Cooling module, temperature sensing mechanism, temperature sensing device, reaction chamber, and semiconductor apparatus

Abstract

This application provides a cooling module, a temperature sensing mechanism, a temperature sensing device, a reaction chamber, and a semiconductor device to solve the technical problem of poor cooling effect of cooling modules on temperature sensors in related technologies. The cooling module in this application includes a liquid cooling assembly and a fin assembly. The fin assembly is fixedly connected to the liquid cooling assembly. The liquid cooling assembly has a first thermally conductive surface, and the fin assembly has a second thermally conductive surface. The first and second thermally conductive surfaces are arranged opposite to each other, and both the first and second thermally conductive surfaces are thermally connected to the temperature sensor.

Description

Technical Field

[0001] This application relates to the field of semiconductor processing and manufacturing technology, specifically to cooling modules, temperature sensing mechanisms, temperature sensing devices, reaction chambers, and semiconductor equipment. Background Technology

[0002] In the manufacturing processes of various products, precise temperature control is a key parameter for ensuring product quality and process stability. To achieve real-time monitoring of processing temperature, temperature sensors are typically integrated into semiconductor equipment. However, to ensure the accuracy of the data obtained by the temperature sensors and to avoid the influence of thermal interference from the processing environment, a dedicated cooling module is usually required for the temperature sensors. However, the cooling effect of existing cooling modules is poor, which can affect the measurement results of the temperature sensors. Utility Model Content

[0003] This application discloses a cooling module, a temperature sensing mechanism, a temperature sensing device, a reaction chamber, and a semiconductor device, which are used to solve the technical problem of poor cooling effect of the cooling module on the temperature sensor in the related art.

[0004] In a first aspect, this application provides a cooling module for a temperature sensor. The cooling module includes a liquid cooling component and a fin assembly. The fin assembly is fixedly connected to the liquid cooling component. The liquid cooling component has a first thermally conductive surface, and the fin assembly has a second thermally conductive surface. The first thermally conductive surface and the second thermally conductive surface are disposed opposite to each other, and both the first thermally conductive surface and the second thermally conductive surface are thermally connected to the temperature sensor.

[0005] According to the above technical means, the cooling module provided in this application fixes the liquid cooling component and the fin component together and respectively sets a first heat-conducting surface and a second heat-conducting surface. The first heat-conducting surface and the second heat-conducting surface are arranged opposite each other and are both heat-conductingly connected to the temperature sensor, forming a bidirectional collaborative heat dissipation port acting on the temperature sensor. Thus, the first heat-conducting surface and the second heat-conducting surface dissipate heat synchronously from both sides of the temperature sensor, thereby avoiding the measurement drift caused by local temperature unevenness due to unilateral cooling and improving the cooling effect of the cooling module on the temperature sensor.

[0006] In addition, the cooling module in this application can also adaptively adjust the cooling mode. For example, under high temperature conditions, the liquid cooling component can play a leading role in heat dissipation due to its efficient active heat exchange capability, thereby achieving rapid cooling of the temperature sensor and ensuring the measurement accuracy of the temperature sensor. Under low temperature or normal conditions, the fin assembly can take on the main heat dissipation function by utilizing its passive heat dissipation characteristics, thereby reducing energy consumption while ensuring heat dissipation.

[0007] Therefore, the cooling module in this application not only significantly improves heat dissipation efficiency to ensure the accuracy of temperature sensor measurements, but also automatically adjusts the heat dissipation mode according to actual operating temperature changes, achieving a balance between efficient heat dissipation and energy-saving operation.

[0008] In one possible implementation, the liquid cooling assembly includes a housing and a heat-conducting element, which are thermally connected. The first heat-conducting surface is the side of the heat-conducting element facing the second heat-conducting surface. Therefore, by configuring the liquid cooling assembly as a combination of a housing and a heat-conducting element, and making the heat-conducting element form the first heat-conducting surface, this application can achieve directional heat conduction along the heat dissipation path of "temperature sensor → heat-conducting element (first heat-conducting surface) → housing," ensuring the directionality of heat conduction, optimizing the heat conduction path, and improving heat conduction efficiency.

[0009] In one possible implementation, the housing is provided with a boss, which is thermally connected to a heat-conducting component. Compared to a single contact surface in planar contact, the three-dimensional structure of the boss can increase the contact area with the heat-conducting component, thereby improving the heat dissipation efficiency between the heat-conducting component and the housing.

[0010] In one possible implementation, the housing includes an inlet, an outlet, and a liquid-cooled cavity. A baffle plate within the liquid-cooled cavity divides it into a first flow channel cavity and a second flow channel cavity. The first flow channel cavity communicates with the inlet, and the second flow channel cavity communicates with the outlet. A baffle gap exists between the end of the baffle plate and the inner wall of the housing, forming a liquid flow path that sequentially flows through the inlet, the first flow channel cavity, the baffle gap, the second flow channel cavity, and the outlet. In this application, the baffle plate divides the liquid-cooled cavity into the first and second flow channel cavities, and the baffle gap between the end of the baffle plate and the inner wall of the housing forms a flow path with an angle. Compared to traditional straight flow channels, the actual flow distance of the coolant from the inlet to the outlet is extended, thereby increasing the contact time between the coolant and the cavity wall, further improving the heat exchange efficiency between the cooling module and the temperature sensor.

[0011] In one possible implementation, the housing includes a first housing and a second housing, which enclose a liquid-cooled cavity. The liquid inlet, liquid outlet, and partition are all located in one of the first and second housings; or, the liquid inlet and liquid outlet are located in one of the first and second housings, and the partition is located in the other. This application simplifies the manufacturing process, reduces production costs, and improves assembly convenience by designing the housing as a combination of a first and a second housing and rationally allocating the positions of the liquid inlet, liquid outlet, and partition.

[0012] In one possible implementation, a second heat-conducting surface extends outward from multiple fins, with the spacing between each fin (trapezoidal) gradually increasing in the direction away from the liquid cooling component, forming a progressive heat dissipation channel. The second heat-conducting surface is thermally connected to a temperature sensor, transmitting the temperature from the temperature sensor to the fin assembly. As the spacing between the multiple fins increases, the airflow between the fins undergoes a dynamic process of "acceleration → diffusion" during flow. The closely spaced fins at the front end promote the airflow to accelerate through the thermal boundary layer, while the sparsely spaced fins at the rear end guide the airflow to diffuse evenly, avoiding the formation of eddies, thereby improving the overall heat exchange capacity of the fin assembly.

[0013] In one possible implementation, the cooling module further includes a first fastener and a second fastener. A first fixing portion and a second fixing portion are respectively provided on both sides of the first heat-conducting surface of the liquid cooling assembly. A third fixing portion and a fourth fixing portion, corresponding to the positions of the first and second fixing portions, are provided on both sides of the second heat-conducting surface of the fin assembly. The first fixing portion and the third fixing portion are connected by the first fastener, and the second fastener is connected by the second fixing portion and the fourth fixing portion, thereby fixing the liquid cooling assembly and the fin assembly. Through the first and second fasteners, both the liquid cooling assembly and the fin assembly in this application can be securely mounted on both sides of the temperature sensor, improving the reliability of the cooling module's cooling of the temperature sensor. Simultaneously, before connecting the first and second fasteners, the alignment of the first and third fixing portions and the second and fourth fixing portions can be used to ensure the accuracy of the connection between the liquid cooling assembly and the fin assembly, ensuring that both can accurately conduct heat to the temperature sensor.

[0014] Secondly, this application provides a temperature sensing mechanism, which includes a cooling module or a temperature sensor mentioned in any of the above possible embodiments. The temperature sensor is thermally connected to the cooling module, and the cooling module is used to cool the temperature sensor.

[0015] The temperature sensing mechanism provided in this application, by combining the aforementioned cooling module with the temperature sensor, can achieve efficient cooling of the temperature sensor, thereby improving the accuracy and stability of temperature measurement.

