Substrate processing device

Abstract

This application provides a substrate processing apparatus. According to one embodiment, the substrate processing apparatus includes a substrate bonding chamber comprising a substrate bonding assembly capable of bonding a substrate onto a carrier. The substrate bonding assembly includes a process table, a carrier lifting module, a substrate lifting module, and a pressure application module. The process table has a preset area. The carrier lifting module is capable of protruding a portion of its area toward the upper side of the process table to move the carrier in a vertical direction. The substrate lifting module is capable of protruding a portion of its area toward the upper side of the process table to move the substrate in a vertical direction. The pressure application module is capable of applying pressure to the substrate toward the process table.

Description

Technical Field

[0001] This disclosure relates to a substrate processing apparatus. Background Technology

[0002] Organic light-emitting displays (OLEDs), as flat panel display devices, are ultra-thin display devices that achieve color images through the self-emission of organic materials. They are attracting attention as promising next-generation display devices due to their simple structure and high light efficiency. OLEDs can include an anode and a cathode, as well as an organic film between the anode and cathode.

[0003] Furthermore, micro-OLEDs offer higher resolution compared to traditional OLEDs. To increase resolution, more intricate circuitry is required. Therefore, silicon substrates are needed in the production of micro-OLEDs. This leads to a problem where processes for producing OLEDs using silicon substrates cannot be performed on equipment that previously used glass substrates. Utility Model Content

[0004] The purpose of this embodiment is to provide a substrate processing apparatus capable of effectively attaching a substrate to a carrier or separating a substrate from a carrier.

[0005] According to one approach, a substrate processing apparatus may include a substrate bonding chamber comprising a substrate bonding assembly capable of bonding a substrate onto a carrier. The substrate bonding assembly includes a process stage, a carrier lifting module, a substrate lifting module, and a pressure application module. The process stage has a preset area. The carrier lifting module is capable of protruding a portion of its area toward the upper side of the process stage to move the carrier in a vertical direction. The substrate lifting module is capable of protruding a portion of its area toward the upper side of the process stage to move the substrate in a vertical direction. The pressure application module is capable of applying pressure to the substrate toward the process stage.

[0006] In addition, the process worktable may be positioned with substrate pin holes facing the vertical direction. The substrate lifting module includes a lifting pin and a pin driving component. The lifting pin can protrude into the upper space of the process worktable after being inserted into the substrate pin hole, and the pin driving component is connected to the lifting pin and causes the lifting pin to move in the vertical direction.

[0007] In addition, the substrate lifting module may also include a sensing sensor connected to the lifting pin and measuring the magnitude of the force applied to the lifting pin.

[0008] In addition, the substrate lifting module may also include a position adjusting member connected to the lifting pin and performing position adjustment of the lifting pin.

[0009] In addition, a carrier pin hole can be positioned in the vertical direction in the process worktable. The carrier lifting module includes a carrier lifting pin and a carrier pin driving component. The carrier lifting pin can protrude into the upper space of the process worktable after being inserted into the carrier pin hole. The carrier pin driving component is connected to the carrier lifting pin and can make the carrier lifting pin move in the vertical direction.

[0010] In addition, the substrate bonding assembly may also include a stage drive member that is connected to the process stage and enables the process stage to move.

[0011] In addition, the substrate bonding assembly may also include a camera component located on the upper side of the process stage and capable of capturing an image of the process stage.

[0012] In addition, the pressure application module may include a pressure application frame, a pressure application driving member, and a pressure application member. The pressure application driving member is connected to the pressure application frame and is capable of moving the pressure application frame in the vertical direction. The pressure application member is connected to the pressure application frame and applies pressure to the substrate.

[0013] In addition, the pressure application module may also include an elastic member located between the pressure application member and the pressure application frame.

[0014] Furthermore, a downwardly recessed receiving groove may be positioned on the upper part of the pressure-applying member, and the lower part of the elastic member is located in the receiving groove.

[0015] In addition, the substrate processing apparatus may also include a pressure sensing sensor connected to the pressure applying member and measuring the magnitude of the force applied to the pressure applying member.

[0016] The substrate processing apparatus may further include a cleaning chamber connected to one side of the substrate bonding chamber and used to clean the carrier on which the substrate is bonded.

[0017] According to another embodiment, the substrate processing apparatus may include a substrate separation chamber comprising a substrate separation assembly capable of separating a substrate bonded to a carrier. The substrate separation assembly includes a process stage, a carrier lifting module, and a substrate lifting module. The process stage has a preset area, the carrier lifting module is capable of protruding a portion of its area above the process stage to move the carrier in a vertical direction, and the substrate lifting module is capable of protruding a portion of its area above the process stage to move the substrate in a vertical direction.

[0018] In addition, the substrate processing apparatus may also include a transfer chamber connected to the substrate separation chamber, for transporting the carrier with the substrate attached to it to the substrate separation chamber, and for removing the carrier with the substrate separated from it from the substrate separation chamber.

[0019] In addition, the substrate processing apparatus may also include a carrier inspection chamber connected to the transfer chamber and for performing inspection of the carrier in which the substrate is separated.

[0020] According to the substrate processing apparatus of the embodiment, the substrate can be effectively bonded to the carrier or separated from the carrier. Attached Figure Description

[0021] Figure 1 This is a diagram illustrating a substrate processing apparatus according to an embodiment.

[0022] Figure 2 It is shown Figure 1 A diagram of the substrate bonding assembly.

[0023] Figure 3 This is a diagram showing the state of the carrier being loaded on the process workbench.

[0024] Figure 4 This diagram shows the state in which the substrate is located in the upper region of the carrier, and Figure 5 This is a diagram showing the state in which the substrate is attached to the carrier.

