A positioning and detection device for a wafer cassette
By designing a positioning and detection device for wafer cassettes, the device automatically detects the orientation of the wafer cassettes using detection blocks and sensors, thus solving the problem of wafer cassettes being placed backwards and improving the yield of wafer processing and the efficiency of equipment operation.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- WAFER WORKS ZHENGZHOU CORP
- Filing Date
- 2025-08-04
- Publication Date
- 2026-07-31
AI Technical Summary
The existing technology lacks a detection device to prevent the wafer cassette from being placed in the wrong direction, which leads to incorrect wafer position inside the wafer cassette, causing equipment failure or wafer scrapping, and manual confirmation is prone to judgment errors.
Design a positioning and detection device including a central through hole, a positioning block, a detection block, and a sensor. By using the interference between the detection block and the side structure of the wafer box and the sensor detection, the correct placement orientation of the wafer box is automatically ensured, preventing it from being placed backwards.
It effectively avoids abnormal placement of wafer cassettes, improves wafer yield and equipment uptime, and reduces wafer scrap and equipment failure.
Smart Images

Figure CN224583653U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of semiconductor manufacturing technology, specifically relating to a positioning and detection device for wafer cassettes. Background Technology
[0002] In the semiconductor wafer manufacturing process, wafer cassettes are used. A wafer cassette is a container specifically designed for storing, transporting, and loading semiconductor wafers. It is typically made of antistatic and chemically resistant materials such as polypropylene (PP), polycarbonate (PC), or carbon fiber reinforced plastic. The wafer cassette primarily protects the wafers from physical damage (such as impacts or scratches) or contamination (such as particles or electrostatic adsorption) during handling and storage. Simultaneously, the wafer cassette has precise slots inside to fix the wafer's position and ensure its positioning accuracy during machine processing.
[0003] In the actual wafer processing process, the wafers to be processed need to be placed into a wafer cassette, which is then positioned at the feed port of the equipment. Since the machine arm or wafer cassette support will subsequently move to the feed port to pick up or drop wafers, the placement of the wafer cassette must be accurate, necessitating a dedicated positioning mechanism. Current positioning methods typically involve installing four positioning blocks at the four corners of the wafer cassette placement location to prevent movement. However, existing technology lacks a detection device to prevent the wafer cassette from being placed in the wrong orientation, relying solely on manual confirmation. Due to the asymmetrical structure of the left and right sides of the wafer cassette, the wafers are not symmetrically positioned. When correctly placed, the wafer cassette handle should face right. If the handle is placed to the left, all wafers within the cassette will be mispositioned. This can lead to problems such as the arm failing to pick up the wafer, snagging or bumping into the wafer, or even colliding with the wafer cassette itself, causing equipment malfunctions or wafer scrap. Furthermore, even if a wafer is retrieved, if its front and back are reversed, the processed wafer must be scrapped. Relying solely on manual confirmation is prone to errors, resulting in incorrect wafer cassette placement.
[0004] Therefore, this application intends to provide a positioning and detection device for wafer cassettes, which can automatically ensure the placement position of the wafer cassettes and prevent abnormal placement of the wafer cassettes. Utility Model Content
[0005] The purpose of this invention is to provide a positioning and detection device for wafer cassettes to address the shortcomings of existing technologies.
[0006] The objective of this utility model is achieved through the following technical solution:
[0007] A positioning and detection device for a wafer cassette, wherein the lower part of a first side of the wafer cassette is hollowed out and a second side opposite to the first side is a solid surface; the positioning and detection device includes a base with a through hole in the center and a positioning block, a sensor and a detection block located on the base;
[0008] The base is used to support the wafer cassette; the positioning block is used to position the wafer cassette.
[0009] The detection block is located on one side of the through hole and is adapted to the cutout on the first side of the wafer cassette. When the wafer cassette is placed on the base in the correct direction, the detection block can be placed exactly in the cutout, allowing the wafer cassette to be placed smoothly on the base. When the wafer cassette is placed on the base in the opposite direction, the detection block interferes with the second side, preventing the wafer cassette from being placed smoothly on the base.
