Packaging unit, backlight module and display device

Abstract

This application relates to a packaging unit, a backlight module, and a display device. The packaging unit includes a substrate, LED chips, and a light-transmitting element. At least a portion of the substrate is made of metal, and the metal portion of the substrate has a groove. The LED chips are disposed within the groove. The light-transmitting element is disposed within the groove to encapsulate the LED chips within the groove. By forming a groove on the substrate to accommodate the LED chips, the reliance on dam structures in traditional packaging processes can be eliminated, thereby simplifying the packaging process and improving packaging efficiency. Furthermore, eliminating the dam structure also helps reduce material usage and lower production costs.

Description

Technical Field

[0001] This application relates to the field of LED backlighting, and more particularly to a packaging unit, a backlight module, and a display device. Background Technology

[0002] LEDs, as a highly efficient, energy-saving, and long-life light source, are widely used in lighting and display fields, especially in LED backlight strips. In their packaging process, dams are often placed around the chip to facilitate the directional coating of phosphor or encapsulating adhesive and reduce light absorption on the chip's sidewalls. Dams define the flow area of ​​the adhesive, helping to guide its distribution and improve light extraction efficiency.

[0003] In related technologies, dams are typically formed before chip mounting; that is, dams are first fabricated on the substrate, and then the chips are mounted one by one in the middle of the dams. This method is relatively complex, has low packaging efficiency, and high manufacturing costs. Utility Model Content

[0004] This application provides a packaging unit, a backlight module, and a display device, which improves the packaging efficiency of LED light boards and at least partially solves the above-mentioned technical problems.

[0005] To achieve the above objectives, according to a first aspect of this application, a packaging unit is provided, comprising: The substrate is at least partially made of metal, and the metal portion of the substrate has a groove; LED beads are disposed within the groove; and A light-transmitting element is disposed within the groove to encapsulate the LED bead within the groove.

[0006] In some embodiments, a lens is also included, the lens being disposed on the substrate and covering the opening side of the groove; and / or, The ratio of the depth of the groove to the thickness of the substrate is 0.3-0.7.

[0007] In some embodiments, the depth of the groove is 0.3 mm; and / or, The diameter of the groove is 2 mm.

[0008] In some embodiments, the groove is a flared groove; and / or, The light-transmitting body includes a light-transmitting adhesive; and / or, The substrate includes an aluminum substrate.

[0009] In some embodiments, the angle between the sidewall and bottom wall of the groove is 105 to 135 degrees.

[0010] In some embodiments, the included angle between the sidewall and bottom wall of the groove is 110 degrees, 120 degrees, or 130 degrees.

[0011] In some embodiments, a reflective layer is also included, which at least covers the inner wall of the groove.

[0012] In some embodiments, the reflective layer is made of a flexible material; and / or, The reflective layer covers the surface of the substrate.

[0013] According to a second aspect of this application, a backlight module is provided, including the packaging unit described in the above technical solution.

[0014] According to a third aspect of this application, a display device is also provided, including the packaging unit described in the above technical solution, or including the backlight module described in the above technical solution.

[0015] In the packaging unit of this application embodiment, by forming a groove on the substrate for accommodating the LED chip, the reliance on a dam structure in the traditional packaging process can be eliminated, thereby simplifying the packaging process and improving packaging efficiency. Furthermore, eliminating the dam structure also helps reduce material usage and lower production costs.

[0016] Other features and advantages of this application will be described in detail in the following detailed description section. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] To gain a more complete understanding of this application and its beneficial effects, the following description will be provided in conjunction with the accompanying drawings, wherein the same reference numerals in the following description denote the same parts.

[0019] Figure 1 This is a schematic diagram of the packaging unit provided in an exemplary embodiment of this disclosure.

[0020] Explanation of reference numerals in the attached figures: 100, substrate; 110, groove; 200, LED bead; 300, light-transmitting body; 400, lens; 500, reflective layer. Detailed Implementation

[0021] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the protection scope of this application.

[0022] According to the first aspect of this application, referring to Figure 1 This disclosure provides a packaging unit including a substrate 100, an LED chip 200, and a light-transmitting element 300. This packaging unit is suitable for backlight modules of display devices, such as LED backlight strips for displays.