[0025] Figure 6 This diagram shows the state in which the position of the process worktable has been adjusted.

[0026] Figure 7 This is a diagram illustrating a substrate processing apparatus according to another embodiment.

[0027] Figure 8 This is a diagram showing the state of the substrate being separated in the substrate separation assembly.

[0028] Figure 9 This is a diagram showing the state of the carrier being unloaded from the process workbench.

[0029] Figure 10 This is a diagram illustrating a substrate lifting module according to another embodiment.

[0030] Figure 11 This is a diagram illustrating a substrate lifting module according to yet another embodiment.

[0031] Figure 12 This is a diagram illustrating a substrate bonding assembly according to another embodiment.

[0032] Explanation of reference numerals in the attached figures

[0033] 2: Carrier loading section; 3: Carrier loading chamber; 4: Carrier sorting section; 5: Substrate loading section; 6: Substrate bonding chamber; 7: Cleaning chamber; 8: Unloading section; 9: Inspection section; 100: Substrate bonding assembly; 1000: Process worktable; 1010: Substrate pin hole; 1020: Carrier pin hole; 1100: Worktable drive component; 1200: Carrier lifting module; 1210: Carrier lifting pin; 1220: Carrier pin drive component 1300: Substrate lifting module; 1310: Lifting pin; 1315: Support member; 1320: Pin drive member; 1330: Position adjustment member; 1340: Sensing sensor; 1400: Pressure application module; 1410: Connecting frame part; 1420: Main frame part; 1430: Pressure driving member; 1440: Pressure application member; 1450: Elastic member; 1460: Pressure sensing sensor; 1500: Imaging member Detailed Implementation

[0034] Hereinafter, numerous embodiments of the present invention will be described in detail with reference to the accompanying drawings, so that those skilled in the art to which this invention pertains can easily implement the present invention. The present invention can be implemented in many different forms and is not limited to the embodiments described herein.

[0035] To clearly illustrate this utility model, parts unrelated to the description of this utility model have been omitted, and throughout the entire specification, the same or similar constituent elements are given the same reference numerals.

[0036] Furthermore, for ease of explanation, the size and thickness of each component shown in the accompanying drawings are arbitrarily depicted; therefore, this invention is not necessarily limited to the content shown in the drawings. In the drawings, the thickness of various layers and regions may be exaggerated to clearly illustrate their thickness. Additionally, in the accompanying drawings, the thickness of some layers and regions is exaggerated for ease of explanation.

[0037] Furthermore, when a part is referred to as a layer, membrane, region, plate, etc., being "above" or "on top of" another part, this includes not only that it is "directly" "above" the other part, but also that there is another part between them. Conversely, when a part is referred to as being "directly" "above" another part, it means that there is no other part between them. Additionally, when a part is referred to as being "above" or "on top of" a reference part, it means that it is located above or below the reference part, and does not mean that it must be "above" or "on top of" in the opposite direction of gravity.

[0038] Furthermore, throughout the specification, when a part is described as "comprising" a constituent element, it means, unless specifically stated otherwise, that other constituent elements may also be included, rather than excluding other constituent elements.

[0039] Furthermore, throughout the instruction manual, when referred to as "on a plane," it indicates the view of the object portion from above, and when referred to as "on a cross section," it indicates the view of the object portion being vertically cut across from the side.

[0040] Figure 1 This is a diagram showing a substrate processing apparatus 1 according to an embodiment.

[0041] Reference Figure 1 According to one embodiment, the substrate processing apparatus 1 may include a carrier loading section 2, a carrier loading chamber 3, a substrate loading section 5, a substrate bonding chamber 6, a cleaning chamber 7, and a loading section 8.

[0042] The substrate to be bonded is positioned on the carrier loading section 2. Figure 4 S) vehicle ( Figure 3 The CA is located therein. The vehicle loading unit 2 can provide identification for each vehicle CA individually via an identification code located on one side of the vehicle CA. The vehicle loading unit 2 can perform inspections on the vehicle CA. The vehicle loading unit 2 can perform shape checks on the vehicle CA. The vehicle loading unit 2 can check for the presence of an adhesive layer on the vehicle CA. Figure 3 (ST).

[0043] The carrier loading chamber 3 can be connected to the carrier loading section 2 and the substrate bonding chamber 6. The carrier loading chamber 3 can transport carriers CA from the carrier loading section 2 to the substrate bonding chamber 6. A carrier loading robot 30 can be located inside the carrier loading chamber 3. The carrier loading robot 30 can pick up carriers CA located in the carrier loading section 2 and transport them to the substrate bonding chamber 6. A carrier sorting section 4 can be connected to one side of the carrier loading chamber 3. The carrier loading robot 30 can transport carriers CA that are determined to be abnormal based on the inspection results performed in the carrier loading section 2 to the carrier sorting section 4. Furthermore, the carrier loading robot 30 can transport carriers CA that are determined to be normal based on the inspection results performed in the carrier loading section 2 to the substrate bonding chamber 6.

[0044] The substrate loading section 5 positions substrates S. The substrate loading section 5 can be configured to individually identify each substrate S using an identification code. Furthermore, the substrate loading section 5 can perform orientation alignment of the substrates S via a notch located on one side of each substrate S.

