Deep ultraviolet separation high reflective package substrate

Abstract

This utility model relates to a deep ultraviolet (DUV) discrete high-reflectivity packaging substrate, belonging to the field of LED packaging technology. It includes, from bottom to top, a ceramic substrate protrusion eutectic layer, a high-reflectivity material packaging cavity layer, and a damming lens fixing layer, all bonded together. The ceramic substrate protrusion eutectic layer comprises a ceramic substrate with multiple welded protrusion pairs integrally formed in an array on it. The high-reflectivity material packaging cavity layer includes a first high-reflectivity substrate with multiple reflective cups arranged in an array on it. Each reflective cup corresponds to one of the welded protrusion pairs and is located around the welded protrusion pairs. The damming lens fixing layer includes a second high-reflectivity substrate with multiple lens mounting holes arranged in an array on it. Each lens mounting hole corresponds to one of the reflective cups and is located around the reflective cups. This utility model can simultaneously achieve the damming support function of a traditional packaging substrate and the reflection enhancement effect on the light output of the deep ultraviolet LED chip.

Description

Technical Field

[0001] This utility model relates to the field of LED packaging technology, and in particular to a deep ultraviolet-separated high-reflectivity packaging substrate. Background Technology

[0002] Currently, ceramic substrates are a common choice for deep ultraviolet (DUV) LED packaging due to their high hardness, good thermal stability, and electrical insulation. When ceramic substrates are used as packaging substrates, gold plating is often used for surface treatment. However, the use of gold plating presents certain problems in the deep ultraviolet band. Specifically, while gold plating has high reflectivity in the visible and infrared bands, its reflectivity is low in the deep ultraviolet band (especially in the 260-315nm range), typically less than 20%. This means that the reflectivity of gold is not ideal in the deep ultraviolet spectrum, leading to light energy loss and affecting the efficiency of the light source and the light output of the package. Furthermore, due to the poor reflectivity of gold, the emission efficiency of deep ultraviolet light is also limited, especially under high power output requirements, where the performance of the light source may fail to meet expectations. Therefore, it is necessary to explore new metal materials or other processing methods to optimize the reflectivity of the packaging substrate and improve the luminous efficiency of the package.

[0003] In addition, gold-tin soldering is a commonly used connection method in the packaging process of deep ultraviolet LED chips, especially for soldering between the chip and the packaging substrate. To ensure the reliability and long-term stability of the soldering, the eutectic region of the packaging substrate needs to be gold-plated. Gold's good conductivity and solderability are key to ensuring the stability of the soldering process. Electrochemical gold plating is typically used for the gold-tin soldering area. This process is suitable for large-area gold plating on the surface of the packaging substrate to form the gold layer required for soldering. However, traditional electrochemical gold plating technology has certain limitations: First, electrochemical gold plating is a uniform gold plating process, which makes it difficult to control the thickness and position of local areas. Therefore, it is impossible to achieve partial gold plating in the eutectic region of the packaging substrate; instead, the entire surface of the packaging substrate is gold-plated. This creates a problem: in addition to the soldering area, other parts of the entire packaging substrate are also plated with a gold layer. Furthermore, the low reflectivity of gold in the deep ultraviolet band means that light loss also occurs in non-soldering areas on the surface of the packaging substrate, further reducing luminous efficiency. Summary of the Invention

[0004] To solve the above-mentioned technical problems, this utility model provides a deep ultraviolet discrete high-reflectivity packaging substrate. The technical solution of this utility model is as follows: A deep ultraviolet-separated high-reflectivity packaging substrate includes, from bottom to top, a ceramic substrate protrusion eutectic layer, a high-reflectivity material packaging cavity layer, and a dam lens fixing layer. The ceramic substrate protrusion eutectic layer includes a ceramic substrate, on which multiple pairs of welded protrusions are integrally formed in an array. The high-reflectivity material encapsulation cavity layer includes a first high-reflectivity substrate, on which a plurality of reflective cups are arranged in an array, and the reflective cups correspond one-to-one with the welding protrusions and the reflective cups are located on the periphery of the welding protrusions. The dam lens fixing layer includes a second high-reflectivity substrate, on which multiple lens mounting holes are arranged in an array. Each lens mounting hole corresponds to a reflector cup and is located around the reflector cup.

