A silicon wafer cleaning equipment

Abstract

This application relates to the field of tank cleaning technology and discloses a silicon wafer cleaning equipment. The silicon wafer cleaning equipment includes a solution preparation system, a cleaning unit, and a pressure device. The solution preparation system is used to prepare the cleaning solution and includes a solution preparation tank. The cleaning unit is used to clean the silicon wafers and includes a cleaning tank. The cleaning tank and the solution preparation tank are connected via a delivery pipeline and a recovery pipeline. The cleaning solution in the solution preparation tank can be delivered to the cleaning tank via the delivery pipeline, and the cleaning solution in the cleaning tank can be recovered back to the solution preparation tank via the recovery pipeline. The pressure device is installed on the recovery pipeline and can provide pressure to the cleaning solution in the cleaning tank, so that the cleaning solution in the cleaning tank is recovered back to the solution preparation tank via the recovery pipeline. Using this technical solution, when the cleaning tank needs maintenance or repair, the unused cleaning solution in the cleaning tank can be recovered back to the solution preparation tank via the pressure device, avoiding the waste of cleaning solution caused by directly discharging the unused cleaning solution from the cleaning tank and reducing production costs.

Description

Technical Field

[0001] This application relates to the field of tank cleaning technology, and more particularly to a silicon wafer cleaning device. Background Technology

[0002] In the current booming development of the photovoltaic industry, the silicon wafer cleaning process plays a crucial role as a key step in ensuring silicon wafer quality and improving the performance of photovoltaic products.

[0003] Existing photovoltaic cleaning machines typically consist of a chemical tank, a water tank, and a drying tank. During operation, different chemicals are diluted between the chemical tanks using a water tank to prevent liquid mixing during the sequential transfer of silicon wafers. After the complete cleaning process, the silicon wafers are dried in the drying tank and then transferred to the next process.

[0004] However, this traditional cleaning machine has revealed many drawbacks during long-term operation, severely restricting the efficient production and cost control of the photovoltaic industry. When the cleaning tank of the cleaning machine needs maintenance, the cleaning fluid in the tank often needs to be drained before maintenance can be carried out. If the drained cleaning fluid is unused, it will result in waste of the cleaning fluid and increase costs. Utility Model Content

[0005] This application discloses a silicon wafer cleaning device that can return the cleaning solution in the cleaning tank to the solution mixing tank, thereby avoiding waste of unused cleaning solution and reducing costs.

[0006] To achieve the above objectives, embodiments of this application disclose a silicon wafer cleaning apparatus, comprising:

[0007] A solution preparation system, the solution preparation system being used to prepare a cleaning solution, the solution preparation system including a solution preparation tank;

[0008] A cleaning unit is used to clean silicon wafers. The cleaning unit includes a cleaning tank, which is connected to a solution preparation tank via a delivery pipeline and a recovery pipeline. The cleaning solution in the solution preparation tank can be delivered to the cleaning tank via the delivery pipeline, and the cleaning solution in the cleaning tank can be recovered to the solution preparation tank via the recovery pipeline.

[0009] A pressure device is provided in the recovery pipeline, which can provide pressure to the cleaning liquid in the cleaning tank so that the cleaning liquid in the cleaning tank is recovered to the liquid preparation tank through the recovery pipeline.

[0010] As an optional implementation, the cleaning unit includes multiple units, and the cleaning tanks of the multiple cleaning units are all connected to the liquid preparation tank of the liquid preparation system through the infusion pipeline and the recovery pipeline. The pressure device includes multiple units, and the end of the recovery pipeline connected to the cleaning tank of each cleaning unit is provided with the pressure device, so that the cleaning fluid can be recovered from the cleaning tanks of the multiple cleaning units to the liquid preparation tank of the liquid preparation system through the recovery pipeline.

[0011] As an optional implementation, a first control valve is provided at one end of the infusion pipeline connected to the liquid preparation tank to control the opening and closing of the infusion pipeline.

[0012] As an optional implementation, the first control valve is provided at the end of the infusion line that is connected to the cleaning tank of each cleaning unit.

[0013] As an optional implementation, a second control valve is provided at one end of the recovery pipeline connected to the liquid preparation tank of the liquid preparation system to control the opening and closing of the recovery pipeline.

[0014] As an optional implementation, the pressure device includes a water pump.

