An integrated heat dissipation structure and optical module

Abstract

This invention provides an integrated heat dissipation structure, comprising a first heat dissipation plate, a second heat dissipation plate, and a third heat dissipation plate, forming an integrated vapor chamber radiator. A heat dissipation cavity is formed between the first and second heat dissipation plates, and a heat dissipation component is disposed within the heat dissipation cavity. The second and third heat dissipation plates are fixedly connected to form a heat dissipation space. When heat is generated, the heat enters the heat dissipation cavity through the first heat dissipation plate, diffuses to the second heat dissipation plate through the heat dissipation component, and then diffuses to the heat dissipation space through the second heat dissipation plate. The heat transfer process is not limited by the multiple partitions in the independent installation of vapor chambers and radiators in the prior art, and can be transferred in a timely manner, thereby improving heat dissipation efficiency and capacity.

Description

Technical Field

[0001] This utility model relates to the field of optical modules, and more specifically, to an integrated heat dissipation structure and an optical module. Background Technology

[0002] An optical module is a device composed of optoelectronic components, functional circuits, and optical interfaces. It is typically used to convert optical signals into electrical signals and / or electrical signals into optical signals. During operation, optical modules usually generate a lot of heat. The performance of optoelectronic components is extremely sensitive to temperature. Increased temperature can lead to increased threshold current, decreased optical power, and wavelength drift, which in turn can cause signal distortion or system interruption.

[0003] Existing optical module heat dissipation structures typically employ a combination of a heat spreader and a heat sink. Specifically, the heat spreader and heat sink are separate modules assembled through welding and other methods, and installed inside the optical module's housing for heat dissipation. However, due to the independent installation of the heat spreader and heat sink, heat transfer between them involves at least two layers of partitions, preventing timely heat transfer. As the power consumption of optical modules increases, the heat transfer effect between the heat spreader and heat sink is insufficient to meet the heat generated by the optical module, leading to heat accumulation and ultimately poor overall heat dissipation. Utility Model Content

[0004] Based on this, in order to solve the problem, this utility model provides an integrated heat dissipation structure and optical module, the specific technical solution of which is as follows: An integrated heat dissipation structure includes a first heat dissipation plate, a second heat dissipation plate, and a third heat dissipation plate; A heat dissipation cavity is formed between the first heat dissipation plate and the second heat dissipation plate, and a heat dissipation component is provided in the heat dissipation cavity; The second heat sink and the third heat sink are fixedly connected to form a heat dissipation space.

[0005] The aforementioned integrated heat dissipation structure uses a heat dissipation cavity formed by the first heat dissipation plate and the second heat dissipation plate for the installation of heat dissipation components. When heat is generated, the heat enters the heat dissipation cavity through the first heat dissipation plate, diffuses to the second heat dissipation plate through the heat dissipation components, and then diffuses to the heat dissipation space through the second heat dissipation plate. The heat transfer process is not limited by the multi-layer partitions when the heat exchange plate and radiator are installed independently in the prior art, and can be transferred in a timely manner, thereby improving heat dissipation efficiency and heat dissipation capacity.

[0006] Furthermore, the first heat sink, the second heat sink, and the third heat sink are integrally formed, and the first heat sink, the second heat sink, and the third heat sink are made of the same material.

[0007] Furthermore, the first heat sink includes a flat plate portion and a cavity portion. The flat plate portion surrounds the periphery of the cavity portion. The flat plate portion is fixedly connected to the second heat sink, and a heat dissipation cavity is formed between the cavity portion and the second heat sink.

[0008] Furthermore, the heat dissipation assembly includes a first capillary wall, a second capillary wall, and a support column, wherein the support column connects the first capillary wall and the second capillary wall.

[0009] Furthermore, the first capillary wall is adapted to the shape of the cavity portion, and the first capillary wall is attached to the inner wall of the cavity portion.

[0010] Furthermore, the integrated heat dissipation structure also includes a heat-conducting component, which is installed on the outer wall of the cavity portion.

[0011] Furthermore, the heat dissipation space is provided with multiple heat sinks, which are arranged side by side and evenly, and a heat dissipation channel is formed between two adjacent heat sinks.