[0005] Preferably, the ceramic substrate is made of aluminum nitride or aluminum oxide.

[0006] Preferably, both the first and second highly reflective substrates are made of Teflon.

[0007] Preferably, the ceramic substrate has at least two first positioning holes, the first high-reflectivity substrate has at least two second positioning holes, and the second high-reflectivity substrate has at least two third positioning holes, with the first positioning holes, second positioning holes, and third positioning holes corresponding one-to-one from bottom to top.

[0008] Preferably, the array is in the form of 13×13.

[0009] Preferably, the longitudinal section of the reflector cup is a pair of mutually symmetrical right trapezoids.

[0010] Preferably, the ceramic substrate has several horizontally distributed cutting channels and several vertically distributed cutting channels, which divide the ceramic substrate into an array.

[0011] Preferably, the ceramic substrate, the first high-reflectivity substrate, and the second high-reflectivity substrate are all square in shape. The ceramic substrate has several first vertical grooves along its horizontal edge and several first horizontal grooves along its vertical edge. The first vertical grooves are aligned with vertical cutting lines, and the first horizontal grooves are aligned with horizontal cutting lines. The first high-reflectivity substrate has several second vertical grooves along its horizontal edge and several second horizontal grooves along its vertical edge. The second high-reflectivity substrate has several third vertical grooves along its horizontal edge and several third horizontal grooves along its vertical edge. The first, second, and third vertical grooves correspond one-to-one from bottom to top, and the first, second, and third horizontal grooves correspond one-to-one from bottom to top.

[0012] All of the above optional technical solutions can be combined arbitrarily, and this utility model does not provide a detailed description of the structure after each combination.

[0013] The beneficial effects of this utility model through the above solution are as follows: By setting the packaging substrate to include, from bottom to top, a ceramic substrate protruding eutectic layer, a high-reflectivity material packaging cavity layer, and a dam lens fixing layer, and setting welding protrusion pairs, reflective cups, and lens mounting holes in a one-to-one correspondence, the packaging substrate provided by this utility model can simultaneously achieve the dam support function of traditional packaging substrates and the reflection enhancement effect on the light output of deep ultraviolet LED chips. This not only improves the light efficiency of the packaging but also ensures thermal management and long-term stability under high-power drive, solving the problems of low light output efficiency and poor heat dissipation in traditional deep ultraviolet packaging.

[0014] The above description is only an overview of the technical solution of this utility model. In order to better understand the technical means of this utility model and to implement it in accordance with the contents of the specification, the preferred embodiments of this utility model are described in detail below with reference to the accompanying drawings. Attached Figure Description

[0015] Figure 1 This is a cross-sectional view of a single welded protrusion pair, a reflector cup, and a lens mounting hole in this utility model.

[0016] Figure 2 yes Figure 1 Top view.

[0017] Figure 3 This is a top view of the protruding eutectic layer on the ceramic substrate in this utility model.

[0018] Figure 4 yes Figure 3 Enlarged view of point A in the middle.

[0019] Figure 5 This is a cross-sectional view of a single welded protrusion pair in this utility model.

[0020] Figure 6 This is a top view of a single welding protrusion pair in this utility model.

[0021] Figure 7 This is a top view of the high-reflectivity material encapsulation cavity layer in this utility model.

[0022] Figure 8 This is a cross-sectional view of a single reflective cup in this utility model.

[0023] Figure 9 This is a top view of a single reflective cup in this utility model.

[0024] Figure 10 This is a top view of the lens fixing layer of the dam in this utility model.

[0025] Figure 11This is a cross-sectional view of a single lens mounting hole in this utility model.

