Silicon wafer passivation mechanism and silicon wafer production equipment

Abstract

This utility model relates to the field of silicon wafer manufacturing equipment technology, and discloses a silicon wafer passivation mechanism and a silicon wafer production apparatus. The silicon wafer passivation mechanism includes a frame, a first adsorption component, a second adsorption component, a first driving module, a passivation module, and a second driving module. The first adsorption component and the second adsorption component are respectively used to adsorb a first silicon wafer and a second silicon wafer. The first driving module is connected to the frame and can drive the first adsorption component and the second adsorption component to move away from each other along a first direction. The second driving module can drive the passivation module to move between the first silicon wafer and the second silicon wafer. The first driving module can also drive the first adsorption component and the second adsorption component to move closer to each other, so that the opposite end faces of the first silicon wafer and the second silicon wafer respectively contact the passivation module to adhere the passivation liquid. This silicon wafer passivation mechanism can automatically complete the passivation of the cut end faces of the first and second silicon wafers formed by cutting, which not only has high production efficiency but also stable silicon wafer passivation quality.

Description

Technical Field

[0001] This utility model relates to the field of silicon wafer manufacturing equipment technology, and in particular to a silicon wafer passivation mechanism and a silicon wafer production device. Background Technology

[0002] Photovoltaic power generation is a technology that directly converts solar energy into electrical energy using solar cells based on the photovoltaic effect. Silicon wafers are an important component of solar cells. Typically, the silicon wafers used in photovoltaic power generation are approximately square in shape. However, with technological advancements, half-wafer silicon wafer technology has become more advantageous in some technological approaches. Therefore, it is necessary to cut the square silicon wafer into two rectangular halves.

[0003] To ensure the subsequent performance of the half-piece, a passivation material needs to be applied to the end face formed by cutting the half-piece. Currently, the passivation material application for the half-piece requires manual operation, which is not only inefficient but also results in inconsistent coating quality.

[0004] Therefore, there is an urgent need for a silicon wafer passivation mechanism to solve the above-mentioned technical problems. Utility Model Content

[0005] One objective of this invention is to provide a silicon wafer passivation mechanism that can automatically passivate the cut ends of the first and second silicon wafers formed by cutting, which not only has high production efficiency but also provides stable silicon wafer passivation quality.

[0006] To achieve this objective, the present invention adopts the following technical solution:

[0007] A silicon wafer passivation mechanism includes a frame, a first adsorption component, a second adsorption component, a first driving module, a passivation module, and a second driving module. The first adsorption component and the second adsorption component are arranged along a first direction and are used to adsorb a first silicon wafer and a second silicon wafer, respectively. The first driving module is connected to the frame and can drive the first adsorption component and the second adsorption component to move away from each other along the first direction. The second driving module can drive the passivation module to move between the first silicon wafer and the second silicon wafer. The first driving module can also drive the first adsorption component and the second adsorption component to move closer to each other so that the opposite end faces of the first silicon wafer and the second silicon wafer respectively contact the passivation module to adhere passivation liquid.

[0008] As an optional solution, the passivation module includes:

[0009] A retaining component, wherein the retaining component is connected to the output terminal of the second driving module;

[0010] A porous flexible element is connected to the retaining assembly. The porous flexible element is used to wet a passivation solution. The opposing end faces of the first silicon wafer and the second silicon wafer can respectively contact and press the porous flexible element to adhere the passivation solution.

[0011] As an alternative, the retaining component is provided with a limiting groove, and the porous flexible element is installed in the limiting groove. The limiting groove is open at both ends along the first direction so that the opposite end faces of the first silicon wafer and the second silicon wafer can contact the porous flexible element.

[0012] As an optional solution, the retaining component is provided with a liquid supply channel, which has an inlet port and an outlet port. The inlet port is configured to communicate with the passivation liquid supply mechanism, and the outlet port is opposite to the porous flexible component.

[0013] As an optional solution, the first driving module can also drive the first adsorption component or the second adsorption component to rotate so that the orientation of the first silicon wafer and the orientation of the second silicon wafer are consistent.

[0014] As an optional solution, the first driver module includes:

[0015] A first driving component is connected to the frame, and a first adsorption component is connected to the output end of the first driving component. The first driving component is used to drive the first adsorption component to move along the first direction.

[0016] A second driving component and a third driving component are provided. The second driving component is connected to the frame, and the third driving component is connected to the output end of the second driving component. The second adsorption component is connected to the output end of the third driving component. The second driving component can drive the third driving component and the second adsorption component to move along the first direction. The third driving component can drive the second adsorption component and the second silicon wafer to rotate around an axis perpendicular to the plane where the second silicon wafer is located.

[0017] As an alternative, the first adsorption component can adsorb at least two of the first silicon wafers that are spaced apart along the second direction;

[0018] The silicon wafer passivation mechanism includes at least two second adsorption components spaced apart along the second direction, each of the second adsorption components being rotatable about an axis.

