A cooling structure and intelligent computing center

Abstract

This utility model provides a cooling structure and intelligent computing center, comprising: a housing with a cavity formed inside, the cavity being divided into a first area for installing a cooling pipe assembly and a second area for installing a module to be cooled; a first channel at the upper end of a main partition connecting the upper ends of the first and second areas, and a second channel at the lower end of the main partition connecting the lower ends of the first and second areas; a cooling pipe assembly disposed within the first area for cooling the coolant within the first area; and a fluid propulsion device disposed within the first or second area, or disposed on the main partition, for generating thrust. This utility model's cooling structure and intelligent computing center, through its partitioned isolation and active circulation design, simultaneously achieves extremely high cooling efficiency, excellent temperature uniformity, a compact structural layout, and extremely high equipment reliability, providing solid support for the stability of high-performance computing equipment during long-term operation.

Description

Technical Field

[0001] This utility model relates to a cooling device, and more particularly to a cooling structure and a smart computing center. Background Technology

[0002] Current traditional cooling solutions for intelligent computing centers have many limitations: On the one hand, most of them use air cooling or conventional liquid cooling technology, and the heat conduction performance of the coolant is limited, making it difficult to meet the rapid heat dissipation requirements of high-density computing environments, which easily leads to local heat accumulation and uneven heat dissipation; on the other hand, traditional cooling systems have complex architectures and numerous connecting components, which not only increases the difficulty of installation and maintenance costs, but also increases the probability of failure. In addition, some systems rely on external circulation of coolant, requiring a large number of circulation pumps, resulting in high energy consumption. At the same time, the external environment can easily contaminate the coolant, affecting the stability of system operation. Utility Model Content

[0003] The technical problem to be solved by this utility model is to provide a cooling structure and intelligent computing center that is compact, has high heat dissipation efficiency and stable operation.

[0004] This utility model provides a cooling structure, including:

[0005] The housing 1 has a cavity formed inside, and a main partition 11 is provided inside the cavity. The main partition 11 divides the cavity into a first area 10a for installing the cooling pipe assembly 2 and a second area 10b for installing the module 3 to be cooled. The upper end of the main partition 11 is provided with a first channel 101, which connects the upper ends of the first area 10a and the second area 10b. The lower end of the main partition 11 is provided with a second channel 102, which connects the lower ends of the first area 10a and the second area 10b.

[0006] Cooling pipe assembly 2 is disposed in the first region 10a and is used to cool the coolant in the first region 10a;

[0007] The fluid propulsion device 5 is disposed in the first region 10a or the second region 10b, or on the main partition 11, for generating thrust and propelling the coolant to circulate between the first region 10a and the second region 10b.

[0008] Furthermore, the fluid propulsion device 5 enables the coolant in the second region 10b to enter the first region 10a through the first channel 101, and enables the coolant in the first region 10a to enter the second region 10b through the second channel 102.

[0009] Furthermore, the medium inside the cooling pipe assembly 2 is carbon dioxide, and the inlet and outlet ends of the cooling pipe assembly 2 are located outside the housing 1.

[0010] Furthermore, there are multiple modules 3 to be cooled and they are equidistantly arranged along the length direction of the main partition 11. A secondary partition 4 is provided between two adjacent modules 3 to be cooled, forming a cooling channel 104 between the two adjacent modules 3 to be cooled. The lower end of the secondary partition 4 is provided with a third channel 103 that communicates with the second channel 102.

[0011] Furthermore, the module to be cooled 3 has one or more heating units, and the secondary partition 4 is disposed at both ends of the module to be cooled 3 and / or between two adjacent heating units.

[0012] Furthermore, the sub-partition 4 has a certain width and is used to reduce the width of the cooling channel 104 between two adjacent sub-partitions 4.

[0013] Furthermore, the main partition 11 is perpendicular to the horizontal plane and parallel to the length direction of the box 1, and the module to be cooled 3 is plate-shaped and is perpendicular to both the horizontal plane and the main partition 11.

[0014] Furthermore, the horizontal height of the first channel 101 is higher than or level with the upper end height of the module 3 to be cooled, and the upper end of the module 3 to be cooled forms a reflux zone.

[0015] Furthermore, the lower end of the main partition 11 has a gap with the bottom surface of the receiving cavity to form the second channel 102, and the upper end of the main partition 11 has a through hole to form the first channel 101. There are multiple first channels 101 and they are arranged sequentially along the length direction of the main partition 11. The fluid pushing device 5 is arranged on the first channel 101.