[0015] As an optional implementation, the solution preparation tank includes multiple tanks, and each cleaning unit includes multiple cleaning tanks. One solution preparation tank is connected to one cleaning tank of each cleaning unit through the infusion pipeline and the recovery pipeline. The end of the recovery pipeline connected to each cleaning tank is provided with the pressure device.

[0016] As an optional implementation, the dispensing system further includes a plurality of first metering tanks and a plurality of second metering tanks, each of the dispensing tanks being connected to one of the first metering tanks and one of the second metering tanks. The first metering tanks and the second metering tanks are used to supply chemicals to the dispensing tanks, and the capacity markings of the first metering tanks are different from those of the second metering tanks.

[0017] As an optional implementation, a portion of the plurality of solution mixing tanks is an alkali solution mixing tank, and another portion of the plurality of solution mixing tanks is an acid solution mixing tank; a portion of the plurality of cleaning tanks is an alkali washing cleaning tank, and another portion of the plurality of cleaning tanks is an acid washing cleaning tank; one alkali solution mixing tank is connected to one alkali washing cleaning tank of each cleaning unit, and one acid solution mixing tank is connected to one acid washing cleaning tank of each cleaning unit.

[0018] As an optional implementation, the solution preparation system is connected above the cleaning unit.

[0019] Compared with the prior art, the beneficial effects of this application are at least as follows:

[0020] This application provides a silicon wafer cleaning device, which includes a solution preparation system, a cleaning unit, and a pressure device. The solution preparation system is used to prepare the cleaning solution and includes a solution preparation tank. The cleaning unit is used to clean the silicon wafers and includes a cleaning tank. The cleaning tank and the solution preparation tank are connected via a delivery pipeline and a recovery pipeline. The cleaning solution in the solution preparation tank can be delivered to the cleaning tank via the delivery pipeline, and the cleaning solution in the cleaning tank can be recovered back to the solution preparation tank via the recovery pipeline. The pressure device is installed on the recovery pipeline and can provide pressure to the cleaning solution in the cleaning tank, so that the cleaning solution in the cleaning tank is recovered back to the solution preparation tank via the recovery pipeline. In this way, when the cleaning tank needs maintenance or repair, the pressure device on the recovery pipeline can return the unused cleaning solution in the cleaning tank to the solution preparation tank, avoiding the waste of cleaning solution caused by directly discharging unused cleaning solution, realizing the recycling and reuse of cleaning solution, reducing the amount of cleaning solution used, and lowering production costs. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 This is the silicon wafer cleaning equipment disclosed in the embodiments of this application.

[0023] Explanation of reference numerals in the attached figures:

[0024] 100-Silicon wafer cleaning equipment;

[0025] 1-Liquid preparation system; 11-Liquid preparation tank; 12-First metering tank; 13-Second metering tank;

[0026] 2-Cleaning unit; 21-Cleaning tank;

[0027] 3-Pressure device;

[0028] 4-Infusion tubing;

[0029] 5-Recovery pipeline;

[0030] 6-First control valve;

[0031] 7-Second control valve. Detailed Implementation

[0032] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0033] In this application, the terms "upper," "lower," "left," "right," "front," "rear," "top," "bottom," "inner," "outer," "vertical," "horizontal," "lateral," and "longitudinal" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are primarily for the purpose of better describing this application and its embodiments, and are not intended to limit the indicated device, element, or component to having a specific orientation, or to be constructed and operated in a specific orientation.

[0034] Furthermore, in addition to indicating location or positional relationship, some of the aforementioned terms may also have other meanings. For example, the term "above" may also be used in some cases to indicate a certain dependency or connection relationship. Those skilled in the art can understand the specific meaning of these terms in this application based on the specific circumstances.

[0035] Furthermore, the terms "installation," "setup," "equipped with," "connection," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral structure; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium, or an internal connection between two devices, components, or parts. Those skilled in the art can understand the specific meaning of these terms in this application based on the specific circumstances.

[0036] Furthermore, the terms "first," "second," etc., are primarily used to distinguish different devices, components, or parts (which may be the same or different in specific type and construction), and are not intended to indicate or imply the relative importance or quantity of the indicated devices, components, or parts. Unless otherwise stated, "a plurality of" means two or more.