[0016] Thirdly, this application provides a temperature sensing device, which includes a plurality of temperature sensing mechanisms and a valve island in any of the above possible embodiments. The valve island has a plurality of liquid transmission ports corresponding to the plurality of temperature sensing mechanisms, and each liquid transmission port is connected to its corresponding temperature sensing mechanism.

[0017] The temperature sensing device in this application connects multiple temperature sensing mechanisms by setting up a valve island with multiple liquid transmission ports, which can realize centralized cooling control, simplify pipeline layout, and improve system integration.

[0018] In one possible implementation, the distance between the temperature sensing mechanism and the valve island is less than a preset value, and the corresponding liquid transmission port has a spiral structure.

[0019] This application increases the flow resistance of the liquid inlet near the valve island by designing it in a spiral shape, thereby balancing the flow distribution at each inlet. Specifically, the spiral structure of the liquid inlet increases the fluid resistance near the valve island by extending the flow channel length and changing the fluid flow path, thus regulating the flow rate at that inlet. This avoids flow concentration caused by insufficient resistance in the proximal region of the valve island, achieving flow balance among the liquid inlets and improving the stability and reliability of the system operation.

[0020] In one possible implementation, the flow rate of each liquid transfer port is proportional to the distance from its corresponding temperature sensing mechanism to the valve island.

[0021] Building upon the above, this application establishes a positive correlation between the liquid transfer port flow rate and the distance between the temperature sensing mechanism and the valve island, thereby achieving reasonable distribution and balanced control of the cooling flow rate. Specifically, the flow rate at the liquid transfer port is linearly and positively correlated with the distance between the corresponding temperature sensing mechanism and the valve island; that is, the farther the temperature sensing mechanism is from the valve island, the greater the flow rate at its corresponding liquid transfer port. This application solves the problem of flow concentration caused by the low fluid resistance in the near-field region of the valve island by dynamically varying the liquid transfer port flow rate with distance. This ensures that each temperature sensing mechanism receives a cooling flow rate matching its heat dissipation requirements, thereby ensuring consistency in cooling across different temperature sensing mechanisms and avoiding localized overheating or excessive cooling due to uneven flow distribution. This improves the temperature control accuracy and operational stability of the entire system.

[0022] Fourthly, this application provides a reaction chamber, which includes a cavity and a temperature sensing device in any of the above possible embodiments, the temperature sensing device being fixed to the outside of the cavity of the reaction chamber.

[0023] Therefore, this application places the temperature sensing device on the outside of the reaction chamber. The temperature sensing device obtains the temperature change inside the chamber through the chamber. Moreover, the temperature sensing device can be kept away from the reaction medium inside the chamber. The temperature monitoring is isolated from the inside of the chamber through the chamber, avoiding interference with the reaction process inside the chamber and improving the safety of the processing.

[0024] Fifthly, this application provides a semiconductor device including the aforementioned reaction chamber.

[0025] The reaction chamber in the semiconductor equipment of this application can achieve accurate temperature detection through a temperature sensing device, and heat can be effectively transferred through the liquid transfer port of the temperature sensing device, thereby improving the process quality and stability of semiconductor processing.

[0026] It should be noted that the technical effects of the implementation methods of the second to fifth aspects can be found in the technical effects of the corresponding implementation methods in the first aspect, and will not be repeated here.

[0027] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and do not limit this application. Attached Figure Description

[0028] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0029] Figure 1 This is a schematic diagram of the structure of the reaction chamber provided in an embodiment of this application; Figure 2 This is a schematic diagram of the structure of one side of the temperature sensor provided in an embodiment of this application; Figure 3 Examples of this application Figure 2 The diagram shows the structure of the other side of the temperature sensor. Figure 4 This is a schematic diagram of the structure of the temperature sensing device provided in the embodiments of this application; Figure 5 Provided for the embodiments of this application Figure 4 A partial cross-sectional view of the temperature sensing device shown along the I-I direction; Figure 6 This is a schematic diagram of the valve island structure provided in an embodiment of this application; Figure 7 This is a schematic diagram of the cooling module provided in the embodiments of this application; Figure 8 This is a schematic diagram of the structure of the liquid cooling assembly provided in the embodiments of this application; Figure 9 A schematic diagram of the structure of the fin assembly provided in the embodiments of this application. Figure 10 A schematic diagram of a semiconductor device provided in an embodiment of this application.

[0030] Explanation of reference numerals in the attached figures: 1-Reaction chamber; 2-Semiconductor equipment; 3-Temperature sensing device; 4-Temperature sensing mechanism; 101 - Detection hole; 1011 - First detection hole; 1012 - Second detection hole; 20 - Mounting platform; 201 - Clearance hole; 202 - Mounting surface; 30 - Temperature sensor; 301 - Body; 3011 - Interface; 302 - Flange; 303 - Probe; 40-Liquid cooling assembly; 401-Liquid cooling cavity; 4011-Liquid inlet; 4012-Liquid outlet; 4013-First opening; 402-Connecting pipe; 4021-Liquid inlet pipe; 4021a-Main liquid inlet pipe; 4021b-Sub-liquid inlet pipe; 4022-Drain pipe; 4022a-Main liquid drain pipe; 4022b-Sub-liquid drain pipe; 403-Outer shell; 4031-First shell; 4031a-Boss; 4032-Second shell; 404-Partition; 405-Heat-conducting component; 4051-First heat-conducting surface; 406-First fixing part; 407-Second fixing part; 50 - Fin assembly; 501 - Third fixing part; 502 - Heat dissipation part; 5021 - Base; 5021a - Second heat-conducting surface; 5022 - Fin; 5022a - Progressive heat dissipation channel; 503 - Fourth fixing part; 61 - First fastener; 62 - Second fastener; 70 - Valve island; 71 - Spiral structure; S - Accommodation space. Detailed Implementation

[0031] In the embodiments of this application, the terms "exemplarily" or "for example" are used to indicate examples, illustrations, or explanations. Any embodiment or design described as "exemplarily" or "for example" in the embodiments of this application should not be construed as being more preferred or advantageous than other embodiments or designs. Specifically, the use of terms such as "exemplarily" or "for example" is intended to present the relevant concepts in a specific manner.

[0032] In the description of the embodiments of this application, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, "linking" can be a detachable connection or a non-detachable connection; it can be a direct connection or an indirect connection through an intermediate medium. It is understood that "multiple" as used herein refers to two or more.

[0033] In the description of embodiments of this application, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element.

[0034] In some embodiments, see Figure 1 and combined Figure 10 This application provides a semiconductor device 2, which refers to the dedicated equipment required in the entire process from wafer fabrication to packaging and testing, and is mainly used to realize the micro-nano processing and functional integration of semiconductor devices.

[0035] For example, semiconductor device 2 may include epitaxial equipment, rapid thermal processing equipment, and chemical vapor deposition equipment, etc. This application embodiment does not impose any special limitations on the specific form of the semiconductor device 2 described above.

[0036] In some embodiments, see Figure 1 and combined Figure 10 The semiconductor device 2 in this application includes a reaction chamber 1, which includes a cavity, and semiconductor processing is performed within the cavity.

[0037] For ease of explanation, this application uses semiconductor device 2 as an example of an epitaxial device to illustrate the semiconductor device 2 in this application. Specifically, in the field of semiconductor manufacturing technology, in order to improve the surface quality of wafers and reduce the impact of wafer defects on subsequent processes, an epitaxial device can be used to grow an epitaxial layer on the wafer surface. Correspondingly, reaction chamber 1 is an epitaxial device, and an epitaxial layer is grown inside the cavity of reaction chamber 1.

[0038] Of course, the reaction chamber 1 in this application can also be used for production and processing in other fields, and this application does not limit it. Taking epitaxial layer processing as an example, epitaxial layer processing is a process of decomposing a gaseous precursor and depositing a thin film on the substrate surface in a high-temperature environment. High temperature is one of the conditions for epitaxial layer processing. Epitaxial layer processing is usually carried out in the cavity of reaction chamber 1 at a high temperature of 800°C to 1200°C. This high-temperature environment will directly cause the temperature of the processing chamber and its surrounding components to rise.