[0016] Furthermore, the cooling pipe assembly 2 includes an inlet pipe 21 and an outlet pipe 22, and multiple cooling pipes 23 are connected in parallel between the inlet pipe 21 and the outlet pipe 22.

[0017] Furthermore, the fluid driving device 5 is a pump or an impeller.

[0018] Meanwhile, this utility model also provides a smart computing center using the cooling structure, wherein the module 3 to be cooled is a blade server, and the blade server has one or more heat-generating units, the heat-generating units being CPU and / or GPU.

[0019] This utility model's cooling structure and intelligent computing center, through the design of partitioned isolation and active circulation, simultaneously achieves extremely high cooling efficiency, excellent temperature uniformity, compact structural layout, and extremely high equipment reliability, providing solid support for the stability of high-performance computing equipment during long-term operation. Attached Figure Description

[0020] Figure 1This is a schematic diagram of the cooling structure of this utility model;

[0021] Figure 2 This is a cross-sectional view of the cooling structure of this utility model;

[0022] Figure 3 This is an exploded structural diagram of the cooling structure of this utility model;

[0023] Figure 4 This is a schematic diagram of the cooling structure box of this utility model;

[0024] Figure 5 This is a schematic diagram of the cooling pipe assembly of the cooling structure of this utility model;

[0025] Figure 6 This is a partial enlarged view of the cooling pipe assembly of the cooling structure of this utility model;

[0026] Figure 7 This is a cross-sectional view of the cooling pipe of the cooling structure of this utility model;

[0027] Figure 8 This is a schematic diagram showing the placement of the secondary baffle in the cooling structure of this utility model;

[0028] Figure 9 This is a schematic diagram of the secondary baffle of the cooling structure of this utility model;

[0029] Figure 10 This is a schematic diagram of the coolant flow in the cooling structure of this utility model.

[0030] In the diagram: 1. Box body, 10a. First area, 10b. Second area, 101. First channel, 102. Second channel, 103. Third channel, 104. Cooling channel, 11. Main partition, 2. Cooling pipe assembly, 21. Liquid inlet pipe, 22. Liquid outlet pipe, 23. Cooling pipe, 3. Module to be cooled, 4. Secondary partition, 41. First plate, 42. Second plate, 5. Fluid propulsion device. Detailed Implementation

[0031] The embodiments of this utility model will now be described in detail with reference to the accompanying drawings.

[0032] See Figures 1-10 This utility model provides a cooling structure, including a housing, a cooling pipe assembly 2, and a fluid driving device 5.

[0033] The housing 1 serves as the main installation component, comprising a housing body with an open top and a cover at the open top of the housing body, thus forming a receiving cavity within the housing 1. A main partition 11 is provided within this receiving cavity, dividing it into a first region 10a and a second region 10b. The first region 10a and the second region 10b are completely separated by the main partition, forming independent sealed chambers. The first region 10a is used to install the cooling pipe assembly 2, and the second region 10b is used to install the module 3 to be cooled. The upper end of the main partition 11 is provided with a first channel 101, which connects the upper ends of the first region 10a and the second region 10b to each other. The upper ends of the first region 10a and the second region 10b are connected through the first channel 101. The lower end of the main partition 11 is provided with a second channel 102, which connects the lower ends of the first region 10a and the second region 10b to each other. The lower ends of the first region 10a and the second region 10b are connected through the second channel 102. The cavity is filled with coolant.

[0034] Cooling pipe assembly 2, as the main cooling unit, is installed in the first region 10a and is used to cool the coolant in the first region 10a;

[0035] The fluid driving device 5 is installed in the first region 10a or the second region 10b, or on the main partition 11, to generate thrust, thereby driving the coolant to circulate between the first region 10a and the second region 10b, thereby circulating and cooling the module 3 to be cooled in the second region 10b.

[0036] It forms an independent circulating cooling structure within the casing, which has the following advantages:

[0037] 1. It has high efficiency in heat exchange and temperature uniformity. The structure creates a closed coolant circulation loop (second region 10b → second channel 102 → first region 10a → first channel 101 → second region 10b). The fluid driving device 5 actively drives the coolant flow, which can quickly remove the heat generated by the module to be cooled 3 and send it to the first region 10a for centralized cooling by the cooling pipe group 2. This forced circulation avoids local overheating, making the temperature of the entire second region and the module to be cooled very uniform. The heat dissipation efficiency is much higher than that of static liquid cooling systems that rely on natural convection.