[0019] As an alternative, the second driving module can drive the passivation module to move along a third direction to be positioned between the first silicon wafer and the second silicon wafer, wherein the third direction is the thickness direction of the first silicon wafer.

[0020] As an optional solution, the silicon wafer passivation mechanism further includes a second guide assembly, which is mounted on the rack and extends along the third direction, and the passivation module slides with the rack through the second guide assembly.

[0021] Another objective of this invention is to provide a silicon wafer production apparatus that, by employing the aforementioned silicon wafer passivation mechanism, enables online passivation of the silicon wafer cutting end face, resulting in high production efficiency and stable silicon wafer passivation quality.

[0022] To achieve this objective, the present invention adopts the following technical solution:

[0023] A silicon wafer production apparatus includes a conveying mechanism, a lifting drive mechanism, and a silicon wafer passivation mechanism. The conveying mechanism is used to convey the first silicon wafer and the second silicon wafer. The lifting drive mechanism is used to drive the silicon wafer passivation mechanism to move up and down to pick up the first silicon wafer and the second silicon wafer from the conveying mechanism and to place the passivated first silicon wafer and the second silicon wafer on the conveying mechanism.

[0024] The beneficial effects of this utility model are:

[0025] This invention relates to a silicon wafer passivation mechanism, comprising a frame, a first adsorption component, a second adsorption component, a first driving module, a passivation module, and a second driving module. In actual operation, the first and second adsorption components are arranged along a first direction to adsorb a first silicon wafer and a second silicon wafer, respectively, formed by cutting a single silicon wafer. The opposing end faces of the first and second silicon wafers are the surfaces to be passivated. Next, the first driving module drives the first and second adsorption components to move away from each other along the first direction, creating sufficient space between the opposing end faces of the first and second silicon wafers. Then, the second driving module drives the passivation module to move between the first and second silicon wafers. Finally, the first driving module drives the first and second adsorption components to move closer together along the first direction, so that the opposing end faces of the first and second silicon wafers contact the passivation module to adhere the passivation liquid. This silicon wafer passivation mechanism can automatically coat the cut surfaces of two silicon wafers with passivation liquid, resulting in high production efficiency and stable and reliable coating quality.

[0026] The silicon wafer production apparatus of this invention, by adopting the above-mentioned silicon wafer passivation mechanism, can complete the passivation of the silicon wafer cutting end face online, with high productivity and stable silicon wafer passivation quality. Attached Figure Description

[0027] Figure 1 This is a schematic diagram of the silicon wafer edge passivation mechanism provided in a specific embodiment of the present invention from a first-view perspective;

[0028] Figure 2This is a schematic diagram of the silicon wafer edge passivation mechanism provided in a specific embodiment of the present invention from a second perspective.

[0029] Figure 3 This is a schematic diagram of the silicon wafer edge passivation mechanism provided in a specific embodiment of the present invention from a third-person perspective.

[0030] Figure 4 This is a schematic diagram of the silicon wafer edge passivation mechanism provided in a specific embodiment of the present invention from a fourth-view perspective;

[0031] Figure 5 This is a cross-sectional view of the passivation module provided in a specific embodiment of this utility model.

[0032] In the picture:

[0033] 10. Frame; 11. Horizontal plate; 111. First clearance hole; 112. Second clearance hole; 113. Third clearance hole; 12. Vertical plate; 13. Reinforcing plate; 14. Support assembly;

[0034] 20. First adsorption component; 21. First support plate; 22. First suction nozzle;

[0035] 30. Second adsorption component; 31. Second support plate; 32. Second suction nozzle;

[0036] 40. Passivation module; 41. Holding assembly; 411. First holding member; 412. Second holding member; 413. Limiting groove; 414. Liquid supply channel; 4141. Liquid inlet port; 4142. Liquid outlet port; 4143. Main channel; 4144. Branch channel; 42. Porous flexible component; 43. Connector;

[0037] 50. First drive module; 51. First drive assembly; 511. First drive source; 512. First lead screw and nut assembly; 52. Second drive assembly; 521. Second drive source; 522. Second lead screw and nut assembly; 523. Second pulley assembly; 53. Third drive assembly; 531. Third drive source; 532. Third pulley assembly; 54. Mounting plate;

[0038] 60. Second drive module; 61. Fourth drive source; 62. Fourth transmission assembly; 621. Fourth pulley assembly; 622. Fourth lead screw and nut assembly;

[0039] 71. First guide assembly; 711. First guide rail; 712. First slider; 72. Second guide assembly; 721. Second guide rail; 722. Second slider;

[0040] 100, First silicon wafer; 200, Second silicon wafer. Detailed Implementation

[0041] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for illustrative purposes only and are not intended to limit the scope of the invention. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, and not the entire structure.

