Optocouplers and their input terminal assembly structures

Abstract

This application discloses an optocoupler and its input terminal assembly structure, relating to the field of optocoupler technology. The optocoupler includes a package, a resistor chip, a light-emitting chip, a photosensitive chip, electrical signal input pins, and electrical signal output pins. The resistor chip, light-emitting chip, and photosensitive chip are housed within the package. The resistor chip, light-emitting chip, and photosensitive chip are connected in series with the electrical signal input pins; the photosensitive chip is connected in series with the electrical signal output pins. This application improves the user's convenience in using the optocoupler and facilitates miniaturization of the overall space required for the optocoupler and resistor chip.

Description

Technical Field

[0001] This application relates to the field of optocoupler technology, and more specifically to optocouplers and the input terminal combination structure of optocouplers. Background Technology

[0002] like Figure 1 As shown, a conventional optocoupler 100 generally includes a light-emitting chip 110, a photosensitive chip 120, and a package 130; the light-emitting chip 110 and the photosensitive chip 120 are disposed within the package 130. The conventional optocoupler 100 is a current-controlled optocoupler. When using the optocoupler 100, in order to protect the light-emitting chip 110, a resistor chip 140 connected in series with the light-emitting chip 110 needs to be set on the peripheral circuit of the optocoupler 100 to provide a pull-up or pull-down current-limiting resistor for the light-emitting chip 110.

[0003] Therefore, users often need to manually configure a resistor chip 140 connected in series with the light-emitting chip 110 on the peripheral circuit of the optocoupler 100. This presents two technical problems. First, users need to temporarily configure the resistor chip 140 when assembling the optocoupler 100, causing inconvenience. Second, the optocoupler 100 and the resistor chip 140 in the peripheral circuit require a large amount of space, which is not conducive to miniaturization.

[0004] Therefore, how to improve the convenience of using optocouplers and how to minimize the space required for the optocoupler and resistor chip as a whole are still technical problems that need to be solved by those skilled in the art. Utility Model Content

[0005] In view of this, in order to solve the above-mentioned technical problems, this application provides an optocoupler and an input terminal combination structure of the optocoupler.

[0006] To solve the above-mentioned technical problems, one of the technical solutions adopted in this application is to provide an optocoupler, which includes a package, a resistor chip, a light-emitting chip, a photosensitive chip, an electrical signal input terminal pin, and an electrical signal output terminal pin. The resistor chip, the light-emitting chip, and the photosensitive chip are housed within the package; the resistor chip and the light-emitting chip are connected in series with the electrical signal input pins; and the photosensitive chip is connected in series with the electrical signal output pins.

[0007] Optionally, the optocoupler includes an input lead frame, an electrical signal input pin is formed on the input lead frame, and includes a positive input pin and a negative input pin; The input lead frame includes a resistor chip base island and a light-emitting chip base island; the resistor chip base island and the light-emitting chip base island are disposed in the package and are insulated from each other, with the resistor chip disposed in the resistor chip base island and the light-emitting chip disposed in the light-emitting chip base island; The resistor chip base island and the light-emitting chip base island are electrically connected by bonding wires; one of the positive input pin and the negative input pin is the first pin, and the other is the second pin; the first pin is electrically connected to the resistor chip base island, and the second pin is electrically connected to the light-emitting chip base island.

[0008] Optionally, the first pin is integrally formed with the resistor chip base island, and the second pin is integrally formed with the light-emitting chip base island.

[0009] Optionally, the resistor chip base island and the light-emitting chip base island are arranged in the same layer and spaced apart from each other to form an insulating gap.

[0010] Optionally, the first pin and the second pin are arranged at a relative interval; the resistor chip base island and the light-emitting chip base island are arranged between the first pin and the second pin; The first direction is defined by the relative spacing between the first pin and the second pin, and the second direction is defined by a direction perpendicular to the first direction and parallel to the resistor chip base island and the light-emitting chip base island; the resistor chip base island and the light-emitting chip base island are arranged at relative intervals along the second direction.