[0038] 2. High cooling efficiency and strong heat dissipation capacity. Cooling pipe group 2 (connected to an external cold source) is specifically responsible for cooling liquid. It is physically separated from the module to be cooled 3 but is thermally connected through liquid circulation. This design makes the cooling system not limited by the installation space of the module to be cooled and can meet the cooling requirements of high power and high heat generation.

[0039] There is a gap between the lower end of the main partition 11 and the bottom surface of the receiving cavity, which forms a second channel 102. A through hole is provided at the upper end of the main partition 11, which forms a first channel 101. There are multiple first channels 101, which are arranged sequentially along the length of the main partition 11. Preferably, they are arranged at equal intervals along the length of the main partition. The fluid driving device 5 is arranged on the first channel 101. The second channel is a continuous and wide gap between the lower end of the main partition and the bottom of the box, which allows the coolant to flow into the second area without obstruction and evenly. The first channel has a hole structure, which can improve the circulation efficiency and avoid the large-scale eddies and suction vortices that may be formed under a single large return port, thus ensuring the stability of the circulation.

[0040] To improve cooling efficiency and effectiveness, in this application, the fluid driving device 5 enables the coolant in the second region 10b to enter the first region 10a through the first channel 101, and enables the coolant in the first region 10a to enter the second region 10b through the second channel 102. (See reference...) Figure 10 ;

[0041] It can achieve optimal hot and cold liquid stratification and thermal management. Specifically, in the second region 10b, the module to be cooled 3 heats the coolant, and the hot liquid naturally rises and tends to accumulate at the top. The fluid propulsion device 5 actively pushes the hot liquid at the top (or upper end) of the second region 10b into the first region 10a through the first channel 101 above. In the first region 10a, the cooling pipe group 2 cools the liquid, and the density of the cold liquid naturally sinks to the bottom. Under the action of internal circulation, the cold liquid enters the bottom of the second region 10b through the second channel 102 below to cool the module to be cooled, and the cycle repeats. This design actively enhances the favorable temperature stratification, always using the coldest liquid to contact the heat source and the hottest liquid to contact the cold source, achieving efficient heat exchange with maximum temperature difference.

[0042] The fluid propulsion device 5 drives the coolant to circulate in a directional manner along the path of the second region → upper channel → first region → lower channel → second region, transforming a potentially inefficient and environmentally dependent thermosiphon system into a highly efficient, reliable, controllable, and high-performance active liquid cooling system. This is the core guarantee for achieving high-intensity and highly uniform heat dissipation.

[0043] In this embodiment, the medium inside the cooling tube assembly 2 is carbon dioxide. The inlet and outlet ends of the cooling tube assembly 2 are located outside the housing 1, and the exposed part is sealed to the housing for easy assembly and connection. Carbon dioxide can absorb a huge amount of heat during the phase change process, which means that even under a small temperature difference, the carbon dioxide cooling tube assembly can remove a large amount of heat from the surrounding coolant, resulting in extremely high heat exchange efficiency. At the same time, carbon dioxide has high thermal conductivity and low viscosity, which makes its heat transfer efficiency in the pipe higher and its flow resistance lower, thereby reducing pumping power consumption and enabling a more compact heat exchanger design.

[0044] To further improve heat exchange efficiency, in this application, the cooling pipe assembly 2 includes an inlet pipe 21 and an outlet pipe 22, with multiple cooling pipes 23 connected in parallel between the inlet pipe 21 and the outlet pipe 22. The cooling pipes 23 are reciprocating coils, forming a three-dimensional cooling structure. The reciprocating coil structure allows for an extremely long total pipe length within the limited space of the first region 10a, greatly increasing the heat exchange surface area in contact with the coolant. The huge heat exchange area enables the carbon dioxide medium to exchange heat more fully and quickly with the coolant in the tank, significantly improving the cooling efficiency and cooling power of the entire system. At the same time, the parallel connection of multiple cooling pipes 23 between the inlet pipe 21 and the outlet pipe 22 ensures that the carbon dioxide flow rate and velocity in each cooling pipe 23 are relatively uniform, avoiding the problem of uneven heat exchange caused by excessive temperature difference between the front and rear ends in the series design.

