A processing device and semiconductor apparatus

Abstract

The utility model belongs to the field of semiconductor processing technology discloses a kind of processing device and semiconductor equipment, the processing device includes at least two cooling layers and a layer of buffer layer, the cooling layer is provided with at least two wafer cooling zones, and the buffer layer is provided with at least one wafer buffer area.The processing device of the utility model can improve the efficiency of wafer cooling, and speed up process flow.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor processing technology, and in particular to a processing device and semiconductor equipment. Background Technology

[0002] In related technologies, de-attachment machines mostly employ single-wafer transport. During wafer loading, the interior of the de-attachment machine is open to the atmosphere; after wafer loading is complete, the de-attachment machine needs to be evacuated and the wafer temperature raised to facilitate subsequent transport and processing; after the processing is completed, the de-attachment machine returns to the atmosphere and the wafer is cooled.

[0003] Because the desizing machine takes a long time to switch between atmospheric and vacuum conditions, the single-wafer transport requires frequent state switching, which greatly reduces the overall efficiency of the desizing machine. Therefore, a desizing machine capable of processing multiple wafers simultaneously was designed.

[0004] However, when multiple wafers are present in the desizing machine, after the wafers cool, the robot arm needs to transfer each wafer to a wafer cassette based on its individual position. With a large number of wafers, this requires repeated parameter adjustments, which is not only inefficient but also causes significant wear and tear on the robot arm. Utility Model Content

[0005] One object of this utility model is to provide a processing device, comprising:

[0006] At least two cooling layers and one buffer layer;

[0007] The cooling layer is provided with at least two wafer cooling zones, and the cooling layer is used to cool the wafer;

[0008] The cache layer is provided with at least one wafer cache area, which is used to cache the wafer after cooling is completed.

[0009] In one embodiment, the cooling layer is provided with a cold plate and a lower cover plate, the cold plate being above the lower cover plate, and a cold water channel being provided on the side of the cold plate opposite to the lower cover plate, the cold water channel being used to house cold water pipes.

[0010] In one embodiment, the cooling layer is provided with a wafer positioning module, which is used to adjust the position of the wafer placed in the wafer cooling area.

[0011] In one embodiment, the cooling layer is provided with a height adjustment mechanism for adjusting the height of the cooling layer.

[0012] In one embodiment, the cooling layer is provided with a lifting mechanism for adjusting the height of the wafer in the cooling layer.

[0013] In one embodiment, the cooling layer is provided with a first sensor;

[0014] The first sensor is used to detect whether a wafer is placed in the wafer cooling area; and / or,

[0015] The first sensor is used to detect whether the position of the wafer placed in the wafer cooling area is accurate; and / or,

[0016] The first sensor is used to detect whether the wafer placed in the wafer cooling zone has been successfully cooled.

[0017] In one embodiment, the cache layer is provided with a position adjustment module, which is used to adjust the position of the wafer placed in the wafer cache area.

[0018] In one embodiment, the cache layer is provided with a second sensor;

[0019] The second sensor is used to detect whether a wafer is placed in the wafer buffer area; and / or,

[0020] The second sensor is used to detect whether the position of the wafer placed in the wafer buffer area is accurate; and / or,

[0021] The second sensor is used to detect the buffer duration of the wafer in which the wafer buffer area is placed.

[0022] Another objective of this invention is to provide a semiconductor device with a processing unit capable of simultaneously cooling multiple wafers, which helps to improve the overall working efficiency of the desizing machine.

[0023] To achieve this objective, the present invention provides a semiconductor device comprising the processing apparatus as described above.

[0024] The beneficial effects of this utility model are:

[0025] The processing device provided by this invention includes at least two cooling layers, and each cooling layer is provided with at least two wafer cooling zones. Therefore, the processing device provided by this invention can cool at least two wafers at the same time, effectively improving the wafer cooling efficiency.