[0012] This utility model also provides an optical module, including the above-mentioned integrated heat dissipation structure and housing; The housing has an opening adapted to the heat dissipation cavity, and the heat dissipation cavity is embedded in the opening so that the heat dissipation cavity is located inside the housing.

[0013] Furthermore, the housing is fixedly connected to the flat plate portion of the first heat sink. Attached Figure Description

[0014] The present invention can be further understood from the following description taken in conjunction with the accompanying drawings. The components in the drawings are not necessarily drawn to scale; rather, the focus is on illustrating the principles of the embodiments. In different views, the same reference numerals designate corresponding parts.

[0015] Figure 1 This is a schematic diagram of the integrated heat dissipation structure according to an embodiment of the present invention; Figure 2 This is a schematic diagram of the heat sink of the optical module and integrated heat dissipation structure according to an embodiment of the present invention; Figure 3 This is another structural schematic diagram of the heat sink of the optical module and integrated heat dissipation structure according to an embodiment of the present invention; Figure 4 yes Figure 3 The illustrated embodiment shows a schematic diagram of the optical module and the integrated heat dissipation structure.

[0016] Explanation of reference numerals in the attached figures: 1-First heat sink, 11-Plate section, 12-Cavity section, 121-Heat conductor, 13-Heat dissipation assembly, 131-First capillary wall, 132-Second capillary wall, 133-Support column; 2-Second heat sink; 3-Third heat sink, 31-Heat fin; 4-Shell, 41-Bottom plate, 42-Side plate. Detailed Implementation

[0017] To make the objectives, technical solutions, and advantages of this utility model clearer, the following detailed description is provided in conjunction with its embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the utility model and do not limit its scope of protection.

[0018] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly attached to the other element or there may be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementations.

[0019] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0020] In this utility model, "first" and "second" do not represent a specific quantity or order, but are merely used to distinguish names.

[0021] like Figure 1-3 As shown, an integrated heat dissipation structure in one embodiment of the present invention includes a first heat dissipation plate 1 and a radiator. The first heat dissipation plate 1 and the radiator are integrally formed to form a heat dissipation cavity, and a heat dissipation component 13 is provided in the heat dissipation cavity.

[0022] In this invention, the heat dissipation cavity formed by the first heat dissipation plate 1 and the radiator is used for the installation of the heat dissipation component 13. When heat is generated, the heat enters the heat dissipation cavity through the first heat dissipation plate 1, diffuses to the second heat dissipation plate 2 through the action of the heat dissipation component 13, and then diffuses to the heat dissipation space through the second heat dissipation plate 2. The heat transfer process is not limited by the multi-layer partitions when the heat spreader and radiator are installed independently in the prior art, and can be transferred in a timely manner, thereby improving the heat dissipation efficiency and heat dissipation capacity.

[0023] In one embodiment, the heat sink includes an integrally formed second heat sink plate 2 and heat sink fins 31. A plurality of heat sink fins 31 are arranged side by side evenly on one side of the second heat sink plate 2 away from the heat dissipation cavity, and a heat dissipation channel is formed between two adjacent heat sink fins 31. Specifically, the heat sink fins 31 are integrally formed with the second heat sink plate 2. At this time, the second heat sink plate serves as the upper cover plate of the heat dissipation cavity to seal the cavity, and at the same time serves as the substrate of the heat sink fins 31, playing a crucial role in achieving uniform temperature.

[0024] In some embodiments, the heat sink further includes a third heat sink 3, wherein the heat sink 31 connects the second heat sink 2 and the third heat sink 3; the first heat sink 1, the second heat sink 2, the heat sink 31, and the third heat sink 3 are integrally formed, and the first heat sink 1, the second heat sink 2, the heat sink 31, and the third heat sink 3 are made of the same material, specifically as follows: Figure 1 As shown, the heat sink 31 connects the second heat sink 2 and the third heat sink 3, serving as a support and connection. At the same time, the heat dissipation airflow formed in each heat dissipation channel can disperse heat, thereby quickly carrying away the heat. Through the first heat sink 1 and the second heat sink 2, combined with the third heat sink 3 and the heat sink 31, an integrated heat dissipation plate radiator is formed, improving the heat dissipation effect.

