A small built-in resistance semiconductor support

Abstract

This utility model discloses a compact built-in resistor semiconductor bracket, including a third metal pad and two symmetrically arranged metal pads, a groove between the first, second, and third metal pads, a cup-shaped body injection molded onto the first, second, and third metal pads, and a surface-mount resistor mounted on the first and third metal pads. The second and third metal pads are used for die bonding of LED chips. The surface-mount resistor is integrally formed or fixedly connected to the first and third metal pads, reducing the soldering points of traditional independent resistor components and lowering the risk of failures such as cold solder joints and desoldering, thereby improving the reliability and stability of the product. The built-in surface-mount resistor design eliminates the need for additional resistor wiring and space occupation on the circuit board, making it particularly suitable for small lamps and portable devices. The cup-shaped injection molding design increases the light-emitting surface and improves the brightness and luminous efficacy of the LED chip.

Description

Technical Field

[0001] This utility model belongs to the field of LED lighting technology, specifically a compact built-in resistor semiconductor bracket. Background Technology

[0002] In the production and application of LED lighting products, stable current control is crucial to ensuring the normal operation of LED chips and extending their lifespan. The operating characteristics of LED chips require the current to be maintained within a specific range to prevent overcurrent that could cause overheating or damage, thus ensuring the stability of their luminous efficacy, color temperature, and lifespan. Resistors, as important components for current regulation, can provide suitable operating current to LED chips through voltage division or current limiting, meeting the performance requirements of different application scenarios.

[0003] Currently, LED lighting products typically achieve current regulation by soldering independent resistors onto the circuit board. This method requires reserving dedicated wiring and mounting locations for the resistors in the circuit board design. The resistors' voltage division or current limiting functions ensure that the LED chip operates within a safe current range. This method is widely used in various LED lighting products, especially in multi-layer circuit board or high-density wiring designs, to meet the driving requirements of LED chips with different power and brightness needs.

[0004] However, existing methods of regulating current by soldering independent resistors have significant drawbacks. The circuit design is complex, the addition of resistors increases wiring difficulty, and the independent resistors occupy circuit board space, limiting the miniaturization and integration of products, especially in space-constrained small lighting fixtures or portable devices. Therefore, developing LED brackets with built-in resistors to solve these problems has significant practical importance and market value. Utility Model Content

[0005] The purpose of this invention is to provide a compact built-in resistor semiconductor support to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, this utility model provides the following technical solution:

[0007] A compact built-in resistor semiconductor support includes a third metal pad and two symmetrically arranged metal pads, a groove between the first, second and third metal pads, a cup molded onto the first, second and third metal pads, a surface mount resistor mounted on the first and third metal pads, and the second and third metal pads used for die bonding of LED chips.

[0008] In a further technical solution, anti-pull holes are provided at both ends of the first metal pad, an anti-pull hole is provided at the end of the second metal pad away from the third metal pad, and an anti-pull hole is provided at the end of the third metal pad away from the second metal pad. The anti-pull holes are circular.

[0009] In a further technical solution, the metal pad 1, metal pad 2, and metal pad 3 are provided with a number of trapezoidal penetration grooves corresponding to the injection molding positions of the cup body, and the number of trapezoidal penetration grooves is greater than two.

[0010] In a further technical solution, the first metal pad, the second metal pad, and the third metal pad are all electroplated with a silver plating layer.

[0011] In a further technical solution, the inner wall of the cup is provided with a reflective coating.

[0012] A further technical solution is that a mark is provided at the mouth of the cup.

[0013] The beneficial effects of this utility model are:

[0014] This utility model features a surface-mount resistor integrally formed or fixedly connected to metal pad 1 and metal pad 3, reducing the number of soldering points of traditional independent resistor components and lowering the risk of failures such as cold solder joints and desoldering, thereby improving the reliability and stability of the product. At the same time, the built-in surface-mount resistor design eliminates the need for additional resistor wiring and space occupation on the circuit board, simplifying the complexity of circuit design and effectively supporting the needs of miniaturized and highly integrated products. It is particularly suitable for small lamps and portable devices. The cup-shaped injection molding design increases the light-emitting surface and improves the brightness and luminous efficacy of the LED chip.

[0015] Other features and advantages of this invention will be described in detail in the following detailed description section. Attached Figure Description

[0016] Figure 1 : Front view of this utility model.

[0017] Figure 2 : Cross-sectional view of this utility model.

[0018] Figure 3 : Rear view of this utility model.

[0019] Figure 4 : Structural diagram of this utility model.

[0020] Figure 5 Side view of this utility model.

[0021] Figure 6 The structural diagram of metal pad 1, metal pad 2 and metal pad 3 of this utility model.

[0022] Figure labels: 1. Metal pad one; 2. Metal pad two; 3. Metal pad three; 4. Groove; 5. Cup body; 6. Surface mount resistor; 7. Anti-pull hole; 8. Trapezoidal penetration groove; 9. Reflective coating; 10. Mark; Detailed Implementation

[0023] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention.

[0024] Please refer to Figure 1-6 ;

[0025] In the production and application of LED lighting products, stable current control is crucial for the normal operation and lifespan of LED chips. Currently, the common practice is to adjust the current by soldering independent resistors onto the circuit board to meet the operating requirements of the LED chips. However, this method suffers from problems such as complex circuit design, large space occupation, and high cost.