[0045] The substrate bonding chamber 6 is connected to the substrate loading section 5 and the carrier loading chamber 3. The substrate bonding chamber 6 bonds the substrate S loaded from the substrate loading section 5 onto the carrier CA loaded from the carrier loading chamber 3. The substrate bonding chamber 6 may include a substrate loading robot 61, a unloading robot 62, and a substrate bonding assembly 100. The substrate loading robot 61 can transfer the substrate S loaded from the substrate loading section 5 to the substrate bonding assembly 100. The unloading robot 62 can pick up the carrier CA with the substrate S bonded to it from the substrate bonding assembly 100 and remove it. The substrate bonding assembly 100 can bond the substrate S onto the carrier CA. The carrier CA with the substrate S to be bonded can be transferred to the substrate bonding assembly 100 via the carrier loading robot 30 in the carrier loading chamber 3.

[0046] The cleaning chamber 7 can be connected to one side of the substrate bonding chamber 6. The cleaning chamber 7 can clean the carrier CA to which the substrate S is bonded. The cleaning chamber 7 can include a cleaning table 70 and a cleaning head 72. The cleaning table 70 can support the carrier CA. The cleaning table 70 can be located on the cleaning track 71 and move along the cleaning track 71. The cleaning head 72 cleans the carrier CA. As an example, the cleaning head 72 can perform dry cleaning using ultrasonic waves. The cleaning head 72 can be located on the path for the cleaning table 70 to move along the cleaning track 71. The loading and unloading of the carrier CA into and out of the cleaning chamber 7 can be performed by the unloading robot 62. That is, the unloading robot 62 can pick up the carrier CA with the substrate S bonded to it from the substrate bonding assembly 100 and load it into the cleaning chamber 7. In addition, the unloading robot 62 can pick up the cleaned carrier CA from the cleaning chamber 7 and unload it to the unloading section 8.

[0047] The transfer section 8 positions a carrier CA to which the substrate S is bonded. An inspection section 9 can be located between the transfer section 8 and the substrate bonding chamber 6. The inspection section 9 can perform inspections on the carrier CA to which the substrate S is bonded. For example, the inspection section 9 can inspect the substrate S for cracks.

[0048] The transfer section 8 can accommodate multiple carriers CA. Furthermore, the transfer robot 62 can classify and detect abnormal carriers CA and non-abnormal carriers CA based on the inspection results of the inspection section 9, and transfer them to the transfer section 8.

[0049] Figure 2 It is shown Figure 1 Figure 100 of substrate bonding assembly.

[0050] Reference Figure 2 The substrate bonding assembly 100 may include a process worktable 1000, a carrier lifting module 1200, a substrate lifting module 1300, a pressure application module 1400, and an imaging component 1500.

[0051] The process worktable 1000 supports a carrier CA. The process worktable 1000 can be provided as a plate structure with a predetermined area. The area of ​​the upper surface of the process worktable 1000 can be greater than the area of ​​the lower surface of the carrier CA. Multiple substrate pin holes 1010 can be positioned in the process worktable 1000. The substrate pin holes 1010 can be positioned spaced apart from each other. The substrate pin holes 1010 can be positioned in the vertical direction, such that the upper end of the substrate pin hole 1010 is located on the upper surface of the process worktable 1000, and the lower end of the substrate pin hole 1010 is located on the lower surface of the process worktable 1000. The substrate pin holes 1010 can be positioned in sets. The area of ​​the region where the multiple substrate pin holes 1010 are positioned in a set can be less than the area of ​​a single substrate S. Therefore, when the substrate S is located on the process worktable 1000, the multiple substrate pin holes 1010 in a set can be located on the underside of the substrate S. Furthermore, multiple sets of substrate pin holes 1010 can be provided.

[0052] The process worktable 1000 may have multiple carrier pin holes 1020 positioned therein. The carrier pin holes 1020 may be positioned spaced apart from each other. The carrier pin holes 1020 may be positioned in the vertical direction, such that the upper end of the carrier pin hole 1020 is located on the upper surface of the process worktable 1000, and the lower end of the carrier pin hole 1020 is located on the lower surface of the process worktable 1000.

[0053] The process worktable 1000 can be connected to the worktable drive member 1100. The worktable drive member 1100 can move the process worktable 1000 on a horizontal plane. As an example, the process worktable 1000 can be movably positioned on the worktable drive member 1100.

[0054] The carrier lifting module 1200 can be located on the underside of the process table 1000. A portion of the carrier lifting module 1200 can protrude upwards from the process table 1000 through the carrier pin holes 1020, allowing the carrier CA to move vertically on the process table 1000. Multiple carrier lifting modules 1200 can be provided. The arrangement of multiple carrier lifting modules 1200 can correspond to the arrangement of the carrier pin holes 1020.

[0055] The vehicle lifting module 1200 may include a vehicle lifting pin 1210 and a vehicle pin drive component 1220.

[0056] The carrier lifting pin 1210 has a preset length. The length direction of the carrier lifting pin 1210 can be vertical. After being inserted into the carrier pin hole 1020, the carrier lifting pin 1210 can protrude upwards towards the process table 1000. Furthermore, the upper end of the carrier lifting pin 1210 can be provided with a piping structure to create a negative pressure at the upper end of the carrier lifting pin 1210. Thus, when the carrier CA is located on the carrier lifting pin 1210, the carrier CA can be fixed on the carrier lifting pin 1210 when a negative pressure is created at the upper end of the carrier lifting pin 1210.

[0057] The carrier pin drive member 1220 can be connected to the carrier lifting pin 1210 and move the carrier lifting pin 1210 in the vertical direction. Thus, with the carrier pin hole 1020 aligned vertically with the carrier lifting pin 1210, when the carrier pin drive member 1220 raises the carrier lifting pin 1210, the carrier lifting pin 1210 protrudes upwards through the carrier pin hole 1020 toward the upper side of the process table 1000. The carrier pin drive member 1220 may include a motor, a hydraulic cylinder, etc.