[0037] In the current booming photovoltaic industry, silicon wafer cleaning plays a crucial role as a key process for ensuring silicon wafer quality and improving the performance of photovoltaic products. Currently, silicon wafers are typically cleaned using cleaning machines. Previously, these machines used manual solution preparation. However, cleaning machines require solution replacement every 20-30 days, and each solution preparation takes 2-4 hours, resulting in significant wasted capacity. Therefore, a solution preparation system was designed to pre-prepare the solution, allowing production to resume immediately after cleaning machine maintenance without waiting for preparation time, thus increasing capacity. However, when the cleaning machine requires maintenance, the cleaning solution must be drained before maintenance can begin. If the drained solution is unused, the solution preparation system must be restarted to prepare the solution and then deliver it to the cleaned machine after maintenance, leading to waste of cleaning solution and increased production costs.

[0038] Based on this, this application provides a silicon wafer cleaning device that can return the cleaning solution in the cleaning unit to the solution preparation system, thereby avoiding waste of unused cleaning solution and reducing costs.

[0039] The present technical solution will be further described below with reference to the embodiments and accompanying drawings.

[0040] Please see Figure 1 This application discloses a silicon wafer cleaning device 100, which includes a solution preparation system 1, a cleaning unit 2, and a pressure device 3. Specifically, the solution preparation system 1 is used to prepare the cleaning solution and includes a solution preparation tank 11. The cleaning unit 2 is used to clean the silicon wafer and includes a cleaning tank 21. The cleaning tank 21 is connected to the solution preparation tank 11 through a delivery pipeline 4 and a recovery pipeline 5. The cleaning solution in the solution preparation tank 11 can be delivered to the cleaning tank 21 through the delivery pipeline 4, and the cleaning solution in the cleaning tank 21 can be recovered to the solution preparation tank 11 through the recovery pipeline 5. The pressure device 3 is installed in the recovery pipeline 5 and can provide pressure to the cleaning solution in the cleaning tank 21 so that the cleaning solution in the cleaning tank 21 is recovered to the solution preparation tank 11 through the recovery pipeline 5.

[0041] In related technologies, the liquid preparation tank 11 of the liquid preparation system 1 can only deliver cleaning liquid to the cleaning tank 21 of the cleaning unit 2. When the cleaning tank 21 of the cleaning unit 2 needs maintenance or repair, the unused cleaning liquid that has been delivered to the cleaning tank 21 of the cleaning unit 2 can only be discharged before the cleaning tank 21 of the cleaning unit 2 can be repaired. After the cleaning tank 21 is repaired, new cleaning liquid is delivered to the cleaning tank 21 of the cleaning unit 2 through the liquid preparation tank 11 of the liquid preparation system 1. This results in the waste of unused cleaning liquid and increases production costs.

[0042] In this embodiment, when the cleaning tank 21 of the cleaning unit 2 needs repair or maintenance, the pressure device 3 installed on the recovery pipeline 5 can send the unused cleaning liquid in the cleaning tank 21 of the cleaning unit 2 back to the liquid distribution tank 11 of the liquid distribution system 1. This avoids the waste of cleaning liquid caused by directly discharging the unused cleaning liquid, realizes the recycling and reuse of cleaning liquid, reduces the amount of cleaning liquid used, and lowers the production cost.

[0043] Optionally, such as Figure 1 As shown, the cleaning unit 2 includes multiple units, and the cleaning tanks 21 of the multiple cleaning units 2 are connected to the liquid preparation tank 11 of the liquid preparation system 1 through the infusion pipeline 4 and the recovery pipeline 5. The pressure device 3 includes multiple units, and a pressure device 3 is provided at one end of the recovery pipeline 5 connected to the cleaning tank 21 of each cleaning unit 2, so that the cleaning liquid can be recovered from the cleaning tanks 21 of the multiple cleaning units 2 to the liquid preparation tank 11 of the liquid preparation system 1 through the recovery pipeline 5.

[0044] This means that a single liquid distribution system 1 supplies liquid to multiple cleaning units 2, allowing multiple cleaning units 2 to clean multiple silicon wafers simultaneously. Compared to a single cleaning unit 2, this results in cleaning more silicon wafers per unit time, significantly improving production efficiency and meeting the cleaning capacity requirements of large-scale silicon wafer production. Furthermore, through a dedicated liquid delivery pipeline 4, the liquid distribution system 1 can quickly and evenly distribute the cleaning liquid to each cleaning unit 2, ensuring the timeliness and stability of the cleaning liquid supply to each unit 2. In addition, a dedicated recovery pipeline 5 is provided to recover the cleaning liquid from the cleaning units 2 back to the liquid distribution system 1, avoiding interference between the recovery pipeline 5 and the delivery pipeline 4. Moreover, multiple pressure devices 3 ensure that the cleaning liquid in the cleaning tank 21 of each cleaning unit 2 can be recovered to the liquid distribution tank 11 of the liquid distribution system 1, preventing waste of the cleaning liquid.