[0023] The substrate 100 is at least partially made of metal, and the metal portion of the substrate 100 has a groove 110. For example, the substrate 100 can be made of aluminum, whose good thermal conductivity helps to conduct the heat generated by the LED chip 200 during operation, thereby helping to maintain the thermal stability of the packaging unit. The substrate 100 has a groove 110 for accommodating the LED chip 200, and the LED chip 200 is disposed in the groove 110 such that the light-emitting surface of the LED chip 200 is below the surface of the substrate 100. By embedding the LED chip 200 into the groove 110, it is easier to perform subsequent encapsulation and, to some extent, improves the positional stability of the LED chip 200 and reduces packaging errors.

[0024] The groove 110 can be formed on the surface of the substrate 100 by laser processing, stamping, or other mechanical methods. Exemplarily, the substrate 100 can be a printed circuit board, the main body of which may include resin, ceramic, or other insulating materials, while the area for forming the groove 110 can be an embedded or covered metal material to meet thermal conductivity or structural strength requirements. In other embodiments, the substrate 100 can also be entirely made of metal, such as aluminum, copper, or other metal materials suitable for packaging structures.

[0025] In some embodiments, the substrate 100 may include one or more metal layers. Different metal layers may be selected based on heat dissipation performance, processing characteristics, or electrical function requirements, such as aluminum layers, stainless steel layers, or copper layers. The aforementioned metal layers may be constructed in the structure of the substrate 100 by means of lamination, plating, embedding, etc.

[0026] In some embodiments, the groove 110 can be formed by stamping. For example, a mold can be used to imprint the metal area to form the groove 110 structure in one step. Compared with the traditional dam manufacturing process, this method does not require additional dam construction and can directly complete the structural construction of the lamp bead 200 mounting part in the substrate 100 forming or subsequent processes, thereby simplifying the overall packaging process.

[0027] This processing method can be integrated into the mass production line of light strips. After the light strips come off the production line, the groove 110 area for accommodating the light beads 200 is directly formed in the preset position through the stamping step, thereby realizing the positioning and packaging of the light beads 200. This reduces the materials and processes related to the dam, and has the characteristics of simple process flow and high efficiency.

[0028] The above method can not only reduce manufacturing costs to a certain extent, but also create a new packaging path that does not require a dam auxiliary structure, which is conducive to optimizing the packaging process and product integration solution of LED backlight strips.

[0029] In some embodiments, refer to Figure 1 The LED chip 200 is disposed within the groove 110. By embedding the LED chip 200 in the groove 110, its position can be restricted to a certain extent, facilitating subsequent potting and encapsulation and the covering operation of the light-transmitting body 300. Since the groove 110 has a certain depth and defined contour, it can play a role in the initial positioning and support of the LED chip 200, thereby reducing the possibility of positional displacement and improving encapsulation accuracy and consistency.

[0030] Furthermore, the LED 200 is located inside the recess 110, with its light-emitting surface lower than the surface of the substrate 100. This design helps to prevent direct mechanical forces from acting on the chip, thereby improving the structural stability and reliability of the packaging unit. This structural design also facilitates the concentrated distribution of the encapsulating colloid, enhancing the consistency of optical output and the integrity of the packaging.

[0031] In some embodiments, refer to Figure 1 A light-transmitting element 300 is disposed within the groove 110 to encapsulate the LED chip 200 within the groove 110. The light-transmitting element 300 fills the gap between the LED chip 200 and the inner wall of the groove 110, and covers the light-emitting surface of the LED chip 200, thus encapsulating and protecting the LED chip 200 while allowing light transmission. The placement of the light-transmitting element 300 not only enhances the mechanical strength of the encapsulation but also, to a certain extent, prevents external environmental contamination or damage to the LED chip 200.

[0032] For example, the light-transmitting body 300 can be a light-transmitting adhesive, such as silicone, epoxy resin, or other polymeric materials that are light-transmitting and suitable for LED encapsulation. Such materials have good flowability, allowing them to fully fill the groove 110 during potting, and after curing, form a stable encapsulation structure, enhancing the environmental adaptability of the LED bead 200 and improving the overall reliability of the product.