[0011] Optionally, the optocoupler includes an output lead frame, an electrical signal output pin is formed on the output lead frame, and includes a positive output pin and a negative output pin; The output lead frame includes a photosensitive chip base island, which is disposed within the package, and the photosensitive chip is disposed on the photosensitive chip base island. One of the positive and negative output pins is the third pin, and the other is the fourth pin. The third pin is integrally formed with the photosensitive chip base island, and the fourth pin is insulated from the photosensitive chip base island and electrically connected to the photosensitive chip through bonding wires.

[0012] Optionally, the relative spacing between the third pin and the fourth pin is set; the direction of the relative spacing between the third pin and the fourth pin is taken as the third direction, and the direction perpendicular to the third direction and parallel to the photosensitive chip base island is taken as the fourth direction; The photosensitive chip base island and the third pin are arranged along the fourth direction, and the projections of the photosensitive chip base island and the fourth pin along the fourth direction at least partially overlap.

[0013] To solve the above-mentioned technical problems, another technical solution adopted in this application is to provide an input terminal assembly structure of an optocoupler, which includes a resistor chip, a light-emitting chip and an input terminal lead frame; The input lead frame includes a resistor chip base island, a light-emitting chip base island, and electrical signal input pins; the resistor chip is disposed on the resistor chip base island, and the light-emitting chip is disposed on the light-emitting chip base island; The electrical signal input pins include a positive input pin and a negative input pin; one of the positive input pin and the negative input pin is the first pin, and the other is the second pin; the first pin is electrically connected to the base island of the resistor chip, and the second pin is electrically connected to the base island of the light-emitting chip; the resistor chip and the light-emitting chip are connected in series between the positive input pin and the negative input pin.

[0014] Optionally, the first pin is integrally formed with the resistor chip base island, and the second pin is integrally formed with the light-emitting chip base island.

[0015] Optionally, the resistor chip base island and the light-emitting chip base island are arranged on the same layer and spaced apart from each other to form an insulating gap; the first pin and the second pin are spaced apart from each other; the resistor chip base island and the light-emitting chip base island are disposed between the first pin and the second pin. The first direction is defined by the relative spacing between the first pin and the second pin, and the second direction is defined by a direction perpendicular to the first direction and parallel to the resistor chip base island and the light-emitting chip base island; the resistor chip base island and the light-emitting chip base island are arranged at relative intervals along the second direction.

[0016] Beneficial Effects: Unlike existing technologies, in this application, the resistor chip connected in series with the light-emitting chip is directly configured within the package. This eliminates the need for the user to configure a current-limiting resistor chip for the light-emitting chip in an external circuit, allowing the electrical signal input pins to receive voltage signals to control and drive the light-emitting chip, thereby improving the user's convenience in using the optocoupler. Furthermore, the current-limiting resistor connected in series with the light-emitting chip is integrated into the package, just like the light-emitting chip itself. This reduces the overall space required for the optocoupler and current-limiting resistor, facilitating miniaturization of the entire optocoupler and current-limiting resistor configuration. In short, this application improves the user's convenience in using the optocoupler and facilitates miniaturization of the overall space required for the optocoupler and resistor chip. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the current-limiting resistor configuration used in existing optocouplers; Figure 2 This is a schematic diagram of the configuration of the current-limiting resistor when the optocoupler of this application is used; Figure 3 This is a front view schematic diagram of the input terminal assembly structure of the optocoupler of this application; Figure 4 This is a side view schematic diagram of the input terminal assembly structure of the optocoupler of this application; Figure 5 This is a front view schematic diagram of the area where the output lead frame of the optocoupler of this application is located; Figure 6 This is a cross-sectional structural diagram of the optocoupler of this application.

