LED packaging structure and LED lamp

Abstract

This utility model provides an LED packaging structure and an LED lamp. The LED packaging structure includes a substrate, a cup structure disposed on the substrate, and an LED chip. The cup structure surrounds the LED chip. The LED packaging structure also includes three stacked phosphor layers and a connecting layer. The three phosphor layers are used to reflect red light, blue light, and yellow light, respectively. The three phosphor layers are located above the LED chip and inside the cup structure. The connecting layer is connected to the top of the cup structure. This application improves the problem of silicone in traditional packaging layers being easily yellowed and ineffective due to temperature, which is beneficial to improving the visual effect of light emission.

Description

Technical Field

[0001] This utility model relates to the field of LED packaging technology, and in particular to an LED packaging structure and an LED lamp. Background Technology

[0002] Light-emitting diode (LED) lamps, also known as LED lamps, are devices that can transmit, distribute, and change the light distribution of LED light sources. They include all components needed to fix and protect the LED light source, as well as the wiring accessories necessary for connecting to the power supply.

[0003] SMD LED lighting products are currently the mainstream products in the LED market, widely used in general lighting T-tubes, panel lights, bulbs, and high-end lighting products. Existing white LEDs often use a mixture of phosphor and silicone for their encapsulation layer. Over time, this encapsulation layer is affected by the heat generated by the LED chip, making it prone to yellowing. This is especially true when the operating current of high-power LEDs reaches a certain value, resulting in high junction temperatures for the LED chip. The silicone in the encapsulation layer is then subjected to high-temperature baking, making it even more susceptible to yellowing and failure, thus affecting the luminous efficacy. Utility Model Content

[0004] Therefore, the purpose of this utility model is to provide an LED packaging structure and an LED lamp to overcome the shortcomings of the prior art.

[0005] To achieve the above objectives, this utility model provides an LED packaging structure, including a substrate, a cup structure disposed on the substrate, and an LED chip. The cup structure surrounds the LED chip. The LED packaging structure also includes three stacked phosphor layers and a connecting layer. The three phosphor layers are used to reflect red light, blue light, and yellow light, respectively. The three phosphor layers are located above the LED chip and inside the cup structure. The connecting layer is connected to the top of the cup structure.

[0006] The beneficial effects of this utility model are as follows: by stacking three phosphor layers and a connecting layer, and placing the three phosphor layers and part of the connecting layer inside the cup structure, placing the three phosphor layers above the LED chip, connecting them to the top of the cup structure through the connecting layer, and reflecting red light, blue light and yellow light respectively through the three phosphor layers, and using the principle of mixing the three primary colors to form white light, the light emitted by the LED chip is still white light after passing through the phosphor layer and the connecting layer. This is different from the existing technology and improves the problem that the silicone in the traditional encapsulation layer is easily yellowed and fails due to temperature, which is beneficial to improving the visual effect of light emission.

[0007] Preferably, the connecting layer includes a transparent silicone layer, the central part of which protrudes outward to form a hemispherical structure.

[0008] Preferably, the three phosphor layers are fixedly connected to the connecting layer by injection molding.

[0009] Preferably, the edge of the connecting layer is provided with a connecting ear, and the top of the bowl-cup structure is provided with a groove so that the top of the bowl-cup structure forms a step, and the connecting ear is located in the groove.

[0010] Preferably, the LED chip is connected to the substrate via a die-bonding adhesive, the die-bonding adhesive containing a silicon dioxide layer located directly beneath the LED chip.

[0011] Preferably, the opening area of ​​the end of the bowl-cup structure furthest from the substrate is larger than the opening area of ​​the end closest to the substrate.

[0012] Preferably, the inner wall of the bowl-cup structure is provided with an aluminum film.

[0013] To achieve the above objectives, this utility model also provides an LED lamp, including the LED packaging structure described above.