[0026] Figure 12 This is a top view of a single lens mounting hole in this utility model. Detailed Implementation

[0027] The specific embodiments of this utility model will be described in further detail below with reference to the accompanying drawings and examples. The following examples are used to illustrate this utility model, but are not intended to limit its scope.

[0028] like Figures 1 to 12 As shown, the deep ultraviolet-separated high-reflectivity packaging substrate provided in this embodiment includes, from bottom to top, a ceramic substrate protrusion eutectic layer, a high-reflectivity material packaging cavity layer, and a dam lens fixing layer. The ceramic substrate protrusion eutectic layer includes a ceramic substrate 1-1, on which multiple welding protrusion pairs 1-2 are integrally formed in an array. The high-reflectivity material packaging cavity layer includes a first high-reflectivity substrate 2-1, on which multiple reflective cups 2-2 are formed in an array. Each reflective cup 2-2 corresponds to one of the welding protrusion pairs 1-2 and is located around the welding protrusion pairs 1-2. The dam lens fixing layer includes a second high-reflectivity substrate 3-1, on which multiple lens mounting holes 3-2 are formed in an array. Each lens mounting hole 3-2 corresponds to one of the reflective cups 2-2 and is located around the reflective cups 2-2.

[0029] Specifically, the protruding eutectic layer on the ceramic substrate plays a supporting and thermal management role in the overall structure. Due to its excellent thermal conductivity and high hardness, the ceramic substrate 1-1 effectively supports the LED chip and provides a good heat conduction path, ensuring that the deep ultraviolet LED chip maintains a stable operating temperature during high-power driving and extending its lifespan. Furthermore, as the foundation of the overall structure, the ceramic substrate 1-1 ensures the mechanical strength and stability of the entire structure.

[0030] The high-reflectivity material encapsulation cavity layer is a key innovation of this invention. Traditional deep ultraviolet (DUV) encapsulation substrates often suffer from low reflectivity of the gold-plated metal layer, thus affecting the output efficiency of DUV light. The high-reflectivity material encapsulation cavity layer, through the use of a first high-reflectivity substrate 2-1, leverages its high reflectivity to effectively improve the reflectivity of DUV light, reflecting the light emitted by the LED chip back to the chip surface, thereby increasing light output efficiency. Furthermore, it solves the light loss problem caused by the gold plating layer in traditional encapsulation substrates. This design not only optimizes light utilization but also effectively reduces light loss, improving the overall performance of the light source.

[0031] The function of the lens damming layer is to ensure the lens is fixed in the correct position and to provide necessary damming support during the encapsulation process. This layer structure not only enhances the stability of the encapsulation substrate but also, to a certain extent, enables the focusing or diffusion of deep ultraviolet light, thereby optimizing the illumination effect. The lens's fixed position directly affects the quality of light output; therefore, this layer requires extremely high precision and strength.

[0032] The actual production process involves bonding and merging the three separate structures—the ceramic substrate protrusion eutectic layer, the high-reflectivity material encapsulation cavity layer, and the dam lens fixing layer—into a single array substrate according to the array diagram. This makes it easier for the substrate to be used in large-scale production.

[0033] By combining the above three layers, the packaging substrate provided by this invention can simultaneously achieve the damming support function of traditional packaging substrates and the reflection enhancement effect on the light output of deep ultraviolet LED chips. This structural innovation not only improves the luminous efficiency of the package but also ensures thermal management and long-term stability under high-power drive, solving the problems of low light output efficiency and poor heat dissipation in traditional deep ultraviolet packaging, and providing a new technical solution for the high-efficiency packaging of deep ultraviolet LEDs.

[0034] The purpose of the welding protrusions 1-2 is to effectively elevate the chip during the subsequent merging of the three-layer structure, ensuring that most of the deep ultraviolet light emitted by the chip illuminates the reflector cup for better light extraction. Additionally, elevating the chip prevents direct exposure of the adhesive at the bonding site to deep ultraviolet light, thus avoiding aging and ensuring the overall reliability of the package structure.