[0018] Explanation of reference numerals in the attached figures: Optocoupler 100; Light-emitting chip 110; Photosensitive chip 120; Package 130; Resistor chip 140; Optocoupler 200; bonding wire 201; conductive silver paste 202; light-emitting chip 210; photosensitive chip 220; package 230; light-transmitting inner package 231; light-blocking outer package 232; resistor chip 240; input lead frame 250; electrical signal input pin 251; positive input pin 2511; negative input pin 2512; first pin 21; second pin 22; resistor chip base island 252; light-emitting chip base island 253; insulation gap 254; output lead frame 260; electrical signal output pin 261; positive output pin 2611; negative output pin 2612; third pin 23; fourth pin 24; photosensitive chip base island 262; first direction W1; second direction L1; third direction W2; fourth direction L2; thickness direction H; input assembly structure 300. Detailed Implementation

[0019] To enable those skilled in the art to better understand the technical solutions of this application, the application will be further described in detail below with reference to the accompanying drawings and specific embodiments. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0020] Please see Figures 2-6 The optocoupler 200 of this application includes a package 230, a resistor chip 240, a light-emitting chip 210, a photosensitive chip 220, an electrical signal input pin 251, and an electrical signal output pin 261.

[0021] Resistor chip 240, light-emitting chip 210, and photosensitive chip 220 are disposed within package 230. Resistor chip 240 and light-emitting chip 210 are connected in series with electrical signal input pin 251. Photosensitive chip 220 is connected in series with electrical signal output pin 261.

[0022] In this way, the resistor chip 240 connected in series with the light-emitting chip 210 is directly disposed within the package 230. This eliminates the need for the user to configure a current-limiting resistor chip 240 for the light-emitting chip 210 in an external circuit, allowing the electrical signal input pin 251 to receive a voltage signal to control and drive the light-emitting chip 210, thereby improving the user's convenience in using the optocoupler 200. Furthermore, the current-limiting resistor connected in series with the light-emitting chip 210 is integrated into the package 230, just like the light-emitting chip 210 itself. This reduces the overall space required by the optocoupler 200 and the current-limiting resistor, facilitating miniaturization of the optocoupler 200 and the current-limiting resistor. In other words, this application improves the user's convenience in using the optocoupler 200 and facilitates miniaturization of the overall space required by the optocoupler 200 and the resistor chip 240.

[0023] It should be emphasized that, through the above method, the optocoupler 200 of this application is formed as a voltage-controlled optocoupler, that is, the electrical signal input pin 251 of the optocoupler 200 can accept voltage signals to control and drive the light-emitting chip 210, thereby improving the convenience of the user in using the optocoupler 200.

[0024] Optionally, such as Figures 2-6 As shown, the optocoupler 200 includes an input lead frame 250, an electrical signal input pin 251 formed on the input lead frame 250, and includes an input positive pin 2511 and an input negative pin 2512.

[0025] The input lead frame 250 includes a resistor chip base island 252 and a light-emitting chip base island 253. The resistor chip base island 252 and the light-emitting chip base island 253 are disposed within the package 230 and are insulated from each other. The resistor chip 240 is disposed on the resistor chip base island 252, and the light-emitting chip 210 is disposed on the light-emitting chip base island 253.

[0026] The resistor chip base island 252 and the light-emitting chip base island 253 are electrically connected via bonding wire 201. One of the input positive terminal pin 2511 and the input negative terminal pin 2512 is designated as the first pin 21, and the other as the second pin 22. The first pin 21 is electrically connected to the resistor chip base island 252, and the second pin 22 is electrically connected to the light-emitting chip base island 253.

[0027] In the above manner, the resistor chip 240 and the light-emitting chip 210 are separately disposed on different base islands, that is, the resistor chip 240 is disposed on the resistor chip base island 252 and the light-emitting chip 210 is disposed on the light-emitting chip base island 253, so that the resistor chip 240 and the light-emitting chip 210 are separated. This can avoid or reduce the blocking or absorption of light emitted from the light-emitting chip 210 to the photosensitive chip 220 by the resistor chip 240, thereby enabling the light emitted from the light-emitting chip 210 to reach the photosensitive chip 220 as much as possible, so that the photosensitive chip 220 receives the light signal transmitted by the light-emitting chip 210, generates a corresponding electrical signal, and outputs it through the electrical signal output pin 261.

