A lead frame shared by N terminal and P terminal of optocoupling light emitting chip

Abstract

This utility model relates to the field of optocoupler technology, specifically a lead frame for the shared N-terminal and P-terminal of an optocoupler light-emitting chip. By setting a first base island and a second base island at the ends of the first and second pins respectively, the N / P TOP light-emitting chip can freely choose which base island to solder. When installing a P TOP chip, its negative electrode can be directly soldered to the base island connected to the negative electrode pin, and the positive electrode is connected to the other base island via a wire. For an N TOP chip, its positive electrode is directly soldered to the base island connected to the positive electrode pin, and the negative electrode is connected to the other base island via a wire. This design allows the same frame to simultaneously meet the electrical connection requirements of both N and P light-emitting chips, eliminating the risk of mixing materials due to the frame's special nature. By producing a universal frame with a single set of molds, the mold development cost is directly reduced. This solves the problem that currently, there are two types of lead frames used to install N / P TOP light-emitting chips, resulting in high production costs and easy mixing.

Description

Technical Field

[0001] This utility model relates to the field of optocoupler technology, specifically a lead frame shared by the N and P terminals of an optocoupler light-emitting chip. Background Technology

[0002] Optocouplers are widely used devices in electronic circuits. They achieve isolated transmission of electrical signals through photoelectric conversion and play an important role in many fields such as industrial control, communication equipment, and power supply circuits. The N / P TOP LED chip is the core component of the optocoupler that converts electrical signals into optical signals, and its performance has a critical impact on the overall function of the optocoupler. The lead frame, as a bridge connecting the chip to the external circuit, not only undertakes the function of electrical connection but also provides mechanical support and protection for the chip. When mounting the N / P TOP LED chip onto the lead frame, the P TOP LED chip needs to be soldered to the base island of the pin connected to the negative terminal, while the N TOP LED chip needs to be mounted on the base island of the pin connected to the positive terminal.

[0003] Therefore, for the installation of existing N / P TOP light-emitting chips, two sets of molds need to be developed to produce lead frames corresponding to different light-emitting chips. Since the cost of a single set of stamping bracket molds on the existing market is high, opening two sets of stamping molds will undoubtedly increase the company's costs. Moreover, during the production process, N / P brackets are easily mixed up, resulting in product scrap and waste of resources. Utility Model Content

[0004] To address the shortcomings of existing technologies, this invention provides a lead frame that is shared by the N and P terminals of an optocoupler light-emitting chip, thus solving the problem that there are currently two types of lead frames used for mounting N / P TOP light-emitting chips, resulting in high production costs and easy mixing of different types.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a lead frame for the shared N-terminal and P-terminal of an optocoupler light-emitting chip, comprising two symmetrically arranged side rails, a plurality of parallel connecting ribs between the two side rails, and a plurality of sets of optocoupler pins on the connecting ribs. Each set of optocoupler pins includes a first pin, a second pin, and an NC pin arranged sequentially on the connecting rib. The ends of the first pin and the second pin are respectively provided with a first base island and a second base island. Both the N-terminal and P-terminal of the light-emitting chip can be disposed on the first base island and the second base island.

[0006] Preferably, a first dividing hole is provided between the first base island and the first pin.

[0007] Preferably, a second dividing hole is provided between the second base island and the second pin.

[0008] Preferably, an identification hole is provided at the end of the NC pin near the first base island and the second base island.

[0009] Preferably, the first pin and the first base island are arranged in an L-shape, and the first base island extends from the first pin toward the NC pin.

[0010] Preferably, positioning holes are provided on the first pin, the second pin, and the NC pin.