[0010] When the wafer cassette is correctly placed on the base, the wafer of the wafer cassette is exposed outside the through-hole;
[0011] The sensor is used to detect whether the wafer cassette is placed on the base.
[0012] Preferably, the detection block is L-shaped, including a vertical section and a horizontal section. The horizontal section is installed on the base by a first screw, and the vertical section is adapted to the hollowed-out area.
[0013] Preferably, the horizontal section is provided with a first elongated mounting hole through which the first screw passes.
[0014] Preferably, there are four positioning blocks, located at the four corners of the wafer cassette, which position the wafer cassette by abutting against the corners of the wafer cassette with their inner sides.
[0015] Preferably, the positioning block has a corner on its inner side, and the two sides forming the corner are respectively used to abut against the two sides of the corner of the wafer box.
[0016] Preferably, the inner surface of the positioning block is an inclined surface that gradually slopes inward from top to bottom.
[0017] Preferably, the positioning block includes a first positioning block and a second positioning block arranged symmetrically, with two of each. The first positioning block and the second positioning block are respectively arranged diagonally at the four corners of the through hole.
[0018] Preferably, the positioning block is fixed to the base by a second screw, and the positioning block is provided with a second elongated mounting hole through which the second screw passes.
[0019] Preferably, there are two sensors, symmetrically arranged on two opposite sides of the through hole;
[0020] Furthermore, the sensor and the detection block are located on different sides of the through hole.
[0021] Preferably, the sensor is fixed to the base by a third screw.
[0022] The wafer cassette positioning and inspection device provided in this application not only ensures accurate wafer cassette placement but also detects and prompts operators to correct incorrect placement, preventing subsequent wafer scrap and equipment malfunctions. This effectively improves wafer yield and equipment uptime. Therefore, the wafer cassette positioning and inspection device provided in this application has significant practical value and technological improvement implications in semiconductor wafer processing. Attached Figure Description
[0023] Figure 1 This is a schematic diagram of the positioning and detection device provided in this application;
[0024] Figure 2 This is a front view diagram of the positioning and detection device after the wafer cassette has been placed.
[0025] Figure 3 This is a schematic diagram of the rear side of the positioning and detection device after the wafer cassette is placed;
[0026] Figure 4 This is a left-side diagram of the positioning and detection device after the wafer cassette has been placed.
[0027] Figure 5 This is a schematic diagram on the right side after the positioning and detection device has placed the wafer cassette;
[0028] Figure 6 This is a top view of the positioning and detection device after the wafer cassette is placed;
[0029] Figure 7 This is a partial schematic diagram showing the positioning and detection device after the wafer cassette has been placed.
[0030] Explanation of reference numerals in the attached figures:
[0031] 1-Chip box; 2-Handle; 3-Base; 4-First positioning block; 5-Second positioning block; 6-Chip; 7-Sensor; 8-Detection block; 9-Left side; 10-Right side; 11-First screw; 12-Second screw; 13-Third screw. Detailed Implementation
[0032] A typical wafer cassette used in the prior art is as follows: Figures 2-3As shown, the lower part of the first side of the wafer box 1 is hollowed out, while the second side, opposite to the first side, is a solid surface. The two sides have different structures. Specifically, the left and right sides of the wafer box have different structures. The left side 9 is "H"-shaped, with hollowed-out structures at the top and bottom, connected by a horizontal bar in the middle; the right side 10 is a solid plate with a handle 2 for the operator to pick up the wafer box. Since the wafers inside the wafer box are not placed symmetrically, when placing the wafer box 1 at the feeding port, it must be placed strictly with the "H"-shaped side on the left and the handle on the right. Otherwise, problems may occur such as the arm being unable to pick up the wafer, snagging or bumping into the wafer, or even hitting the wafer box itself, causing equipment failure or wafer scrapping. In the prior art, the orientation is generally confirmed manually, which has a certain degree of error.
[0033] To address the aforementioned problems, this application provides a positioning and detection device for wafer cassettes, such as... Figures 1 to 7 As shown, it includes a base 3 with a through hole in the center, a positioning block, a sensor 7, and a detection block 8 located on the base 3.