[0025] Furthermore, the first heat sink 1, the second heat sink 2, the heat sink 31, and the third heat sink 3 are made of the same material. Specifically, the same material is the same heat dissipation material, and the heat dissipation structure of this application is formed by integral molding, which is conducive to heat transfer and improves the heat dissipation effect. In a preferred embodiment, the heat dissipation material is copper or aluminum, etc.

[0026] In one embodiment, such as Figure 1 As shown, the first heat sink 1 includes a flat plate portion 11 and a cavity portion 12. The flat plate portion 11 surrounds the cavity portion 12 and is fixedly connected to the second heat sink 2. The cavity portion 12 and the second heat sink 2 form a heat dissipation cavity. Specifically, the cavity portion 12 is a cavity-shaped structure, which is combined with the second heat sink 2 to form a heat dissipation cavity for the installation of the heat dissipation assembly 13.

[0027] In one embodiment, the heat dissipation assembly 13 includes a first capillary wall 131, a second capillary wall 132, and a support column 133. The support column 133 connects the first capillary wall 131 and the second capillary wall 132 to prevent the cavity formed by the first capillary wall 131 and the second capillary wall 132 from deforming due to external pressure, while also enhancing the structural strength. It is worth noting that the heat dissipation assembly 13 also includes a cooling medium disposed between the first capillary wall 131 and the second capillary wall 132 for heat transfer. The heat dissipation cavity is a vacuum environment. The first heat sink 1 is in contact with the heat source and enters the heat dissipation cavity through heat conduction. The cooling medium near the heat source will quickly absorb heat and vaporize to form high-pressure steam. The high-pressure steam diffuses to the other side of the heat dissipation cavity, i.e., the second heat sink 2, due to the pressure difference. At this time, the high-pressure steam further liquefies into liquid and releases heat energy. Finally, the cooling medium is transferred to the first capillary wall 131 through the second capillary wall 132, and the heat is diffused through the heat dissipation space, thereby completing a heat transfer cycle and realizing heat dissipation of the optical module.

[0028] In one embodiment, the first capillary wall 131 is adapted to the shape of the cavity portion 12, and the first capillary wall 131 is attached to the inner wall of the cavity portion 12, thereby improving the heat transfer efficiency and effect.

[0029] Specifically, a heat dissipation cavity is formed by welding the first heat dissipation plate 1 and the second heat dissipation plate 2, such as by brazing or diffusion welding. The heat dissipation cavity is attached with a first capillary wall 131 and a second capillary wall 132, and a corresponding copper pillar / powder pillar is arranged between the first capillary wall 131 and the second capillary wall 132 as a strength support. The copper pillar / powder pillar is a preferred embodiment of the support pillar 133 in this utility model. In addition, the entire sealed cavity is under negative pressure, and the capillary structure and the copper pillar / powder pillar store a liquid working fluid that facilitates the two-phase conversion between the first heat dissipation plate 1 and the second heat dissipation plate 2.

[0030] In one embodiment, the integrated heat dissipation structure further includes a heat-conducting element 121 with a trapezoidal cross-section. The heat-conducting element 121 is installed on the outer wall of the cavity portion 12. Specifically, in practical applications, the heat-conducting element 121 contacts the heat source, thereby rapidly conducting heat to the first heat dissipation plate 1, such as... Figure 3 As shown, the contact area between the heat-conducting component 121 and the outer wall of the cavity 12 is larger than the contact area with the heat source, which is beneficial for heat to be quickly diffused from the heat source to the heat-conducting component 121 to the first heat dissipation plate 1, thereby improving the heat dissipation effect.