[0026] The processing device provided by this invention includes a buffer layer. After the wafer has been cooled in the cooling layer, it will be transferred from the cooling layer to the buffer layer. Furthermore, the robot only needs to transfer the wafer in the wafer buffer area to the wafer cassette according to the fixed position of the wafer buffer area. Since the wafer is only transferred to the buffer layer after cooling, the robot's wafer transfer efficiency is higher, and the robot does not need to repeatedly adjust the setting parameters, which helps to reduce the wear and tear on the robot. Attached Figure Description

[0027] Figure 1 This is a schematic diagram of the processing device provided in an embodiment of the present utility model;

[0028] Figure 2 This is a schematic diagram of the cooling layer of the processing device provided in this embodiment of the utility model;

[0029] Figure 3 This is a schematic diagram of the bottom structure of the cooling layer of the processing device provided in this embodiment of the utility model;

[0030] Figure 4 This is a schematic diagram of the structure of the cache layer of the processing device provided in this embodiment of the utility model;

[0031] In the picture:

[0032] 1. Cooling layer; 11. Wafer cooling area; 12. Cold tray; 121. Cooling water channel; 1211. Cooling water pipe; 13. Lower cover plate; 14. Wafer positioning module; 15. Height adjustment mechanism; 16. Lifting mechanism; 17. First sensor;

[0033] 2. Cache layer; 21. Wafer cache area; 22. Position adjustment module; 23. Second sensor. Detailed Implementation

[0034] The technical solution of this utility model will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0035] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this utility model and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The terms "first position" and "second position" refer to two different positions. Moreover, "above," "on top of," and "over" the first feature in relation to the second feature includes the first feature directly above and diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "under," and "below" the first feature in relation to the second feature includes the first feature directly below and diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0036] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0037] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0038] Figure 1A schematic diagram of a processing device is shown. The device includes at least two cooling layers 1 and a buffer layer 2. The cooling layers 1 have at least two wafer cooling zones 11 for cooling the wafers. The buffer layer 2 has at least one wafer buffer zone 21 for buffering the cooled wafers. By providing at least two wafer cooling zones 11 on each cooling layer 1, the processing device can simultaneously cool at least two wafers. After cooling is complete in the cooling layers 1, the wafers are transferred from the cooling layers 1 to the buffer layer 2. Furthermore, the robotic arm only needs to transfer the wafers from the wafer buffer zone 21 to the wafer cassette based on the fixed position of the wafer buffer zone 21. Since the wafers are only transferred to the buffer layer 2 after cooling, the robotic arm's wafer transfer efficiency is higher, and the robotic arm does not need to repeatedly adjust its settings, which helps reduce wear and tear on the robotic arm.

[0039] It should be noted that the "robotic arm" described in this embodiment is a "robotic arm" already used in related technologies. Based on the processing device provided by this utility model, there is no need to provide a new robotic arm adapted to the processing device provided by this utility model, which helps to save the modification costs required for semiconductor equipment using the processing device provided by this utility model.

[0040] Next, this embodiment will describe the cooling layer 1 and the buffer layer 2 respectively.

[0041] For cooling layer 1:

[0042] Figure 2 A schematic diagram of the structure of the cooling layer 1 of the processing device provided in this embodiment of the present invention is shown.

[0043] In some embodiments, the cooling layer 1 is provided with a cold plate 12 and a lower cover plate 13. The cold plate 12 is above the lower cover plate 13. A cold water channel 121 is provided on the side of the cold plate 12 opposite to the lower cover plate 13. The cold water channel 121 is used to place the cold water pipe 1211. The cold water channel 121 is filled with thermally conductive silicone grease.

[0044] After the wafer in the stripping chamber has completed processing, it will be transferred to cooling layer 1 for cooling. Process cooling water (PCW) flowing through cooling water pipe 1211 rapidly carries away the heat released by the wafer, achieving rapid cooling of the wafer. Optionally, the PCW flowing through cooling water pipe 121 is recirculating.

[0045] In some embodiments, the cooling layer 1 is provided with a height adjustment mechanism 15, which is used to adjust the height of the cooling layer 1. Generally, the height adjustment mechanism 15 is pre-adjusted, and the height of the cooling layer 1 needs to be pre-adjusted by the height adjustment mechanism 15 before using the processing device provided in this embodiment of the present invention.

[0046] In some embodiments, the cooling layer 1 is provided with a lifting mechanism 16, which is used to adjust the height of the wafer in the cooling layer 1. Optionally, the lifting mechanism 16 adjusts the height of the cold tray 12 by adjusting the height of the support member used to support the cold tray 12, thereby adjusting the height of the wafer. Or, in this case, the lifting mechanism 16 is used to indirectly adjust the height of the wafer. It should be noted that when the lifting mechanism 16 is used to indirectly adjust the wafer height, the lifting mechanism 16 is pre-adjusted and needs to be pre-adjusted before the wafer is placed into the wafer cooling area 11. Optionally, the lifting mechanism 16 is used to directly adjust the height of the wafer. Or, in this case, the lifting mechanism 16 is used to directly support the wafer above the cold tray 12.