[0058] The substrate lifting module 1300 can be located on the lower side of the process stage 1000. The substrate lifting module 1300 can allow a portion of its area to protrude upwards from the process stage 1000 through the substrate pin hole 1010, thereby allowing the substrate S to move vertically on the process stage 1000. The substrate lifting module 1300 may include a lifting pin 1310, a pin drive member 1320, a position adjustment member 1330, and a sensing sensor 1340.

[0059] The lifting pin 1310 has a preset length. The length direction of the lifting pin 1310 can be vertical. After being inserted into the substrate pin hole 1010, the lifting pin 1310 protrudes into the upper space of the process table 1000. Multiple lifting pins 1310 can be provided. The number of lifting pins 1310 can be the same as the number of substrate pin holes 1010 in a group. Furthermore, the arrangement of multiple lifting pins 1310 can correspond to the arrangement of a group of substrate pin holes 1010. Thus, the lifting pin 1310 can rise and protrude into the upper space of the process table 1000 while vertically aligned with a group of substrate pin holes 1010. As an example, the lower part of the multiple lifting pins 1310 can be connected to the support member 1315. Furthermore, when the support member 1315 rises or falls, the lifting pins 1310 connected to the support member 1315 rise or fall. Furthermore, the upper end of the lifting pin 1310 can be provided with a piping structure to form a negative pressure at the upper end of the lifting pin 1310. Thus, when the substrate S is located on the lifting pin 1310, the substrate S can be fixed on the lifting pin 1310 when a negative pressure is formed at the upper end of the lifting pin 1310.

[0060] The pin drive component 1320 can be connected to the lifting pin 1310 and cause the lifting pin 1310 to move in the vertical direction. The pin drive component 1320 can be connected to the support component 1315. The pin drive component 1320 may include a motor, hydraulic cylinder, etc.

[0061] The position adjustment member 1330 can be connected to the lifting pin 1310 and performs position adjustment of the lifting pin 1310 on the horizontal plane. The position adjustment member 1330 can be located between the pin drive member 1320 and the lifting pin 1310. The position adjustment member 1330 can also be located between the pin drive member 1320 and the support member 1315. Thus, the position adjustment member 1330 can rise or fall together with the lifting pin 1310 via the pin drive member 1320.

[0062] The sensing sensor 1340 can be connected to the lifting pin 1310 and measure the magnitude of the force acting on the lifting pin 1310. The sensing sensor 1340 can be connected to the support member 1315. The sensing sensor 1340 can be located between the pin drive member 1320 and the support member 1315. The sensing sensor 1340 can be located between the position adjustment member 1330 and the support member 1315.

[0063] The pressure application module 1400 can apply pressure to the substrate S toward the process stage 1000 to make the substrate S adhere to the carrier CA. The pressure application module 1400 is located on the upper side of the process stage 1000. The pressure application module 1400 may include pressure application frames 1410 and 1420, pressure application drive member 1430, pressure application member 1440, elastic member 1450, and pressure sensing sensor 1460.

[0064] Pressure frames 1410 and 1420 provide the skeleton of the pressure module 1400. Pressure frames 1410 and 1420 may include a main frame portion 1420 and a connecting frame portion 1410. The main frame portion 1420 has a predetermined volume. The connecting frame portion 1410 is connected to the main frame portion 1420. The connecting frame portion 1410 may be provided to protrude downwards from the main frame portion 1420. As an example, the connecting frame portion 1410 may have a rod structure, and its upper part is connected to the lower part of the main frame portion 1420. Multiple connecting frame portions 1410 may be provided. Multiple connecting frame portions 1410 are positioned spaced apart from each other.

[0065] The pressure driving member 1430 can be connected to the pressure frames 1410 and 1420 and cause the pressure frames 1410 and 1420 to move in the vertical direction. The pressure driving member 1430 can be connected to the main frame portion 1420. The pressure driving member 1430 may include a motor, a hydraulic cylinder, etc.

[0066] The pressure-applying member 1440 is connected to the pressure-applying frames 1410 and 1420. The pressure-applying member 1440 can be connected to the lower part of the connecting frame portion 1410. When the pressure-applying frames 1410 and 1420 descend toward the process table 1000, the pressure-applying member 1440 applies pressure to the substrate S located on the process table 1000, so that the substrate S adheres to the carrier CA.

[0067] The elastic member 1450 can be located between the pressure-applying member 1440 and the pressure-applying frames 1410 and 1420. During the process of the pressure-applying member 1440 applying pressure to the substrate S, the elastic member 1450 prevents the substrate S from being subjected to excessive force. The upper part of the pressure-applying member 1440 can be positioned with a downwardly recessed receiving groove 1441. Furthermore, the lower part of the elastic member 1450 can be located inside the receiving groove 1441. Thus, particles can be prevented from falling out of the elastic member 1450.

[0068] The pressure sensing sensor 1460 can be connected to the pressure applying member 1440 and measure the magnitude of the force applied to the pressure applying member 1440. The pressure sensing sensor 1460 can be located between the pressure applying member 1440 and the pressure applying frames 1410 and 1420. The pressure sensing sensor 1460 can be located between the pressure applying member 1440 and the connecting frame portion 1410. The pressure sensing sensor 1460 can be located between the elastic member 1450 and the connecting frame portion 1410.

[0069] The imaging component 1500 is located on the upper side of the process worktable 1000. The imaging component 1500 can capture images of the process worktable 1000. Thus, the imaging component 1500 can capture images of the state in which the carrier CA is aligned on the process worktable 1000, the state in which the substrate S is aligned on the carrier CA, and the state in which the pressure-applying component 1440 applies pressure to the substrate S.

[0070] Figure 3 This diagram shows the state of the carrier CA being loaded on the process worktable 1000.