[0034] The base 3 supports the wafer cassette and can be installed at the feeding port of the equipment using screws or similar means. A central through-hole allows the wafer support or wafer cassette support to push the wafer upwards for loading and unloading. The shapes of the base 3 and the through-hole can be adjusted according to the actual shape of the wafer cassette, wafer support, or wafer cassette support. In an optional embodiment, the base 3 and the through-hole are square.
[0035] The positioning block is used to position the wafer cassette and prevent it from moving.
[0036] The detection block 8 is located on one side of the through hole, adjacent to the first side of the wafer cassette (e.g., ...). Figure 2 As shown in the diagram (left side), the cutout is designed to fit the wafer cassette. When the wafer cassette is placed on the base in the correct orientation, the detection block is positioned precisely at the cutout, allowing the wafer cassette to be placed smoothly on the base. However, when the wafer cassette is placed on the base in the opposite orientation, due to the second side (as shown in the diagram), the detection block is positioned at the cutout, allowing the wafer cassette to be placed smoothly on the base. Figure 2 The right side shown is entirely solid. During the downward placement of the wafer cassette, the second side will be placed on top of the detection block, meaning the detection block and the second side (as shown) will be aligned. Figure 2 As shown on the right side, interference occurs, preventing the wafer cassette from being placed smoothly on the base 3. This serves as a reminder to the material handling personnel to identify the problem and correct it in a timely manner, which can effectively prevent subsequent abnormalities from occurring.
[0037] The shape, size and position of the detection block 8 can be adjusted according to the wafer cassette specifications so that the detection block is located exactly at the cutout structure below the first side of the wafer cassette, without contacting the wafer 6 inside the wafer cassette 1.
[0038] Preferably, the detection block 8 is L-shaped, including a vertical section and a horizontal section. The horizontal section is installed on the base 3 by the first screw 11, and the vertical section is adapted to the hollow structure of the wafer box.
[0039] More preferably, the horizontal section is provided with a first elongated mounting hole through which the first screw 11 passes, and the first elongated mounting hole can facilitate the adjustment of the position of the detection block 8.
[0040] When the wafer cassette 1 is correctly placed on the base 3, the wafer in the wafer cassette is exposed outside the through-hole and can contact the wafer stage or the wafer cassette stage.
[0041] Sensor 7 is used to detect whether the wafer cassette is placed on the base 3. When the wafer cassette is detected to be placed on the base, the sensor automatically transmits the signal to the device, which then automatically performs subsequent actions such as wafer retrieval.
[0042] The workflow of this application is as follows: First, the operator places the wafer cassette 1 onto the base 3. The positioning block ensures the accurate positioning of the wafer cassette 1, while the detection block 8 ensures the correct orientation of the wafer cassette 1. Then, the sensor 7 detects the wafer cassette 1 and automatically transmits the signal to the equipment. Finally, the equipment automatically performs subsequent wafer picking and other actions. During this process, if the wafer cassette 1 is placed in the wrong orientation (i.e., the right side 10 with the handle is placed on the left), because the bottom of the right side 10 is not open, it will directly touch the top of the detection block 8, preventing proper placement. This alerts the operator to confirm the problem and correct it promptly, effectively preventing subsequent abnormalities.
[0043] The positioning block can be made using existing technology. This application provides a preferred structure, such as... Figures 1-6 As shown, there are four positioning blocks, located at the four corners of the wafer box, which position the wafer box by abutting against the corners of the wafer box with their inner sides.
[0044] More preferably, the inner side of the positioning block is provided with a corner, and the two sides forming the corner are respectively used to abut against the two sides of the wafer box corner, so as to limit the wafer box from two directions and improve the limiting stability.
[0045] Preferably, the inner side of the positioning block is a slope that gradually slopes inward from top to bottom. The purpose of setting it as a slope is to ensure that there is enough space when the wafer cassette 1 is placed in the middle of the four positioning blocks. It does not need to be placed exactly in the middle of the four positioning blocks. As long as it is placed within the range of the slope of the positioning block, the wafer cassette 1 will slide along the slope to the middle position of the four positioning blocks, which facilitates the picking and placing of the wafer cassette 1.