[0033] In some embodiments, the light-transmitting body 300 may also contain phosphor components according to application requirements to achieve light color conversion function, further expanding its adaptability in light color control. It should be understood that the material type and specific composition of the light-transmitting body 300 can be selected according to the actual application scenario, and this application does not limit it in this regard.

[0034] In some embodiments, refer to Figure 1 It also includes a lens 400, which is disposed on the substrate 100 and covers the opening side of the groove 110. The lens 400 is beneficial to protecting the exposed wafer to a certain extent, reducing the impact of external mechanical or environmental factors, and at the same time helps to improve optical performance, increase light extraction efficiency and beam uniformity.

[0035] For example, the lens 400 can be an optical element made of materials such as plastic lens 400, silicone lens 400, or glass lens 400, and its shape can be a convex lens 400, an aspherical lens 400, or a freeform surface lens 400, to adapt to different optical adjustment needs. The specific structure and material of the lens 400 can be selected according to the optical design requirements of the actual application, and this application does not limit it in this regard.

[0036] In some embodiments, the ratio of the depth of the groove 110 to the thickness of the substrate 100 is 0.3-0.7. Setting this ratio range helps to maintain the structural strength and overall stability of the substrate 100 while ensuring that the groove 110 has sufficient space to accommodate the LED chip 200. A suitable depth ratio allows the LED chip 200 to be relatively securely embedded in the groove 110, which is beneficial for the uniform filling of subsequent encapsulation materials and the stable performance of optical properties.

[0037] Meanwhile, the depth of the groove 110 within this range helps to achieve effective heat conduction and dissipation, avoids the reduction of mechanical strength of the substrate 100 due to excessive groove cutting, and improves the reliability and service life of the packaging unit.

[0038] In some embodiments, the ratio of the depth of the groove 110 to the thickness of the substrate 100 can be 0.30, 0.33, 0.35, 0.38, 0.40, 0.42, 0.45, 0.48, 0.50, 0.53, 0.55, 0.58, 0.60, 0.63, 0.65, 0.68, or 0.70, or any value within the above range. It should be noted that this application does not limit the range or specific value of this ratio; the specific value can be selected and adjusted according to the actual structural design and manufacturing process.

[0039] In some embodiments, the depth of the groove 110 is 0.3 mm. This depth design helps to provide suitable accommodating space for the LED chip 200, while taking into account the mechanical strength of the substrate 100 and the overall stability of the package. The depth of the groove 110 can be adjusted appropriately according to specific application requirements, and this application does not limit this. Furthermore, setting the groove 110 depth to 0.3 mm is beneficial for forming the groove 110 on the substrate 100 through an imprinting process. This depth can, to some extent, avoid damage to the substrate 100 structure caused by excessive depth, while also meeting the installation requirements of the LED chip 200. If the groove 110 depth is too shallow, the LED chip 200 may not be fully embedded, affecting the stability of the package and optical performance. Therefore, a reasonable groove 110 depth helps to balance the feasibility of the processing technology with the functionality of the package structure.

[0040] In some embodiments, the diameter of the recess 110 is 2 mm. This size is beneficial for providing suitable mounting space for the LED chip 200, while also ensuring the structural integrity of the substrate 100 and the feasibility of the manufacturing process. The specific diameter can be adjusted according to the size of the LED chip 200 and packaging requirements, and this application does not limit it in this regard.

[0041] In some embodiments, the groove 110 is a flared groove. This flared design makes the opening end of the groove 110 wider than the bottom, which helps improve the ease of installation and positioning accuracy of the LED chip 200, and also facilitates the filling and distribution of the encapsulation material to a certain extent. The flared groove structure can also reduce stress concentration, improving the mechanical strength and durability of the encapsulation unit. In addition, the flared groove structure is beneficial for guiding and reflecting the light emitted by the LED chip 200, causing some of the light to be reflected towards the opening of the groove 110, thereby improving the brightness and uniformity of the emitted light. By optimizing the shape and angle of the flare, the light utilization efficiency can be enhanced, which is beneficial for improving the optical performance of the encapsulation unit.