[0031] Specifically, the heat-conducting sheet 121 is in contact with the heat source. In a preferred embodiment, the heat-conducting sheet 121 is made of copper. When the heat from the optical module heat source is transferred from the chip to the heat-conducting sheet 121, and then from the heat-conducting sheet 121 to the surface of the cavity 12, the heat is transferred from the cavity 12 to the first capillary wall 131. The liquid working fluid in the first capillary wall 131 begins to boil and changes from liquid to vapor, thereby forming a pressure difference in the cavity. The vapor flows supersonically to the entire sealed area. The heat of the vapor is transferred to the second capillary wall 132, and then from the second capillary wall 132 to the second heat sink 2, the heat sink 31, and the third heat sink 3. The heat sink 31, the third heat sink 3, and the heat sink disposed on the third heat sink 3 carry away the heat through airflow. At the same time, after the above heat exchange, the vapor changes from gaseous to liquid and is stored in the second capillary wall 132. Under the action of capillary force, the liquid working fluid flows back to the vapor area, i.e., the first capillary wall 131.

[0032] This utility model also provides an optical module, including the above-mentioned integrated heat dissipation structure and a housing 4; the housing 4 is provided with an opening adapted to the heat dissipation cavity, and the heat dissipation cavity is embedded in the opening, so that the heat dissipation cavity is located inside the housing 4, thereby the heat inside the housing 4 can be quickly dissipated through the integrated heat dissipation structure to achieve heat dissipation of the optical module.

[0033] In one embodiment, the housing 4 is fixedly connected to the flat plate portion 11 of the first heat sink 1. In some embodiments, the housing 4 includes a bottom plate 41 and two side plates 42. The two side plates 42 are fixed to the two sides of the bottom plate 41 respectively to form an installation space. The flat plate portion 11 is fixed to the side of the bottom plate 41 where the installation space is located, so that the cavity portion 12 is embedded in the opening, and the heat dissipation space formed by the second heat sink 2 and the third heat sink 3 is located in the installation space.

[0034] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0035] The embodiments described above are merely illustrative of several implementations of this utility model, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

Claims

1. An integrated heat dissipation structure, characterized by comprising: Includes the first heat sink and the radiator; The first heat sink plate and the heat sink are integrally formed to form a heat dissipation cavity, and a heat dissipation component is provided inside the heat dissipation cavity.

2. The integrated heat spreading structure of claim 1, wherein, The radiator includes an integrally formed second heat dissipation plate and heat dissipation fins. A plurality of heat dissipation fins are arranged side by side evenly on one side of the second heat dissipation plate away from the heat dissipation cavity, and a heat dissipation channel is formed between two adjacent heat dissipation fins.

3. The integrated heat dissipation structure according to claim 2, characterized in that, The radiator further includes a third heat dissipation plate, and the heat dissipation fins connect the second heat dissipation plate and the third heat dissipation plate; The first heat sink, the second heat sink, the heat sink fin, and the third heat sink are integrally formed, and the first heat sink, the second heat sink, the heat sink fin, and the third heat sink are made of the same material.

4. The integrated heat dissipation structure according to claim 2, characterized in that, The first heat sink includes a flat plate portion and a cavity portion. The flat plate portion surrounds the periphery of the cavity portion. The flat plate portion is fixedly connected to the second heat sink, and a heat dissipation cavity is formed between the cavity portion and the second heat sink.

5. The integrated heat dissipation structure according to claim 4, characterized in that, The heat dissipation assembly includes a first capillary wall, a second capillary wall, and a support column, wherein the support column connects the first capillary wall and the second capillary wall.

6. The integrated heat dissipation structure according to claim 5, characterized in that, The first capillary wall is adapted to the shape of the cavity portion and is attached to the inner wall of the cavity portion.

7. The integrated heat dissipation structure according to claim 4, characterized in that, It also includes a heat-conducting component, which is installed on the outer wall of the cavity portion, and the heat-conducting component has a trapezoidal cross-section.

8. An optical module, characterized in that, Includes the integrated heat dissipation structure and housing as described in any one of claims 1-7; The housing has an opening adapted to the heat dissipation cavity, and the heat dissipation cavity is embedded in the opening so that the heat dissipation cavity is located inside the housing.

9. The optical module according to claim 8, characterized in that, The housing is fixedly connected to the flat plate portion of the first heat sink.

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