[0039] The aforementioned manufacturing process is highly sensitive to temperature changes. Therefore, in some embodiments, please refer to... Figure 1 The reaction chamber 1 in this application also includes a temperature sensing device 3, which is used to detect and monitor the temperature of the chamber or substrate to provide temperature data to help operators or control systems understand the current process status.

[0040] In some embodiments, see Figure 1 , Figure 3 and combined Figure 10 In this application, the temperature sensing device 3 is fixed to the outside of the cavity of the reaction chamber 1. That is, the temperature sensing device 3 is arranged on the outer shell of the reaction chamber 1.

[0041] For example, the connection between the temperature sensing device 3 and the reaction chamber 1 is bolted to the reaction chamber 1. Alternatively, the connection between the temperature sensing device 3 and the reaction chamber 1 can be welded to the reaction chamber 1. This application does not limit the connection method between the two.

[0042] Based on this, the temperature sensing device 3 can monitor the temperature through the cavity and is isolated from the inside of the cavity, away from the reaction medium being processed inside the cavity, thus avoiding interference with the reaction process inside the cavity and improving the safety of the processing.

[0043] For example, the temperature sensing device 3 in this application includes a plurality of temperature sensing mechanisms 4, which are distributed on the outside of the cavity of the reaction chamber 1 to accurately detect the temperature inside the reaction chamber 1.

[0044] Of course, the temperature sensing device 3 and temperature sensing mechanism 4 in this application can also be installed in other devices to detect the temperature at the target location. This application is only for illustrative purposes and does not constitute a limitation on this application.

[0045] In some embodiments, see Figure 1 and combined Figure 3 The temperature sensing mechanism 4 in this application includes a cooling module and a temperature sensor 30. The temperature sensor 30 is thermally connected to the cooling module for cooling the temperature sensor 30. By combining the cooling module and the temperature sensor, efficient cooling of the temperature sensor 30 can be achieved, thus improving the accuracy and stability of temperature measurement.

[0046] It should be noted that the cooling module in this application can be multiple or a single one. Correspondingly, the number of temperature sensors 30 can be multiple or a single one. A cooling module can be connected to one temperature sensor 30 or multiple temperature sensors 30. This application does not limit the combination or number of cooling modules and temperature sensors 30.

[0047] The temperature sensing device 3 includes a temperature sensor 30 for monitoring temperature. The temperature sensor 30 can be an optical thermometer or a thermocouple temperature sensor. This application uses an optical thermometer as an example to illustrate the use of the temperature sensor 30. Specifically, the optical thermometer can be an infrared thermometer.

[0048] It should be noted that the thermal connection between the temperature sensor 30 and the cooling module means that heat can be transferred between the temperature sensor 30 and the cooling module, thereby realizing temperature conduction and heat exchange to meet the temperature control requirements of the temperature sensor 30.

[0049] In some embodiments, see Figure 1 and combined Figure 6 In this application, the temperature sensing device 3 includes a valve island 70, which is an integrated device capable of centrally managing the cooling medium in one or more cooling modules.

[0050] For example, the valve island 70 can precisely control the flow direction and on / off state of the cooling medium through a built-in multi-way solenoid valve and flow control component. Combined with pressure and temperature sensors, this forms a closed-loop feedback, driving the cooling medium to form a circulation loop between the cooling module and the valve island 70. Of course, the valve island 70 can also be adjusted in other ways. This application is merely an example and does not constitute a limitation on the valve island 70 in this application.

[0051] In some embodiments, the valve island 70 has multiple liquid transmission channels corresponding to multiple temperature sensing mechanisms 4, and each liquid transmission channel is connected to its corresponding temperature sensing mechanism 4.

[0052] For example, the valve island 70 is provided with multiple liquid transmission channels, each channel being matched with a corresponding temperature sensing mechanism 4 to form an independent liquid flow path. Each liquid transmission channel is directly connected to the corresponding temperature sensing mechanism 4, forming a closed fluid loop. For example, when the temperature sensing mechanism 4 detects an abnormal temperature in the target area, the valve island 70 can control the liquid flow through the channels, allowing the medium (such as coolant) to flow through the sensing mechanism, thereby achieving temperature regulation through heat exchange, or feeding back temperature data through the medium flow status.

[0053] Based on this, the valve island 70 can deliver cooling medium to the cooling module through the liquid transmission channel, and can also receive cooling medium from the cooling module after temperature exchange with the temperature sensor 30 through the liquid transmission channel.

[0054] In some embodiments, the end of the valve island 70 away from the temperature sensor 30 is connected to an external liquid source to achieve the circulation of the cooling medium.

[0055] For example, taking the application of the cooling module in semiconductor equipment 2 as an example, the external liquid source in this application can be the water source used by a semiconductor wafer fab (Fab). Of course, the external liquid source in this application can also be other water sources, and this application does not limit this.

[0056] The valve island 70 is also equipped with multiple liquid transmission channels between itself and the external liquid source. The valve island 70 realizes the transmission of cooling medium between the cooling module and the external liquid source through multiple liquid transmission channels.

[0057] The temperature sensing device 3 in this application connects multiple temperature sensing mechanisms 4 by setting a valve island 70 with multiple liquid transmission ports, which can realize centralized cooling control, simplify pipeline layout and improve system integration.

[0058] In some embodiments, see Figure 1 and combined Figure 6 The distance between the temperature sensing mechanism 4 and the valve island 70 is less than the preset value, and the corresponding liquid transmission channel is a spiral structure 71.

[0059] For example, the liquid transport channel is a rigid pipe, thereby enabling the liquid transport channel itself to be supported on the semiconductor device 2.

[0060] Based on this, the spiral structure 71 can significantly increase the length of the liquid transport path within a limited space, allowing the liquid to fully contact the channel wall, thereby improving the heat exchange efficiency.

[0061] In some embodiments, this application provides an exemplary description of the structure of a liquid transfer channel. Exemplarily, the liquid transfer channel connects the valve island 70 and the cooling module, with a corresponding liquid transfer channel provided at the end of the liquid transfer channel facing the cooling module.

[0062] This application designs the liquid transmission channel closer to the valve island 70 as a spiral structure 71. The spiral bend of the spiral structure 71 can generate friction resistance and local resistance on the cooling medium, and apply additional fluid resistance to the short path channel near the valve island 70 end (which is prone to flow velocity deviation due to lower flow resistance). This adjusts the liquid flow resistance and makes the liquid transmission speed of each liquid transmission channel more consistent, thereby ensuring the heat dissipation uniformity among multiple cooling modules.

[0063] In some embodiments, along the direction of conveying the cooling medium to the valve island via the liquid transmission channel, the thread engagement density of the spiral structure 71 corresponding to the liquid transmission channel in this application gradually increases to further regulate the liquid transmission speed.

[0064] In other embodiments, the spiral structure 71 of the liquid transmission channels connected to the multiple cooling modules has different thread engagement densities, thereby adjusting the liquid flow resistance between the different cooling modules and the valve island 70, making the liquid transmission speed of each liquid transmission channel more consistent, and thus ensuring the heat dissipation uniformity among the multiple cooling modules.

[0065] It should be noted that this application does not impose any restrictions on the preset values, which can be adjusted according to different scenarios.

[0066] In some embodiments, see Figure 1 and combined Figure 6 The flow rate of each liquid transmission channel is proportional to the distance from its corresponding temperature sensing mechanism 4 to the valve island 70.

[0067] The flow rate of the liquid transmission port is linearly and positively correlated with the distance between the corresponding temperature sensing mechanism 4 and the valve island 70. That is, the farther the temperature sensing mechanism 4 is from the valve island 70, the greater the flow rate of its corresponding liquid transmission port. This application solves the problem of flow concentration caused by the low fluid resistance in the close area of ​​the valve island 70 by dynamically changing the flow rate of the liquid transmission port with distance. This allows each temperature sensing mechanism 4 to obtain a cooling flow rate that matches the heat dissipation requirements, thereby ensuring that the temperature sensing mechanisms 4 in different positions maintain consistency during the cooling process. This avoids local overheating or overcooling caused by uneven flow distribution, and improves the temperature control accuracy and operational stability of the entire system.