[0042] In some embodiments, the light-transmitting body 300 includes a light-transmitting adhesive. This adhesive has good light transmittance and suitable adhesion properties, enabling it to fill the gaps within the groove 110 during the encapsulation process, covering the LED bead 200 and forming a stable protective layer. Simultaneously, the adhesive exhibits minimal light attenuation, which helps maintain the stability of the light intensity and color emitted by the LED bead 200.

[0043] Translucent adhesives can be made of silicone, epoxy resin, or other polymer materials suitable for LED encapsulation. Depending on the specific application requirements, the curing method of the translucent adhesive can include various forms such as thermosetting and UV curing. The specific materials and processes can be selected according to the actual situation.

[0044] In some embodiments, the substrate 100 includes an aluminum substrate 100. The aluminum substrate 100 has good thermal conductivity, which helps to promptly conduct the heat generated during the operation of the LED chip 200 to the external environment, thereby reducing the device temperature rise to a certain extent and extending the lifespan of the LED chip 200. Furthermore, the aluminum substrate 100 has high mechanical strength and dimensional stability, making it suitable for various LED packaging applications.

[0045] Furthermore, the aluminum substrate 100 has lower hardness compared to other commonly used metal materials, which is beneficial for forming groove 110 structures on its surface by means of embossing, thereby simplifying the processing flow, improving production efficiency, and making it suitable for large-scale production.

[0046] In some embodiments, the angle between the sidewall and bottom wall of the groove 110 is between 105 and 135 degrees. This angle range is beneficial for achieving the guiding effect of the flared structure, facilitating the installation and positioning of the LED bead 200, and contributing to the uniform filling of the light-transmitting body 300 material, thus improving encapsulation consistency. Simultaneously, a larger angle can, to some extent, improve the light emission direction and increase light extraction efficiency.

[0047] In some embodiments, the included angle between the sidewall and bottom wall of the groove 110 is 105 degrees, 108 degrees, 110 degrees, 115 degrees, 118 degrees, 120 degrees, 123 degrees, 126 degrees, or 130 degrees, and the specific value can be selected according to the packaging structure and optical requirements. This application embodiment does not limit this.

[0048] In some embodiments, the angle between the sidewall and bottom wall of the groove 110 is 110 degrees, 120 degrees, or 130 degrees. This angle can be adapted to the actual optical distance (OD) height of the backlight module, thereby helping to adjust the light emission angle and diffusion effect, and improving the overall optical performance of the backlight system.

[0049] In some embodiments, by adjusting the depth of the groove 110 and the angle between the sidewall and the bottom wall in the imprinting process, the light emission pattern of the lamp bead 200 can be controlled to a certain extent, which is beneficial to achieving different light pattern design requirements, thereby making the packaging structure more flexible and adjustable in adapting to diverse lighting or backlighting scenarios.

[0050] In some embodiments, refer to Figure 1 It also includes a reflective layer 500, which at least covers the inner wall of the groove 110. The reflective layer 500 helps to improve the reflectivity of light and reduce the absorption of light in the groove 110, thereby improving the light output efficiency to a certain extent.

[0051] For example, the reflective layer 500 may include a white reflective coating, an aluminum reflective film, a silver reflective film, or other metals or inorganic materials with high reflectivity. This reflective layer 500 material can improve the reflective performance of the inner wall of the groove 110 to a certain extent, which helps reduce light absorption and scattering losses, thereby improving the overall light output efficiency and brightness performance.

[0052] The reflective layer 500 can be formed by spraying, vapor deposition, electroplating or other suitable processes. The specific materials and preparation methods can be selected according to the encapsulation process requirements and cost control.

[0053] In some embodiments, the reflective layer 500 is made of a flexible material. The flexible reflective layer 500 is less prone to breakage during the imprinting process to form the groove 110 and can adapt to groove 110 structures of different shapes and sizes. Furthermore, the reflective layer 500 can be pre-deposited on the surface of the substrate 100 and naturally formed on the inner wall of the groove 110 after imprinting, avoiding the increased process complexity and cost associated with separately coating the reflective layer 500 within the groove 110 later.

[0054] Due to the small size of the groove 110, it presents significant technological challenges in subsequently setting the reflective layer 500 within the groove 110, which is detrimental to improving production efficiency and controlling costs. Therefore, using a flexible material to pre-arrange the reflective layer 500 on the surface of the substrate 100 can effectively simplify the manufacturing process and improve the production reliability and economy of the packaging unit.