[0042] In the description of this utility model, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0043] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0044] In the description of this embodiment, the terms "upper," "lower," "right," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first" and "second" are only used for distinction in description and have no special meaning.

[0045] This embodiment provides a silicon wafer passivation mechanism and a silicon wafer production apparatus. In this embodiment, the passivation of the cut end faces of two halves formed by cutting a single silicon wafer is described in detail. In this embodiment, the two halves are defined as a first silicon wafer and a second silicon wafer.

[0046] like Figure 1As shown, the silicon wafer production apparatus includes a conveying mechanism, a silicon wafer passivation mechanism, and a lifting drive mechanism. The conveying mechanism continuously conveys a first silicon wafer 100 and a second silicon wafer 200 formed by cutting a single silicon wafer. In this embodiment, the conveying mechanism can be a belt conveyor or other existing structures capable of conveying silicon wafers. The silicon wafer passivation mechanism is positioned above the conveying mechanism. The output end of the lifting drive mechanism is connected to the silicon wafer passivation mechanism, which drives the silicon wafer passivation mechanism to move up and down, thereby picking up the first silicon wafer 100 and the second silicon wafer 200 to be passivated from the conveying mechanism. After the silicon wafer passivation mechanism passivates the cut end faces of the first silicon wafer 100 and the second silicon wafer 200, the lifting drive mechanism drives the silicon wafer passivation mechanism to move downwards, facilitating the repositioning of the passivated first silicon wafer 100 and the second silicon wafer 200 onto the conveying mechanism for further conveying. Optionally, the lifting drive mechanism can be an existing linear module or a drive mechanism including a motor and a lead screw and nut transmission assembly; no specific limitations are imposed here. The silicon wafer production apparatus of this embodiment can realize the online passivation process of the cut end face of the silicon wafer after cutting. It not only has high production efficiency, but also has a compact overall structure with the silicon wafer passivation mechanism set on the silicon wafer conveying path.

[0047] like Figure 1 As shown, since the first silicon wafer 100 and the second silicon wafer 200 are formed by cutting the same silicon wafer, the end faces of the first silicon wafer 100 and the second silicon wafer 200 facing each other on the conveying mechanism are the cut surfaces, i.e., the surfaces that need to be passivated. The edges of the first silicon wafer 100 and the second silicon wafer 200 away from each other are chamfered. Therefore, the first silicon wafer 100 and the second silicon wafer 200 have different orientations before reaching the silicon wafer passivation mechanism. In this embodiment, the first direction, the second direction, and the third direction are defined as three mutually perpendicular directions in space, where the first direction and the second direction are both horizontal, and the third direction is vertical. The first silicon wafer 100 and the second silicon wafer 200 are both placed horizontally on the conveying mechanism.

[0048] like Figure 1 and Figure 2As shown, the silicon wafer passivation mechanism includes a frame 10, a first adsorption component 20, a second adsorption component 30, a first drive module 50, a passivation module 40, and a second drive module 60. The frame 10 is connected to the output end of a lifting drive mechanism. The first drive module 50 is mounted on the frame 10, and both the first adsorption component 20 and the second adsorption component 30 are connected to the output end of the first drive module 50. The first adsorption component 20 and the second adsorption component 30 are arranged along a first direction and are used to adsorb the first silicon wafer 100 and the second silicon wafer 200, respectively. The first drive module 50 can drive the first adsorption component 20 and the second adsorption component 30 to move away from each other along the first direction, so that a gap is formed between the first silicon wafer 100 and the second silicon wafer 200. The second drive module 60 is also mounted on the frame 10, and the passivation module 40 is connected to the output end of the second drive module 60. The second drive module 60 can drive the passivation module 40 to move between the first silicon wafer 100 and the second silicon wafer 200. The first driving module 50 can also drive the first adsorption component 20 and the second adsorption component 30 to move closer to each other along a first direction, so that the end faces of the first silicon wafer 100 and the second silicon wafer 200 facing each other respectively come into contact with the passivation module 40 to be coated with passivation liquid. It is understood that the passivation liquid is an existing liquid, and those skilled in the art can select passivation liquids with different compositions according to the required passivation effect.

[0049] In actual operation, the silicon wafer passivation mechanism moves downwards, causing the first adsorption component 20 and the second adsorption component 30 to adsorb the first silicon wafer 100 and the second silicon wafer 200 on the conveying mechanism, respectively. Then, the first drive module 50 drives the first adsorption component 20 and the second adsorption component 30 to move away from each other along a first direction, creating a sufficiently large gap between the opposing end faces of the first silicon wafer 100 and the second silicon wafer 200. Next, the second drive module 60 drives the passivation module 40 to move between the first silicon wafer 100 and the second silicon wafer 200. Then, the first drive module 50 drives the first adsorption component 20 and the second adsorption component 30 to move closer together along the first direction, so that the opposing end faces of the first silicon wafer 100 and the second silicon wafer 200 contact the passivation module 40 to adhere the passivation liquid. This embodiment of the silicon wafer passivation mechanism can automatically coat the cut surfaces of the two silicon wafers after cutting with passivation liquid, resulting in high production efficiency and stable and reliable coating quality. By employing the aforementioned silicon wafer passivation mechanism, the silicon wafer production equipment can complete the passivation of the silicon wafer cutting end face online, resulting in high productivity and stable silicon wafer passivation quality.