[0068] For ease of understanding, this application describes the structure of the temperature sensor 30 described above.

[0069] In some embodiments, please refer to Figure 2 and combined Figure 3 The temperature sensor 30 includes a body 301 and a probe 303 connected to the body 301. The body 301 is the main part of the infrared temperature sensor 30. The body 301 integrates components such as circuit system, display screen, and operation buttons, and is responsible for processing signals, displaying temperature values, and providing a user interface.

[0070] The temperature sensor 30 has an infrared sensor at the front end of its probe 303, which can detect the infrared radiation emitted by the object. The infrared sensor converts the detected infrared radiation into an electrical signal and transmits it to the main body 301. The circuit system inside the main body 301 processes and calculates the received signal to obtain the temperature value of the object, which is then displayed on the screen.

[0071] In other embodiments, please refer to Figure 2 and combined Figure 3The temperature sensor 30's body 301 also includes an interface 3011. The temperature sensor 30 can be connected to a power source via the interface 3011, and can also output data and signals and perform digital communication through the interface 3011. In this way, the temperature sensor 30 can transmit temperature data to a monitoring system, enabling real-time monitoring and alarm functions. The interface 3011 can be a USB interface, including but not limited to a Type-C interface.

[0072] In some embodiments, please refer to Figures 1-4 The body 301 of the temperature sensor 30 is connected to the reaction chamber 1, and the probe 303 detects the temperature information inside the reaction chamber 1. Therefore, by connecting the temperature sensor 30 to the reaction chamber 1, operators or users can measure the temperature inside the reaction chamber 1 in real time or periodically to monitor the process status of semiconductor processing.

[0073] In some embodiments, please continue reading Figure 1 , Figure 3 and combined Figure 4 The reaction chamber 1 has a cavity, and a detection hole 101 is provided in the reaction chamber 1. The probe 303 is opposite to the detection hole 101 to detect the temperature inside the cavity. By providing a detection hole 101 in the reaction chamber 1 and directly aligning the probe 303 with the inside of the cavity, the internal temperature of the reaction chamber 1 can be accurately measured, thereby promptly detecting potential overheating or malfunctions during semiconductor processing and avoiding potential safety hazards or abnormal situations.

[0074] It should be noted that there may be one or more detection holes 101 in this application. This application does not limit the number of detection holes 101. The number of temperature sensors 30 in this application corresponds to the number of detection holes 101, that is, one detection hole 101 is matched with one temperature sensor 30.

[0075] In some embodiments, please refer to Figure 4 and combined Figure 5 The semiconductor device 2 also includes a mounting platform 20, which is located outside the reaction chamber 1. The mounting platform 20 is connected to the main body 301, and the mounting platform 20 is provided with a clearance hole 201, which communicates with the detection hole 101. In this way, the probe 303 can detect the temperature inside the reaction chamber 1 through the clearance hole 201 and the detection hole 101.

[0076] In this application, the quantity relationship between the clearance hole 201 and the mounting platform 20 is not limited. It is understood that this application can provide multiple clearance holes 201 on one mounting platform 20, or it can provide only one clearance hole 201 on one mounting platform 20, with one clearance hole 201 corresponding to one mounting hole. The latter is used as an example in this application.

[0077] It should be noted that this application does not limit the location of the mounting platform 20. The mounting platform 20 can be located on the top surface of the reaction chamber 1 or on the side wall of the reaction chamber 1. This application does not limit this location. This application uses the mounting platform 20 located on the top surface of the reaction chamber 1 as an example for illustration. This application also does not limit the shape of the top surface of the reaction chamber 1. The top surface of the reaction chamber 1 can be a plane or a curved surface.

[0078] This application uses the shape of the top surface of the reaction chamber 1 as an example for illustration. To ensure that the light emitted by the probe 303 can successfully reach the target location (i.e., the surface of the semiconductor processing), multiple detection holes 101 are provided in this application, and the multiple detection holes 101 are distributed radially at intervals along the reaction chamber 1 and arranged around the axis of the reaction chamber 1. Specifically, the axis of the detection hole 101 located at the center coincides with the axis of the reaction chamber 1, while along the radial direction of the reaction chamber 1, the angle formed by the axis of the detection hole 101 and the axis of the reaction chamber 1 gradually increases as the distance from the center of the reaction chamber 1 increases. This allows the light from the probe 303 to cover various areas of the semiconductor processing surface at different angles, ensuring that the light can reach the target location uniformly and accurately, thereby improving the accuracy and comprehensiveness of temperature measurement.

[0079] Correspondingly, this application provides multiple clearance holes 201, which are distributed radially at intervals along the reaction chamber 1 and arranged around the axis of the reaction chamber 1. Each clearance hole 201 corresponds to one detection hole 101. Furthermore, the axis of the clearance hole 201 located at the center coincides with the axis of the reaction chamber 1, while along the radial direction of the reaction chamber 1, the angle between the axis of the clearance hole 201 and the axis of the reaction chamber 1 gradually increases as the distance from the center of the reaction chamber 1 increases. This allows the light from the probe 303 to cover various areas of the semiconductor processing surface at different angles, ensuring that the light reaches the target position uniformly and accurately, thereby improving the accuracy and comprehensiveness of temperature measurement.

[0080] In some embodiments, please refer to Figures 2-5The plurality of detection holes 101 include a first detection hole 1011 and a second detection hole 1012. In this application, the first detection hole 1011 and the second detection hole 1012 are arranged radially spaced apart along the reaction chamber 1, and the axis of the first detection hole 1011 intersects the axis of the second detection hole 1012. The first detection hole 1011 and the second detection hole 1012 may be disposed on the side wall of the reaction chamber 1 and the other on the top surface of the reaction chamber 1; alternatively, both may be disposed on the top surface of the reaction chamber 1. This application does not limit the specific arrangement of these two holes.

[0081] This application illustrates the application by exemplifying the first detection hole 1011 and the second detection hole 1012 being disposed on the top surface of the reaction chamber 1, with the top surface of the reaction chamber 1 being a plane. In this way, the probe 303 of the temperature sensor 30 can emit light onto the surface of the part to be detected, whether through the first detection hole 1011 or the second detection hole 1012, ensuring the accuracy of the detected temperature.

[0082] Meanwhile, the first detection hole 1011 and the second detection hole 1012 are spaced apart on the surface of the reaction chamber 1, which can avoid interference between the two temperature sensors 30 corresponding to the first detection hole 1011 and the second detection hole 1012, and avoid interference between the probes 303 corresponding to the two temperature sensors 30. Furthermore, if a single probe 303 fails, the other probes 303 can still provide reliable data.

[0083] In some embodiments, please refer to Figures 2-5 The mounting platform 20 includes a mounting surface 202 facing away from the reaction chamber 1, which is connected to the body 301. The mounting surface 202, facing away from the reaction chamber 1, provides a flat and stable support for the body 301 of the temperature sensor 30, facilitating quick installation and fixation. Furthermore, the mounting surface 202 is located outside the reaction chamber 1, allowing for easy maintenance or replacement of the temperature sensor 30 without disassembling the reaction chamber 1 or interfering with internal components.

[0084] This application illustrates the example of a clearance hole 201 being formed on a mounting surface 202. In this way, the temperature sensor 30 can be set perpendicular to the plane on which the mounting surface 202 is located. The probe 303 is inserted into the clearance hole 201, and the body 301 is fixed on the mounting surface 202. The clearance hole 201 provides an insertion path for the probe 303, ensuring that the light emitted by the probe 303 can enter the interior of the reaction chamber 1 through the detection hole 101 of the reaction chamber 1.