[0071] Reference Figure 3 To load the carrier CA, the process table 1000 is first positioned so that the carrier pin hole 1020 is aligned vertically with the carrier lifting pin 1210. Then, the carrier pin drive member 1220 raises the carrier lifting pin 1210. As a result, the carrier lifting pin 1210 protrudes into the upper space of the process table 1000 through the carrier pin hole 1020. The carrier CA is then loaded onto the carrier lifting pin 1210. Subsequently, when the carrier pin drive member 1220 lowers the carrier lifting pin 1210, the carrier CA is positioned on the upper surface of the process table 1000.

[0072] The carrier CA can be provided as a plate structure with a predetermined area and thickness. At least one substrate receiving region R can be positioned on the upper surface of the carrier CA. For example, the substrate receiving region R can have an area corresponding to the substrate S and a recessed shape according to a predetermined depth. Furthermore, a pin lifting hole PH can be positioned in the carrier CA. The pin lifting hole PH can be located inside the substrate receiving region R. The arrangement of the pin lifting holes PH can correspond to the arrangement of the substrate pin holes 1010. Thus, when the carrier CA is correctly positioned on the process table 1000, the pin lifting holes PH can be vertically aligned with the substrate pin holes 1010. Additionally, an adhesive layer ST can be positioned in the carrier CA. The adhesive layer ST can be located inside the substrate receiving region R.

[0073] Figure 4 This diagram shows the state in which the substrate S is located in the upper region of the carrier CA, and Figure 5 This diagram shows the state in which the substrate S is attached to the carrier CA.

[0074] Reference Figure 4 and Figure 5 After the carrier CA is positioned on the process table 1000, the substrate S is attached to the carrier CA. For this purpose, the pin drive member 1320 first raises the lifting pin 1310. As a result, the lifting pin 1310 protrudes into the upper space of the carrier CA through the substrate pin hole 1010 and the pin lifting hole PH. The substrate S is then loaded onto the lifting pin 1310. Subsequently, when the pin drive member 1320 lowers the lifting pin 1310, the substrate S is positioned in the substrate receiving area R of the carrier CA. Then, when the pressure drive member 1430 lowers the pressure member 1440 to apply pressure to the substrate S, the substrate S is attached to the carrier CA. During the pressure application process on the substrate S, the force acting on the pressure member 1440 can be measured by the pressure sensing sensor 1460. Therefore, the operating state of the pressure drive member 1430 can be adjusted to prevent the pressure member 1440 from applying excessive force to the substrate S.

[0075] When the substrate S is bonded, the pressure driving member 1430 raises the pressure member 1440. Thus, the bonding of the substrate S to a substrate receiving area R is complete. Subsequently, the pin driving member 1320 raises the lifting pin 1310. Therefore, after the lifting pin 1310 contacts the substrate S, the force exerted by the substrate S on the lifting pin 1310 can be sensed by the sensing sensor 1340. This allows it to be determined whether the substrate S is correctly bonded to the carrier CA. Subsequently, the pin driving member 1320 lowers the lifting pin 1310.

[0076] Figure 6 This diagram shows the state in which the position of the process worktable 1000 is adjusted.

[0077] Reference Figure 6 The worktable drive component 1100 can move the process worktable 1000 to perform position adjustment of the process worktable 1000. Therefore, another substrate accommodating area R in the carrier CA can be located in the upper space of the substrate lifting module 1300. Furthermore, through... Figure 4 and Figure 5 The process described above can be used to bond substrate S to another substrate accommodating region R.

[0078] Subsequently, once the substrate S on the carrier CA has been bonded, the carrier CA can be moved out of the process table 1000. For this purpose, the process table 1000 can be positioned so that the carrier pin hole 1020 and the carrier lifting pin 1210 are vertically aligned, and the carrier pin drive member 1220 can raise the carrier lifting pin 1210. Thus, the carrier lifting pin 1210 can lift the carrier CA while protruding through the carrier pin hole 1020 into the upper space of the process table 1000. Furthermore, the transport robot 62 can pick up the carrier CA.

[0079] According to one embodiment, the substrate processing apparatus 1 can effectively bond a substrate S onto a carrier CA. The carrier CA can then have a size corresponding to that of a display panel. Therefore, the substrate S, while bonded to the carrier CA, can be placed into equipment used in the production of display panels and undergo a manufacturing process. The substrate S can be a silicon substrate.

[0080] Figure 7 This is a diagram showing a substrate processing apparatus 1a according to another embodiment.

[0081] Reference Figure 7 The substrate processing apparatus 1a may include a loading section 2a, a transfer chamber 3a, a substrate separation chamber 4a, a substrate unloading section 5a, a carrier inspection chamber 6a, and a carrier unloading section 7a.

[0082] The loading section 2a positions a carrier CA to which the substrate S is attached. As an example, the carrier CA to which the substrate S is attached can be transferred and placed into the carrier loading section 2a by a transport device such as an Automated Guided Vehicle (AGV) or by personnel. The substrate S is attached to the carrier CA, and it may be in a state where an organic vapor deposition process or an encapsulation process has been performed.

[0083] The transfer chamber 3a can be connected to the loading section 2a. The transfer chamber 3a may include a transfer robot 30a. The transfer robot 30a can pick up the carrier CA with the substrate S attached from the loading section 2a and transfer it to the substrate separation chamber 4a. Furthermore, after the transfer robot 30a picks up and removes the carrier CA from the substrate separation chamber 4a, after the substrate S has been separated, it transfers it to the carrier removal section 7a. The transfer chamber 3a may include a transfer track 31a. The transfer robot 30a can be located on the transfer track 31a and move along the transfer track 31a.