[0050] like Figure 1As shown, the frame 10 includes a vertical plate 12 and a horizontal plate 11. The vertical plate 12 is connected to the output end of the lifting drive mechanism, and the horizontal plate 11 is connected to the lower end of the vertical plate 12. The horizontal plate 11 provides mounting positions for at least a portion of the first drive module 50 and at least a portion of the second drive module 60. A first adsorption assembly 20 and a second adsorption assembly 30 are disposed on the lower side of the horizontal plate 11 to facilitate the adsorption of the first silicon wafer 100 and the second silicon wafer 200 onto the conveying mechanism. A passivation module 40 is at least partially located on the lower side of the horizontal plate 11 to allow it to extend between the first silicon wafer 100 and the second silicon wafer 200. Figure 1 As shown, the frame 10 also includes a reinforcing plate 13, which is connected to the upper side of the horizontal plate 11 and to the vertical plate 12. In this embodiment, two reinforcing plates 13 are provided and are arranged opposite to each other along the first direction. On the one hand, the horizontal plate 11, the vertical plate 12, and the reinforcing plate 13 cooperate to form a solid support structure; on the other hand, a certain accommodating space is formed between the two reinforcing plates 13, which can accommodate at least part of the first driving module 50 and at least part of the second driving module 60. This not only provides protection for the first driving module 50 and the second driving module 60, but also makes the entire silicon wafer edge passivation mechanism structure more compact.

[0051] In this embodiment, as Figure 1 and Figure 2 As shown, the first adsorption assembly 20 includes a first support plate 21 and a plurality of first suction nozzles 22. The first support plate 21 is connected to the output end of the first drive module 50. The plurality of first suction nozzles 22 are mounted on the first support plate 21 and are used to communicate with an air source to adsorb the first silicon wafer 100. The second adsorption assembly 30 includes a second support plate 31 and a plurality of second suction nozzles 32. The second support plate 31 is connected to the output end of the first drive module 50. The plurality of second suction nozzles 32 are all mounted on the second support plate 31 and are used to communicate with an air source to adsorb the second silicon wafer 200.

[0052] Based on the production requirements of the downstream operating mechanism of the silicon wafer passivation mechanism, it is necessary to maintain the same posture for the first silicon wafer 100 and the second silicon wafer 200. Specifically, maintaining the same posture means that the end face of the first silicon wafer 100 with the passivation liquid adhered to it and the end face of the second silicon wafer 200 with the passivation liquid adhered to it face the same direction. In this embodiment, rotating the first silicon wafer 100 or the second silicon wafer 200 180° around the vertical axis will make their postures consistent. In related technologies, manual adjustment is performed when the silicon wafer is transported by the conveying mechanism, which consumes manpower.

[0053] like Figure 2 and Figure 3As shown, the first driving module 50 can also drive the first adsorption component 20 or the second adsorption component 30 to rotate, so that the orientation of the first silicon wafer 100 and the second silicon wafer 200 are consistent. In the actual production process, after the first driving module 50 drives the first adsorption component 20 and the second adsorption component 30 to move closer to each other and make the first silicon wafer 100 and the second silicon wafer 200 adhere to the passivation liquid, the first driving module 50 then drives the first adsorption component 20 and the second adsorption component 30 to move away from each other along the first direction; then the second driving module 60 drives the passivation module 40 to move away from the first silicon wafer 100 and the second silicon wafer 200; then the first driving module 50 drives the first adsorption component 20 to rotate 180° or drives the second adsorption component 30 to rotate 180°, so that the orientation of the first silicon wafer 100 and the second silicon wafer 200 is consistent.