[0045] Optionally, the volume of the solution mixing tank 11 is greater than the sum of the volumes of the cleaning tanks 21 of the multiple cleaning units 2. This prevents the cleaning solution in the cleaning tanks 21 of the multiple cleaning units 2 from being simultaneously recycled into the solution mixing tank 11, which would result in incomplete recycling due to insufficient volume of the solution mixing tank 11.

[0046] In some embodiments, such as Figure 1 As shown, a first control valve 6 is provided at the end of the infusion pipeline 4 connected to the liquid preparation tank 11 of the liquid preparation system 1 to control the opening and closing of the infusion pipeline 4. The first control valve 6 can control the opening and closing of the infusion pipeline 4, allowing operators to flexibly adjust the timing and amount of cleaning fluid delivered to the cleaning tank 21 of the cleaning unit 2 according to actual cleaning needs, avoiding waste of cleaning fluid, and ensuring that each cleaning tank 21 of the cleaning unit 2 can obtain the appropriate amount of cleaning fluid in a timely and accurate manner when needed.

[0047] For example, when the cleaning tank 21 of the cleaning unit 2 stops working or when the cleaning fluid is no longer needed, closing the first control valve 6 can effectively prevent the cleaning fluid from flowing back from the infusion line 4 into the dispensing tank 11 of the dispensing system 1. This avoids problems such as cleaning fluid contamination and pressure changes in the dispensing system caused by backflow, ensuring the stable operation of the dispensing system 1 and the quality of the cleaning fluid. When maintenance, repair, or replacement of the infusion line 4 or the cleaning unit 2 is required, closing the first control valve 6 can isolate the infusion line 4 from the dispensing system 1, ensuring that personnel can operate in a safe, pressure-free environment, while preventing cleaning fluid leakage and protecting the equipment and the surrounding environment.

[0048] Optionally, the first control valve 6 can be integrated with an automated control system. Sensors monitor the operating status of the cleaning unit 2 and parameters such as the flow rate of the cleaning fluid, and the control system automatically controls the opening and closing of the first control valve 6 according to a preset program. This not only improves the automation level of the silicon wafer cleaning equipment 100 and reduces manual intervention, but also ensures the stability and consistency of the cleaning process, improving production efficiency and cleaning quality.

[0049] Furthermore, a first control valve 6 is provided at the end of the infusion pipeline 4 that connects to the cleaning tank 21 of each cleaning unit 2. This allows for independent control of the cleaning tank 21 of each cleaning unit 2 by installing the first control valve 6 at the connection point of the infusion pipeline 4. Operators can individually control the timing and amount of cleaning fluid supplied to the cleaning tank 21 of a specific cleaning unit 2 according to the actual cleaning needs of the silicon wafers, avoiding problems such as waste and uneven cleaning that may occur when simultaneously supplying cleaning fluid to all cleaning tanks 21 of all cleaning units 2, thus improving the flexibility and accuracy of the cleaning process. Moreover, different cleaning stages or different types of silicon wafers may require different cleaning processes during silicon wafer cleaning. The independent first control valve 6 allows the equipment to flexibly adjust the working state of each cleaning unit 2 according to different operating conditions, achieving more complex and refined cleaning processes and meeting diverse production needs. Furthermore, if a cleaning unit 2 malfunctions, such as through leakage or blockage, the corresponding first control valve 6 can be quickly shut off, isolating that cleaning unit 2 from the liquid preparation system 1 and other cleaning units 2. This prevents the malfunction from escalating and avoids the cleaning fluid affecting other normally operating cleaning units 2. It also facilitates the repair and replacement of the malfunctioning cleaning unit 2, improving the overall safety and reliability of the equipment. When maintenance, inspection, or component replacement is required for a cleaning unit 2, only the corresponding first control valve 6 needs to be shut off, without shutting down the entire liquid preparation system 1 or other cleaning unit 2 pipelines. This reduces the impact of maintenance work on the entire production process, minimizes equipment downtime, and improves production efficiency.