[0028] Optionally, such as Figures 2-6 As shown, the first pin 21 is integrally formed with the resistor chip base island 252, and the second pin 22 is integrally formed with the light-emitting chip base island 253.

[0029] In this way, the heat from the resistor chip 240 can be transferred to the outside of the package 230 in a timely manner through the resistor chip base island 252 and the first pin 21, thus improving the heat dissipation effect of the resistor chip 240. Similarly, the heat from the light-emitting chip 210 can be transferred to the outside of the package 230 in a timely manner through the light-emitting chip base island 253 and the second pin 22, thus improving the heat dissipation effect of the light-emitting chip 210.

[0030] Optionally, such as Figures 2-6 As shown, the resistor chip base island 252 and the light-emitting chip base island 253 are arranged on the same layer and spaced apart from each other to form an insulating gap 254. In this way, the resistor chip base island 252 and the light-emitting chip base island 253 can be insulated and separated by the insulating gap 254, but it is not limited to this.

[0031] Optionally, such as Figures 2-6 As shown, the first pin 21 and the second pin 22 are arranged at a distance from each other. The resistor chip base island 252 and the light-emitting chip base island 253 are disposed between the first pin 21 and the second pin 22.

[0032] The first direction W1 is defined by the relative spacing between the first pin 21 and the second pin 22, and the second direction L1 is defined by a direction perpendicular to the first direction W1 and parallel to the resistor chip base island 252 and the light-emitting chip base island 253. The resistor chip base island 252 and the light-emitting chip base island 253 are arranged at a relative interval along the second direction L1.

[0033] In this manner, the resistor chip base island 252 and the light-emitting chip base island 253 are arranged along the second direction L1 between the first pin 21 and the second pin 22 extending along the second direction L1, and the resistor chip base island 252 and the light-emitting chip base island 253 are arranged at intervals relative to each other along the second direction L1. That is, the first pin 21, the resistor chip base island 252, the second pin 22, and the light-emitting chip base island 253 can be arranged in three adjacent columns, with the first pin 21 in one column, the resistor chip base island 252 and the light-emitting chip base island 253 in another column, and the second pin 22 in yet another column. This compact arrangement of the first pin 21, the resistor chip base island 252, the light-emitting chip base island 253, and the second pin 22 facilitates miniaturization.

[0034] Optionally, such as Figures 2-6 As shown, the optocoupler 200 includes an output lead frame 260, an electrical signal output pin 261 formed on the output lead frame 260, and includes an output positive pin 2611 and an output negative pin 2612.

[0035] The output lead frame 260 includes a photosensitive chip island 262, which is disposed within the package 230. A photosensitive chip 220 is disposed within the photosensitive chip island 262. One of the output positive pin 2611 and the output negative pin 2612 is designated as a third pin 23, and the other as a fourth pin 24. The third pin 23 is integrally formed with the photosensitive chip island 262, while the fourth pin 24 is insulated from the photosensitive chip island 262 and electrically connected to the photosensitive chip 220 via a bonding wire 201.

[0036] In the above manner, the heat of the photosensitive chip 220 can be transferred to the outside of the package 230 in a timely manner through the photosensitive chip base island 262 and the third pin 23, so as to dissipate heat in a timely manner and improve the heat dissipation effect of the photosensitive chip 220.

[0037] Optionally, such as Figures 2-6 As shown, the relative spacing between the third pin 23 and the fourth pin 24 is set. The direction of the relative spacing between the third pin 23 and the fourth pin 24 is defined as the third direction W2, and the direction perpendicular to the third direction W2 and parallel to the photosensitive chip base island 262 is defined as the fourth direction L2.

[0038] In this arrangement, the photosensitive chip base island 262 and the third pin 23 are arranged along the fourth direction L2, and the projections of the photosensitive chip base island 262 and the fourth pin 24 along the fourth direction L2 at least partially overlap.