[0026] A compact built-in resistor semiconductor support includes a metal pad 3 and two symmetrical metal pads 1 and 2. A groove 4 is provided between the metal pads 1, 2, and 3. In this embodiment, the groove 4 is a stepped groove. A cup 5 is injection molded on the metal pads 1, 2, and 3. The cup 5 is a bowl-shaped cup to increase the light-emitting surface and improve the brightness. A surface mount resistor 6 is installed on the metal pads 1 and 3. The surface mount resistor 6 can be integrally formed with the metal pads 1 and 3 or fixedly connected. The metal pads 2 and 3 are used for die bonding of LED chips.

[0027] Specifically, the surface mount resistor 6 is integrally formed or fixedly connected with metal pad 1 and metal pad 3, reducing the soldering points of traditional independent resistor components and lowering the risk of failures such as cold solder joints and desoldering, thereby improving the reliability and stability of the product. At the same time, the built-in surface mount resistor 6 design eliminates the need for additional resistor wiring and space occupation on the circuit board, simplifies the complexity of circuit design, and effectively supports the needs of miniaturized and highly integrated products. It is especially suitable for small lamps and portable devices. The injection molding design of the bowl-shaped cup body 5 increases the light-emitting surface and improves the brightness and luminous efficacy of the LED chip.

[0028] Furthermore, anti-pull holes 7 are provided at both ends of metal pad 1, and anti-pull holes 7 are provided at the ends of metal pad 2 away from metal pad 3 and metal pad 3 away from metal pad 2. The anti-pull holes 7 are circular. In the compact built-in resistor semiconductor bracket, the circular anti-pull holes 7 on metal pad 1, metal pad 2, and metal pad 3 significantly enhance the structural stability and reliability of the bracket. By increasing the bonding force between metal pad 1, metal pad 2, and metal pad 3 and the cup body 5, the anti-pull holes 7 effectively prevent metal pad 1, metal pad 2, and metal pad 3 from shifting or detaching due to external pulling during production, transportation, or use. This improves the mechanical strength and durability of the bracket, further reduces the risk of solder joint failure, enhances the installation stability of the LED chip and the surface mount resistor 6, and thus improves the reliability and service life of the entire LED lighting product. Meanwhile, the circular anti-pull hole 7 facilitates processing, optimizes production efficiency, reduces manufacturing costs, and further supports the market competitiveness of miniaturized, high-performance LED lighting products.

[0029] Furthermore, several trapezoidal penetration grooves 8 are provided at the positions of metal pad 1, metal pad 2, and metal pad 3 corresponding to the injection-molded cup body 5. The number of trapezoidal penetration grooves is greater than two. In this embodiment, the number of trapezoidal penetration grooves is two. The multiple trapezoidal penetration grooves 8 provided at the positions of metal pad 1, metal pad 2, and metal pad 3 corresponding to the injection-molded cup body 5 further enhance the bonding strength between the bracket and the injection-molded cup body 5. The design of the trapezoidal penetration grooves 8 allows the injection molding material to fully penetrate and fill the grooves during the molding process, forming a more robust mechanical interlocking structure. This effectively prevents the metal pad 1, metal pad 2, and metal pad 3 from detaching or loosening from the cup body 5, thereby improving the overall structural stability and durability of the bracket.

[0030] In this embodiment, the metal pads 1, 2, and 3 are all electroplated with silver to enhance electrical connection; the inner wall of the cup body 5 is provided with a reflective coating 9 to enhance the light-emitting surface and thus enhance brightness; the cup mouth of the cup body 5 is provided with Mark 10 to distinguish the positive and negative leads, and the positive and negative leads are reliably electrically connected to the corresponding electrodes of the LED chip and the built-in surface mount resistor 6 through a precise soldering process.

[0031] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0032] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style of the specification is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A small built-in resistor semiconductor holder, characterized by, It includes a metal pad three (3) and a metal pad one (1) and a metal pad two (2) with symmetrical structure. A groove (4) is provided between the metal pad one (1), the metal pad two (2) and the metal pad three (3). A cup body (5) is injection molded on the metal pad one (1), the metal pad two (2) and the metal pad three (3). A chip resistor (6) is installed on the metal pad one (1) and the metal pad three (3). The metal pad two (2) and the metal pad three (3) are used for die bonding of LED chips.

2. The small built-in resistor semiconductor holder according to claim 1, wherein The metal pad 1 (1) has anti-pull holes (7) at both ends, the metal pad 2 (2) has an anti-pull hole (7) at the end away from the metal pad 3 (3), and the metal pad 3 (3) has an anti-pull hole (7) at the end away from the metal pad 2 (2). The anti-pull hole (7) is a circular anti-pull hole (7).

3. The small built-in resistor semiconductor holder according to claim 1, wherein The metal pads 1 (1), 2 (2), and 3 (3) are provided with a number of trapezoidal permeation grooves (8) corresponding to the positions of the injection-molded cup body (5), and the number of trapezoidal permeation grooves is greater than two.

4. The small built-in resistor semiconductor holder according to claim 1, wherein The metal pad 1 (1), the metal pad 2 (2), and the metal pad 3 (3) are all electroplated with a silver plating layer.

5. The small built-in resistor semiconductor holder according to claim 1, wherein The inner wall of the cup body (5) is provided with a reflective coating (9).

6. The small built-in resistor semiconductor holder according to claim 1, wherein The cup body (5) has a Mark (10) at its mouth.

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