[0035] In addition, the ceramic substrate 1-1 was treated with nickel-gold plating, and the welding protrusions 1-2 were treated with gold plating.

[0036] In one specific embodiment, the ceramic substrate 1-1 is made of aluminum nitride or aluminum oxide. The first high-reflectivity substrate 2-1 and the second high-reflectivity substrate 3-1 are both made of Teflon. Teflon has high reflectivity to deep ultraviolet light, effectively improving the reflectivity of deep ultraviolet light. Of course, the first high-reflectivity substrate 2-1 and / or the second high-reflectivity substrate 3-1 can also be made of polished aluminum or other materials with high reflectivity to deep ultraviolet light.

[0037] In one specific embodiment, the ceramic substrate 1-1 has at least two first positioning holes 1-3, the first high-reflectivity substrate 2-1 has at least two second positioning holes 2-3, and the second high-reflectivity substrate 3-1 has at least two third positioning holes 3-3. The first positioning holes 1-3, the second positioning holes 2-3, and the third positioning holes 3-3 correspond one-to-one from bottom to top.

[0038] The first positioning hole 1-3, the second positioning hole 2-3 and the third positioning hole 3-3 are used to position the three-layer structure when merging the three-layer structure.

[0039] Preferably, the ceramic substrate 1-1, the first high-reflectivity substrate 2-1, and the second high-reflectivity substrate 3-1 are all square in shape, and the number of the first positioning hole 1-3, the second positioning hole 2-3, and the third positioning hole 3-3 are all two. In this case, the two first positioning holes 1-3, the second positioning holes 2-3, and the third positioning holes 3-3 are respectively located at the corners of the ceramic substrate 1-1, the first high-reflectivity substrate 2-1, and the second high-reflectivity substrate 3-1 at diagonal positions.

[0040] Preferably, the ceramic substrate 1-1, the first high-reflectivity substrate 2-1, and the second high-reflectivity substrate 3-1 are all square in shape, and there are four first positioning holes 1-3, two positioning holes 2-3, and three positioning holes 3-3. The four first positioning holes 1-3, two positioning holes 2-3, and three positioning holes 3-3 are located at the four corners of the ceramic substrate 1-1, the first high-reflectivity substrate 2-1, and the second high-reflectivity substrate 3-1, respectively.

[0041] In one specific embodiment, the array is in the form of 13×13. This configuration allows for the simultaneous packaging of 13×13 chips.

[0042] In one specific embodiment, the longitudinal section of the reflector cup 2-2 is a pair of symmetrical right-angled trapezoids. This arrangement makes the overall structure of the reflector cup 2-2 square, which improves light output.

[0043] In one specific embodiment, the ceramic substrate 1-1 has several horizontally distributed cutting channels 1-4 and several vertically distributed cutting channels 1-5, which divide the ceramic substrate 1-1 into an array. By setting the horizontal cutting channels 1-4 and the vertical cutting channels 1-5, it is convenient to cut the chip.

[0044] Specifically, the width of the horizontal cutting grooves 1-4 and the vertical cutting grooves 1-5 is 0.2mm.

[0045] Furthermore, the ceramic substrate 1-1, the first high-reflectivity substrate 2-1, and the second high-reflectivity substrate 3-1 are all square in shape. Several first vertical grooves 1-6 are formed along the horizontal edge of the ceramic substrate 1-1, and several first horizontal grooves 1-7 are formed along the vertical edge of the ceramic substrate 1-1. The first vertical grooves 1-6 are aligned with the vertical cutting channels 1-5, and the first horizontal grooves 1-7 are aligned with the horizontal cutting channels 1-4. Several second vertical grooves are formed along the horizontal edge of the first high-reflectivity substrate 2-1. The first high-reflectivity substrate 2-1 has several second horizontal grooves 2-5 along its vertical edge, and the second high-reflectivity substrate 3-1 has several third vertical grooves 3-4 along its horizontal edge. The first vertical groove 1-6, the second vertical groove 2-4, and the third vertical groove 3-4 correspond one-to-one from bottom to top, and the first horizontal groove 1-7, the second horizontal groove 2-5, and the third horizontal groove 3-5 correspond one-to-one from bottom to top.