[0039] The above method can further improve the compactness between the photosensitive chip base island 262, the third pin 23 and the fourth pin 24, and further realize the miniaturization of the optocoupler 200.

[0040] Optionally, such as Figures 2-6 As shown, the planes extending along the first direction W1 and the second direction L1 are parallel to the planes extending along the third direction W2 and the fourth direction L2. For example, the first direction W1, the second direction L1, the third direction W2, and the fourth direction L2 are all perpendicular to the thickness direction H of the package 230, but are not limited thereto.

[0041] Optionally, such as Figures 2-6 As shown, the package 230 includes a light-transmitting inner package 231 and a light-blocking outer package 232. The area between the light-emitting chip 210 and the photosensitive chip 220 is disposed within the light-transmitting inner package 231, and the light-transmitting inner package 231, the light-emitting chip base island 253, the resistor chip base island 252, and the photosensitive chip base island 262 are disposed within the light-blocking outer package 232.

[0042] Optionally, such as Figures 2-6 As shown, both the translucent inner sealant and the light-blocking outer sealant can be made of epoxy resin, but are not limited to it. The light-blocking outer sealant may contain a black substance to form an opaque state, but is not limited to it.

[0043] Optionally, such as Figures 2-6 As shown, the light-emitting chip 210, photosensitive chip 220, and resistor chip 240 can all be vertical structures. One end of the light-emitting chip 210 not connected to the bonding wire 201 can be fixed to and electrically connected to the light-emitting chip base island 253 using corresponding conductive silver paste 202, but this is not limited to this. One end of the photosensitive chip 220 not connected to the bonding wire 201 can be fixed to and electrically connected to the photosensitive chip base island 262 using corresponding conductive silver paste 202, but this is not limited to this. One end of the resistor chip 240 not connected to the bonding wire 201 can be fixed to and electrically connected to the resistor chip base island 252 using corresponding conductive silver paste 202, but this is not limited to this.

[0044] Optionally, such as Figures 2-6 As shown, the light-emitting chip 210 can be, but is not limited to, an LED chip, such as an infrared chip. The photosensitive chip 220 can be, but is not limited to, a phototransistor or a photodiode.

[0045] like Figure 3 As shown, this application also provides an input terminal assembly structure 300 for an optocoupler 200, which includes a resistor chip 240, a light-emitting chip 210, and an input terminal lead frame 250.

[0046] The input lead frame 250 includes a resistor chip base island 252, a light-emitting chip base island 253, and an electrical signal input pin 251. The resistor chip 240 is disposed on the resistor chip base island 252, and the light-emitting chip 210 is disposed on the light-emitting chip base island 253.

[0047] The electrical signal input pin 251 includes a positive input pin 2511 and a negative input pin 2512; one of the positive input pin 2511 and the negative input pin 2512 is designated as a first pin 21, and the other as a second pin 22. The first pin 21 is electrically connected to the resistor chip base island 252, and the second pin 22 is electrically connected to the light-emitting chip base island 253. The resistor chip 240 and the light-emitting chip 210 are connected in series between the positive input pin 2511 and the negative input pin 2512.

[0048] like Figures 2-6 As shown, the resistor chip 240, the light-emitting chip 210, and the input lead frame 250 in the input terminal combination structure 300 can be described in the corresponding structure of the optocoupler 200, and will not be repeated here.

[0049] The above are merely embodiments of this application and do not limit the scope of this patent application. Any equivalent structural or procedural changes made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the scope of patent protection of this application.

Claims

1. An opto-coupler, characterized by, The optocoupler includes a package, a resistor chip, a light-emitting chip, a photosensitive chip, an electrical signal input pin, and an electrical signal output pin. The resistor chip, the light-emitting chip, and the photosensitive chip are disposed within the package; the resistor chip and the light-emitting chip are connected in series with the electrical signal input pin; and the photosensitive chip is connected in series with the electrical signal output pin.