[0084] The substrate separation chamber 4a can be connected to one side of the transfer chamber 3a. The substrate separation chamber 4a may include a substrate separation assembly 100a and a substrate handling robot 40a.

[0085] The substrate separation assembly 100a separates the substrate S from the carrier CA. The carrier CA with the substrate S attached can be transferred to the substrate separation assembly 100a by the transfer robot 30a. The carrier identification unit 41a can be located on one side of the substrate separation chamber 4a. The carrier identification unit 41a can be located in the area between the substrate separation assembly 100a and the transfer chamber 3a. The carrier identification unit 41a can provide the ability to individually identify each carrier CA by means of an identification code located on one side of the carrier CA. In addition, the carrier identification unit 41a can perform orientation alignment before the carrier CA is placed into the substrate separation assembly 100a.

[0086] The substrate removal robot 40a can transport substrates S separated from the carrier CA to outside the substrate separation chamber 4a. A substrate inspection unit 42a and a substrate loading unit 43a can be located on one side of the substrate separation chamber 4a. The substrate inspection unit 42a performs surface inspection on the substrates S separated from the carrier CA. For example, the substrate inspection unit 42a can check for cracks on the substrates S and for impurities such as adhesive substances adhering to the surface of the substrates S. Furthermore, the substrate inspection unit 42a can be configured to individually identify each substrate S using an identification code. The substrate loading unit 43a provides space for loading the substrates S. For example, the substrate loading unit 43a can have a structure where the space for loading the substrates S is stacked in multiple sections. The substrate removal robot 40a can transport substrates S separated from the carrier CA to the substrate inspection unit 42a. Furthermore, the substrate removal robot 40a can transport substrates S that are determined to be free of abnormalities in the substrate inspection unit 42a from the substrate inspection unit 42a to the substrate removal unit 5a. Furthermore, the substrate handling robot 40a can transport substrates S that are determined to be abnormal in the substrate inspection unit 42a from the substrate inspection unit 42a to the substrate loading unit 43a.

[0087] The substrate removal section 5a can be connected to one side of the substrate separation chamber 4a. The substrate removal section 5a can perform orientation alignment of the substrate S through a notch located on one side of the substrate S.

[0088] The carrier inspection chamber 6a is connected to one side of the transfer chamber 3a. The carrier inspection chamber 6a performs inspection of the carrier CA after the substrate S has been separated. For example, the carrier inspection chamber 6a can inspect whether there is residual adhesive layer ST in the carrier CA, whether there are cracks on the carrier CA, etc. The carrier inspection chamber 6a may have a structure in which the space for loading the carrier CA is stacked in multiple segments and can accommodate multiple carrier CAs. The carrier CA after the substrate S has been separated can be transferred from the substrate separation chamber 4a to the carrier inspection chamber 6a by the transfer robot 30a.

[0089] The vehicle removal section 7a can be connected to one side of the transfer chamber 3a. Vehicles CA that have undergone inspection in the vehicle inspection chamber 6a can be transferred from the vehicle inspection chamber 6a to the vehicle removal section 7a via the transfer robot 30a. Vehicles CA located in the vehicle removal section 7a can be moved outside the vehicle removal section 7a by a transport device such as an Automated Guided Vehicle (AGV) or by personnel.

[0090] Figure 8 This is a diagram showing the state of separating the substrate S in the substrate separation assembly 100a.

[0091] Reference Figure 8 The substrate separation assembly 100a may include a process worktable 1000a, a worktable drive component 1100a, a carrier lifting module 1200a, a substrate lifting module 1300a, and an imaging component 1500a.

[0092] The process worktable 1000a supports the carrier CA. The process worktable 1000a has a base plate pin hole 1010a and a carrier pin hole 1020a for positioning. A worktable drive component 1100a is connected to the process worktable 1000a. The structures of the process worktable 1000a and the worktable drive component 1100a can be combined with… Figure 2 The process worktable 1000 and the worktable drive component 1100 described above are the same or similar, and repeated descriptions of them will be omitted.

[0093] The carrier lifting module 1200a can be located below the process worktable 1000a. The carrier lifting module 1200a may include a carrier lifting pin 1210a and a carrier pin drive component 1220a. The structure of the carrier lifting module 1200a can be... Figure 2 The vehicle lifting module 1200 described above is the same as or similar to the one described above, and repeated descriptions of it will be omitted.

[0094] The substrate lifting module 1300a can be located below the process stage 1000a. The substrate lifting module 1300a may include a lifting pin 1310a, a support member 1315a, a pin drive member 1320a, a position adjustment member 1330a, and a sensing sensor 1340a. The structure of the substrate lifting module 1300a can be... Figure 2 The substrate lifting module 1300 described above is the same as or similar to the one described above, and further description of it will be omitted.

[0095] The imaging component 1500a is located on the upper side of the process worktable 1000a. The imaging component 1500a can capture images of the process worktable 1000a. Thus, the imaging component 1500a can capture images of the state in which the carrier CA is aligned on the process worktable 1000a, the state in which the substrate S is separated from the carrier CA, etc.

