Anti-twist semiconductor support

Abstract

The utility model discloses an anti -twist's semiconductor support, including metal base plate and the cup body of injection molding on metal base plate, metal base plate includes pad no.

Description

Technical Field

[0001] This invention belongs to the field of semiconductor support technology, specifically a torsion-resistant semiconductor support. Background Technology

[0002] Semiconductor supports are metal or composite material structures used to support and fix semiconductor chips, such as LED chips and IC chips, during the semiconductor packaging process. They typically serve as carriers for conductive connections, heat conduction, and mechanical support of the chips and are key components in semiconductor device packaging.

[0003] Existing semiconductor brackets have anti-pull holes at both ends, and these holes are left untreated. This allows the solder pads to detach directly when the bracket is twisted, leading to product failure. Furthermore, prior art patent document "CN103794702A" discloses an "LED bracket," which includes a specification and appendix. Figure 5 It can be seen that the first and second injection holes are treated with a stepped design, that is, a thinning treatment around the back. By extruding, a discontinuity is formed on the inner side of the first and second injection holes. Because the inner diameter is reduced by the thinning method around the perimeter, the pads are easily detached when the bracket patch is twisted. Utility Model Content

[0004] The purpose of this invention is to provide a torsion-resistant semiconductor support to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution:

[0006] A torsion-resistant semiconductor support includes a metal substrate and a cup body injection-molded on the metal substrate. The metal substrate includes a first pad and a second pad, with an isolation channel between the first pad and the second pad. Both the first pad and the second pad are provided with anti-pull holes. The inner wall of the anti-pull hole is provided with a discontinuous groove. The inner wall of the anti-pull hole located on one side of the discontinuous groove is provided with a discontinuous protrusion. The sidewall of the discontinuous protrusion is flush with the bottom of the discontinuous groove.

[0007] In a further technical solution, the anti-pull hole is a rectangular anti-pull hole with a rounded end.

[0008] In a further technical solution, the two discontinuous grooves and the two discontinuous protrusions are respectively disposed on the two rectangular inner walls of the anti-pull hole.

[0009] In a further technical solution, the two discontinuous grooves and the two discontinuous protrusions are respectively disposed on the two circular inner walls of the anti-pull hole.

[0010] A further technical solution involves filling the isolation channel with plastic, specifically stepped plastic.

[0011] In a further technical solution, the first and second solder pads are provided with a plurality of trapezoidal penetration grooves corresponding to the positions of the injection-molded cup body, and the number of trapezoidal penetration grooves is greater than two.

[0012] In a further technical solution, the cup body is a light-emitting bowl-shaped cup body, and a marking position is provided on one side of the light-emitting bowl-shaped cup body.

[0013] In a further technical solution, the ratio of the area of ​​the functional area of ​​the first pad to the area of ​​the functional area of ​​the second pad is 1:4.

[0014] The beneficial effects of this utility model are:

[0015] In use, this invention first fixes the LED chip to pads one and two on a metal substrate. The chip is fixed to pad two using die bond or eutectic bonding and then connected to pad one via wire bonding for electrical connection. The isolation channels on the metal substrate are designed in a stepped shape to separate pads one and two, ensuring electrical insulation. Anti-pull holes are provided on pads one and two, and the discontinuous grooves and discontinuous protrusions on one side of their inner walls form an interlocking structure, enhancing the bonding force between the injection molded cup and the metal substrate. Specifically, during production, when the injection molding material fills the anti-pull holes... The material flows into the discontinuous groove and wraps around the discontinuous bumps, forming a tight fit. The bracket is then soldered onto the circuit board to complete the assembly of the LED device. During use or testing, even if the bracket is subjected to torsion or external force, the special design of the anti-pull holes effectively disperses stress, prevents the solder pads from falling off, enhances the bonding strength between the cup and the metal substrate, and improves the defect of traditional brackets where the solder pads easily fall off when torsion. The interlocking structure of the discontinuous groove and discontinuous bumps allows the injection molding material to form a stronger anchoring effect within the anti-pull holes, preventing the cup from peeling off from the metal substrate. Compared with existing technologies, this effectively improves the bracket's torsional resistance and structural stability.