[0050] It should be noted that the first control valve 6 can be a manual valve, a pneumatic valve, or a solenoid valve; this embodiment does not specifically limit it in this regard.

[0051] For example, the first control valve 6 is a pneumatic valve. This allows for automated control via a pneumatic actuator, as well as remote control, improving production efficiency. The valve can be opened and closed simply by controlling the air supply, making operation easy.

[0052] In some embodiments, such as Figure 1 As shown, a second control valve 7 is provided at one end of the recovery pipeline 5 connected to the liquid preparation tank 11 of the liquid preparation system 1 to control the opening and closing of the recovery pipeline 5. The second control valve 7 allows operators to flexibly adjust the timing and amount of cleaning fluid recovered from multiple cleaning units 2 according to the actual cleaning situation and the needs of the liquid preparation system 1, preventing instability caused by excessive or insufficient recovery of cleaning fluid. Controlling the second control valve 7 ensures a stable circulation loop of cleaning fluid between each cleaning unit 2 and the liquid preparation system 1, improving the recycling rate of the cleaning fluid, reducing waste, and lowering production costs.

[0053] Similarly, the second control valve 7 can be combined with an automated control system. The system monitors the working status of the cleaning unit and parameters such as the flow rate and level of the cleaning fluid through sensors. The control system then automatically controls the opening and closing of the second control valve 7 according to a preset program, thereby improving the automation level of the equipment, reducing manual intervention, and ensuring the stability and consistency of the cleaning process.

[0054] It should be noted that the second control valve 7 is similar to the first control valve 6 and can be a manual valve, a pneumatic valve, or a solenoid valve. This embodiment does not make specific limitations on this.

[0055] Optionally, the pressure device 3 includes a water pump. The water pump can stably provide the necessary pressure to ensure that the cleaning fluid can be transported from the cleaning unit 2 back to the liquid distribution system 1, avoiding problems such as poor or slow recovery due to insufficient pressure, and maintaining the efficient operation of the system. Furthermore, the water pump can provide appropriate and sufficient pressure by adjusting its speed and power according to the resistance changes in the delivery pipeline 4 and the recovery pipeline 5 (such as pipeline length, diameter, number of bends, etc.), ensuring the normal delivery and recovery of the cleaning fluid under various complex pipeline conditions. In addition, the water pump has a relatively simple structure, and the cause of failure is relatively easy to diagnose and repair. Usually, only periodic replacement of easily worn parts such as seals and bearings is needed to maintain its normal operation. Compared with complex pneumatic or electric pressure devices, the maintenance cost and difficulty of the water pump are lower.

[0056] It should be noted that the pressure device 3 can be a water pump, a hydraulic pump, or a pneumatic pumping device, but this embodiment does not specifically limit it.

[0057] In some embodiments, such as Figure 1 As shown, the liquid preparation tank 11 includes multiple tanks, and each cleaning unit 2 includes multiple cleaning tanks 21. One liquid preparation tank 11 is connected to one cleaning tank 21 of each cleaning unit 2 through a liquid delivery pipeline 4 and a recovery pipeline 5. A pressure device 3 is provided at one end of the recovery pipeline 5 connected to each cleaning tank 21.

[0058] The arrangement of multiple solution preparation tanks 11 and cleaning tanks 21 allows multiple cleaning units 2 to perform cleaning operations simultaneously. Each cleaning tank 21 can independently transport and recover the cleaning solution, improving the parallel processing capability of silicon wafer cleaning, meeting the cleaning needs of large-scale silicon wafer production, and significantly shortening the overall cleaning time. Furthermore, this allows for flexible adjustment of parameters such as the cleaning solution composition, flow rate, pressure, and cleaning time in each cleaning tank 21 according to different silicon wafer types and cleaning process requirements, achieving diverse cleaning process combinations and improving the equipment's versatility and adaptability.

[0059] Furthermore, such as Figure 1 As shown, the solution preparation system 1 also includes multiple first metering tanks 12 and multiple second metering tanks 13. Each solution preparation tank 11 is connected to one first metering tank 12 and one second metering tank 13. The first metering tanks 12 and 13 are used to supply chemicals to the solution preparation tank 11. The capacity markings of the first metering tanks 12 and 13 are different. The metering tanks allow control over the amount of chemicals added to the solution preparation tank 11, ensuring precise proportions of the cleaning solution components and guaranteeing the stability of the cleaning solution's quality and performance. Furthermore, by setting up two metering tanks with different capacity markings, precise management of different types or dosage requirements of chemicals can be achieved. For example, one chemical may require high-precision micro-addition, while another requires precise control of a larger volume. This differentiated management improves the accuracy and flexibility of cleaning solution preparation.