[0011] Compared with the prior art, this utility model provides a lead frame for both the N-terminus and P-terminus of an optocoupler light-emitting chip, which has the following advantages: 1. This utility model, by setting a first base island and a second base island at the ends of the first and second pins respectively, allows N / P TOP light-emitting chips to freely choose which base island to solder. When installing a P TOP chip, its negative electrode can be directly soldered to the base island connected to the negative electrode pin, and the positive electrode is connected to another base island through a wire. For an N TOP chip, its positive electrode is directly soldered to the base island connected to the positive electrode pin, and the negative electrode is connected to another base island through a wire. This design breaks through the polarity limitation of traditional lead frames, enabling the same frame to be compatible with the electrical connection requirements of both N and P light-emitting chips, eliminating the risk of material mixing caused by the special nature of the frame, and producing a universal frame with a single set of molds, directly reducing mold development costs by 50% and reducing production line changeover time by more than 30%, significantly improving production flexibility and resource utilization.

[0012] 2. By setting a first dividing hole between the first base island and the first pin, and a second dividing hole between the second base island and the second pin, precise positioning of the base island is achieved through physical isolation. The dividing holes are formed simultaneously during stamping, saving material and serving as optical alignment marks. This keeps the soldering position error within ±0.05mm, preventing electrical failures caused by chip misalignment. Simultaneously, an identification hole is added near the base island end of the NC pin. Its hollowed-out structure forms a physical barrier, significantly reducing the risk of mistakenly soldering the chip to the NC pin. These three holes work together to form a three-level error-proofing system, greatly improving production yield and reducing maintenance costs.

[0013] 3. By adopting an L-shaped topology layout of the first pin and the first base island, the base island extends towards the NC pin direction, transforming the traditional horizontal arrangement into a three-dimensional space optimization. This design shortens the chip wire span, reduces signal transmission loss, and enhances the base island's resistance to mechanical stress. Attached Figure Description

[0014] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings: Figure 1This is a schematic diagram of the lead frame shared by the N and P terminals of the optocoupler light-emitting chip of this utility model; Figure 2 This utility model Figure 1 Enlarged view of point A in the middle; Figure 3 This is a soldering diagram of the PTOP chip of this utility model; Figure 4 This is a soldering diagram of the N TOP chip of this utility model; Figure 5 This is a schematic diagram of the PTOP chip of this utility model; Figure 6 This is a schematic diagram of the N TOP chip of this utility model.

[0015] In the diagram: 1. Side rail; 2. Connecting rib; 3. Optocoupler pin; 31. First pin; 32. Second pin; 33. NC pin; 4. First base island; 5. Second base island; 6. First dividing hole; 7. Second dividing hole; 8. Identification hole; 9. Positioning hole. Detailed Implementation

[0016] The following will describe in detail the implementation of this application with reference to the accompanying drawings and embodiments, so that the implementation process of how this application uses technical means to solve technical problems and achieve technical effects can be fully understood and implemented accordingly.

[0017] To address the problem that current lead frames for mounting N / P TOP LED chips are of two types, resulting in high production costs and easy misuse, this invention provides a lead frame that is shared by both the N and P terminals of the optocoupler LED chip, such as... Figures 1-4 As shown, N / P TOP LED chips can share a single lead frame, significantly reducing mold and production costs. Several parallel connecting ribs 2 are arranged between two symmetrically positioned side rails 1. Each connecting rib 2 has several sets of optocoupler pins 3. Each set of optocoupler pins 3 includes a first pin 31, a second pin 32, and an NC pin 33 sequentially arranged on the connecting rib 2. One of the first pin 31 and the second pin 32 is connected to the positive terminal, and the other to the negative terminal, depending on the application requirements. The ends of the first pin 31 and the second pin 32 are respectively provided with a first base island 4 and a second base island 5 for bonding the LED chip. Both the N-terminus and P-terminus of the LED chip can be located on the first base island 4 and the second base island 5. That is, during installation, the LED chip can be installed on either the first base island 4 or the second base island 5 depending on whether it is an N-TOP or P-TOP LED chip. The specific installation method can be as follows: Figures 3-6 As shown, Figure 5 and Figure 6The diagram shows the structure of N-TOP and P-TOP LED chips. During soldering, the positive terminals of both N-TOP and P-TOP chips are still connected to the first base island 4 or the second base island 5, which is set as the positive terminal. The difference is that, taking the P-TOP chip as an example, the chip is soldered to the first base island 4 or the second base island 5, which is set as the negative terminal, and the positive terminal of the P-TOP chip is connected to the other base island through a wire. For the N-TOP chip, the chip is directly soldered to the first base island 4 or the second base island 5, which is set as the positive terminal, and the negative terminal of the N-TOP chip is connected to the first base island 4 or the second base island 5, which is set as the negative terminal, through a wire. Thus, this invention can realize the installation of both N-TOP and P-TOP chips with a single lead frame, requiring only one set of molds to produce the lead frame, resulting in lower costs and eliminating the possibility of mixing lead frames.