[0014] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0015] Figure 1 A cross-sectional view of the LED packaging structure provided in the first embodiment of this utility model;

[0016] Figure 2 A cross-sectional view of the LED packaging structure provided in the second embodiment of this utility model;

[0017] Figure 3 for Figure 2 Enlarged view of point A in the middle.

[0018] Explanation of key component symbols:

[0019] 10. Substrate; 20. Cup structure; 21. Step; 22. Aluminum film; 30. LED chip; 41. Phosphor layer; 42. Connecting layer; 421. Connecting ear; 50. Die-bonding adhesive; 51. Silicon dioxide layer.

[0020] The following detailed description, in conjunction with the accompanying drawings, will further illustrate this utility model. Detailed Implementation

[0021] To facilitate understanding of this utility model, a more complete description will be given below with reference to the accompanying drawings. Several embodiments of this utility model are shown in the drawings. However, this utility model can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that the disclosure of this utility model will be more thorough and complete.

[0022] It should be noted that when a component is said to be "fixed to" another component, it can be directly on the other component or there may be an intervening component. When a component is said to be "connected to" another component, it can be directly connected to the other component or there may be an intervening component. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this document are for illustrative purposes only.

[0023] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0024] Example 1

[0025] Please see Figure 1 The LED packaging structure in the first embodiment of this utility model includes a substrate 10, a cup structure 20, an LED chip 30, and a packaging layer.

[0026] The cup structure 20 and the LED chip 30 are both disposed on the substrate 10. The cup structure 20 is a ring structure and surrounds the LED chip 30. The encapsulation layer includes three stacked phosphor layers 41 and a connecting layer 42. The three phosphor layers 41 are located above the LED chip 30 and are located inside the cup structure 20. Since the phosphor conversion efficiency of the phosphor layer 41 is affected by the high temperature environment, the phosphor layer 41 closest to the LED chip 30 has the largest thickness. The thickness of the three phosphor layers 41 decreases sequentially from the direction away from the LED chip 30 to ensure a certain conversion rate and not affect the light emission effect.

[0027] It should be noted that the three phosphor layers 41 are used to reflect red light, blue light and yellow light respectively. By utilizing the principle of three primary colors, the light emitted by the LED chip 30 is still white light after passing through the encapsulation layer in this embodiment, which improves the problem in the original technology that the encapsulation layer turns yellow after being affected by temperature, thus affecting the visual effect of light emission.

[0028] In this embodiment, the three phosphor layers 41 are fixedly connected to the connecting layer 42 by injection molding.

[0029] In this embodiment, the connecting layer 42 is used to protect the phosphor layer 41 and also to enhance the connection strength between the encapsulation layer and the cup structure 20. Specifically, the edge of the connecting layer 42 is provided with a connecting ear 421, and the top of the cup structure 20 is provided with a groove, so that the top of the cup structure 20 forms a step 21. The connecting ear 421 is located in the groove, and the top of the connecting ear 421 is flush with the top of the cup structure 20. By embedding the connecting ear 421 into the groove, the connection area is increased, thereby enhancing the connection strength between the encapsulation layer and the cup structure 20 in this embodiment through the connecting layer 42.

[0030] In this embodiment, the connecting layer 42 includes a transparent silicone layer with a hemispherical structure protruding outward from the center. This hemispherical structure can be similar to a convex lens to improve the luminous brightness of the LED lamps produced later.

[0031] In this embodiment, the LED chip 30 is connected to the substrate 10 via die bond adhesive 50.

[0032] In this embodiment, the cross-section of the cup structure 20 is an inverted trapezoidal structure, that is, the opening area of ​​the end of the cup structure 20 away from the substrate 10 is larger than the opening area of ​​the end of the cup structure 20 close to the substrate 10, so as to expand the light emission angle of the LED chip 30. An aluminum film 22 is provided on the inner wall of the cup structure 20. The aluminum film 22 is used to reflect the light that is incident on the inner wall of the cup structure 20. The aluminum film 22 has good heat dissipation performance to improve the heat dissipation effect of the LED packaging structure.