2. The opto-coupler of claim 1, wherein, The optocoupler includes an input lead frame, and the electrical signal input pin is formed on the input lead frame, including a positive input pin and a negative input pin. The input lead frame includes a resistor chip base island and a light-emitting chip base island; the resistor chip base island and the light-emitting chip base island are disposed within the package and are insulated from each other, the resistor chip is disposed on the resistor chip base island, and the light-emitting chip is disposed on the light-emitting chip base island; The resistor chip base island and the light-emitting chip base island are electrically connected by bonding wires; one of the positive input terminal pin and the negative input terminal pin is a first pin, and the other is a second pin; the first pin is electrically connected to the resistor chip base island, and the second pin is electrically connected to the light-emitting chip base island.

3. The opto-coupler of claim 2, wherein, The first pin is integrally formed with the resistor chip base island, and the second pin is integrally formed with the light-emitting chip base island.

4. The opto-coupler of claim 3, wherein, The resistor chip base island and the light-emitting chip base island are arranged in the same layer and are spaced apart from each other to form an insulating gap.

5. The opto-coupler of claim 4, wherein, The first pin and the second pin are arranged at a distance from each other; the resistor chip base island and the light-emitting chip base island are arranged between the first pin and the second pin; The first direction is defined by the relative spacing between the first pin and the second pin, and the second direction is defined by a direction perpendicular to the first direction and parallel to the resistor chip base island and the light-emitting chip base island; the resistor chip base island and the light-emitting chip base island are arranged at relative intervals along the second direction.

6. The optoelectrical coupler according to claim 1, characterized in that The optocoupler includes an output lead frame, and the electrical signal output pins are formed on the output lead frame, including a positive output pin and a negative output pin. The output lead frame includes a photosensitive chip base island, which is disposed within the package body, and the photosensitive chip is disposed on the photosensitive chip base island. One of the positive output pin and the negative output pin is a third pin, and the other is a fourth pin. The third pin is integrally formed with the photosensitive chip base island, and the fourth pin is insulated from the photosensitive chip base island and electrically connected to the photosensitive chip via bonding wires.

7. The optoelectrical coupler according to claim 6, characterized in that The relative spacing between the third pin and the fourth pin is set; the direction of the relative spacing between the third pin and the fourth pin is taken as the third direction, and the direction perpendicular to the third direction and parallel to the photosensitive chip base island is taken as the fourth direction; Wherein, the photosensitive chip base island and the third pin are arranged along the fourth direction, and the projections of the photosensitive chip base island and the fourth pin along the fourth direction at least partially overlap.

8. An input terminal assembly for a photocoupler, comprising: The input terminal assembly structure includes a resistor chip, a light-emitting chip, and an input terminal lead frame; The input lead frame includes a resistor chip base island, a light-emitting chip base island, and electrical signal input pins; the resistor chip is disposed on the resistor chip base island, and the light-emitting chip is disposed on the light-emitting chip base island; The electrical signal input pins include a positive input pin and a negative input pin; one of the positive input pin and the negative input pin is a first pin, and the other is a second pin; the first pin is electrically connected to the base island of the resistor chip, and the second pin is electrically connected to the base island of the light-emitting chip; the resistor chip and the light-emitting chip are connected in series between the positive input pin and the negative input pin.

9. The input combination structure according to claim 8, wherein The first pin is integrally formed with the resistor chip base island, and the second pin is integrally formed with the light-emitting chip base island.

10. The input combination structure according to claim 9, wherein The resistor chip base island and the light-emitting chip base island are arranged on the same layer and spaced apart from each other to form an insulating gap; the first pin and the second pin are spaced apart from each other; the resistor chip base island and the light-emitting chip base island are disposed between the first pin and the second pin; The first direction is defined by the relative spacing between the first pin and the second pin, and the second direction is defined by a direction perpendicular to the first direction and parallel to the resistor chip base island and the light-emitting chip base island; the resistor chip base island and the light-emitting chip base island are arranged at relative intervals along the second direction.

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