[0054] In this embodiment, the example given is that the first driving module 50 can drive the second adsorption component 30 to rotate. Figure 2 and Figure 3 As shown, the first driving module 50 includes a first driving component 51, a second driving component 52, and a third driving component 53. The first driving component 51 is connected to the frame 10, and the first adsorption component 20 is connected to the output end of the first driving component 51. The first driving component 51 drives the first adsorption component 20 to move along a first direction. The second driving component 52 is connected to the frame 10, and the third driving component 53 is connected to the output end of the second driving component 52. The second adsorption component 30 is connected to the output end of the third driving component 53. The second driving component 52 can drive the third driving component 53 and the second adsorption component 30 to move along the first direction. The third driving component 53 can drive the second driving component 52 and the second silicon wafer 200 it adsorbs to rotate around an axis perpendicular to the plane containing the second silicon wafer 200. Through the cooperation of the first driving component 51, the second driving component 52, and the third driving component 53, the movement of the first adsorption component 20 along the first direction, the movement of the second adsorption component 30 along the first direction, and the rotation of the second adsorption component 30 can be achieved, thereby realizing the application of the passivation liquid and rotating the orientation of the second silicon wafer 200 adsorbed by the second adsorption component 30 to be the same as the orientation of the first silicon wafer 100 adsorbed by the first adsorption component 20. In this embodiment, the first driving module 50 further includes a mounting plate 54, which is connected to the output end of the second driving component 52. The third driving component 53 is mounted on the mounting plate 54 and is driven by the second driving component 52.

[0055] like Figure 2As shown, the first drive assembly 51 includes a first drive source 511 and a first lead screw and nut assembly 512. The first drive source 511 is mounted on the upper side of the horizontal plate 11. The lead screw of the first lead screw and nut assembly 512 extends along a first direction and is rotatably supported on the upper side of the horizontal plate 11. The nut of the first lead screw and nut assembly 512 passes through a first clearance hole 111 on the horizontal plate 11 and connects to the first adsorption assembly 20 located on the lower side of the horizontal plate 11. The cooperation between the first drive source 511 and the first lead screw and nut assembly 512 makes the movement of the first adsorption assembly 20 along the first direction smooth and precise. It is understood that in other embodiments, the first drive assembly 51 can also be a cylinder or other structures capable of outputting linear motion, and no specific limitation is made here.

[0056] like Figure 2 and Figure 3 As shown, the second drive assembly 52 includes a second drive source 521, a second pulley assembly 523, and a second lead screw and nut assembly 522. The second drive source 521 is a motor. The lead screw of the second lead screw and nut assembly 522 extends along a first direction and is rotatably supported on the upper side of the horizontal plate 11. The nut of the second lead screw and nut assembly 522 passes through a second clearance hole 112 on the horizontal plate 11 and connects to a mounting plate 54 located below the horizontal plate 11. The input pulley of the second pulley assembly 523 is connected to the output end of the second drive source 521, and the output pulley of the second pulley assembly 523 is connected to the lead screw of the second lead screw and nut assembly 522. When the second drive source 521 rotates, the second pulley assembly 523 drives the lead screw of the second lead screw and nut assembly 522 to rotate. The nut of the second lead screw and nut assembly 522 drives the mounting plate 54, the third drive assembly 53, and the second adsorption assembly 30 to move synchronously along the first direction, thereby realizing the reciprocating motion of the second silicon wafer 200 along the first direction. In this embodiment, by providing the second pulley assembly 523, the position of the rotation axis output by the second drive source 521 can be changed, allowing the second drive source 521 to be arranged to the side of the second lead screw and nut assembly 522, thereby improving the structural compactness of the silicon wafer passivation mechanism. In this embodiment, the second drive source 521 is mounted on the vertical plate 12.

[0057] like Figure 3 As shown, the third drive assembly 53 includes a third drive source 531 and a third pulley assembly 532. Both the third drive source 531 and the third pulley assembly 532 are mounted on the mounting plate 54. The third drive source 531 is a motor. The input pulley of the third pulley assembly 532 is connected to the output end of the third drive source 531, and the output pulley of the third pulley assembly 532 is connected to the second adsorption assembly 30. When the third drive source 531 rotates, the second pulley assembly 532 drives the second adsorption assembly 30 to rotate around its vertical axis.

[0058] In this embodiment, as Figure 3As shown, the first adsorption component 20 can adsorb at least two first silicon wafers 100 spaced apart along the second direction. The silicon wafer passivation mechanism includes at least two second adsorption components 30 spaced apart along the second direction, each of which can rotate around an axis. With this configuration, the silicon wafer passivation mechanism can simultaneously passivate at least two sets of first silicon wafers 100 and second silicon wafers 200, and rotate the orientation of each second silicon wafer 200 to match the orientation of the first silicon wafer 100, thereby further improving production efficiency. In this embodiment, the first adsorption component 20 can adsorb two first silicon wafers 100 spaced apart along the second direction. This can be achieved by increasing the number of first suction nozzles 22 of the first adsorption component 20. Correspondingly, the silicon wafer passivation mechanism has two second adsorption components 30. Optionally, in this embodiment, the third pulley assembly 532 includes two output pulleys, each output pulley connected to one second adsorption component 30. Thus, a third drive assembly 53 can drive the rotation of the two second adsorption components 30, reducing the manufacturing cost of the silicon wafer passivation mechanism. Of course, in other embodiments, multiple third driving components 53 may be provided, each third driving component 53 being used to drive a second adsorption component 30 to rotate.

