlet of the centrifugal fan (1) is connected to a first heat dissipation mechanism (2) through a first ventilation pipe, and the first heat dissipation mechanism (2) is connected to a second heat dissipation mechanism (3) through a second ventilation pipe. The first heat dissipation mechanism (2) includes a first heat dissipation box (21) fixedly connected to the first ventilation pipe. The first heat dissipation box (21) is provided with heat dissipation fins. The heat dissipation fins are provided with a cooling pipe (25) for conveying cooling medium. One end of the cooling pipe (25) is provided with a cooling medium inlet (24) penetrating the first heat dissipation box (21), and the other end is provided with a cooling medium outlet (26) penetrating the first heat dissipation box (21). The second heat dissipation mechanism (3) includes a second heat dissipation box (31) fixedly connected to the second ventilation pipe. The second heat dissipation box (31) is provided with a support frame (32), and at least one heat dissipation channel (33) is installed on the support frame (32).

2. The fan heat sink of claim 1, wherein The heat dissipation channel (33) includes a channel inlet (34) and a channel outlet (35), both of which are equipped with heat dissipation plates.

3. The fan heat sink of claim 2, wherein, The heat sink is provided with multiple wavy, raised heat dissipation fins.

4. The fan cooling device according to claim 1, characterized in that, The cooling medium inlet (24) is located near the second heat dissipation mechanism (3), and the cooling medium outlet (26) is located near the centrifugal fan (1).

5. A fan cooling device according to claim 4, characterized in that, The cooling medium outlet (26) and the cooling medium inlet (24) are both funnel-shaped. The inner diameter of the cooling medium outlet (26) near the cooling pipe (25) is smaller than the inner diameter of the other end. The inner diameter of the cooling medium inlet (24) near the cooling pipe (25) is smaller than the inner diameter of the other end.

6. A fan cooling device according to claim 4, characterized in that, The cooling pipe (25) is a T2 copper pipe.

7. A fan cooling device according to claim 1, characterized in that, The heat sink includes a heat-conducting mounting portion (22) for contacting the device, the heat-conducting mounting portion (22) is connected to a plurality of heat-conducting fins (23), and the cooling pipe (25) passes through the heat-conducting fins (23).

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