[0016] Other features and advantages of this invention will be described in detail in the following detailed description section. Attached Figure Description

[0017] Figure 1 : Overall structural diagram of this utility model.

[0018] Figure 2 : A bottom view of this utility model.

[0019] Figure 3 Side view of this utility model Figure 1 .

[0020] Figure 4 Side view of this utility model Figure 2 .

[0021] Figure 5The structure of Embodiment 1 of this utility model Figure 1 .

[0022] Figure 6 The structure of Embodiment 1 of this utility model Figure 2 .

[0023] Figure 7 : Structural diagram of embodiment two of this utility model.

[0024] Figure 8 Front view of this utility model Figure 1 .

[0025] Figure 9 Cross-section of this utility model Figure 1 .

[0026] Figure 10 Front view of this utility model Figure 2 .

[0027] Figure 11 Cross-section of this utility model Figure 2 .

[0028] Attached reference numerals: 1. Cup body; 2. Pad 1; 3. Pad 2; 4. Isolation channel; 5. Anti-pull hole; 6. Discontinuous groove; 7. Discontinuous bump; 8. Stepped plastic; 9. Trapezoidal permeation groove; 10. Marker position Detailed Implementation

[0029] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention.

[0030] Please refer to Figure 1-11 ;

[0031] This embodiment discloses a torsion-resistant semiconductor support, including a metal substrate and a cup 1 injection-molded on the metal substrate. The metal substrate includes a first pad 2 and a second pad 3. An isolation channel 4 is provided between the first pad 2 and the second pad 3. The isolation channel 4 is stepped. Both the first pad 2 and the second pad 3 are provided with anti-pull holes 5. A discontinuous groove 6 is provided on one side of the inner wall of the anti-pull hole 5. The groove opening of the discontinuous groove 6 is flush with the surface of the first pad 2 or the second pad 3. A discontinuous protrusion 7 is provided on the inner wall of the anti-pull hole 5 on one side of the discontinuous groove 6. The side wall of the discontinuous protrusion 7 is flush with the bottom of the discontinuous groove 6. The two ends of the discontinuous protrusion 7 are arc-shaped.

[0032] More specifically, during use, the LED chip is first fixed to pads 2 and 3 on the metal substrate. The chip is fixed to pad 3 by die bond or eutectic bonding and connected to pad 2 by wire bonding to achieve electrical connection. The isolation channel 4 on the metal substrate has a stepped design, separating pad 2 and pad 3 to ensure electrical insulation. The anti-pull hole 5 is set on pad 2 and pad 3, and the discontinuous groove 6 on one side of its inner wall forms an interlocking structure with the discontinuous protrusion 7, which enhances the bonding force between the injection molded cup 1 and the metal substrate. That is, in production, the injection molding material fills the anti-pull hole. When the tube is in hole 5, the material flows into the discontinuous groove 6 and wraps around the discontinuous bumps 7, forming a tight fit. The bracket is then soldered onto the circuit board to complete the assembly of the LED device. During use or testing, even if the bracket is subjected to torsion or external force, the special design of the anti-pull hole 5 can effectively disperse stress, prevent the solder pads from falling off, enhance the bonding strength between the cup body 1 and the metal substrate, and improve the defect of traditional brackets where the solder pads are easily detached when torsion. The interlocking structure of the discontinuous groove 6 and the discontinuous bumps 7 makes the injection molding material form a stronger anchoring effect within the anti-pull hole 5, preventing the cup body 1 from peeling off from the metal substrate. Compared with the existing technology, this effectively improves the bracket's torsional resistance and structural stability.