[0085] The body 301 of the temperature sensor 30 can be directly fixed to the mounting surface 202 by bolts, clips or welding. This application does not limit the specific connection method. The corresponding setting of the clearance hole 201 and the probe 303 makes it possible to eliminate the need for complex positioning or adjustment between the body 301 and the mounting surface 202.

[0086] For example, a flange 302 is connected to the side of the body 301 facing the probe 303. The flange 302 is connected to the mounting surface 202 by bolts or clips, providing additional support for the body 301 of the temperature sensor 30 and enhancing installation stability.

[0087] It should be noted that the above content is only an example of the installation method of the temperature sensor 30 in this application, and does not constitute a limitation on the implementation of this application.

[0088] In some embodiments, please refer to Figures 5-9 The cooling module provided in the above embodiments of this application is used to cool the temperature sensor 30 of the semiconductor device 2.

[0089] Specifically, the cooling module includes a liquid cooling component 40 and a fin assembly 50. The fin assembly 50 is fixedly connected to the liquid cooling component 40. The liquid cooling component 40 has a first heat-conducting surface 4051, and the fin assembly 50 has a second heat-conducting surface 5021a. The first heat-conducting surface 4051 and the second heat-conducting surface 5021a are arranged opposite to each other. Both the first heat-conducting surface 4051 and the second heat-conducting surface 5021a are thermally connected to the temperature sensor 30.

[0090] The cooling module of this application constructs a bidirectional collaborative heat dissipation port for the temperature sensor 30 through a rigid connection design between the liquid cooling component 40 and the fin assembly 50. Specifically, the first heat-conducting surface 4051 and the second heat-conducting surface 5021a, which are positioned opposite each other, dissipate heat synchronously from both sides of the sensor, eliminating the local temperature gradient caused by unilateral cooling and avoiding measurement drift problems.

[0091] Optionally, under high-temperature conditions, the liquid-cooled component 40, leveraging its active heat exchange advantage, dominates heat dissipation, achieving rapid cooling of the sensor to maintain measurement accuracy. Under low-temperature or normal operating conditions, the finned component 50 continues to operate through passive heat dissipation, ensuring heat dissipation efficiency while reducing system energy consumption. Thus, this application not only ensures the measurement accuracy of the temperature sensor 30 through efficient heat exchange but also automatically switches the heat dissipation mode according to the real-time temperature, achieving a dynamic balance between heat dissipation efficiency and energy-saving operation.

[0092] For example, the housings of both the liquid cooling assembly 40 and the fin assembly 50 can be configured as thermally conductive housings, with the surfaces of the thermally conductive housings that contact the temperature sensor 30 forming corresponding first thermally conductive surface 4051 and second thermally conductive surface 5021a.

[0093] In some embodiments, please refer to Figures 5-9 In this application, the temperature sensor 30 includes a body 301 and a probe 303 connected to the body 301 as an example. The cooling module includes a liquid cooling component 40, which is thermally connected to the body 301 of the temperature sensor 30 through a first thermally conductive surface 4051.

[0094] During the operation of semiconductor device 2, temperature sensor 30 is affected by the high temperature of the processing environment, or it may generate heat itself as the operating time of temperature sensor 30 increases. Temperature sensor 30 contains various electronic components, such as sensors and microprocessors. These components have normal operating temperature ranges. When the ambient temperature is too high, it may exceed the upper limit of the operating temperature of these components, causing their operating state to change and thus affecting the accuracy of temperature measurement.

[0095] By making a thermally conductive connection between the liquid cooling component 40 in this application and the body 301 of the temperature sensor 30, the heat generated by the body 301 of the temperature sensor 30 can be carried away to reduce its operating temperature, thereby reducing the temperature measurement error caused by the temperature rise of the temperature sensor 30 itself and further improving the measurement accuracy of the temperature sensor 30.

[0096] For example, the liquid cooling assembly 40 can be in direct contact with the body 301 of the temperature sensor 30 to achieve heat conduction. Alternatively, the liquid cooling assembly 40 can also be thermally connected to the body 301 of the temperature sensor 30 by using a thermally conductive material.

[0097] In some embodiments, the liquid cooling assembly 40 may be a heat pipe filled with a working fluid. When one end is heated, the working fluid evaporates and flows to the other end, where it condenses and releases heat. The heat pipe may be embedded in the body 301 of the temperature sensor 30 or thermally connected to the body 301 of the temperature sensor 30 to rapidly conduct heat to the other end of the heat pipe.

[0098] In other embodiments, please refer to Figure 6 The liquid cooling assembly 40 can also be a liquid cooling plate that uses liquid circulation for heat dissipation. The surface of the liquid cooling plate forms a first heat-conducting surface 4051. The liquid cooling plate can be closely attached to the body 301 of the temperature sensor 30, transferring the heat generated by the temperature sensor 30 to the coolant through heat conduction, and then carrying away the heat through coolant circulation. This application uses the liquid cooling assembly 40 as an example to illustrate the liquid cooling assembly 40 as a liquid cooling plate.

[0099] In some embodiments, please refer to Figure 7 The liquid cooling assembly 40 is provided with a liquid cooling cavity 401. The liquid cooling cavity 401 is provided with a liquid inlet 4011 and a liquid outlet 4012. The liquid inlet 4011 is used to supply coolant to the liquid cooling cavity 401, and the liquid outlet 4012 is used to discharge the coolant in the liquid cooling cavity 401.

[0100] In this way, the low-temperature coolant enters the liquid-cooled cavity 401 through the inlet 4011. The coolant flows within the liquid-cooled cavity 401, absorbing the heat generated by the body 301 of the temperature sensor 30. The coolant has a high heat capacity and heat transfer efficiency, enabling it to quickly absorb the heat from the body 301 of the temperature sensor 30, thereby effectively reducing the temperature of the body 301. The coolant, having absorbed heat, increases in temperature and then flows out of the liquid-cooled cavity 401 through the outlet 4012.

[0101] For example, after the coolant flows out of the liquid cooling chamber 401, it can also enter an external coolant drainage system. During this process, the coolant releases the absorbed heat, its temperature decreases, and it can then re-enter the liquid cooling chamber 401 for recycling.

[0102] This application does not specify the number, size and shape of the inlet 4011 and the outlet 4012. The number (can be the same or different), size (can be the same or different) and shape (can be the same or different) of the inlet 4011 and the outlet 4012 can be designed according to actual needs.

[0103] Liquid cooling technology offers higher heat dissipation efficiency compared to traditional air cooling or natural cooling methods. Because the coolant is in direct contact with the body 301 of the temperature sensor 30, heat can be carried away more quickly, effectively reducing the temperature of the body 301 and ensuring the stability of the temperature sensor 30's operation. Furthermore, the liquid cooling component 40 achieves cooling through active heat dissipation, which is even more beneficial for reducing heat in temperature sensor 30 operating in high-temperature environments.

[0104] For example, the coolant can be water. As another example, the coolant can be an ethylene glycol solution. This application does not limit the scope of the application.

[0105] In some embodiments, please refer to Figure 5 and combined Figure 7 The liquid cooling assembly 40 in this application is located outside the reaction chamber 1, thereby reducing the possibility of the coolant contaminating the gaseous environment inside the processing chamber. Furthermore, the liquid cooling assembly 40 does not occupy the chamber space within the reaction chamber 1 used for semiconductor processing, and the maintenance, replacement, or cleaning of the liquid cooling assembly 40 can be performed outside the equipment, reducing downtime, lowering maintenance costs, and improving production efficiency.

[0106] In some embodiments, the liquid cooling component 40 is disposed on the peripheral surface of the body 301 of the temperature sensor 30, and the liquid cooling component 40 is connected to the mounting surface 202.

[0107] On the one hand, the liquid cooling component 40 is located on the circumferential surface of the body 301 of the temperature sensor 30, which facilitates increasing the connection area between the liquid cooling component 40 and the body 301, significantly improving heat dissipation efficiency. On the other hand, the mounting surface 202 also provides stable support for the liquid cooling component 40.