[0059] like Figure 3 As shown, the silicon wafer passivation mechanism also includes a first guide component 71. The first guide component 71 is mounted on the frame 10 and extends along a first direction. The first adsorption component 20 and the second adsorption component 30 are both connected to the frame 10 through the first guide component 71, thereby improving the smoothness and accuracy of the movement of the first adsorption component 20 and the second adsorption component 30. In this embodiment, the first guide component 71 includes a first guide rail 711 and a first slider 712. The first guide rail 711 extends along the first direction and is mounted on the frame 10. The first adsorption component 20 is connected to the first slider 712 and slides with the first guide rail 711 through the first slider 712. The second adsorption component 30 is also connected to the first slider 712 and slides with the first guide rail 711 through the first slider 712. Of course, in other embodiments, the first adsorption component 20 and the second adsorption component 30 may also slide with the frame 10 through different guide components, which is not specifically limited here.

[0060] like Figure 1 and Figure 2As shown, the second driving module 60 can drive the passivation module 40 to move along a third direction to be located between the first silicon wafer 100 and the second silicon wafer 200. The third direction is the thickness direction of the first silicon wafer 100, which is also the thickness direction of the second silicon wafer 200. Specifically, in this embodiment, the second driving module 60 can drive the passivation module 40 to move up and down in the vertical direction. Since the first silicon wafer 100 and the second silicon wafer 200 are relatively small in the thickness direction, by setting the second driving module 60 to drive the passivation module 40 along the thickness direction of the silicon wafers, the movement stroke of the passivation module 40 can be shortened, thereby increasing the production cycle and improving the passivation efficiency, while ensuring that the passivation module 40 can be aligned and contacted with the opposite end faces of the first silicon wafer 100 and the second silicon wafer 200 respectively. Of course, in other embodiments, the second driving module 60 can also be set to drive the passivation module 40 to extend into the space between the first silicon wafer 100 and the second silicon wafer 200 along a second direction, which is not specifically limited here.

[0061] like Figure 2 As shown, in this embodiment, the frame 10 further includes a support assembly 14, which is mounted on the upper side of the horizontal plate 11. The second drive module 60 is connected to the support assembly 14. Specifically, the second drive module 60 is located on the upper side of the horizontal plate 11. A third clearance hole 113 is provided on the horizontal plate 11. A portion of the passivation module 40 extends from the third clearance hole 113 to the upper side of the horizontal plate 11 to facilitate connection with the output end of the second drive module 60. Specifically, as... Figure 1 and Figure 2 As shown, the second drive module 60 includes a fourth drive source 61 and a fourth transmission assembly 62, both of which are mounted on the support assembly 14. The input and output terminals of the fourth transmission assembly 62 are connected to the output terminal of the fourth drive source 61, and the output terminal of the fourth transmission assembly 62 is connected to the passivation module 40. Optionally, the fourth drive source 61 includes a motor, and the fourth transmission assembly 62 includes a fourth pulley assembly 621 and a fourth lead screw and nut assembly 622. The lead screw of the fourth lead screw and nut assembly 622 extends along a third direction and is rotatably supported on the support assembly 14. The nut of the fourth lead screw and nut assembly 622 is connected to the passivation module 40. The input pulley of the fourth pulley assembly 621 is connected to the output end of the fourth drive source 61, and the output pulley is connected to the lead screw of the fourth lead screw and nut assembly 622. When the fourth drive source 61 rotates, the fourth pulley assembly 621 transmits the rotation to the lead screw of the fourth lead screw and nut assembly 622, thereby causing the nut of the fourth lead screw and nut assembly 622 to drive the passivation module 40 to move up and down. By setting the fourth pulley assembly 621, the position of the rotation axis of the output of the fourth drive source 61 is changed, so that the fourth drive source 61 can be set to the side of the fourth lead screw and nut assembly 622, thereby making the overall structure of the silicon wafer passivation mechanism more compact.

[0062] like Figure 2 As shown, the silicon wafer passivation mechanism also includes a second guide component 72. The second guide component 72 is mounted on the frame 10 and extends along a third direction. The passivation module 40 is slidably engaged with the frame 10 via the second guide component 72. The second guide component 72 can guide the movement of the passivation module 40, ensuring its movement accuracy, and thus ensuring that the passivation end faces of the first silicon wafer 100 and the second silicon wafer 200 can accurately contact the passivation module 40 to adhere the passivation liquid. In this embodiment, the second guide component 72 includes a second guide rail 721 and a second slider 722. The second guide rail 721 is mounted on the support component 14 and extends along a third direction. The second slider 722 is slidably engaged with the second guide rail 721, and the passivation module 40 is connected to the second slider 722.