[0055] In some embodiments, refer to Figure 1 A reflective layer 500 covers the surface of the substrate 100. This coverage helps to improve the overall reflective performance of the substrate 100, reduce light energy loss, and is beneficial to improving the light extraction efficiency and uniformity of the packaging unit.

[0056] The reflective layer 500 covering the surface of the substrate 100 can also protect the substrate 100 from the influence of the external environment to a certain extent, and improve the durability and stability of the packaging structure.

[0057] In some embodiments, refer to Figure 1 The lens 400 has a first groove on its surface facing the groove 110; exemplarily, the first groove is a conical groove. By providing this first groove, the fit between the lens 400 and the groove 110 can be improved to a certain extent, promoting reasonable refraction and distribution of light, thereby helping to optimize the light output effect.

[0058] In some embodiments, a first groove is provided on the surface of the lens 400 opposite to the groove 110; exemplarily, the second groove is a conical groove. This structure is beneficial for adjusting the optical performance of the lens 400, such as changing the divergence angle or focusing effect of the light beam, to meet the optical characteristics required by different application scenarios.

[0059] In some embodiments, refer to Figure 1 The opening size of the first groove is the same as the opening size of the recess 110, and the first groove and the recess 110 are spatially corresponding and directly opposite each other. This arrangement helps to ensure precise alignment between the lens 400 and the recess 110 of the substrate 100, thereby improving the optical coupling effect and enhancing the light extraction efficiency and uniformity of the overall packaging unit.

[0060] According to a second aspect of this disclosure, a backlight module is provided, including the packaging unit in the above embodiments. This backlight module possesses all the beneficial effects of the aforementioned packaging unit, which will not be elaborated further herein.

[0061] According to a third aspect of this disclosure, a display device is provided, including the packaging unit in the above embodiments, or including the backlight module in the above embodiments. This display device has all the beneficial effects of the above-described packaging unit or backlight module, which will not be elaborated further herein.

[0062] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0063] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0064] The embodiments, implementation methods, and related technical features of this application can be combined and substituted for each other without conflict.

[0065] The above are merely preferred embodiments of this application and are not intended to limit this application in any way. Any simple modifications, equivalent changes, and alterations made to the above embodiments based on the technical essence of this application without departing from the scope of the technical solution of this application shall still fall within the scope of the technical solution of this application.

Claims

1. A packaging unit, characterized by include: The substrate (100) is at least partially made of metal, and the metal part of the substrate (100) has a groove (110); LED beads (200) are disposed within the groove (110); and A light-transmitting body (300) is disposed in the groove (110) to encapsulate the lamp bead (200) in the groove (110).

2. The packaging unit according to claim 1, characterized in that, It also includes a lens (400) disposed on the substrate (100) and covering the opening side of the groove (110); and / or, The ratio of the depth of the groove (110) to the thickness of the substrate (100) is 0.3-0.

7.

3. The packaging unit according to claim 1 or 2, characterized in that, The depth of the groove (110) is 0.3 mm; and / or, The diameter of the groove (110) is 2 mm.

4. The package unit of claim 1, wherein, The groove (110) is a flared groove; and / or, The light-transmitting body (300) includes a light-transmitting adhesive; and / or, The substrate (100) includes an aluminum substrate (100).

5. The packaging unit of claim 1, wherein, The angle between the sidewall and bottom wall of the groove (110) is 105 degrees to 135 degrees.

6. The packaging unit according to claim 1 or 5, characterized in that The included angle between the sidewall and bottom wall of the groove (110) is 110 degrees, 120 degrees or 130 degrees.

7. The packaging unit of claim 1, wherein, It also includes a reflective layer (500) that at least covers the inner wall of the groove (110).

8. The packaging unit according to claim 7, characterized in that, The reflective layer (500) is made of a flexible material; and / or, The reflective layer (500) covers the surface of the substrate (100).

9. A backlight module, characterized in that, Includes the packaging unit as described in any one of claims 1 to 8.

10. A display device, characterized by comprising: It includes the packaging unit as described in any one of claims 1 to 8, or the backlight module as described in claim 9.

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