[0047] Figure 3 A schematic diagram of the bottom structure of the cooling layer 1 of the processing device provided in this embodiment of the present invention is shown.

[0048] In some embodiments, the cooling layer 1 is provided with a wafer positioning module 14, which is used to adjust the position of the wafer placed in the wafer cooling area 11. When a wafer is placed in the wafer cooling area 11, the wafer positioning module 14 will quickly position and adjust the wafer in the wafer cooling area 11 so that the wafer can be cooled quickly.

[0049] It should be noted that since wafer cooling is achieved based on the rapid flow of PCW (polycarbonate) in the cooling water pipe 1211, and the location of the cooling water pipe 1211 is usually fixed, the position of the wafer in the wafer cooling zone 11 directly affects the wafer cooling efficiency. Therefore, the processing device provided by this invention, by setting a wafer positioning module 14 in the cooling layer 1, can effectively improve the wafer cooling efficiency and ensure that all wafers in the wafer cooling zone 11 can be cooled rapidly.

[0050] In some embodiments, the wafer positioning module 14 includes at least one guiding submodule and at least one cylinder actuation submodule (not shown in the figure). The cylinder actuation submodule includes at least a cylinder fixing plate, a micro cylinder, a wafer adjusting block, and a cylinder limiting post (not shown in the figure). For example, Figure 3As shown, the wafer positioning module 14 consists of a guide submodule and two cylinder actuation submodules, with an included angle of 90° or 180° between the two cylinder actuation submodules. The guide submodule is used for coarse adjustment of the position of the wafer placed in the wafer cooling zone 11, while the cylinder actuation submodules are used for precise adjustment of the position of the wafer placed in the wafer cooling zone 11. Generally, one guide submodule and one cylinder actuation submodule are sufficient for two-point positioning. Optionally, to further improve the accuracy of the wafer position within the wafer cooling zone 11, the number of cylinder actuation submodules can be increased, such as two, three, or more; this embodiment of the invention does not limit this. Furthermore, considering the overall economic practicality of the equipment, the number of cylinder actuation submodules should not be excessive.

[0051] In some embodiments, the cooling layer 1 is provided with a first sensor 17. Wherein:

[0052] The first sensor 17 is used to detect whether a wafer is placed in the wafer cooling area 11; and / or,

[0053] The first sensor 17 is used to detect whether the position of the wafer placed in the wafer cooling area 11 is accurate; and / or,

[0054] The first sensor 17 is used to detect whether the wafer placed in the wafer cooling zone 11 has been successfully cooled.

[0055] Optionally, the first sensor 17 can be a photoelectric sensor, a proximity sensor, or a displacement sensor. In this embodiment, the type of the first sensor 17 is not limited.

[0056] Optionally, the first sensor 17 is located in the wafer cooling area 11.

[0057] Optionally, the number of first sensors 17 is not limited. For example, the first sensor 17 includes a first sub-sensor 1, wherein: the first sub-sensor 1 is used to detect whether a wafer is placed in the wafer cooling area 11, whether the position of the wafer placed in the wafer cooling area 11 is accurate, and whether the wafer placed in the wafer cooling area 11 has been successfully cooled. Alternatively, the first sensor 17 includes a first sub-sensor 1 and a first sub-sensor 2, wherein: the first sub-sensor 1 is used to detect whether a wafer is placed in the wafer cooling area 11; and the first sub-sensor 2 is used to detect whether the position of the wafer placed in the wafer cooling area 11 is accurate, and whether the wafer placed in the wafer cooling area 11 has been successfully cooled. For example, the first sensor 17 includes a first sub-sensor 1, a first sub-sensor 2, and a first sub-sensor 3, wherein: the first sub-sensor 1 is used to detect whether a wafer is placed in the wafer cooling area 11; the first sub-sensor 2 is used to detect whether the position of the wafer placed in the wafer cooling area 11 is accurate; and the first sub-sensor 3 is used to detect whether the wafer placed in the wafer cooling area 11 has been successfully cooled. Alternatively, the first sensor 17 may include a first sub-sensor 1, a first sub-sensor 2, a first sub-sensor 3, and a first sub-sensor 4, wherein: the first sub-sensor 1 is used to detect whether a wafer is placed in the wafer cooling area 11; the first sub-sensor 2 is used to detect whether the position of the wafer placed in the wafer cooling area 11 is accurate; and the first sub-sensors 3 and 4 are used to detect whether the wafer placed in the wafer cooling area 11 has been successfully cooled. Many other possible combinations will not be listed here.