[0046] The first vertical groove 1-6 serves as an index to the vertical cutting path 1-5, and the first horizontal groove 1-7 serves as an index to the horizontal cutting path. The other horizontal and vertical grooves are similarly defined. Furthermore, each horizontal and vertical groove can also serve as a positioning reference when merging the three-layer structure. After the three-layer structure is bonded, during cutting, cutting along the third vertical groove 3-4 and the vertical cutting path 1-5 achieves vertical chip cutting, while cutting along the third horizontal groove 3-5 and the horizontal cutting path 1-4 achieves horizontal chip cutting.

[0047] In summary, this utility model has the following beneficial effects: 1. Improve light output efficiency.

[0048] By employing a high-reflectivity encapsulation cavity layer, such as one using Teflon, the light reflectivity within the encapsulation cavity can be effectively improved. Traditional encapsulation substrates typically use aluminum substrates or other conventional materials with low reflectivity, resulting in significant loss of ultraviolet light emitted by the LED chip. In contrast, the high-reflectivity encapsulation cavity layer optimizes the light reflection path by using high-reflectivity materials, ensuring that more deep ultraviolet light is reflected back to the chip surface, thereby improving light output efficiency. Furthermore, designing the reflector cup 2-2 as a square structure further enhances the reflection effect, guiding more light in the desired direction.

[0049] 2. Optimize light extraction performance.

[0050] In traditional deep ultraviolet (DUV) packaging substrates, light extraction efficiency is typically affected by the packaging structure, especially the design of the packaging layer, which often makes it difficult to maximize the utilization of light emitted by the chip. However, in this invention, the design of the raised eutectic layer on the ceramic substrate ensures that the vast majority of the DUV light emitted by the chip can illuminate the reflector cup 2-2, thereby enabling more efficient light extraction. This design ensures precise alignment between the chip and the optical reflector cavity, thus optimizing light guidance and output and reducing light loss caused by unevenness or misalignment.

[0051] 3. Optimized production processes and advantages of mass production.

[0052] This invention proposes a three-layer, separate structural design, ensuring that each layer functions independently and precisely. By combining the three layers through bonding and anchoring techniques, not only is high-precision alignment between each layer ensured, but assembly and adjustment during production are also facilitated. Traditional packaging substrate structures typically fuse materials with different functions directly, which can easily lead to inaccurate alignment or significant errors. In contrast, this invention allows for more flexible production processes for each layer, enabling more precise control during production and facilitating subsequent maintenance and upgrades. Due to the independence of each layer, the production and assembly process of the packaging substrate can achieve large-scale automated production, significantly improving production efficiency and reducing production costs.

[0053] 4. Improve the reliability and durability of the packaging.

[0054] Because the packaging substrate provided by this invention uses a combination of high-reflectivity materials (such as Teflon) and ceramic materials, it not only has advantages in light output efficiency and thermal management, but also improves the overall reliability of the packaging. The stability and UV resistance of the high-reflectivity materials ensure the stability of the packaging cavity during long-term operation, while the high-temperature resistance of the ceramic materials allows the packaging substrate to withstand long-term thermal stress, making it less prone to deformation or aging, thereby extending the product's service life.

[0055] 5. Adapt to the special requirements of deep ultraviolet LED technology.

[0056] Traditional deep ultraviolet (DUV) LED packaging substrates often fall short in terms of high reflectivity, thermal management, and packaging precision, making it difficult to meet the performance requirements of high-power driving of DUV LED chips. The packaging substrate design provided by this invention not only solves these shortcomings of traditional packaging substrates but also optimizes for the specific requirements of DUV LEDs. For example, Teflon material has high transmittance and reflectivity for deep ultraviolet light, effectively improving the luminous efficacy of DUV LEDs. Furthermore, the design of the raised eutectic layer on the ceramic substrate allows for more precise chip mounting, contributing to improved light extraction.