[0063] like Figure 2 , Figure 4 and Figure 5 As shown, the passivation module 40 includes a holding component 41 and a porous flexible component 42. The holding component 41 is connected to the output end of the second driving module 60, and the porous flexible component 42 is connected to the holding component 41. The porous flexible component 42 is used to wet the passivation liquid. When the first driving module 50 drives the first adsorption component 20 and the second adsorption component 30 to approach each other along a first direction, the opposing end faces of the first silicon wafer 100 and the second silicon wafer 200 can respectively contact and squeeze the porous flexible component 42. Under the action of the squeezing force, the passivation liquid in the porous flexible component 42 is drawn out of the porous flexible component 42 and adheres to the first silicon wafer 100 and the second silicon wafer 200. By setting the porous flexible component 42 to be wetted with passivation liquid, and coordinating the approaching action of the first adsorption component 20 and the second adsorption component 30, the passivation liquid coating of the two end faces to be passivated can be realized simultaneously. This not only has a simple structure and low cost, but also simple operation and high coating efficiency. Furthermore, it is understood that by controlling the movement stroke of the first adsorption component 20 and the second adsorption component 30 along the first direction, the amount of extrusion of the first silicon wafer 100 and the second silicon wafer 200 onto the porous flexible component 42 can be controlled, thereby controlling the amount of passivation liquid applied.

[0064] In this embodiment, the porous flexible element 42 can specifically be a sponge. It is understood that, in embodiments where the silicon wafer passivation mechanism has two or more second adsorption components 30, the porous flexible element 42 can also be arranged in two or more at intervals, with each porous flexible element 42 corresponding to a set of opposing first silicon wafers 100 and second silicon wafers 200, providing passivation fluid. For example... Figure 2 , Figure 4 and Figure 5 As shown, the passivation module 40 also includes a connector 43, one end of which is connected to the second slider 722, and the other end is provided with a third clearance hole 113 to extend to the underside of the horizontal plate 11 and is connected to the retaining component 41.

[0065] like Figure 4 and Figure 5 As shown, a limiting groove 413 is provided on the retaining component 41, and the porous flexible component 42 is installed in the limiting groove 413. The two ends of the limiting groove 413 are open along the first direction, so that the opposing end faces of the first silicon wafer 100 and the second silicon wafer 200 can contact the porous flexible component 42. The groove wall of the limiting groove 413 can fix the position and maintain the shape of the porous flexible component 42, thereby ensuring that the porous flexible component 42 is impregnated with an appropriate amount of passivation liquid before being squeezed.

[0066] In this embodiment, as Figure 4 As shown, a liquid supply channel 414 is provided within the retaining assembly 41. The liquid supply channel 414 has an inlet port 4141 and an outlet port 4142. The inlet port 4141 is configured to communicate with an external passivation liquid supply mechanism, and the outlet port 4142 is opposite to the porous flexible component 42. The passivation liquid supply mechanism injects passivation liquid into the liquid supply channel 414 through the inlet port 4141, and the passivation liquid flows into the porous flexible component 42 from the outlet port 4142. By providing a liquid supply channel 414 inside the retaining assembly 41, it is convenient to continuously replenish the passivation liquid into the porous flexible component 42, ensuring that the passivation liquid in the porous flexible component 42 is maintained within an appropriate range, thereby ensuring that the amount of passivation liquid applied each time is relatively uniform.

[0067] In this embodiment, as Figure 4 and Figure 5 As shown, the liquid supply channel 414 includes a main channel 4143 and multiple branch channels 4144. One end of the main channel 4143 forms a liquid inlet port 4141, and the multiple branch channels 4144 are all connected to the main channel 4143. One end of each branch channel 4144 forms a liquid outlet port 4142. In this embodiment, the arrangement of multiple liquid outlet ports 4142 can more evenly replenish the passivation liquid to the porous flexible component 42, thereby ensuring that the passivation liquid adhered to each position of the first silicon wafer 100 and the second silicon wafer 200 is uniform. In this embodiment, the multiple branch channels 4144 are evenly distributed along the second direction. The liquid outlet port 4142 is located on the top wall of the limiting groove 413, that is, on the top of the porous flexible component 42, so the passivation liquid can evenly wet the passivation liquid under the action of gravity.

[0068] like Figure 4 and Figure 5As shown, the retaining assembly 41 includes a first retaining member 411 and a second retaining member 412. The first retaining member 411 is connected to the connecting member 43, and the second retaining member 412 is installed on the lower side of the first retaining member 411. A liquid supply channel 414 is formed within the first retaining member 411. By configuring the retaining assembly 41 to consist of two retaining members, the processing of the liquid supply channel 414 is facilitated. In this embodiment, at least one of the first retaining member 411 and the second retaining member 412 has a groove on its side facing the other, and this groove extends through the first direction to naturally form a limiting groove 413 after the first retaining member 411 and the second retaining member 412 are connected.