[0033] In specific implementation, three phosphor layers 41 and a connecting layer 42 are stacked, and the three phosphor layers 41 and part of the connecting layer 42 are placed inside the cup structure 20. The three phosphor layers 41 are placed above the LED chip 30 and connected to the top of the cup structure 20 through the connecting layer 42. Red light, blue light and yellow light are reflected by the three phosphor layers 41 respectively. By using the principle of mixing the three primary colors to form white light, the light emitted by the LED chip 30 is still white light after passing through the phosphor layer 41 and the connecting layer 42. This is different from the existing technology and improves the problem that the silicone in the traditional encapsulation layer is easily yellowed and failed due to temperature. It is beneficial to improve the visual effect of light emission.

[0034] It should be noted that the above implementation process is only to illustrate the feasibility of this application, but it does not mean that the LED packaging structure of this application has only one implementation process. On the contrary, as long as the LED packaging structure of this application can be implemented, it can be included in the feasible implementation scheme of this application.

[0035] Example 2

[0036] Please see Figure 2 and Figure 3 The difference between the LED packaging structure in the second embodiment of this utility model and the LED packaging structure in the first embodiment is that the LED chip 30 is connected to the substrate 10 through a die-bonding adhesive 50. The die-bonding adhesive 50 contains a silicon dioxide layer 51. Specifically, after laying a first layer of die-bonding adhesive 50 on the substrate 10, a silicon dioxide layer 51 is laid flat on the first layer of die-bonding adhesive 50, and then a second layer of die-bonding adhesive 50 is laid flat on the silicon dioxide layer 51, thereby forming a die-bonding adhesive 50 containing a silicon dioxide layer 51, which is connected to the LED chip 30. The silicon dioxide layer 51 is located directly below the LED chip 30. It can be understood that the silicon dioxide layer 51 is used to reduce the refractive index of the die-bonding adhesive 50, so as to reduce the critical angle of light at the chip-adhesive interface, enhance the total internal reflection effect, and compensate for light loss.

[0037] Example 3

[0038] The LED lamp in the third embodiment of this utility model includes the LED packaging structure in the second embodiment.

[0039] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0040] The above-described embodiments are merely illustrative of several implementations of this utility model, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of this utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the appended claims.

Claims

1. An LED packaging structure, comprising a substrate, a bowl cup structure arranged on the substrate, and an LED chip, the bowl cup structure surrounding the LED chip, characterized in that, The LED packaging structure also includes three stacked phosphor layers and a connecting layer. The three phosphor layers are used to reflect red light, blue light and yellow light respectively. The three phosphor layers are located above the LED chip and inside the cup structure. The connecting layer is connected to the top of the cup structure.

2. The LED package structure of claim 1, wherein, The connecting layer includes a transparent silicone layer, the central part of which protrudes outward to form a hemispherical structure.

3. The LED package structure of claim 1, wherein, The three phosphor layers are fixedly connected to the connecting layer by injection molding.

4. The LED package structure of claim 1, wherein, The edge of the connecting layer is provided with a connecting lug, and the top of the bowl-cup structure is provided with a groove so that the top of the bowl-cup structure forms a step, and the connecting lug is located in the groove.

5. The LED package structure of claim 1, wherein, The LED chip is connected to the substrate via a die-bonding adhesive, which contains a silicon dioxide layer located directly beneath the LED chip.

6. The LED package structure of claim 1, wherein, The opening area of ​​the bowl-shaped structure at the end furthest from the substrate is larger than the opening area at the end closest to the substrate.

7. The LED package structure of claim 1, wherein, The inner wall of the bowl-cup structure is provided with an aluminum film.

8. An LED lamp, characterized in that Includes the LED packaging structure as described in any one of claims 1-7.

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