[0060] Furthermore, the solution preparation system 1 also includes a supply component (not shown in the figure). Each solution preparation tank 11 is connected to the supply component via a water supply pipeline. The supply component is used to supply water to the solution preparation tank 11, and the water and the chemicals in the solution preparation tank 11 are mixed to prepare a cleaning solution.

[0061] Optionally, a third control valve and a flow meter are also installed on the water supply pipeline. The third control valve is used to control the opening and closing of the water supply pipeline, and the flow meter is used to monitor the water flow rate in the water supply pipeline. The third control valve and the flow meter can work together to monitor the water flow rate in the water supply pipeline and feed back the flow information to the third control valve, thereby achieving real-time control of the water supply pipeline.

[0062] It should be noted that the liquid preparation system 1 also includes a chemical supply source for supplying chemicals to the liquid preparation tank 11. Each chemical supply source supplies chemicals to the first metering tank 12 and the second metering tank 13 connected to the liquid preparation tank 11. Each chemical supply source has a separate delivery pipeline to deliver chemicals to each liquid preparation tank 11, ensuring that multiple liquid preparation tanks 11 can be prepared simultaneously without having to spend time waiting in line for liquid preparation, thus improving production efficiency.

[0063] In some embodiments, a portion of the plurality of solution mixing tanks 11 is an alkali solution mixing tank, and another portion of the plurality of solution mixing tanks 11 is an acid solution mixing tank. A portion of the plurality of cleaning tanks 21 is an alkaline washing cleaning tank, and another portion of the plurality of cleaning tanks 21 is an acid washing cleaning tank. One alkali solution mixing tank is connected to one alkaline washing cleaning tank of each cleaning unit 2, and one acid solution mixing tank is connected to one acid washing cleaning tank of each cleaning unit 2. Since alkali and acid solutions target different types of contaminants—alkaline solutions are typically used to remove organic matter, grease, etc., while acid solutions are used to remove metal ions, inorganic matter, etc.—more thorough cleaning can be achieved by setting up alkali solution mixing tanks, acid solution mixing tanks, alkaline washing cleaning tanks, and acid washing cleaning tanks, improving the cleanliness of the silicon wafers. Furthermore, since the alkali and acid solutions are in separate systems, equipment downtime caused by switching cleaning solutions is reduced, improving production efficiency.

[0064] For example, a sodium hydroxide solution is prepared in an alkaline solution preparation tank, and an acidic solution is prepared in an acidic solution preparation tank using hydrofluoric acid and hydrogen peroxide. The sodium hydroxide solution prepared in the alkaline solution preparation tank is introduced into the alkaline washing tank, and the acidic solution prepared in the acidic solution preparation tank is introduced into the acidic washing tank. During silicon wafer cleaning, the wafers are first cleaned in multiple alkaline washing tanks, and then cleaned in multiple acidic washing tanks. After cleaning, the silicon wafers are cleaned through two processes: slow lifting and drying.

[0065] In some embodiments, the solution preparation system 1 is connected above the cleaning unit 2. This allows the cleaning solution to flow naturally from the solution preparation tank 11 of the solution preparation system 1 into the cleaning tank 21 of the cleaning unit 2 under gravity, eliminating the need for additional power equipment to overcome the height difference. This simplifies the design and operation of the cleaning solution delivery system and reduces equipment complexity and cost. Furthermore, this avoids residual liquid in the delivery pipeline 4 caused by the solution preparation system 1 being lower than the cleaning unit 2, which could mix with the liquid in the next preparation, altering the concentration of the solution and affecting the cleaning process effectiveness.

[0066] In some embodiments, each liquid preparation tank 11 is provided with a liquid delivery outlet and a recovery inlet on its side wall. The liquid delivery outlet is located near the bottom of the liquid preparation tank 11, and the recovery inlet is located away from the bottom of the liquid preparation tank 11.