[0108] In some embodiments, please refer to Figure 5 and combined Figure 7 The cooling module also includes a connecting pipe 402, which includes an inlet pipe 4021 connected to the inlet port 4011 and a drain pipe 4022 connected to the outlet port 4012. The inlet pipe 4021 and the drain pipe 4022 are both connected to the valve island 70.

[0109] The inlet pipe 4021 delivers coolant to the liquid cooling chamber 401 of the liquid cooling assembly 40. After the coolant exchanges heat with the body 301 of the temperature sensor 30, the heated coolant is discharged through the drain pipe 4022, forming a closed loop. The liquid flows through the inlet pipe 4021 and the outlet pipe, and the temperature of the coolant in the liquid cooling chamber 401 can be kept lower than the temperature of the body 301. Thus, the liquid cooling assembly 40 can greatly improve the heat dissipation efficiency through liquid circulation, ensuring that the temperature sensor 30 operates within a suitable temperature range.

[0110] In some embodiments, please refer to Figure 5 and combined Figure 7 The liquid cooling assembly 40 includes a housing and a heat-conducting element 405, which are thermally connected. A first heat-conducting surface 4051 is the side of the heat-conducting element 405 facing the second heat-conducting surface 5021a. The heat-conducting element 405 is disposed on the surface of the liquid cooling assembly 40 facing the temperature sensor 30 and is used for thermal connection with the temperature sensor 30. Furthermore, the heat-conducting element 405 is thermally connected to the body 301 of the temperature sensor 30.

[0111] On the one hand, the heat-conducting component 405 can fill the tiny gap between the liquid cooling component 40 and the temperature sensor 30, increasing the contact area with the body 301 of the temperature sensor 30 and ensuring heat dissipation efficiency; on the other hand, the heat-conducting component 405 accelerates the heat dissipation speed of the body 301 of the temperature sensor 30, so that the heat generated by the body 301 is quickly transferred to the liquid cooling component 40.

[0112] For example, the thermal conductive element 405 may be silicone. Yet another example, the thermal conductive element 405 may be a graphene composite material.

[0113] In some embodiments, please refer to Figure 7 and combined Figure 9The housing is provided with a boss 4031a. Specifically, the boss 4031a is provided on the outer wall surface of the housing and is thermally connected to the heat-conducting component 405. Compared with the single contact surface in planar contact, the three-dimensional structure of the boss 4031a can increase the contact area with the heat-conducting component 405, thereby improving the heat dissipation efficiency between the heat-conducting component 405 and the housing.

[0114] It should be noted that, in this application, the boss 4031a is exemplarily disposed in the middle region of the outer wall surface of the housing to achieve symmetrical and balanced heat conduction. In practical applications, the installation position of the boss 4031a has flexible adjustment space and can be adjusted according to heat dissipation requirements and specific structural requirements. As another example, the boss 4031a can be arranged in the edge region of the outer wall surface. Furthermore, the external shape of the boss 4031a also offers diverse options. It can adopt a square block structure to maximize the planar contact area, or it can be designed as a ring-shaped block, using a hollow structure to optimize the fluid flow path and reduce the weight of the cooling module, thus lowering costs. The structural selection, dimensional parameters, and spatial layout scheme of the boss in this application are merely illustrative examples of embodiments of this application and do not constitute a limitation on the technical solution. Any equivalent structural transformations and optimization designs based on the concept of this application fall within the scope of patent protection.

[0115] In some embodiments, please refer to Figure 5 and combined Figure 7 The liquid cooling components 40 are multiple. The liquid inlet pipe 4021 includes a main liquid inlet pipe 4021a and multiple sub-liquid inlet pipes 4021b connected to the main liquid inlet pipe 4021a. The multiple sub-liquid inlet pipes 4021b are respectively connected to the liquid inlet ports 4011 of the multiple liquid cooling components 40. The liquid outlet pipe 4022 includes a main liquid outlet pipe 4022a and multiple sub-liquid outlet pipes 4022b connected to the main liquid outlet pipe 4022a. The multiple sub-liquid outlet pipes 4022b are connected to the liquid outlet ports 4012 of the multiple liquid cooling components 40.

[0116] Therefore, the main inlet pipe 4021a can divert the coolant to distribute it evenly to each inlet sub-pipe 4021b, ensuring that each liquid cooling component 40 receives the same cooling intensity. Furthermore, this application only requires one main inlet pipe 4021a and one main outlet pipe 4022a outside the reaction chamber 1 as the "main channel" for coolant delivery, reducing redundant piping. By branching multiple inlet sub-pipes 4021b and outlet sub-pipes 4022b from the main pipe and directly connecting them to each liquid cooling component 40, the length of the sub-pipes can be shortened, avoiding long-distance winding.

[0117] In addition, this application can also provide an additional liquid cooling component 40 to connect to other equipment that requires cooling during the semiconductor processing. Only the liquid inlet tube 4021b and the liquid outlet tube 4022b need to be added, which reduces the processing difficulty.

[0118] In some embodiments, please refer to Figure 5 and combined Figure 7 The main inlet pipe 4021a, the sub-inlet pipe 4021b, the main outlet pipe 4022a, and the sub-outlet pipe 4022b are all rigid pipes.

[0119] In this way, the main inlet pipe 4021a, the sub-pipe 4021b, the main outlet pipe 4022a, and the sub-pipe 4022b can have the characteristics of high temperature resistance, high pressure resistance, corrosion resistance, and vibration resistance, so as to cope with the complex environment of high temperature, high pressure, strong corrosive gas, and frequent vibration in semiconductor processing, which significantly improves the reliability, safety and life of the cooling system.

[0120] In some embodiments, please refer to Figure 5 and combined Figure 7 The liquid cooling assembly 40 also includes a housing 403 and a partition 404. The partition 404 is disposed inside the liquid cooling cavity 401. The housing includes a liquid inlet 4011, a liquid outlet 4012, and the liquid cooling cavity 401. The partition 404 is disposed inside the liquid cooling cavity 401, dividing the liquid cooling cavity 401 into a first flow channel cavity and a second flow channel cavity. The first flow channel cavity is connected to the liquid inlet 4011, and the second flow channel cavity is connected to the liquid outlet 4012. There is a flow deflection gap between the end of the partition 404 and the inner wall of the housing, forming a liquid flow path that flows sequentially through the liquid inlet 4011, the first flow channel cavity, the flow deflection gap, the second flow channel cavity, and the liquid outlet 4012.

[0121] Specifically, please see Figure 7 One end of the partition 404 is fixedly connected to the inner wall of the housing, and the other end of the partition 404 extends towards the interior of the cavity and is spaced apart from the inner wall of the housing. In this way, the cooling medium entering the housing from the inlet 4011 is blocked by the partition 404 and can only pass through the baffle gap formed between the other end of the partition 404 and the inner wall of the housing. In this application, the partition 404 divides the liquid-cooled cavity 401 into a first flow channel cavity and a second flow channel cavity, and forms a flow path with an angle through the baffle gap between its end and the inner wall of the housing. Compared with the traditional straight flow channel, the actual flow distance of the coolant from the inlet 4011 to the outlet 4012 is extended, thereby increasing the contact time between the coolant and the cavity wall and further improving the heat exchange efficiency between the cooling module and the temperature sensor 30.

[0122] For example, please refer to Figure 5 and combined Figure 7The liquid inlet 4011 and the liquid outlet 4012 are located on the same wall surface of the outer shell 403. The liquid cooling cavity 401 and the partition 404 are both located inside the outer shell 403. The partition 404 is located between the liquid inlet 4011 and the liquid outlet 4012. One end of the partition 404 is connected to the wall surface where the liquid inlet 4011 and the liquid outlet 4012 are located, and the other end of the partition 404 extends toward the interior of the shell to form a baffle gap with the outer shell 403 at intervals.