[0058] In this embodiment, the first sensor 17 detects whether a wafer is placed in the wafer cooling area 11, which helps the processing device to promptly identify the wafer that needs to be cooled and start the cooling process in a timely manner.

[0059] The first sensor 17 detects whether the position of the wafer placed in the wafer cooling area 11 is accurate, which helps to adjust the position of the wafer in the wafer cooling area 11 in a timely manner through the wafer positioning module 14, thereby effectively improving the wafer cooling efficiency and ensuring that the wafers in the wafer cooling area 11 can be cooled quickly.

[0060] The first sensor 17 detects whether the wafer placed in the wafer cooling area 11 has been successfully cooled, which is beneficial for timely monitoring of the wafer cooling effect. On the one hand, it helps to remind the robot to transfer the cooled wafer from the wafer cooling area 11 to the wafer buffer area 21 in a timely manner. On the other hand, it helps to improve the wafer cooling success rate and avoid uncooled wafers being transferred to the wafer buffer area 21, which could cause subsequent process errors.

[0061] For cache layer 2:

[0062] Figure 4A schematic diagram of the bottom structure of the cooling layer 1 of the processing device provided in this embodiment of the present invention is shown.

[0063] In some embodiments, the buffer layer 2 is provided with a position adjustment module 22, which is used to adjust the position of the wafer placed in the wafer buffer area 21. When a wafer is transferred to the wafer buffer area 21, the position adjustment module 22 will quickly locate and adjust the position of the wafer in the wafer buffer area 21 so that the wafer can be further transferred to the wafer cassette by the robot arm.

[0064] It should be noted that, since the position of the robotic arm used to transfer wafers from the wafer buffer area 21 is usually fixed, the position of the wafer in the wafer buffer area 21 directly affects the efficiency of wafer transfer. Therefore, the processing device provided by this invention, by setting a position adjustment module 22 in the buffer layer 2, can effectively improve the efficiency of wafer transfer, ensuring that the wafers in the wafer buffer area 21 can be quickly transferred by the robotic arm to the wafer cassette.

[0065] In some embodiments, the position adjustment module 22 includes at least one position fixing submodule and at least one slide table actuation submodule (not shown in the figure). The slide table actuation submodule includes at least a pneumatic slide table, a ball bearing, and a moving pin (not shown in the figure). For example, Figure 4 As shown, the position adjustment module 22 consists of two position fixing submodules and two slide movement submodules. The position fixing submodules are used for coarse adjustment of the position of the wafer placed in the wafer buffer area 21, and the slide movement submodules are used for precise adjustment of the position of the wafer placed in the wafer cooling area 11.

[0066] In some embodiments, the buffer layer 2 is provided with a second sensor 23. Wherein:

[0067] The second sensor 23 is used to detect whether a wafer is placed in the wafer buffer area 21; and / or,

[0068] The second sensor 23 is used to detect whether the position of the wafer placed in the wafer buffer area 21 is accurate; and / or,

[0069] The second sensor 23 is used to detect the buffer duration of the wafer placed in the wafer buffer area 21.

[0070] Optionally, the second sensor 23 can be a photoelectric sensor, a proximity sensor, or a displacement sensor. In this embodiment, the type of the second sensor 23 is not limited.

[0071] Optionally, the second sensor 23 is located in the wafer cache area 21.

[0072] Optionally, the number of second sensors 23 is not limited. For example, the second sensor 23 includes a second sub-sensor 1, wherein the second sub-sensor 1 is used to detect whether a wafer is placed in the wafer buffer area 21, whether the position of the wafer placed in the wafer buffer area 21 is accurate, and the buffering time of the wafer placed in the wafer buffer area 21. Alternatively, the second sensor 23 includes a second sub-sensor 1 and a second sub-sensor 2, wherein the second sub-sensor 1 is used to detect whether a wafer is placed in the wafer buffer area 21; and the second sub-sensor 2 is used to detect whether the position of the wafer placed in the wafer buffer area 21 is accurate, and the buffering time of the wafer placed in the wafer buffer area 21. For example, the second sensor 23 includes a second sub-sensor 1, a second sub-sensor 2, and a second sub-sensor 3, wherein: the second sub-sensor 1 is used to detect whether a wafer is placed in the wafer buffer area 21; the second sub-sensor 2 is used to detect whether the position of the wafer placed in the wafer buffer area 21 is accurate; and the second sub-sensor 3 is used to detect the buffering time of the wafer placed in the wafer buffer area 21. Alternatively, the second sensor 23 includes a second sub-sensor 1, a second sub-sensor 2, a second sub-sensor 3, and a second sub-sensor 4, wherein: the second sub-sensor 1 is used to detect whether a wafer is placed in the wafer buffer area 21; the second sub-sensor 2 is used to detect the buffering time of the wafer placed in the wafer buffer area 21; and the second sub-sensor 3 and the second sub-sensor 4 are used to detect whether the position of the wafer placed in the wafer buffer area 21 is accurate. Other possible combinations will not be listed in detail.