[0096] To separate the substrate S from the carrier CA, the carrier CA, with the substrate S attached, is moved into the substrate separation assembly 100a. For this purpose, the process stage 1000a is first positioned so that the carrier pin hole 1020a is aligned vertically with the carrier lifting pin 1210a. Then, the carrier pin drive member 1220a raises the carrier lifting pin 1210a. As a result, the carrier lifting pin 1210a protrudes into the upper space of the process stage 1000a through the carrier pin hole 1020a. Furthermore, the carrier CA is loaded onto the carrier lifting pin 1210a. Subsequently, when the carrier pin drive member 1220a lowers the carrier lifting pin 1210a, the carrier CA is positioned on the upper surface of the process stage 1000a. Then, the pin drive member 1320a raises the lifting pin 1310a. Therefore, the lifting pin 1310a can push the substrate S while rising through the substrate pin hole 1010a and the pin lifting hole PH, thereby separating the substrate S from the carrier CA. When the lifting pin 1310a pushes the substrate S, the force acting between the lifting pin 1310a and the substrate S can be measured by the sensing sensor 1340A. This allows control of the operating state of the pin drive member 1320A to prevent the lifting pin 1310a from pushing the substrate S with excessive force. With the lifting pin 1310a in the raised state, the substrate S located on the lifting pin 1310a can be moved out of the substrate separation assembly 100a by the substrate removal robot 40a. Subsequently, the pin drive member 1320a lowers the lifting pin 1310a. Furthermore, the table drive member 1100a can adjust the position of the process table 1000a by moving the process table 1000a. Thus, the area in the carrier CA where the substrate S is attached can be located in the upper space of the substrate lifting module 1300a. Furthermore, the separation and removal of substrate S can be repeated through the above process.

[0097] Figure 9 This is a diagram showing the state of unloading carrier CA from process workbench 1000a.

[0098] Reference Figure 9 When all substrates S attached to the carrier CA are separated, the carrier CA is removed from the substrate separation assembly 100a. To do this, the process stage 1000a is first positioned so that the carrier pin hole 1020a is aligned vertically with the carrier lifting pin 1210a. Then, the carrier pin drive member 1220a raises the carrier lifting pin 1210a. Thus, the carrier lifting pin 1210a pushes the carrier CA as it rises through the carrier pin hole 1020a. With the carrier lifting pin 1210a raised, the carrier CA located on the carrier lifting pin 1210a can be removed from the substrate separation assembly 100a by the transfer robot 30a.

[0099] According to another embodiment, the substrate processing apparatus 1a can effectively separate the substrate S from the carrier CA. Thus, the substrate S can be safely separated from the carrier CA after the manufacturing process is performed while it is attached to the carrier CA.

[0100] Figure 10 This is a diagram showing a substrate lifting module 1300b according to another embodiment.

[0101] Reference Figure 10 The substrate lifting module 1300b may include a lifting pin 1310b, a pin driving component 1320b, and a sensing sensor 1330b.

[0102] The lifting pin 1310b has a preset length. The length direction of the lifting pin 1310b can be vertical. Multiple lifting pins 1310b can be provided. The number of lifting pins 1310b can be the same as the number of base plate pin holes 1010 or 1010a in a group. Furthermore, the arrangement of multiple lifting pins 1310b can be... Figure 2 The arrangement of the substrate pin holes 1010 in one group corresponds to that described above. Therefore, the lifting pin 1310b can rise and protrude into the upper space of the process table 1000 while aligned vertically with the substrate pin holes 1010 in one group. For example, the lower parts of the plurality of lifting pins 1310b can be connected to the support member 1315b. Furthermore, when the support member 1315b rises or falls, the lifting pins 1310b connected to the support member 1315b rise or fall accordingly. Additionally, the upper end of the lifting pin 1310b can be provided with a piping structure to create a negative pressure at the upper end of the lifting pin 1310b. Therefore, when the substrate S is located on the lifting pin 1310b, and a negative pressure is created at the upper end of the lifting pin 1310b, the substrate S can be fixed to the lifting pin 1310b.

[0103] A buffer pad member 1311b can be positioned at the upper end of the lifting pin 1310b. The buffer pad member 1311b can be provided with an elastic coefficient that is smaller than that of the lifting pin 1310b. Thus, the buffer pad member 1311b can buffer the impact generated between the lifting pin 1310b and the substrate S.

[0104] The pin drive component 1320b can be connected to the lifting pin 1310b and cause the lifting pin 1310b to move in the vertical direction. The pin drive component 1320b can be connected to the support component 1315b. The pin drive component 1320b may include a motor, hydraulic cylinder, etc.

[0105] The sensing sensor 1330b can be connected to the lifting pin 1310b and measure the magnitude of the force acting on the lifting pin 1310b. The sensing sensor 1330b can be located between the lifting pin 1310b and the support member 1315b.

[0106] The 1300b baseboard lifting module can be used as Figures 2 to 6 The aforementioned substrate bonding assembly 100 comprises the structural elements of the substrate bonding assembly 100. Furthermore, the substrate lifting module 1300b can be used as... Figure 8 and Figure 9 The constituent elements of the substrate separation assembly 100a mentioned above.

[0107] Figure 11 This is a diagram showing a substrate lifting module 1300c according to yet another embodiment.

[0108] Reference Figure 11 Multiple substrate lifting modules 1300c can be provided. Multiple substrate lifting modules 1300c can be positioned spaced apart from each other. The arrangement of multiple substrate lifting modules 1300c can be... Figure 2 The arrangement of the substrate pin holes 1010 in one of the above groups corresponds to this arrangement.

[0109] The substrate lifting module 1300c may include a lifting pin 1310c, a pin driving component 1320c, and a sensing sensor 1330c.

[0110] The lifting pin 1310c has a preset length. The length direction of the lifting pin 1310c can be oriented vertically. Furthermore, the upper end of the lifting pin 1310c can be provided with a piping structure to create a negative pressure at the upper end of the lifting pin 1310c. Thus, when the substrate S is located on the lifting pin 1310c, the substrate S can be fixed on the lifting pin 1310c when a negative pressure is created at the upper end of the lifting pin 1310c.