[0045] In this application, there are multiple modules 3 to be cooled, which are equidistantly arranged along the length of the main partition 11. A secondary partition 4 is provided between two adjacent modules 3 to be cooled, forming a cooling channel 104 between them. The lower end of the secondary partition 4 is provided with a third channel 103 that communicates with the second channel 102. Each module 3 to be cooled has one or more heating units. The secondary partition 4 is located at both ends of the module 3 to be cooled and between two adjacent heating units. The secondary partition 4 is precisely aligned with the gap between the heating units, creating a dedicated cooling channel for each independent heating unit. This forces the coolant to flow closely along the surface of each heating unit, ensuring that the heat generated by each unit can be carried away in time. This eliminates the temperature difference (hot spots) between different heating units on the module, achieving extreme temperature uniformity on the entire surface of the module 3 to be cooled, thereby significantly improving the operational stability of the module to be cooled.

[0046] To further improve cooling efficiency, in this application, the secondary partition 4 has a certain width, which is parallel to the length direction of the module 3 to be cooled. It is used to reduce the width of the cooling channel 104 between two adjacent secondary partitions 4. By increasing the width of the secondary partition, the cross-sectional area of ​​the cooling channel is reduced, thereby increasing the flow rate of the coolant in the cooling channel. The higher flow rate can more effectively flush the surface of the module 3 to be cooled, destroy the static liquid layer that hinders heat transfer, and improve the heat exchange efficiency.

[0047] In this embodiment, the sub-partition 4 includes two parallel first plates 41, which are perpendicular to the horizontal plane. A second plate 42 is provided at the upper or lower end of the first plate, or at both the upper and lower ends, forming a U-shaped or square structure. The distance between the two second plates is the width of the sub-partition 4, which is parallel to the length direction of the module to be cooled 3, and is used to limit the distance between two adjacent sub-partitions.

[0048] In this application, the main partition 11 is perpendicular to the horizontal plane and parallel to the length direction of the housing 1, while the module to be cooled 3 is plate-shaped and perpendicular to both the horizontal plane and the main partition 11. This achieves extremely high space utilization and power density, meaning that the heat that can be dissipated per unit volume is very high. This makes the entire device very compact and reduces installation space. At the same time, it forms a vertical structure for the cooling channels between the modules to be cooled, providing the smoothest path for the natural rise of the coolant. The coolant can flow smoothly and evenly from bottom to top over the surface of each module with relatively low and stable flow resistance. In addition, it avoids complex flow paths and dead zones, ensuring that the contact area and contact time between the coolant and the surface of each module are maximized, thereby achieving extremely high and uniform heat exchange efficiency.

[0049] To ensure smooth return flow, in this application, the horizontal height of the first channel 101 is higher than or level with the upper end of the module 3 to be cooled, thereby forming a return flow zone at the upper end of the module 3 to be cooled. The first channel is directly connected to this return flow zone. The heated coolant will naturally rise under the action of buoyancy and gather at the top of the second region 10b, i.e. the return flow zone. The first channel 101 is set in this area where the hot liquid naturally gathers. The coolant does not need to change its flow direction or overcome additional resistance at the top to flow out, which significantly reduces the total flow resistance of the circulation, thereby reducing the power consumption required by the fluid propulsion device 5, improving the overall energy efficiency of the system, and ensuring the uniformity of flow distribution and cooling consistency.

[0050] The fluid driving device 5 in this application is a pump or impeller 9 (with a motor). The fluid driving device 5 is installed on the first channel 101. Through the fluid driving device 5, the coolant above the second region 10b enters the first region 10a from the first channel 101 above, realizing the circulation of the coolant.

[0051] Meanwhile, this utility model also provides an intelligent computing center, which uses the above-mentioned cooling structure. The module 3 to be cooled in the intelligent computing center is a blade server, and the blade server has one or more heat-generating units, which are CPU and GPU.

[0052] The intelligent computing center using this cooling structure has the following advantages:

[0053] 1. The cooling pipe assembly uses carbon dioxide as the refrigerant, utilizing the principle of carbon dioxide phase change refrigeration to achieve more efficient heat transfer in high-density computing environments. Carbon dioxide, as a refrigerant, not only possesses excellent thermal conductivity but also maintains a constant temperature during phase change refrigeration, thus improving cooling efficiency. Furthermore, the cooling pipe assembly structure consists of several parallel sets with a modular design, allowing the cooling system to be flexibly expanded according to actual needs, further enhancing its adaptability. By organically combining the intelligent computing center with the cooling system, the problems of uneven heat dissipation and low space utilization in traditional designs are effectively solved, while simultaneously improving the overall operational safety and reliability. This innovative technological improvement provides a brand-new solution for efficient energy management in intelligent computing centers.