[0018] In order to accurately save materials and accurately identify the position of the first base island 4, a first dividing hole 6 is provided between the first base island 4 and the first pin 31. The first base island 4 and the first pin 31 can be integrally formed by stamping, so that the position of the first base island 4 can be known through the first dividing hole 6, thus preventing errors in the bonding position of the light-emitting chip.

[0019] In order to accurately save materials and accurately identify the position of the second base island 5, a second dividing hole 7 is provided between the second base island 5 and the second pin 32. The second base island 5 and the second pin 32 can be integrally formed by stamping, so that the position of the second base island 5 can be known through the second dividing hole 7, preventing errors in the bonding position of the light-emitting chip.

[0020] To prevent the chip from being mistakenly soldered to the end of the NC pin 33 near the second pin 32, an identification hole 8 is provided at the end of the NC pin 33 near the first base island 4 and the second base island 5 to hollow out the position for installing the light-emitting chip, so as to prevent the light-emitting chip from being installed incorrectly.

[0021] To reduce signal transmission loss of the optocoupler and enhance the mechanical stress resistance of the base island, the base island is extended towards the NC pin direction, transforming the traditional horizontal arrangement into a three-dimensional space optimization. This design shortens the wire span of the light-emitting chip. The first pin 31 and the first base island 4 are arranged in an L-shape, and the first base island 4 extends from the first pin 31 towards the NC pin 33.

[0022] To improve the stability of the positions of the first pin 31, the second pin 32, and the NC pin 33 during subsequent packaging and to prevent misalignment, positioning holes 9 are provided on the first pin 31, the second pin 32, and the NC pin 33. This allows for initial positioning of the three pins and facilitates the entry of the encapsulating colloid into the positioning holes 9 for later coagulation, thus achieving relative stability of the three pins after packaging.

[0023] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0024] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A lead frame for a shared N-terminal and P-terminal of an optocoupler light-emitting chip, comprising two symmetrically arranged side rails (1), a plurality of parallel connecting ribs (2) arranged between the two side rails (1), and a plurality of sets of optocoupler pins (3) arranged on the connecting ribs (2), characterized in that, Each group of optical coupler pins (3) includes a first pin (31), a second pin (32) and an NC pin (33) arranged sequentially on the connecting rib (2). The first pin (31) and the second pin (32) are respectively provided with a first base island (4) and a second base island (5). The N-terminal and P-terminal of the light-emitting chip can be arranged on the first base island (4) and the second base island (5). A first dividing hole (6) is provided between the first base island (4) and the first pin (31); A second dividing hole (7) is provided between the second base island (5) and the second pin (32); An identification hole (8) is provided at one end of the NC pin (33) near the first base island (4) and the second base island (5).

2. The leadframe of claim 1, wherein, The first pin (31) and the first base island (4) are arranged in an L-shape, and the first base island (4) extends from the first pin (31) toward the NC pin (33).

3. The leadframe of claim 1, wherein, Positioning holes (9) are provided on the first pin (31), the second pin (32) and the NC pin (33).

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