[0111] A buffer pad member 1311c can be positioned at the upper end of the lifting pin 1310c. The buffer pad member 1311c can be provided with an elastic coefficient that is smaller than that of the lifting pin 1310c. Thus, the buffer pad member 1311c can buffer the impact generated between the lifting pin 1310c and the substrate S.

[0112] The pin drive member 1320c can be connected to the lifting pin 1310c and move the lifting pin 1310c in the vertical direction. Thus, with the base plate pin hole 1010 and the lifting pin 1310c aligned vertically, when the pin drive member 1320c raises the lifting pin 1310c, the lifting pin 1310c protrudes upwards through the base plate pin hole 1010 toward the upper side of the process table 1000. The pin drive member 1320c may include a motor, a hydraulic cylinder, etc.

[0113] The sensing sensor 1330c can be connected to the lifting pin 1310c and measure the magnitude of the force acting on the lifting pin 1310c. The sensing sensor 1330c can be located between the lifting pin 1310c and the pin drive member 1320c.

[0114] The 1300c baseboard lifting module can be used as Figures 2 to 6 The aforementioned substrate bonding assembly 100 comprises the constituent elements. Furthermore, the substrate lifting module 1300c can be used as... Figure 8 and Figure 9 The constituent elements of the substrate separation assembly 100a mentioned above.

[0115] Figure 12 This is a diagram illustrating a substrate bonding assembly 100d according to another embodiment.

[0116] Reference Figure 12 According to another embodiment, the substrate bonding assembly 100d may include a process worktable 1000d, a worktable driving component 1100d, a carrier lifting module 1200d, a substrate lifting module 1300d, a pressure application module 1400d, and an imaging component 1500d.

[0117] The pressure module 1400d is provided to spray gas toward the process stage 1000d. Thus, the gas sprayed from the pressure module 1400d can press the substrate S toward the carrier CA to cause the substrate S to adhere to the carrier CA. As an example, the pressure module 1400d can be an ultrasonic dry cleaner.

[0118] Process workbench 1000d, workbench drive component 1100d, carrier lifting module 1200d, and imaging component 1500d and Figure 2The process worktable 1000, worktable drive component 1100, carrier lifting module 1200 and shooting component 1500 mentioned above are the same or similar, and repeated descriptions of them will be omitted.

[0119] The 1300d baseboard lifting module can be used with Figure 2 The aforementioned baseboard lifting module 1300, Figure 10 The aforementioned substrate lifting module 1300b and Figure 11 The description of the substrate lifting module 1300c described above is the same as or similar to that described above, and repeated descriptions of this will be omitted.

[0120] Although the embodiments of the present invention have been described in detail above, the scope of the present invention is not limited thereto. Various modifications and improvements made by those skilled in the art using the basic concepts of the present invention as defined in the appended claims also fall within the scope of the present invention.

Claims

1. A substrate processing apparatus, characterized in that, include: A substrate bonding chamber, including a substrate bonding assembly for bonding a substrate onto a carrier. The substrate bonding assembly includes: The process workbench has a preset area; The carrier lifting module causes a portion of the vehicle to protrude upwards toward the upper side of the process workbench, enabling the carrier to move vertically. A substrate lifting module causes a portion of the substrate to protrude towards the upper side of the process stage, thereby moving the substrate in the vertical direction; and The pressure application module applies pressure to the substrate toward the process worktable.

2. The substrate processing apparatus according to claim 1, characterized in that, The process workbench is equipped with substrate pin holes positioned in the vertical direction. The substrate lifting module includes: The lifting pin, after being inserted into the pin hole of the substrate, protrudes into the upper space of the process stage; and A pin drive component is connected to the lifting pin and causes the lifting pin to move in the vertical direction.

3. The substrate processing apparatus according to claim 1, characterized in that, The process workbench has a carrier pin hole positioned in the vertical direction. The vehicle lifting module includes: The carrier lifting pin, after being inserted into the carrier pin hole, protrudes into the upper space of the process worktable; and A vehicle pin drive component is connected to the vehicle lifting pin and causes the vehicle lifting pin to move in the vertical direction.

4. The substrate processing apparatus according to claim 1, characterized in that, The substrate bonding assembly further includes: A worktable drive component is connected to the process worktable and causes the process worktable to move.

5. The substrate processing apparatus according to claim 1, characterized in that, The substrate bonding assembly further includes: The imaging component is located on the upper side of the process worktable and captures an image of the process worktable.

6. The substrate processing apparatus according to claim 1, characterized in that, The pressure application module includes: Pressure framework; A pressure-applying drive member, connected to the pressure-applying frame and causing the pressure-applying frame to move in the vertical direction; and A pressure-applying member is connected to the pressure-applying frame and applies pressure to the substrate.

7. The substrate processing apparatus according to claim 1, characterized in that, Also includes: A cleaning chamber is connected to one side of the substrate bonding chamber and is used to clean the carrier to which the substrate is bonded.

8. A substrate processing apparatus, characterized in that, include: A substrate separation chamber includes a substrate separation assembly for separating substrates bonded to a carrier. The substrate separation assembly includes: The process workbench has a preset area; A carrier lifting module causes a portion of the carrier to protrude upwards towards the upper side of the process worktable, enabling the carrier to move vertically; and The substrate lifting module causes a portion of the substrate to protrude toward the upper side of the process worktable and moves the substrate in the vertical direction.

9. The substrate processing apparatus according to claim 8, characterized in that, Also includes: The transfer chamber is connected to the substrate separation chamber. The carrier with the substrate attached is transferred to the substrate separation chamber, and the carrier with the substrate separated is removed from the substrate separation chamber.

10. The substrate processing apparatus according to claim 9, characterized in that, Also includes: A carrier inspection chamber is connected to the transfer chamber and performs inspections of the carrier after the substrate has been separated.

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