[0054] 2. The cooling system boasts a simple structure, facilitating installation and maintenance. The overall design is divided into two areas: a coil cooling area (Area 1) and a functional area for the electrical components of the intelligent computing center (Area 2), connected by a partition and a well-planned liquid flow channel. This simplified structure reduces complex connecting components, thereby lowering the probability of malfunctions. The cooling pipe assembly and the front panel of the enclosure are removable, facilitating easy installation. Furthermore, through collaborative optimization of the electronic information modules and the cooling system, energy efficiency is further improved, ensuring stable performance output of the intelligent computing center even under high load conditions.

[0055] 3. The cooling solution for the intelligent computing center does not involve external circulation of the coolant. Instead, an internal propulsion device completes the entire circulation process. This design reduces the need for external circulation pumps, avoids the risk of cavitation, significantly saves energy consumption, and improves cooling efficiency. Furthermore, the heat exchange and circulation of the coolant are completed within the enclosure. Through the flow channel layout and the guiding function of the fluid propulsion device, the low-temperature coolant flows from the bottom channel to the two main heat dissipation points of the blade server's CPU and GPU, ensuring maximum flow rate at these locations for adequate cooling of the CPU and GPU. This design effectively avoids the need for external circulation of coolant in existing intelligent computing center cooling solutions. Reducing the need for external circulation pumps further enhances the stability and safety of system operation, achieving efficient heat exchange under low energy consumption conditions and significantly reducing the overall energy consumption of the intelligent computing center.

[0056] The above description is only a preferred embodiment of the present utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the technical principles of the present utility model, and these improvements and modifications should also be considered within the protection scope of the present utility model.

Claims

1. A cooling structure characterized by, include: The enclosure has a cavity formed inside, and a main partition is provided inside the cavity. The main partition divides the cavity into a first area for installing a cooling pipe assembly and a second area for installing a module to be cooled. The upper end of the main partition has a first channel that connects the upper ends of the first area and the second area, and the lower end of the main partition has a second channel that connects the lower ends of the first area and the second area. A cooling pipe assembly is installed in the first area to cool the coolant in the first area; A fluid propulsion device, disposed in the first region or the second region, or disposed on the main partition, is used to generate thrust and propel the coolant to circulate between the first region and the second region.

2. The cooling structure as described in claim 1, characterized in that: The fluid propulsion device enables the coolant in the second region to enter the first region through the first channel, and the coolant in the first region to enter the second region through the second channel.

3. The cooling structure as described in claim 1, characterized in that: The cooling pipe assembly includes an inlet pipe and an outlet pipe, and multiple cooling pipes are connected in parallel between the inlet pipe and the outlet pipe. The medium in the cooling pipe assembly is carbon dioxide.

4. The cooling structure as described in claim 1, characterized in that: The modules to be cooled are multiple and are equidistantly arranged along the length of the main partition. A secondary partition is provided between two adjacent modules to be cooled, forming a cooling channel between the two adjacent modules. The lower end of the secondary partition is provided with a third channel that communicates with the second channel.

5. The cooling structure as described in claim 4, characterized in that: The module to be cooled has one or more heating units, and the sub-baffle is disposed at both ends of the module to be cooled and / or between two adjacent heating units.

6. The cooling structure as described in claim 4 or 5, characterized in that: The sub-baffle has a certain width and is used to reduce the width of the cooling channel between two adjacent sub-baffles.

7. The cooling structure as described in claim 1, characterized in that: The main partition is perpendicular to the horizontal plane and parallel to the length direction of the box body, and the module to be cooled is plate-shaped and is perpendicular to both the horizontal plane and the main partition.

8. The cooling structure as described in claim 1, characterized in that: The first channel is at a height that is higher than or level with the upper end of the module to be cooled, thus forming a reflux zone at the upper end of the module to be cooled.

9. The cooling structure as described in claim 1, characterized in that: The lower end of the main partition plate has a gap with the bottom surface of the receiving cavity to form the second channel. The upper end of the main partition plate has a through hole to form the first channel. There are multiple first channels arranged sequentially along the length of the partition plate. The fluid driving device is a pump or impeller and is arranged on the first channel.

10. A computing center using the cooling structure as described in any one of claims 1-9, characterized in that: The module to be cooled is a blade server, which has one or more heat-generating units, namely a CPU and / or a GPU.

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