[0123] In another exemplary embodiment, the inlet 4011 and the outlet 4012 are located on different walls of the housing portion 403. This application provides an exemplary description with the inlet 4011 and the outlet 4012 being arranged opposite to each other. The partition 404 can then be connected to the side wall of the housing portion 403 located between the inlet 4011 and the outlet 4012, and at least partially blocks the line connecting the inlet 4011 and the outlet 4012. While guiding the flow direction of the cooling medium, the partition 404 can force the cooling medium to bypass the partition 404 to form a detour path, thereby extending the liquid flow path between the inlet 4011 and the outlet 4012.

[0124] The baffle 404 extends the flow path of the coolant within the liquid-cooled cavity 401. After entering the liquid-cooled cavity 401 from the inlet 4011, the coolant is guided by the baffle 404, extending its residence time within the cavity. Finally, the coolant exits from the outlet 4012, carrying away the absorbed heat. Understandably, during this process, the increased residence time of the coolant as it flows through the path formed between the baffle 404 and the outer casing 403 allows for more efficient heat absorption and improved heat transfer efficiency.

[0125] It should be noted that this application does not limit the number or shape of the baffles 404. For example, there can be two baffles 404, each connected to two opposite walls of the outer casing 403, forming an S-shaped flow-deflecting gap between them to further extend the flow path of the cooling medium. As another example, the baffles 404 can be designed with an irregular shape, such as an S-shape, a wave shape, or a sawtooth shape, utilizing their irregular contours to further extend the flow path of the coolant.

[0126] In some embodiments, please refer to Figure 5 and combined Figure 7 The housing includes a first housing 4031 and a second housing 4032, which together form a liquid cooling cavity. The liquid inlet 4011, the liquid outlet 4012, and the partition are all disposed in one of the first housing 4031 and the second housing 4032. The liquid inlet 4011 and the liquid outlet 4012 are disposed in one of the first housing 4031 and the second housing 4032, and the partition is disposed in the other of the first housing 4031 and the second housing 4032.

[0127] This application simplifies the manufacturing process, reduces the production cost of the housing, and improves the assembly convenience of the housing by designing the housing as a combination structure of the first housing 4031 and the second housing 4032 and rationally allocating the positions of the liquid inlet 4011, the liquid outlet 4012 and the partition 404.

[0128] Specifically, please refer to Figure 5 and combined Figure 7 The outer shell 403 includes a first shell 4031 and a second shell 4032 connected to each other. A liquid cooling cavity 401 is disposed on the first shell 4031. The liquid cooling cavity 401 is provided with a first opening 4013. The second shell 4032 covers the first opening 4013.

[0129] The separate design of the first housing 4031 and the second housing 4032 enables the separate processing of the liquid cooling assembly 40, thereby improving production efficiency. Furthermore, opening the second housing 4032 allows for cleaning or inspection of the interior of the liquid cooling cavity 401 without disassembling the entire liquid cooling assembly 40.

[0130] The second housing 4032 and the first housing 4031 can be connected by welding or by adding a sealing ring, and this application does not limit this connection.

[0131] By covering the first opening 4013 with the second housing 4032, the sealing effect of the liquid cooling assembly 40 can be improved, thereby avoiding the impact on the processing of the semiconductor device 2 due to the outflow of coolant.

[0132] For example, when the inlet 4011, the outlet 4012 and the partition 404 are all disposed in the same housing (e.g., the first housing 4031), the inlet 4011 and the outlet 4012 are directly formed by processing the wall thickness of the first housing 4031, the peripheral wall of the partition 404 forming the flow baffle is spaced apart from the wall surface of the first housing 4031, and the remaining peripheral surface is attached to the inner wall of the first housing 4031 and the second housing 4032.

[0133] In another example, the inlet 4011, the outlet 4012, and the partition 404 can be respectively disposed in different housings, with one of the inlet 4011 and the outlet 4012 in the first housing 4031 and the other in the second housing 4032, and the partition 404 can also be disposed in the second housing 4032.

[0134] In some embodiments, please refer to Figure 8 and combined Figure 9The cooling module also includes a fin assembly 50, which is connected to the liquid cooling assembly 40. The fin assembly 50 and the liquid cooling assembly 40 form a housing space S, which is used to house the temperature sensor 30.

[0135] This application secures the temperature sensor 30 by forming an accommodating space S between the fin assembly 50 and the liquid cooling assembly 40, ensuring efficient heat conduction between the body 301 of the temperature sensor 30 and the liquid cooling assembly 40. On the one hand, the fin assembly 50 and the liquid cooling assembly 40 can fix the body 301 of the temperature sensor 30 within the accommodating space S, preventing misalignment caused by vibrations generated during the operation of the semiconductor device 2. On the other hand, the accommodating space S provides an accurate installation position for the temperature sensor 30, improving the installation efficiency of the temperature sensor 30 while ensuring that the probe 303 can accurately measure the temperature at the target location.

[0136] In some embodiments, please refer to Figure 8 and combined Figure 9 The fin assembly 50 includes a heat dissipation part 502, which is thermally connected to the temperature sensor 30. In this way, the heat dissipation part 502 and the liquid cooling assembly 40 can work together to dissipate heat from the temperature sensor 30, so as to ensure that the temperature sensor 30 is within a suitable temperature range, thereby ensuring the accuracy of the detection results of the temperature sensor 30.

[0137] It should be noted that the heat dissipation part 502 may or may not have the same structure as the liquid cooling component 40. This application provides an example where the two structures are different. Of course, the heat dissipation part 502 can also be other structural components with heat dissipation functions. This application only lists one case and does not constitute a limitation on the embodiments of this application.

[0138] In some embodiments, please refer to Figures 7-9 The cooling module also includes a first fastener 61 and a second fastener 62. The first heat-conducting surface 4051 of the liquid cooling assembly 40 is provided with a first fixing part 406 and a second fixing part 407 on both sides. The second heat-conducting surface 5021a of the fin assembly 50 is provided with a third fixing part 501 and a fourth fixing part 503 on both sides, corresponding to the positions of the first fixing part 406 and the second fixing part 407. The first fixing part 406 and the third fixing part 501 are connected by the first fastener 61, and the second fixing part 407 and the fourth fixing part 503 are connected by the second fastener 62, so as to fix the liquid cooling assembly 40 and the fin assembly 50.

[0139] In this application, the first fixing part 406 and the second fixing part 407 are provided on opposite horizontal edges of the first heat-conducting surface 4051, and the third fixing part 501 and the fourth fixing part 503 are provided on opposite horizontal edges of the second heat-conducting surface 5021a. Of course, the first fixing part 406, the second fixing part 407, the third fixing part 501, and the fourth fixing part 503 can also be provided in the vertical direction; this application does not limit this. Furthermore, the first fixing part 406, the second fixing part 407, the third fixing part 501, and the fourth fixing part 503 can also be correspondingly provided in the middle of the first heat-conducting surface 4051 and the second heat-conducting surface 5021a. Those skilled in the art can adjust these configurations according to the specific structural requirements of the accommodating space S; this application does not limit this.

[0140] For example, both the first fastener 61 and the second fastener 62 are bolts.

[0141] Specifically, please refer to Figures 7-9 The heat dissipation part 502 is disposed opposite to the liquid cooling assembly 40. The fin assembly 50 also includes a connection between the heat dissipation part 502 and the third fixing part 501 and the fourth fixing part 503. The accommodating space S is also located between the third fixing part 501 and the fourth fixing part 503.

[0142] The heat dissipation unit 502 is disposed opposite to the liquid cooling assembly 40. The third fixing part 501 and the fourth fixing part 503 combine the heat dissipation unit 502 and the liquid cooling assembly 40 into an integral frame, forming a bidirectional heat dissipation path. One side of the body 301 of the temperature sensor 30 is cooled by the heat dissipation unit 502, and the other side of the body 301 of the temperature sensor 30 is cooled by the liquid cooling assembly 40. The heat dissipation from both sides allows the temperature generated by the body 301 of the temperature sensor 30 to be dissipated quickly. This dual heat dissipation structure further improves the heat dissipation efficiency of the temperature sensor 30 and ensures the accuracy of the temperature monitored by the temperature sensor 30.