[0046] Preferably, the positioning block includes a first positioning block 4 and a second positioning block 5 arranged symmetrically, with two of each. The first positioning block 4 and the second positioning block 5 are respectively arranged diagonally at the four corners of the through hole.
[0047] Preferably, the positioning block is fixed to the base 3 by a second screw 12, and the positioning block is provided with a second elongated mounting hole through which the second screw 12 passes. The second elongated mounting hole can also be used to adjust the position of the positioning block to ensure the accurate placement of the wafer cassette 1.
[0048] Preferably, to ensure detection accuracy, two sensors are used, symmetrically arranged on two opposite sides of the through hole. Further, for ease of installation, the sensor 7 and the detection block 8 are located on different sides of the through hole.
[0049] Preferably, the sensor 7 is fixed to the base by two third screws 13.
[0050] In summary, the wafer cassette positioning and inspection device provided in this application not only ensures accurate wafer cassette placement but also detects and prompts operators to correct incorrect placement, preventing subsequent wafer scrap and equipment malfunctions. This effectively improves wafer yield and equipment uptime. Therefore, the wafer cassette positioning and inspection device provided in this application has significant practical value and technological improvement implications in semiconductor wafer processing.
[0051] Although preferred embodiments of the present invention have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments as well as all changes and modifications falling within the scope of the present invention. Clearly, those skilled in the art can make various alterations and modifications to the present invention without departing from its spirit and scope. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention also intends to include these modifications and variations.
Claims
1. A positioning and detection device for a wafer cassette, wherein the lower part of a first side surface of the wafer cassette is hollowed out, and a second side surface opposite to the first side surface is a solid surface; characterized in that, The positioning and detection device includes a base with a through hole in the center, and a positioning block, a sensor, and a detection block located on the base. The base is used to support the wafer cassette; the positioning block is used to position the wafer cassette. The detection block is located on one side of the through hole and is adapted to the cutout on the first side of the wafer box. When the wafer box is placed on the base in the correct direction, the detection block can be placed exactly in the cutout, so that the wafer box can be placed smoothly on the base. When the wafer cassette is placed on the base in the opposite direction, the detection block interferes with the second side, preventing the wafer cassette from being placed smoothly on the base. When the wafer cassette is correctly placed on the base, the wafer of the wafer cassette is exposed outside the through-hole; The sensor is used to detect whether the wafer cassette is placed on the base.
2. The positioning and detection device for wafer cassettes as described in claim 1, characterized in that, The detection block is L-shaped, including a vertical section and a horizontal section. The horizontal section is installed on the base by a first screw, and the vertical section is adapted to the hollowed-out area.
3. The positioning and detection device for wafer cassettes as described in claim 2, characterized in that, The horizontal section is provided with a first elongated mounting hole through which the first screw passes.
4. The positioning and detection device for wafer cassettes as described in claim 1, characterized in that, The number of positioning blocks is four, located at the four corners of the wafer box, and the wafer box is positioned by the inner side of the positioning blocks abutting against the corners of the wafer box.
5. The positioning and detection device for a wafer cassette as described in claim 4, characterized in that, The positioning block has a corner on its inner side, and the two sides forming the corner are respectively used to abut against the two sides of the corner of the wafer box.
6. The positioning and detection device for a wafer cassette as described in claim 5, characterized in that, The inner surface of the positioning block is an inclined surface that gradually slopes inward from top to bottom.
7. The positioning and detection device for a wafer cassette as described in claim 5, characterized in that, The positioning block includes a first positioning block and a second positioning block arranged symmetrically, with two of each. The first positioning block and the second positioning block are respectively diagonally arranged at the four corners of the through hole.
8. The positioning and detection device for a wafer cassette as described in claim 1, characterized in that, The positioning block is fixed to the base by a second screw, and the positioning block is provided with a second elongated mounting hole through which the second screw passes.
9. The positioning and detection device for a wafer cassette as described in claim 1, characterized in that, The number of sensors is two, which are symmetrically arranged on two opposite sides of the through hole; Furthermore, the sensor and the detection block are located on different sides of the through hole.
10. The positioning and detection apparatus for a wafer cassette as described in claim 1, characterized in that, The inductor is fixed to the base by a third screw.