[0073] In this embodiment, the second sensor 23 detects whether there is a wafer in the wafer buffer area 21, which helps the processing device to promptly detect the wafer that needs to be transferred to the wafer cassette.

[0074] The second sensor 23 detects whether the position of the wafer placed in the wafer buffer area 21 is accurate, which helps to adjust the position of the wafer in the wafer buffer area 21 in a timely manner through the position adjustment module 22, thereby effectively improving the efficiency of wafer transfer from the wafer buffer area 21 to the wafer cassette.

[0075] The second sensor 23 detects the buffering time of the wafer placed in the wafer buffer area 21, which helps to promptly remind the robot to remove the successfully cooled wafer from the wafer buffer area 21, thus avoiding the wafer being buffered in the wafer buffer area 21 for a long time, which would delay the subsequent process.

[0076] The present invention further provides a semiconductor device, which includes the processing apparatus as described in any of the above embodiments.

[0077] Obviously, the above embodiments of this utility model are merely examples for clearly illustrating the present utility model, and are not intended to limit the implementation of the present utility model. Those skilled in the art can make various obvious changes, readjustments, and substitutions without departing from the protection scope of this utility model. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the protection scope of the claims of this utility model.

Claims

1. A processing device, characterized by, The processing device includes: At least two cooling layers (1) and one buffer layer (2); The cooling layer (1) is provided with at least two wafer cooling zones (11), and the cooling layer (1) is used to cool the wafer; The cache layer (2) is provided with at least one wafer cache area (21), and the cache layer (2) is used to cache the wafer after cooling is completed.

2. The processing device of claim 1, wherein, The cooling layer (1) is provided with a cold plate (12) and a lower cover plate (13). The cold plate (12) is above the lower cover plate (13). A cold water channel (121) is provided on the side of the cold plate (12) opposite to the lower cover plate (13). The cold water channel (121) is used to place a cold water pipe (1211).

3. The processing device according to claim 1 or 2, characterized in that, The cooling layer (1) is provided with a wafer positioning module (14), which is used to adjust the position of the wafer placed in the wafer cooling area (11).

4. The processing device according to any one of claims 1 to 3, characterized in that, The cooling layer (1) is provided with a height adjustment mechanism (15), which is used to adjust the height of the cooling layer (1).

5. The processing device according to any one of claims 1 to 4, characterized in that, The cooling layer (1) is provided with a lifting mechanism (16), which is used to adjust the height of the wafer in the cooling layer (1).

6. The processing device according to any one of claims 1 to 5, characterized in that, The cooling layer (1) is equipped with a first sensor (17); The first sensor (17) is used to detect whether a wafer is placed in the wafer cooling area (11); and / or, The first sensor (17) is used to detect whether the position of the wafer placed in the wafer cooling area (11) is accurate; and / or, The first sensor (17) is used to detect whether the wafer placed in the wafer cooling zone (11) has been successfully cooled.

7. The processing device according to any one of claims 1 to 6, characterized in that, The cache layer (2) is provided with a position adjustment module (22), which is used to adjust the position of the wafer placed in the wafer cache area (21).

8. The processing device according to any one of claims 1 to 7, characterized in that, The cache layer (2) is equipped with a second sensor (23); The second sensor (23) is used to detect whether a wafer is placed in the wafer buffer area (21); and / or, The second sensor (23) is used to detect whether the position of the wafer placed in the wafer buffer area (21) is accurate; and / or, The second sensor (23) is used to detect the buffer duration of the wafer placed in the wafer buffer area (21).

9. A semiconductor device, characterized by comprising: Includes the processing apparatus as described in any one of claims 1 to 8.

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