[0143] In some embodiments, please refer to Figures 7-9 The third fixing part 501 and the fourth fixing part 503 connected to the heat dissipation part 502 are detachably connected to the first fixing part 406 and the second fixing part 407. For example, the third fixing part 501 and the fourth fixing part 503 are all connected to the first fixing part 406 and the second fixing part 407 by bolts.

[0144] In this way, when installing the temperature sensor 30, the heat sink 502, the third fixing part 501, and the fourth fixing part 503 can be removed from the first fixing part 406 and the second fixing part 407 firstly, and then reconnected to the first fixing part 406 and the second fixing part 407 after the temperature sensor 30 is installed. This allows for flexible adjustment of the distance between the heat sink 502 and the liquid cooling component 40 by tightening the bolts, ensuring that the distance between them meets the requirements for accommodating the temperature sensor 30. On the other hand, it avoids installation difficulties caused by the heat sink 502 obstructing the installation, facilitating the accurate positioning and fixing of the temperature sensor 30.

[0145] Of course, the first fastener 61 and the second fastener 62 can also be other connecting parts with adjustment space. Taking the first fixing part 406 and the third fixing part 501 as an example, a compression spring can be installed between the first fixing part 406 and the third fixing part 501, with both ends of the spring abutting against the two fixing parts respectively, and an adjusting nut is sleeved on the outside of the spring. By rotating the adjusting nut to compress or release the spring, the compression amount of the spring can be changed, thereby adjusting the distance between the first fixing part 406 and the third fixing part 501, and thus adjusting the interval distance between the heat dissipation part 502 and the liquid cooling assembly 40.

[0146] In some embodiments, please refer to Figure 8 and Figure 9 The heat dissipation part 502 includes a base 5021 and heat dissipation fins 5022. The base 5021 forms a second heat-conducting surface 5021a on the surface facing the accommodating space S. The third fixing part 501 and the fourth fixing part 503 are connected between the base 5021 and the first fixing part 406 and the second fixing part 407. The heat dissipation fins 5022 are disposed on the surface of the base 5021 away from the accommodating space S.

[0147] For example, the base 5021 is made of a material with high thermal conductivity (such as copper or aluminum alloy).

[0148] Of course, the base 5021 can also be provided with a protrusion to form a corresponding boss, and the boss forms the second heat-conducting surface 5021a.

[0149] In this way, the base 5021 can transfer the heat generated by the body 301 of the temperature sensor 30 to the heat dissipation fins 5022. The heat dissipation fins 5022 enhance heat dissipation by increasing the surface area, thereby improving heat dissipation efficiency. At the same time, the heat dissipation fins 5022 are arranged outward to avoid interfering with the temperature sensor 30 in the accommodating space S.

[0150] Based on the above configuration, the heat generated by the body 301 of the temperature sensor 30 can be dissipated through two paths. Specifically, on one side of the body 301, heat is transferred to the heat dissipation fins 5022 via the base 5021, and the heat is dissipated by the heat dissipation fins 5022. On the other side of the body 301, it is thermally connected to the liquid cooling assembly 40, and the heat generated by the body 301 is carried away by the circulation of the coolant. The heat dissipation fins 5022 and the liquid cooling assembly 40 work together to effectively improve the cooling efficiency of the cooling module.

[0151] In some embodiments, please refer to Figure 8 and Figure 9 Multiple fins 5022 extend from the second heat-conducting surface 5021a away from the liquid cooling component 40, and the spacing between each fin 5022 gradually increases in the direction away from the liquid cooling component 40, forming a progressive heat dissipation channel 5022a.

[0152] It is understandable that the cross-section of the fin 5022 is trapezoidal, and the lateral spacing between adjacent fins 5022 gradually widens from the starting end near the liquid cooling component 40 to the far end, thus forming a progressive heat dissipation channel 5022a.

[0153] Therefore, the progressive heat dissipation channel 5022a can reduce the airflow resistance between adjacent fins 5022. The expansion shape of the progressive heat dissipation channel 5022a guides the airflow to diffuse to both sides, so that the air covers the surface of the fins 5022 more evenly, further improving the heat dissipation efficiency.

[0154] The above-described preferred embodiments have further detailed the purpose, technical solution, and advantages of this utility model. It should be understood that the above description is only a preferred embodiment of this utility model and is not intended to limit this utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A cooling module for application to a temperature sensor, characterized in that, include: A liquid cooling assembly having a first heat-conducting surface; A fin assembly, which is fixedly connected to the liquid cooling assembly, has a second heat-conducting surface; The first thermally conductive surface and the second thermally conductive surface are disposed opposite to each other, and both the first thermally conductive surface and the second thermally conductive surface are thermally connected to the temperature sensor.

2. Cooling module according to claim 1, characterized in that The liquid cooling assembly includes: The housing and the heat-conducting component are thermally connected, and the first heat-conducting surface is the side of the heat-conducting component facing the second heat-conducting surface.

3. The cooling module of claim 2, wherein, The housing is provided with a boss, which is thermally connected to the heat-conducting component.

4. The cooling module of claim 2, wherein, The housing includes a liquid inlet, a liquid outlet, and a liquid cooling cavity. A partition is provided inside the liquid cooling cavity, which divides the liquid cooling cavity into a first flow channel cavity and a second flow channel cavity. The first flow channel cavity is connected to the liquid inlet, and the second flow channel cavity is connected to the liquid outlet. There is a flow-deflecting gap between the end of the partition and the inner wall of the shell, forming a liquid flow path that flows sequentially through the inlet, the first flow channel cavity, the flow-deflecting gap, the second flow channel cavity and the outlet.

5. Cooling module according to claim 4, characterized in that The housing includes a first housing and a second housing, which together form the liquid cooling cavity. The liquid inlet, the liquid outlet, and the partition are all disposed in one of the first housing and the second housing; Alternatively, the liquid inlet and the liquid outlet may be located in one of the first housing and the second housing, and the partition may be located in the other of the first housing and the second housing.

6. Cooling module according to any one of claims 1 to 5, characterized in that The second heat-conducting surface extends outwards with multiple fins, and the spacing between each fin gradually increases in the direction away from the liquid cooling component, forming a progressive heat dissipation channel.

7. The cooling module according to any one of claims 1 to 6, characterized in that The cooling module further includes a first fastener and a second fastener. The first heat-conducting surface of the liquid cooling component is provided with a first fixing part and a second fixing part on both sides. The second heat-conducting surface of the fin assembly is provided with a third fixing part and a fourth fixing part on both sides, corresponding to the positions of the first fixing part and the second fixing part. The first fixing part and the third fixing part are connected by the first fastener, and the second fastener is connected by the second fixing part and the fourth fixing part to fix the liquid cooling component and the fin assembly.

8. A temperature sensing mechanism, characterized by, include: The cooling module as described in any one of claims 1 to 7; A temperature sensor is thermally connected to the cooling module to cool the temperature sensor.

9. A temperature sensing device, characterized by, include: The plurality of temperature sensing mechanisms as described in claim 8; The valve island has multiple liquid transmission ports corresponding to the multiple temperature sensing mechanisms, and each liquid transmission port is connected to its corresponding temperature sensing mechanism.

10. The temperature sensing device of claim 9, wherein, The distance between the temperature sensing mechanism and the valve island is less than a preset value, and the corresponding liquid transmission port has a spiral structure.

11. The temperature sensing device of claim 9, wherein, The flow rate of each liquid transfer port is proportional to the distance from the corresponding temperature sensing mechanism to the valve island.

12. A reaction chamber, characterized by, include: cavity; The temperature sensing device as described in any one of claims 9 to 11, wherein the temperature sensing device is fixed to the outside of the cavity.

13. A semiconductor device, characterized by comprising: include: The reaction chamber as described in claim 12.

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