[0057] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the technical principles of the present utility model, and these improvements and modifications should also be considered within the protection scope of the present utility model.

Claims

1. A deep ultraviolet-separated high-reflectivity packaging substrate, characterized in that, It includes, from bottom to top, a ceramic substrate protrusion eutectic layer, a high-reflectivity material encapsulation cavity layer, and a dam lens fixing layer; The ceramic substrate protrusion eutectic layer includes a ceramic substrate (1-1), on which multiple welding protrusion pairs (1-2) are integrally formed in an array. The high reflectivity material encapsulation cavity layer includes a first high reflectivity substrate (2-1), on which a plurality of reflective cups (2-2) are arranged in an array. The reflective cups (2-2) correspond one-to-one with the welding protrusion pairs (1-2) and the reflective cups (2-2) are located around the welding protrusion pairs (1-2). The dam lens fixing layer includes a second high-reflectivity substrate (3-1). Multiple lens mounting holes (3-2) are arranged in an array on the second high-reflectivity substrate (3-1). The lens mounting holes (3-2) correspond one-to-one with the reflector cup (2-2) and the lens mounting holes (3-2) are located around the reflector cup (2-2).

2. The deep ultraviolet separated high reflectivity package substrate of claim 1, wherein, The ceramic substrate (1-1) is made of aluminum nitride or aluminum oxide.

3. The deep ultraviolet separated high reflectivity package substrate of claim 1, wherein, The first high-reflectivity substrate (2-1) and the second high-reflectivity substrate (3-1) are both made of Teflon.

4. The deep ultraviolet separated high reflectivity package substrate of claim 1, wherein, The ceramic substrate (1-1) has at least two first positioning holes (1-3), the first high-reflectivity substrate (2-1) has at least two second positioning holes (2-3), and the second high-reflectivity substrate (3-1) has at least two third positioning holes (3-3). The first positioning holes (1-3), the second positioning holes (2-3), and the third positioning holes (3-3) correspond one-to-one from bottom to top.

5. The deep ultraviolet discrete high-reflectivity packaging substrate according to claim 1, characterized in that, The array is in the form of 13×13.

6. The deep ultraviolet separated high reflectivity package substrate of claim 1, wherein, The longitudinal section of the reflector cup (2-2) is a pair of mutually symmetrical right trapezoids.

7. The deep ultraviolet separated high reflectivity package substrate of claim 1, wherein, The ceramic substrate (1-1) has several horizontally distributed cutting channels (1-4) and several vertically distributed cutting channels (1-5), which divide the ceramic substrate (1-1) into an array.

8. The deep ultraviolet separated high reflectivity package substrate of claim 7, wherein, The ceramic substrate (1-1), the first high-reflectivity substrate (2-1), and the second high-reflectivity substrate (3-1) are all square in shape. Several first vertical grooves (1-6) are formed along the horizontal edge of the ceramic substrate (1-1), and several first horizontal grooves (1-7) are formed along the vertical edge of the ceramic substrate (1-1). The first vertical grooves (1-6) are aligned with vertical cutting channels (1-5), and the first horizontal grooves (1-7) are aligned with horizontal cutting channels (1-4). Several second vertical grooves (2-6) are formed along the horizontal edge of the first high-reflectivity substrate (2-1). 4) Several second horizontal grooves (2-5) are provided at the edge of the vertical side of the first high reflectivity substrate (2-1), several third vertical grooves (3-4) are provided at the edge of the horizontal side of the second high reflectivity substrate (3-1), and several third horizontal grooves (3-5) are provided at the edge of the vertical side of the second high reflectivity substrate (3-1). The first vertical groove (1-6), the second vertical groove (2-4) and the third vertical groove (3-4) correspond one-to-one from bottom to top, and the first horizontal groove (1-7), the second horizontal groove (2-5) and the third horizontal groove (3-5) correspond one-to-one from bottom to top.

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