[0033] Furthermore, the anti-pull hole 5 is a round-ended rectangular anti-pull hole 5. Regarding the number and position of the discontinuous grooves 6 and discontinuous protrusions 7, there are two implementation methods. The first implementation method is that two discontinuous grooves 6 and two discontinuous protrusions 7 are respectively set on the two rectangular inner walls of the anti-pull hole 5. The second implementation method is that two discontinuous grooves 6 and two discontinuous protrusions 7 are respectively set on the two rectangular inner walls of the anti-pull hole 5, and the other two discontinuous grooves 6 and two discontinuous protrusions 7 are respectively set on the two circular inner walls of the anti-pull hole 5. Furthermore, the discontinuous protrusions 7 on the inner side of the anti-pull hole 5 and the resin of the injection molded cup body 1 form hooks and fit together, so that when the product is twisted and pulled, the resin of the injection molded cup body 1 in the anti-pull hole 5 and the discontinuous protrusions 7 form an I-shaped inverted interlock, firmly fixing the first solder pad 2 and the second solder pad 3 to the cup body 1.

[0034] Furthermore, the isolation channel 4 is filled with plastic, and the plastic in the isolation channel 4 is stepped plastic 8; several trapezoidal penetration grooves 9 are set on the positions of the injection molded cup body 1 corresponding to the positions of the first pad 2 and the second pad 3. The number of trapezoidal penetration grooves is greater than two. The groove area on the side of the trapezoidal penetration groove closer to the cup body 1 is larger than the groove area on the side farther away from the cup body 1. Through the stepped plastic 8 filled in the stepped isolation channel 4 combined with the multiple trapezoidal penetration grooves 9 on the first pad 2 and the second pad 3, the bonding force between the injection molded cup body 1 and the metal substrate is enhanced, the stress distribution is optimized, and the torsional resistance and structural stability are further improved.

[0035] In this embodiment, the cup body 1 is a light-emitting bowl-shaped cup body 1, and a marking position 10 is provided on one side of the light-emitting bowl-shaped cup body 1 to remind the operator.

[0036] In this embodiment, the ratio of the area of ​​the functional area of ​​pad 2 to that of pad 3 is 1:4, adopting the 28 golden ratio, to meet the requirements of placing high-efficiency large chip polycrystalline combination arrangement to achieve high brightness.

[0037] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0038] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style of the specification is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A torsion-resistant semiconductor holder, characterized by The device includes a metal substrate and a cup body (1) injection molded on the metal substrate. The metal substrate includes a first pad (2) and a second pad (3). An isolation channel (4) is provided between the first pad (2) and the second pad (3). Both the first pad (2) and the second pad (3) are provided with anti-pull holes (5). The inner wall of the anti-pull hole (5) is provided with a discontinuous groove (6). The inner wall of the anti-pull hole (5) located on one side of the discontinuous groove (6) is provided with a discontinuous protrusion (7). The side wall of the discontinuous protrusion (7) is flush with the bottom of the discontinuous groove (6).

2. The torsion-resistant semiconductor support of claim 1, wherein The anti-pull hole (5) is a rectangular anti-pull hole with a rounded end (5).

3. The torsion-resistant semiconductor holder according to claim 2, wherein The two discontinuous grooves (6) and the two discontinuous protrusions (7) are respectively disposed on the two rectangular inner walls of the anti-pull hole (5).

4. A torsion-resistant semiconductor holder according to claim 2 or 3, characterised in that The two discontinuous grooves (6) and the two discontinuous protrusions (7) are respectively disposed on the two circular inner walls of the anti-pull hole (5).

5. The torsion-resistant semiconductor support of claim 1, wherein The isolation channel (4) is filled with plastic, and the plastic in the isolation channel (4) is stepped plastic (8).

6. The torsion-resistant semiconductor support according to claim 1, characterized in that, The first solder pad (2) and the second solder pad (3) are provided with a number of trapezoidal penetration grooves (9) corresponding to the position of the injection molding of the cup body (1), and the number of trapezoidal penetration grooves is greater than two.

7. The anti-torque semiconductor holder of claim 1, wherein, The cup body (1) is a light-emitting bowl-shaped cup body (1), and a marking position (10) is provided on one side of the light-emitting bowl-shaped cup body (1).

8. The anti-torque semiconductor support of claim 1, wherein, The ratio of the area of ​​the functional area of ​​the first pad (2) to the area of ​​the functional area of ​​the second pad (3) is 1:4.

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