[0069] Obviously, the above embodiments of this utility model are merely examples for clearly illustrating the present utility model, and are not intended to limit the implementation of the present utility model. For those skilled in the art, based on the concept of this utility model, there will be changes in the specific implementation methods and application scope. The content of this specification should not be construed as a limitation of this utility model. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the protection scope of the claims of this utility model.

Claims

1. A silicon wafer passivation mechanism, characterized in that, The assembly includes a frame (10), a first adsorption component (20), a second adsorption component (30), a first driving module (50), a passivation module (40), and a second driving module (60). The first adsorption component (20) and the second adsorption component (30) are arranged along a first direction and are used to adsorb a first silicon wafer (100) and a second silicon wafer (200), respectively. The first driving module (50) is connected to the frame (10) and can drive the first adsorption component (20) and the second adsorption component (30) to move away from each other along the first direction. The second driving module (60) can drive the passivation module (40) to move between the first silicon wafer (100) and the second silicon wafer (200). The first driving module (50) can also drive the first adsorption component (20) and the second adsorption component (30) to move closer to each other so that the opposite end faces of the first silicon wafer (100) and the second silicon wafer (200) respectively contact the passivation module (40) to adhere the passivation liquid.

2. The silicon wafer passivation mechanism as described in claim 1, characterized in that, The passivation module (40) includes: A retaining component (41) is connected to the output terminal of the second driving module (60); A porous flexible element (42) is connected to the retaining assembly (41). The porous flexible element (42) is used to wet a passivation liquid. The opposing end faces of the first silicon wafer (100) and the second silicon wafer (200) can respectively contact and squeeze the porous flexible element (42) to adhere the passivation liquid.

3. The silicon wafer passivation mechanism as described in claim 2, characterized in that, The retaining component (41) is provided with a limiting groove (413), and the porous flexible component (42) is installed in the limiting groove (413). The limiting groove (413) is open at both ends along the first direction so that the opposite end faces of the first silicon wafer (100) and the second silicon wafer (200) can contact the porous flexible component (42).

4. The silicon wafer passivation mechanism as described in claim 2, characterized in that, The retaining component (41) is provided with a liquid supply channel (414), which has an inlet port (4141) and an outlet port (4142). The inlet port (4141) is configured to communicate with the passivation liquid supply mechanism, and the outlet port (4142) is opposite to the porous flexible component (42).

5. The silicon wafer passivation mechanism as described in any one of claims 1-4, characterized in that, The first driving module (50) can also drive the first adsorption component (20) or the second adsorption component (30) to rotate so that the orientation of the first silicon wafer (100) and the orientation of the second silicon wafer (200) are consistent.

6. The silicon wafer passivation mechanism as described in claim 5, characterized in that, The first driving module (50) includes: The first driving component (51) is connected to the frame (10), and the first adsorption component (20) is connected to the output end of the first driving component (51). The first driving component (51) is used to drive the first adsorption component (20) to move along the first direction. The second drive assembly (52) and the third drive assembly (53) are connected to the frame (10), the third drive assembly (53) is connected to the output end of the second drive assembly (52), and the second adsorption assembly (30) is connected to the output end of the third drive assembly (53). The second drive assembly (52) can drive the third drive assembly (53) and the second adsorption assembly (30) to move along the first direction, and the third drive assembly (53) can drive the second adsorption assembly (30) and the second silicon wafer (200) to rotate around an axis perpendicular to the plane where the second silicon wafer (200) is located.

7. The silicon wafer passivation mechanism as described in claim 6, characterized in that, The first adsorption component (20) is capable of adsorbing at least two first silicon wafers (100) arranged at intervals along the second direction; The silicon wafer passivation mechanism includes at least two second adsorption components (30) spaced apart along the second direction, each of the second adsorption components (30) being rotatable about an axis.

8. The silicon wafer passivation mechanism according to any one of claims 1-4, characterized in that, The second driving module (60) can drive the passivation module (40) to move along a third direction to be located between the first silicon wafer (100) and the second silicon wafer (200), wherein the third direction is the thickness direction of the first silicon wafer (100).

9. The silicon wafer passivation mechanism as described in claim 8, characterized in that, The silicon wafer passivation mechanism further includes a second guide component (72), which is mounted on the frame (10) and extends along the third direction. The passivation module (40) is slidably engaged with the frame (10) through the second guide component (72).

10. A silicon wafer production apparatus, characterized in that, The device includes a conveying mechanism, a lifting drive mechanism, and a silicon wafer passivation mechanism as described in any one of claims 1-9. The conveying mechanism is used to convey the first silicon wafer (100) and the second silicon wafer (200), and the lifting drive mechanism is used to drive the silicon wafer passivation mechanism to move up and down to pick up the first silicon wafer (100) and the second silicon wafer (200) from the conveying mechanism, and to place the passivated first silicon wafer (100) and the second silicon wafer (200) on the conveying mechanism.

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