[0067] The cleaning unit 2 includes multiple cleaning tanks 21. Each cleaning tank 21 has a liquid inlet and a recovery outlet on its side wall. The liquid inlet is located away from the bottom of the cleaning tank 21, and the recovery outlet is located near the bottom of the cleaning tank 21. The liquid outlet and the liquid inlet are connected through a liquid inlet pipe 4, and the recovery outlet and the recovery inlet are connected through a recovery pipe 5. This makes it more convenient to transport the cleaning solution from the preparation tank 11 to the cleaning tank 21 and to recover the cleaning solution from the cleaning tank 21 to the preparation tank 11. It eliminates the need for components that provide pressure for the flow of the cleaning solution in the preparation tank 11 and the cleaning tank 21, allowing the liquid in the preparation tank 11 to enter the liquid inlet pipe 4 and the cleaning solution in the cleaning tank 21 to enter the recovery pipe 5.

[0068] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A silicon wafer cleaning apparatus, characterized by comprising: The silicon wafer cleaning equipment includes: A solution preparation system, the solution preparation system being used to prepare a cleaning solution, the solution preparation system including a solution preparation tank; A cleaning unit is used to clean silicon wafers. The cleaning unit includes a cleaning tank, which is connected to a solution preparation tank via a delivery pipeline and a recovery pipeline. The cleaning solution in the solution preparation tank can be delivered to the cleaning tank via the delivery pipeline, and the cleaning solution in the cleaning tank can be recovered to the solution preparation tank via the recovery pipeline. A pressure device is provided in the recovery pipeline, which can provide pressure to the cleaning liquid in the cleaning tank so that the cleaning liquid in the cleaning tank is recovered to the liquid preparation tank through the recovery pipeline.

2. The silicon wafer cleaning apparatus according to claim 1, wherein The cleaning unit includes multiple units, and the cleaning tanks of the multiple cleaning units are all connected to the liquid preparation tank of the liquid preparation system through the infusion pipeline and the recovery pipeline. The pressure device includes multiple units, and the end of the recovery pipeline connected to the cleaning tank of each cleaning unit is provided with the pressure device, so that the cleaning liquid can be recovered from the cleaning tanks of the multiple cleaning units to the liquid preparation tank of the liquid preparation system through the recovery pipeline.

3. The silicon wafer cleaning apparatus of claim 2, wherein The infusion pipeline is equipped with a first control valve at one end connected to the liquid preparation tank to control the opening and closing of the infusion pipeline.

4. The silicon wafer cleaning apparatus according to claim 3, wherein The first control valve is provided at one end of the infusion pipeline that connects to the cleaning tank of each cleaning unit.

5. The apparatus for cleaning a silicon wafer as set forth in claim 2, wherein A second control valve is provided at one end of the recovery pipeline that connects to the liquid preparation tank of the liquid preparation system to control the opening and closing of the recovery pipeline.

6. The apparatus for cleaning a silicon wafer according to any one of claims 1 to 5, wherein The pressure device includes a water pump.

7. The apparatus for cleaning a silicon wafer as set forth in claim 2, wherein The solution preparation tank includes multiple tanks, and each cleaning unit includes multiple cleaning tanks. One solution preparation tank is connected to one cleaning tank of each cleaning unit through the infusion pipeline and the recovery pipeline. The end of the recovery pipeline connected to each cleaning tank is equipped with the pressure device.

8. The silicon wafer cleaning apparatus of claim 7, wherein The solution preparation system also includes a plurality of first metering tanks and a plurality of second metering tanks. Each solution preparation tank is connected to one of the first metering tanks and one of the second metering tanks. The first metering tanks and the second metering tanks are used to supply chemicals to the solution preparation tanks. The capacity markings of the first metering tanks and the second metering tanks are different.

9. The apparatus for cleaning a silicon wafer as set forth in claim 7, wherein A portion of the plurality of solution mixing tanks is an alkali solution mixing tank, and another portion of the plurality of solution mixing tanks is an acid solution mixing tank. A portion of the plurality of cleaning tanks is an alkali washing cleaning tank, and another portion of the plurality of cleaning tanks is an acid washing cleaning tank. One alkali solution mixing tank is connected to one alkali washing cleaning tank of each cleaning unit, and one acid solution mixing tank is connected to one acid washing cleaning tank of each cleaning unit.

10. The apparatus for cleaning a silicon wafer of claim 1, wherein, The solution preparation system is connected above the cleaning unit.

Images